CN106862802A - Flux composition, solder composition and electric substrate - Google Patents
Flux composition, solder composition and electric substrate Download PDFInfo
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- CN106862802A CN106862802A CN201610825845.3A CN201610825845A CN106862802A CN 106862802 A CN106862802 A CN 106862802A CN 201610825845 A CN201610825845 A CN 201610825845A CN 106862802 A CN106862802 A CN 106862802A
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- composition
- solder
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- acid
- flux
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Abstract
The present invention provides a kind of flux composition, solder composition and electric substrate, the flux composition contains (A) rosin resinoid, (B) activator and (C) solvent, (B) composition contains (B1) polymerized fatty acid, (B2) aromatic carboxylic acid and (B3) aliphatic dicarboxylic acid, solubility when (C) composition contains 20 DEG C of (C1) temperature to water is the solvent of below 2g/100g, relative to the mass % of (C) composition 100, the use level of (C1) composition is 75 mass %.
Description
Technical field
The present invention relates to flux composition, solder composition and electric substrate.
Background technology
Solder composition be by flux composition (composition containing rosin resinoid, activator and solvent etc.) knead in
Solder powder is simultaneously made the mixture of pasty state.In the solder composition, it is desirable to which melt solder, solder are easily wetted what is sprawled
The weldabilities such as property (solder is sprawled).In order to solve these problems, grinding for the activator in flux composition etc. has been carried out
Study carefully, it is proposed that use glyoxaline compound etc. as activator (referring for example to document 1：International Publication No. 2012/118074).
On the other hand, along with the miniaturization and slimming of electronic equipment, used has electricity in the lower section of electronic unit
The lower electrode part (such as LGA (Background Grid array packages), BGA (BGA Package)) of extreme son.Electricity below this is being installed
During the part of pole, the electrode terminal of welding is enclosed between lower electrode part and circuit board.Therefore, QFP (squares are being installed
Flat type packaged) etc. electronic unit when, the component residue volatilized in Reflow Soldering is in flux residue.Waved in the Reflow Soldering
The component residue for sending is susceptible to migration in the case of in flux residue in insulating reliability experiment, and there is insulation can
By the tendency of property reduction.
Therefore, for the solder composition of the welding for lower electrode part, even if in situation as described above
Under, also require that with enough insulating reliabilities.
The content of the invention
Solder composition it is an object of the invention to provide flux composition and using it and the solder group is used
The electric substrate of compound, the flux composition when solder composition is made, welding property excellent, and for lower electrode portion
Also there is enough insulating reliabilities during the welding of part.
In order to solve above-mentioned problem, the present invention provides flux composition as described below, solder composition and electric substrate.
Flux composition of the invention contains (A) rosin resinoid, (B) activator and (C) solvent, and (B) composition contains
There are (B1) polymerized fatty acid, (B2) aromatic carboxylic acid and (B3) aliphatic dicarboxylic acid, (C) composition contains 20 DEG C of (C1) temperature
When to the solubility of water be the solvent of below 2g/100g, relative to the mass % of (C) composition 100, (C1) composition is matched somebody with somebody
Resultant is more than 75 mass %.
In solder composition of the invention, above-mentioned (C) composition is preferably selected from diglycol monotertiary hexyl ether, ethylene glycol list 2- second
Base hexyl ether, diglycol monotertiary 2- ethyls hexyl ether, ethylene glycol monobenzyl ether, Tri(propylene glycol)butyl ether,mixture of isomers, propane diols monophenyl ether, the fourth of diethylene glycol (DEG) two
At least one solvent in ether and 1,3- ethohexadiols.
Solder composition of the invention is preferably free of glyoxaline compound.
Solder composition of the invention contains the flux composition and solder powder.
For solder composition of the invention, preferably in the lower section that will there is electrode terminal in the lower section of electronic unit
Electrod assembly is used when being installed on electric substrate.
Electronic unit is installed on electric substrate and formed by electric substrate of the invention using the solder composition.
When solder composition is made by flux composition of the invention, welding property excellent and for lower electrode portion
Also there is enough insulating reliabilities, its reason not yet determines that the present inventor etc. is presumed as follows during the welding of part.
That is, the present inventor etc. speculates that the mechanism that Ion transfer occurs is as described below.Ion transfer is by electrode metal from sun
Pole dissolution and migrate to negative electrode separate out and occur.Therefore, the metal of dissolution is while repeated oxidation, reducing, while by gold
Belong to ion, the hydroxide of metal and oxide and separate out in a metallic form.
Specifically, first, there is chemical reaction as described below in anode, CuO is migrated into flux residue, is dispersed into
Colloidal.
(chemical reaction of anode)
Cu→Cu2++2e-(dissolution)
H2O→H++OH-
Cu2++2OH-→Cu(OH)2
Cu(OH)2→CuO+H2O
Then, there is chemical reaction as described below, Cu in flux residue2+Migrate to negative electrode.
(chemical reaction in flux residue)
CuO+H2O=Cu (OH)2=Cu2++2OH-
And, there is chemical reaction as described below in negative electrode, Cu is separated out.
(chemical reaction of negative electrode)
2H++2e-→H2
Cu2++2e-→ Cu (precipitation)
In flux composition of the invention, to the molten of water when more than the specified rate in (C) solvent for 20 DEG C of (C1) temperature
Xie Du is the solvent of below 2g/100g.Accordingly, as (C) composition for the composition volatilized in Reflow Soldering, even if residuing in weldering
In agent residue, the also substantially not adsorption moisture in flux residue.By the chemical reaction in the flux residue in above-mentioned mechanism,
H2O is reduced, and can be suppressed from CuO to Cu (OH)2Reaction.
In addition, the present inventor etc. has made intensive studies, as a result find, be currently used as the imidazoles chemical combination of activator
The nitrogen-containing heterocycle compounds such as thing, pyridine turn into the reason for Ion transfer occurs.Therefore, if by (B1) polymerized fatty acid,
(B2) the activator composition that aromatic carboxylic acid and (B3) aliphatic dicarboxylic acid are combined, even if not using imidazoles chemical combination then
Thing, it is also possible to ensure weldability.In addition, influence of such activator composition to Ion transfer is small.As described above, the present inventor
The effect of the invention described above can be realized Deng supposition.
According to the present invention it is possible to provide flux composition and the solder composition using it and used the solder group
The electric substrate of compound, the flux composition when solder composition is made, welding property excellent, and for lower electrode portion
Also there is enough insulating reliabilities during the welding of part.
Specific embodiment
[flux composition]
First, flux composition of the invention is illustrated.Flux composition of the invention is in solder composition
Composition beyond solder powder, contains (A) rosin resinoid, (B) activator and (C) solvent.
[(A) composition]
As for (A) rosin resinoid of the invention, rosin and rosin modified resin can be enumerated.As rosin
Class, can enumerate：Gum rosin, wood rosin, toll oil rosin, disproportionated rosin, newtrex, hydrogenated rosin and their derivative
Deng.As rosin modified resin, can enumerate：Can be used as the above-mentioned rosin of the reacted constituent of Diels-Alder reaction
Class unsaturated organic acid modified resin (α such as the aliphatic unsaturated monoacid such as (methyl) acrylic acid, fumaric acid, maleic acid,
The modified resin of the unsaturated carboxylic acids with aromatic rings such as the aliphatic such as beta-unsaturated carboxylic acid unsaturated dibasic acid, cinnamic acid etc.)
And the modified resin and the material with these modifiers as principal component of rosin acid etc..These rosin resinoids can individually make
With a kind, it is also possible to mix two or more and use.
Relative to the mass % of flux composition 100, the use level of (A) composition is preferably more than 30 mass % and 70 matter
Amount below %, more preferably more than 35 mass % and below 65 mass %.(A) when the use level of composition is less than the lower limit, meeting
Weldability is reduced, there is the tendency for easily producing solder ball, so-called weldability refers to the copper foil surface for preventing solder pad
Oxidation so that fusion welding is easy to soak the property on its surface, on the other hand, if the use level of (A) composition exceedes on above-mentioned
, then there is the tendency that solder flux residual quantity increases in limit.
[(B) composition]
(B1) polymerized fatty acid containing following explanation, (B2) aromatic carboxylic acid are needed for (B) activator of the invention
And (B3) aliphatic dicarboxylic acid.
As for (Bl) polymerized fatty acid of the invention, can enumerate and be generated by the polymerization of unrighted acid
Aliphatic acid.The tendency for reoxidizing of solder powder is prevented from by (Bl) composition due to existing, therefore can synergistically be improved
The effect of other activators.
The carbon number of the unrighted acid is not particularly limited, preferably more than 8 and less than 22, more preferably 12 with
Upper and less than 18, particularly preferably 18.In addition, as the polymerized fatty acid, be not particularly limited, preferably with binary acid or ternary
Acid is the polymerized fatty acid of principal component.Specifically, can enumerate：Dimeric dibasic acid (carbon number 36), trimer acid (carbon number
54) etc..
Relative to the mass % of the flux composition 100, the use level of above-mentioned (B1) composition is preferably more than 0.1 mass %
And 8 below mass %, more preferably more than 0.5 mass % and below 5 mass %.When use level is less than above-mentioned lower limit, there is weldering
, on the other hand, during more than the above-mentioned upper limit, there is the tendency that flux residue is changed into green in the tendency of connecing property reduction.
Aromatic monocarboxylate and aromatic dicarboxylic acid can be enumerated for (B2) aromatic carboxylic acid of the invention.Wherein, it is excellent
Select aromatic monocarboxylate.These aromatic carboxylic acids can be used alone, it is also possible to mixes two or more and uses.
As aromatic monocarboxylate, can enumerate：Benzoic acid, naphthoic acid, hydroxybenzoic acid and hydroxynaphthoic acid etc..
As aromatic dicarboxylic acid, can enumerate：Phthalic acid, M-phthalic acid and terephthalic acid (TPA) etc..
Relative to the mass % of above-mentioned flux composition 100, the use level of above-mentioned (B2) composition is preferably more than 0.1 mass %
And 8 below mass %, more preferably more than 0.5 mass % and below 5 mass %.When use level is less than above-mentioned lower limit, there is weldering
, on the other hand, during more than the above-mentioned upper limit, there is the tendency of insulating reliability reduction in the tendency of connecing property reduction.
It is the binary acid with alkylidene for (B3) aliphatic dicarboxylic acid of the invention.The carbon of the aliphatic dicarboxylic acid is former
Subnumber is not particularly limited, and preferably more than 3 and less than 22, more preferably more than 5 and less than 20.As the aliphatic dicarboxyl
Acid, can enumerate：Malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, decanedioic acid, dodecane two
Acid and eicosane diacid etc..These aliphatic dicarboxylic acids can be used alone, it is also possible to mixes two or more and uses.
Relative to the mass % of above-mentioned flux composition 100, the use level of above-mentioned (B3) composition is preferably more than 0.1 mass %
And 10 below mass %, more preferably more than 0.5 mass % and below 8 mass %.When use level is less than above-mentioned lower limit, there is weldering
, on the other hand, during more than the above-mentioned upper limit, there is the tendency of insulating reliability reduction in the tendency of connecing property reduction.
In above-mentioned (B) composition, other that can also contain in addition to above-mentioned (B1) composition~above-mentioned (B3) composition have
Machine acid (hereinafter referred to as (B4) composition).
As (B4) composition, the monocarboxylic acid that can be enumerated beyond (B2) composition, other organic acids.
As monocarboxylic acid, can enumerate：Formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, laurate, meat
Myristic acid, pentadecanoic acid, palmitic acid, Heptadecanoic acide, stearic acid, tuberlostearic acid, arachidic acid, behenic acids and lignoceric acid
Deng.
As other organic acids, can enumerate：Glycolic, levulic acid, lactic acid, acrylic acid, anisic acid, citric acid and pyrrole
Pyridine formic acid etc..
These (B4) compositions can be used alone, it is also possible to mixes two or more and uses.It should be noted that from suppression
Solder ball and from the viewpoint of ensuring wetability, in these (B4) compositions, preferably uses pyridine carboxylic acid.
Relative to the mass % of above-mentioned flux composition 100, the use level of above-mentioned (B4) composition is preferably more than 0.1 mass %
And 8 below mass %, more preferably more than 0.2 mass % and below 5 mass %.
In above-mentioned (B) composition, the non-dissociated type being made up of the halogenated compound of (B5) non-dissociated can also be contained and lived
Agent.Should (B5) composition can assign activation as (B5) composition and hardly to above-mentioned (B1) composition~above-mentioned
(B4) activation of composition is impacted.
As above-mentioned (B5) composition, non-salt organic compound of the halogen atom by covalent bonding can be enumerated.
As the halogenated compound, can be as chloride, bromide, fluoride by chlorine, bromine, each independent element of fluorine it is covalent
The compound that key is formed, or any 2 kinds or the compound of the respective covalent bond of whole with chlorine, bromine and fluorine.For
The dissolubility to aqueous solvent is improved, these compounds are preferably for example as halohydrin or halogenated carboxylic acid with hydroxyl, carboxylic
Base isopolarity group.As halohydrin, can enumerate for example：2,3- dibromo-propanols, 2,3- dibromos butanediol, trans- 2,3- bis- are bromo-
The chloro- 2- propyl alcohol of bromhydrin, the 1,3- bis- such as the bromo- 2- butanol of 2- butylene-1,4-diols, 1,4- bis-, tribromoneoamyl alcohol, 1,4- bis- are chloro-
The fluorinated alcohols such as the chlorhydrins such as 2- butanol, 3- fluoro pyrocatechols, other and compound as these compounds.As halo carboxylic
Acid, can enumerate：The iodos such as 2- iodo-benzoic acids, 3- iodo-benzoic acids, 2- iodopropionic acids, 5- iodo-salicylic acids, 5- iodine ortho-aminobenzoic acids
The bromines such as the chlorinated carboxylic acids such as carboxylic acid, 2- chlorobenzoic acids, 3- chloropropionic acids, 2,3- dibromo-propionic acids, 2,3- dibromosuccinic acids, 2- bromobenzoic acids
For carboxylic acid, other and compound as these compounds.These activators can be used alone, it is also possible to mix 2 kinds with
On use.
As the use level of above-mentioned (B5) composition, relative to the mass % of flux composition 100, preferably 0.1 mass % with
Upper and below 10 mass %, more preferably more than 0.5 mass % and below 5 mass %, particularly preferably more than 1 mass % and 3
Below quality %.When the use level of (B5) composition is less than above-mentioned lower limit, there is the tendency that solder sprawls reduction, the opposing party
, when more than the above-mentioned upper limit, there is the tendency of the insulating properties reduction of flux composition in face.
As total use level of above-mentioned (B) composition, relative to the mass % of flux composition 100, preferably more than 1 mass %
And 20 below mass %, more preferably more than 3 mass % and below 15 mass %, particularly preferably more than 5 mass % and 12 matter
Amount below %.When the use level of (B) composition is less than above-mentioned lower limit, there is the tendency for easily producing solder ball, on the other hand, such as
Fruit exceedes the above-mentioned upper limit, then the tendency that there is the insulating properties reduction of flux composition.
[(C) composition]
As for (C) solvent of the invention, it is necessary to when containing 20 DEG C of (C1) temperature to the solubility of water for 2g/100g with
Under solvent.If being somebody's turn to do (C1) composition, even if residuing in flux residue, it is also possible to be adequately suppressed moisture to flux residue
Absorption.In addition, from the viewpoint, solubility during 20 DEG C of the temperature of (C1) composition to water is preferably 1.5g/100g
Hereinafter, more preferably below 1g/100g, particularly preferably below 0.5g/100g.
As above-mentioned (C) composition, can enumerate for example：Diglycol monotertiary hexyl ether (1.7), ethylene glycol single 2-ethyl hexyl ether
(0.2), diglycol monotertiary 2- ethyls hexyl ether (0.3), ethylene glycol monobenzyl ether (0.4), Tri(propylene glycol)butyl ether,mixture of isomers (0.4), propane diols list
Phenylate (0.2), diethylene glycol dibutyl ether (0.3) and 1,3- ethohexadiols (0.6) etc..These solvents can be used alone, it is also possible to
Mix two or more to use.It should be noted that the numerical value in parantheses is above-mentioned solvent in 20 DEG C of temperature to the solubility of water
(unit：g/100g)
Relative to the mass % of above-mentioned (C) composition 100, the use level of above-mentioned (C1) composition needs to be more than 75 mass %.Only
Want (C) composition in (C1) multi-component solvent use level in such scope, it is possible to be adequately suppressed moisture residual to solder flux
The absorption of slag.In addition, from the viewpoint, the use level of above-mentioned (C1) composition is preferably more than 80 mass %, more preferably
It is more than 90 mass %, is even more preferably more than 99 mass %, particularly preferably 100 mass %.
Do not damaging in the range of effect of the present invention, can also be containing beyond above-mentioned (C1) composition in above-mentioned (C) composition
Solvent (hereinafter referred to as (C2) composition).
As such solvent, can enumerate for example：Diethylene glycol, DPG, triethylene glycol, hexylene glycol, hexylene glycol,
1,5- pentanediols, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diglycol monotertiary phenylate, tetraethyleneglycol dimethyl ether (MTEM).These are molten
Agent can be used alone, it is also possible to mixes two or more and uses.
Relative to the mass % of flux composition 100, the use level of above-mentioned (C) composition is preferably more than 20 mass % and 50 matter
Amount below %, more preferably more than 20 mass % and below 40 mass %.As long as the use level of solvent is within the above range, with regard to energy
The viscosity of enough solder compositions that will be obtained suitably is adjusted to suitable scope.
[(D) composition]
In flux composition of the invention, consider from viewpoints such as printings, (D) thixotropic agent can also be contained.As this
In (D) thixotropic agent for using, can enumerate：Solidification castor oil, amide-type, kaolin, cataloid, organobentonite,
Glass dust etc..These thixotropic agent can be used alone, it is also possible to mixes two or more and uses.
During using above-mentioned (D) composition, relative to the mass % of flux composition 100, its use level is preferably more than 1 mass %
And 15 below mass %, more preferably more than 2 mass % and below 10 mass %.When use level is less than above-mentioned lower limit, it is impossible to obtain
Thixotropy, there is the tendency for being susceptible to drippage, on the other hand, if it exceeds the above-mentioned upper limit, then exist thixotropy it is too high and
It is susceptible to the bad tendency of printing.
[other compositions]
In for flux composition of the invention, except above-mentioned (A) composition, above-mentioned (B) composition, above-mentioned (C) composition and
Beyond above-mentioned (D) composition, other additives can be as needed added, can also further add other resins.As
Other additives, can enumerate：Defoamer, antioxidant, modifying agent, delustering agent, foaming agent etc..As other resins, Ke Yiju
Go out acrylic resin etc..
[solder composition]
Hereinafter, solder composition of the invention is illustrated.Solder composition of the invention contains the invention described above
Flux composition and (E) solder powder described below.
Relative to the mass % of solder composition 100, the use level of above-mentioned flux composition is preferably more than 5 mass % and 35
Below quality %, more preferably more than 7 mass % and below 15 mass %, particularly preferably more than 8 mass % and 12 mass %
Below.In the situation (use level of the solder powder feelings more than 95 mass %s of the use level less than 5 mass % of flux composition
Condition) under, the flux composition as adhesive is not enough, therefore presence is difficult to inclining that flux composition and solder powder mix
To, on the other hand, flux composition use level more than 35 mass % situation (use level of solder powder be less than 65 matter
Measure the situation of %) under, when using the solder composition for obtaining, there is the tendency that can not form sufficient welding.
[(E) composition]
Preferably only it is made up of but it is also possible to be leaded solder lead-free solder powder for (E) solder powder of the invention
Powder.As the solder alloy in the solder powder, the preferably alloy with tin (Sn) as principal component.In addition, as the alloy
Second element, can enumerate：Silver (Ag), copper (Cu), zinc (Zn), bismuth (Bi), indium (In) and antimony (Sb) etc..Furthermore it is possible to according to
Need to add in the alloy other elements element of the above (the 3rd and).As other elements, can enumerate：Copper, silver, bismuth,
Indium, antimony and aluminium (A1) etc..
Here, lead-free solder powder refers to the powder of the solder metal or alloy that are not added with lead.But, in Pb-free coating feed powder
In end, it is allowed to there is the lead as inevitable impurity, in this case, the amount of lead is preferably below 100 mass ppm.
As unleaded solder powder, can specifically enumerate：Sn-Ag、Sn-Ag-Cu、Sn-Cu、Sn-Ag-Bi、Sn-Bi、
Sn-Ag-Cu-Bi、Sn-Sb、Sn-Zn-Bi、Sn-Zn、Sn-Zn-Al、Sn-Ag-Bi-In、Sn-Ag-Cu-Bi-In-Sb、In-Ag
Deng.Wherein, from from the viewpoint of weld strength, Sn-Ag-Cu class solder alloys are preferably used.And, Sn-Ag-Cu class solders
Fusing point is usually more than 200 DEG C and less than 250 DEG C.It should be noted that in Sn-Ag-Cu class solders, the relatively low body of silver content
The fusing point of the solder of system is more than 210 DEG C and less than 250 DEG C.
The average grain diameter of above-mentioned (E) composition is usually more than 1 μm and less than 40 μm, narrow from the spacing that can also tackle pad
Electric substrate from the viewpoint of, more preferably more than 1 μm and less than 35 μm, even more preferably for more than 2 μm and 35 μm with
Under, particularly preferably more than 3 μm and less than 30 μm.It should be noted that average grain diameter can utilize the grain of dynamic light scattering formula
Footpath determines device to determine.
[manufacture method of solder composition]
Solder composition of the invention can be by by (E) solder powder of the flux composition of described above and described above
End manufactures according to ratio given herein above with stirring mixing is merged.
[electric substrate]
Next, being illustrated to electric substrate of the invention.Electric substrate of the invention is to use weldering described above
Electronic unit is installed on electric substrate (printed circuit board etc.) by feed composition.
As used here as apparatus for coating, can enumerate：Screen process press, metal mask printing machine, distributor, injection point
Orchestration etc..
Furthermore it is possible to pass through Reflow Soldering operation is installed on electric substrate by electronic unit, the Reflow Soldering operation is to make
Electronic unit is set on solder composition with the coating of above-mentioned apparatus for coating, is heated under prescribed conditions using reflow soldering, will
Above-mentioned electronic unit is installed on the operation of printed circuit board.
In Reflow Soldering operation, above-mentioned electronic unit is set on above-mentioned solder composition, using reflow soldering given
Under the conditions of heated.By the Reflow Soldering operation, can sufficiently be welded between electronic unit and printed circuit board.
The result is that above-mentioned electronic unit can be installed on into above-mentioned printed circuit board.
As long as Reflow Soldering condition suitably sets according to the fusing point of solder.For example, being closed using Sn-Ag-Cu classes solder
In the case of gold, as long as carrying out the preheating of 60~120 seconds at 150~200 DEG C of temperature, and peak temperature is set as
230~270 DEG C.
In addition, solder composition of the invention and electric substrate are not limited to above-mentioned implementation method, the present invention is also included within
Deformation, improvement for being carried out in the range of the object of the invention etc. can be realized.
For example, for above-mentioned electric substrate, it is by Reflow Soldering operation that printed circuit board is Nian Jie with electronic unit,
But it is not limited to this.For example can also be using operation (LASER HEATING operation) generation heated to solder composition using laser
Printed circuit board and electronic unit are bonded for Reflow Soldering operation.In this case, as LASER Light Source, do not limit especially
It is fixed, can suitably be used according to the wavelength for meeting Metal absorption band.As LASER Light Source, can enumerate for example：Solid State Laser
(ruby, glass, YAG etc.), semiconductor laser (GaAs, InGaAsP etc.), liquid laser (pigment etc.), gas laser (He-
Ne、Ar、CO2, quasi-molecule etc.).
Embodiment
Next, by embodiment and comparative example, the present invention will be described in more detail, but the present invention does not receive these
Any restriction of example.In addition, the material that embodiment and comparative example are used is as follows.
((A) composition)
Rosin Resin A：The sour modified rosin of hydrogenation, trade name " Pine crystal KE-604 ", the chemical industry strain of waste river
Formula commercial firm manufactures
Rosin Resin A：Complete hydrogenated rosin, trade name " Foral AX ", the manufacture of Eastman Chemical companies
((B1) composition)
Activator A：Dimeric dibasic acid, trade name " UNIDYME14 ", the manufacture of Arizona Chemical companies
((B2) composition)
Activator B：3- hydroxy-2-naphthoic acids, Tokyo HuaCheng Industry Co., Ltd's manufacture
((B3) composition)
Activator C：Azelaic acid, the manufacture of An Tian KCCs
((B4) composition)
Activator D：Pyridine carboxylic acid
((C1) composition)
Solvent orange 2 A：Diglycol monotertiary hexyl ether (solubility in 20 DEG C of temperature to water is 1.7g/100g)
Solvent B：Diglycol monotertiary -2- ethyls hexyl ether (solubility in 20 DEG C of temperature to water is 0.3g/100g)
((C2) composition)
Solvent C：Tetraethyleneglycol dimethyl ether (solubility in 20 DEG C of temperature to water is infinitely great)
((D) composition)
Thixotropic agent A：Trade name " HIMAKO ", the manufacture of KF Trading companies
Thixotropic agent B：Trade name " Suripakkusu (ス リ パ ッ Network ス) H ", Nippon Kasei Chemical Company's manufacture
((E) composition)
Solder powder：5~15 μm of particle diameter (10 μm of average grain diameter), 220 DEG C of solder melt point, solder composition Sn/Ag3.0/
Cu0.5
(other compositions)
Glyoxaline compound A：2- ethyl imidazol(e)s, Tokyo HuaCheng Industry Co., Ltd's manufacture
Glyoxaline compound B：2-ethyl-4-methylimidazole, trade name " Curezol 2E4MZ ", four countries' chemical conversion strain formula meeting
Society manufactures
Antioxidant：Trade name " IRGANOX 245 ", BASF AG's manufacture
[embodiment 1]
By the mass parts of rosin Resin A 31, the mass parts of rosin resin B 15.5, the mass parts of thixotropic agent A 5, thixotropic agent B
0.5 mass parts, the mass parts of solvent orange 2 A 33.3, the mass parts of activator A 2, the mass parts of activator C 2, the mass parts of activator D 6, work
The mass parts of agent E 0.2 and the mass parts of antioxidant 4.5 input container, are obtained by mixing solder flux and combine using planetary-type mixer
Thing.
Then, the mass % of flux composition 11 and the mass % of solder powder 89 (the amounting to 100 mass %) input that will be obtained
Container, and mixed using planetary-type mixer, thus it is prepared for solder composition.
[embodiment 2~3]
Coordinate various materials according to the composition shown in table 1, in addition, solder flux combination has been obtained similarly to Example 1
Thing and solder composition.
[comparative example 1~5]
Coordinate various materials according to the composition shown in table 1, in addition, solder flux combination has been obtained similarly to Example 1
Thing and solder composition.
The evaluation ＞ of ＜ flux compositions and solder composition
Evaluation (the insulating reliability experiment 1 of flux composition and solder composition has been carried out by method as described below
~4, meltbility).The obtained results are shown in table 1.It should be noted that for insulating reliability experiment 3, to embodiment
1 and comparative example 1~4 evaluated, for insulating reliability experiment 4 for, embodiment 1, comparative example 2 and comparative example 4 are entered
Evaluation is gone.
(1) insulating reliability experiment 1 (85 DEG C, 85%, 12.5V, 0 hour)
Prepare the substrate (line with comb pattern：400 μm, 500 μm of interval), after carrying out ungrease treatment (isopropanol),
By silk-screen printing (mask thickness：0.12mm) print flux composition.Then, set on the flux composition for be printed in substrate
Put glass cover-plate (size：18mm × 18mm, thickness：0.14mm).Then, in the case where preheating temperature is set into 150~200 DEG C 90 seconds
Clock, more than 220 DEG C of retention time is set to 53 seconds and carries out Reflow Soldering under conditions of peak temperature is set into 244 DEG C, made
It is tested substrate.
According to the method described in IPC-TM-650 2.6.3.7, in the experiment substrate input thermostat that will be obtained, in temperature
Insulating resistance value is determined under conditions of 85 DEG C of degree, relative humidity 85%, measure voltage 12.5V.Then, based on the insulated electro for obtaining
Resistance, the insulating reliability according to following benchmark evaluations.
◎：Insulating resistance value is 1 × 109More than Ω.
○：Insulating resistance value is 1 × 108Ω is less than 1 × 109Ω。
△：Insulating resistance value is 5 × 107Ω is less than 1 × 108Ω。
×：Insulating resistance value is less than 5 × 107Ω。
(2) insulating reliability experiment 2 (85 DEG C, 85%, 12.5V, 300 hours)
Substrate is tested by testing 1 same method system with insulating reliability.
According to the method described in IPC-TM-650 2.6.3.7, in the experiment substrate input thermostat that will be obtained, in temperature
Under conditions of 85 DEG C of degree, relative humidity 85%, measure voltage 12.5V, determine by the insulating resistance value after 300 hours.Then,
Based on the insulating resistance value for obtaining, the insulating reliability according to following benchmark evaluations.
◎：Insulating resistance value is 1 × 108More than Ω.
○：Insulating resistance value is 5 × 107Ω is less than 1 × 108Ω。
△：Insulating resistance value is 1 × 107Ω is less than 1 × 108Ω。
×：Insulating resistance value is less than 1 × 107Ω。
(3) insulating reliability experiment 3 (125 DEG C, 12.5V, 0 hour)
Substrate is tested by testing 1 same method system with insulating reliability.
According to the method described in IPC-TM-650 2.6.3.7, in the experiment substrate input thermostat that will be obtained, in temperature
Insulating resistance value is determined under conditions of 125 DEG C of degree, measure voltage 12.5V.Then, based on the insulating resistance value for obtaining, under
State benchmark evaluation insulating reliability.
○：Insulating resistance value is 1 × 107More than Ω.
△：Insulating resistance value is 5 × 106Ω is less than 1 × 107Ω。
×：Insulaion resistance is less than 5 × 106Ω。
(4) insulating reliability experiment 4 (125 DEG C, 12.5V, migration test)
Substrate is tested by testing 1 same method system with insulating reliability.
According to the method described in IPC-TM-650 2.6.3.7, in the experiment substrate input thermostat that will be obtained, in temperature
Migration test has been carried out under conditions of 125 DEG C of degree, measure voltage 12.5V.Then, determine until occurring short caused by migration
The time on road, the insulating reliability according to following benchmark evaluations.
○：Until it is more than 500 hours that the short-circuit time caused by migration occurs.
△：Until short-circuit time of the generation caused by migration is for 300 hours less than 500 hours.
×：Until the short-circuit time occurred caused by migration is less than 300 hours.
(5) meltbility
The use of 49 perforates of diameter phi 0.2mm, thickness are set is the version of 0.12mm, with print speed printing speed on substrate
50mm/ seconds, the condition printing solder composition of coining 0.2N.Then, in 180 DEG C, 60 seconds of preheating temperature and peak temperature 260
DEG C, carry out Reflow Soldering under conditions of 10 seconds, system is tested substrate.In the middle of the printing position (49) of experiment substrate, survey
Determine the melting position after melt solder, the meltbility according to following benchmark evaluation.
○：Melting position is more than 35.
△：Melting position is 25 less than 35.
×：Melting position is less than 25.
Result as shown in Table 1 it has been confirmed that for solder composition of the invention (embodiment 1~3), it is above-mentioned absolutely
The result of edge reliability test is good, and the result of meltbility is also good.It should be noted that above-mentioned insulating reliability experiment is former
The component residue that this imagination is volatilized in Reflow Soldering is in the situation in flux residue.It is possible thereby to confirm, solder of the invention
The welding property excellent of composition, and also there is enough insulating reliabilities in the welding for lower electrode part.
Understand by contrast, for the solder composition obtained in comparative example 1~5, above-mentioned insulating reliability experiment
Result and meltbility result at least any one it is not enough.
Claims (6)
1. a kind of flux composition, it contains (A) rosin resinoid, (B) activator and (C) solvent,
(B) composition contains (B1) polymerized fatty acid, (B2) aromatic carboxylic acid and (B3) aliphatic dicarboxylic acid,
Solubility when (C) composition contains 20 DEG C of (C1) temperature to water is the solvent of below 2g/100g,
Relative to the mass % of (C) composition 100, the use level of (C1) composition is more than 75 mass %.
2. flux composition according to claim 1, wherein, (C) composition is selected from diglycol monotertiary hexyl ether, ethylene glycol
It is single 2-ethyl hexyl ether, diglycol monotertiary 2- ethyls hexyl ether, ethylene glycol monobenzyl ether, Tri(propylene glycol)butyl ether,mixture of isomers, propane diols monophenyl ether, two sweet
At least one solvent in alcohol butyl oxide and 1,3- ethohexadiols.
3. flux composition according to claim 1, it does not contain glyoxaline compound.
4. a kind of solder composition, it contains the flux composition and solder powder any one of claims 1 to 3.
5. solder composition according to claim 4, it is in the lower section that will have electrode terminal in the lower section of electronic unit
Electrod assembly is used when being installed on electric substrate.
6. a kind of electric substrate, it is that electronic unit is installed on electric substrate by solder composition described in usage right requirement 4
.
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| JP2015194588A JP6310893B2 (en) | 2015-09-30 | 2015-09-30 | Flux composition, solder composition, and method for manufacturing electronic substrate |
| JP2015-194588 | 2015-09-30 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109290701A (en) * | 2017-07-25 | 2019-02-01 | 株式会社田村制作所 | The manufacturing method of solder composition, electric substrate and electric substrate |
| CN109719422A (en) * | 2017-10-27 | 2019-05-07 | 株式会社田村制作所 | Solder composition and electric substrate |
| CN110883428A (en) * | 2018-09-10 | 2020-03-17 | 株式会社田村制作所 | Solder composition for jetting dispenser and method for manufacturing electronic substrate |
| CN111225764A (en) * | 2018-09-27 | 2020-06-02 | 株式会社田村制作所 | Solder composition and electronic substrate |
| CN112570930A (en) * | 2019-09-27 | 2021-03-30 | 株式会社田村制作所 | Flux composition for soldering and soldering method |
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| US10913132B2 (en) | 2017-08-30 | 2021-02-09 | Tamura Corporation | Solder composition, electronic board, and bonding method |
| JP6674982B2 (en) * | 2017-08-30 | 2020-04-01 | 株式会社タムラ製作所 | Solder composition and electronic substrate |
| JP7331579B2 (en) * | 2018-09-28 | 2023-08-23 | 荒川化学工業株式会社 | Lead-free solder flux, lead-free solder paste |
| JP6993594B2 (en) * | 2020-03-27 | 2022-02-04 | 千住金属工業株式会社 | Flux and solder paste |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101327552A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Low solid content halogenide-free water-based type cleaning-free scaling powder |
| CN101695794A (en) * | 2009-10-23 | 2010-04-21 | 东莞市特尔佳电子有限公司 | Halogen-free tin-bismuth-copper soldering paste and preparation method thereof |
| CN102756220A (en) * | 2011-04-26 | 2012-10-31 | 荒川化学工业株式会社 | Flux for dip soldering |
| CN103586602A (en) * | 2012-08-16 | 2014-02-19 | 株式会社田村制作所 | Solder composition and printed circuit board using the same |
| CN104070307A (en) * | 2013-03-28 | 2014-10-01 | 株式会社田村制作所 | Flux composition and solder composition |
| CN104159701A (en) * | 2012-03-12 | 2014-11-19 | 株式会社弘辉 | Flux, solder composition and method for producing electronic circuit mounting substrate |
| CN104741833A (en) * | 2013-12-27 | 2015-07-01 | 株式会社田村制作所 | Solder composition |
| JP2015160233A (en) * | 2014-02-27 | 2015-09-07 | 株式会社タムラ製作所 | Flux composition, solder composition and printed wiring board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5246452B2 (en) * | 2010-09-24 | 2013-07-24 | 荒川化学工業株式会社 | Rosin flux and solder paste for soldering |
| KR102018293B1 (en) * | 2012-01-31 | 2019-09-06 | 삼성전자주식회사 | Flux composition for forming a solder bump and method of fabricating a semiconductor device using the composition |
| JP6160861B2 (en) * | 2012-06-13 | 2017-07-12 | 荒川化学工業株式会社 | Solder flux base resin, solder flux and solder paste |
| JP5887330B2 (en) * | 2013-12-26 | 2016-03-16 | 株式会社タムラ製作所 | Solder composition and printed wiring board using the same |
| JP2015131336A (en) * | 2014-01-15 | 2015-07-23 | 株式会社タムラ製作所 | Solder composition and printed wiring board prepared using the same |
-
2015
- 2015-09-30 JP JP2015194588A patent/JP6310893B2/en active Active
-
2016
- 2016-09-14 CN CN201610825845.3A patent/CN106862802A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101327552A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Low solid content halogenide-free water-based type cleaning-free scaling powder |
| CN101695794A (en) * | 2009-10-23 | 2010-04-21 | 东莞市特尔佳电子有限公司 | Halogen-free tin-bismuth-copper soldering paste and preparation method thereof |
| CN102756220A (en) * | 2011-04-26 | 2012-10-31 | 荒川化学工业株式会社 | Flux for dip soldering |
| CN104159701A (en) * | 2012-03-12 | 2014-11-19 | 株式会社弘辉 | Flux, solder composition and method for producing electronic circuit mounting substrate |
| CN103586602A (en) * | 2012-08-16 | 2014-02-19 | 株式会社田村制作所 | Solder composition and printed circuit board using the same |
| CN104070307A (en) * | 2013-03-28 | 2014-10-01 | 株式会社田村制作所 | Flux composition and solder composition |
| CN104741833A (en) * | 2013-12-27 | 2015-07-01 | 株式会社田村制作所 | Solder composition |
| JP2015160233A (en) * | 2014-02-27 | 2015-09-07 | 株式会社タムラ製作所 | Flux composition, solder composition and printed wiring board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109290701A (en) * | 2017-07-25 | 2019-02-01 | 株式会社田村制作所 | The manufacturing method of solder composition, electric substrate and electric substrate |
| CN109290701B (en) * | 2017-07-25 | 2021-09-07 | 株式会社田村制作所 | Solder composition, electronic substrate, and method for manufacturing electronic substrate |
| CN109719422A (en) * | 2017-10-27 | 2019-05-07 | 株式会社田村制作所 | Solder composition and electric substrate |
| CN110883428A (en) * | 2018-09-10 | 2020-03-17 | 株式会社田村制作所 | Solder composition for jetting dispenser and method for manufacturing electronic substrate |
| CN111225764A (en) * | 2018-09-27 | 2020-06-02 | 株式会社田村制作所 | Solder composition and electronic substrate |
| CN112570930A (en) * | 2019-09-27 | 2021-03-30 | 株式会社田村制作所 | Flux composition for soldering and soldering method |
| CN112570930B (en) * | 2019-09-27 | 2023-10-27 | 株式会社田村制作所 | Soldering flux composition and soldering method |
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| Publication number | Publication date |
|---|---|
| JP6310893B2 (en) | 2018-04-11 |
| JP2017064758A (en) | 2017-04-06 |
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