CN1108811A - 集成电路电子信息储存卡及其封装方法 - Google Patents

集成电路电子信息储存卡及其封装方法 Download PDF

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CN1108811A
CN1108811A CN94116968A CN94116968A CN1108811A CN 1108811 A CN1108811 A CN 1108811A CN 94116968 A CN94116968 A CN 94116968A CN 94116968 A CN94116968 A CN 94116968A CN 1108811 A CN1108811 A CN 1108811A
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integrated circuit
chip
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contact panel
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胡斌
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45169—Platinum (Pt) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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Abstract

一种制作集成电路电子信息储存卡(简称IC 卡)的封装工艺，首先将IC芯片1用集成电路粘合 胶直接固定在柔性接点板上(双面覆铜印刷线路板)， 再用超声点焊的办法将IC芯片和柔性板上的对应 接点用白金(或银)丝连接，外面加上集成电路封装 胶。然后在电路测验合格的基础上再将上述总成用 粘接剂固定到预先模制好的其形状与所述总成的外 形一致的卡基的凹槽内。本发明还提供一种结构简 单的集成电路电子信息储存卡。

Description

本发明涉及一种集成电路电子信息储存卡及其封装方法。
随着世界电子科学技术的进步，一种新型的集成电路电子信息储存卡已开始进入人民生活并逐步取代现有的低保密度的磁性信息储存卡。这种新的集成电路电子信息卡（简称IC卡）主要可用作银行取款卡、各种信用卡、付款卡、身份证以及门禁管理卡等薄片式电子信息储存卡。IC卡具有携带信息量大、保密性强、性能可靠和经久耐用等特点，所以它应用广泛，是未来电子信息储存卡的发展方向。
IC卡可分为普通记忆型和智能型（带CPU），但无论哪种类型，IC卡生产的一个关键性问题是它的封装工艺。图4显示了目前世界上生产IC卡的主要公司布尔（BULL，法国）、菲利普和金伯格等公司的有关基本封装原理和基本封装工艺。从图中可以看到上述以布尔公司（IC卡生产的先驱）为主的封装方式基本上是由五层构件迭压来构成的。其工艺过程是：先固定已经压制好的卡基片2，将方形环状的绝缘胶套7与卡基2经热压粘合在一起。然后在环形胶套7的中间卡基片上涂一层集成电路粘合胶后，将IC芯片1固定在卡基2上。再将一块极薄的双面覆铜的柔性接点板3通过超声压焊技术与IC芯片1焊接在一起，并通过压制与胶套7压合。然后再用超声压焊技术将柔性接线板6与柔性接点板3接合在一起（见图5）。这一生产工艺的优点在于定位精确，每一层的厚度可以控制得很好，所以卡的平整度好，表面美观。它的问题在由于产品检验只能在成品完成后进行，所以成品率低（百分之九十以下），而且由于工艺复杂，也是其生产成本高的一个主要原因。
本发明的目的是提供一种工艺简单，不需要复杂昂贵的生产设备，并且成品率高，成本非常低的集成电路电子信息储存卡的封装工艺以及一种结构简单的集成电路电子信息储存卡。
本发明的另一个目的是提供一种结构比目前的集成电路电子储存信息卡更为简单的集成电路电子储存信息卡。
本发明的目的是这样来实现的：本发明的封装方法包括如下步骤：
a）将IC芯片用集成电路粘合胶直接固定在其横截面积大于IC芯片的横截面积的柔性接点板上;
b）用超声点焊的方法将所述IC芯片和所述柔性接点板上的对应接点用高导电率的金属丝连接起来;
c）连接好的所述IC芯片和所述柔性接点板构成一个总成，其外面加上集成电路封装胶;
d）在电路测验合格的基础上将所述总成用粘接剂固定在预先模制好的其形状与所述总成的外形一致的卡基的凹槽内，使所述柔性接点板的上表面与所述卡基的表面保持齐平。
本发明的集成电路电子储存信息卡包括具有凹槽的卡基，IC芯片和柔性接点板，所述IC芯片与所述柔性接点板的对应接点之间用高导电率的金属丝连接。
下面将结合附图详细描述本发明的实施例。
图1是表示本发明的集成电路电子信息储存卡的封装工艺的侧剖面图;
图2是表示IC芯片与柔性接点板构成的总成的侧剖面图;
图3是表示封装好的集成电路电子信息储存卡的侧剖面图;
图4是表示现有技术的信息储存卡的封装过程;
图5是表示封装好的现有技术的信息储存卡的侧剖面图。
本发明的工艺针对上述情况采用了完全不同的封装方式（见图1至3）。工艺可基本分为两步：首先将IC芯片1用集成电路粘合胶直接固定在其横截面积大于IC芯片1的横截面积的柔性接点板3上（双面覆铜印刷线路板），再用超声点焊的办法将IC芯片1和柔性板3上的对应接点用高导电率的金属丝4，例如白金（或银）丝连接，连接好的所述IC芯片1和所述柔性接点板3构成一个总成，外面加上集成电路封装胶5（见图2）。第二步在电路测验合格的基础上再将上述总成用粘接剂固定到预先模制好的其形状与所述总成的外形一致的卡基2的凹槽内，使所述柔性接点板3的上表面与所述卡基2的表面基本保持齐平（见图3）。封装定位的精度主要由模具控制，这完全可以满足工艺精度要求而使表面平整、光洁、无凸起。此设计大大简化了封装工艺，降低了设备的复杂程度，避免了进口IC卡生产专用设备所需的高额投资并提高了成品率，从而降低了生产成本。
图5是本发明的集成电路电子储存信息卡，它包括具有凹槽的卡基2、IC芯片1和柔性接点板3，所述IC芯片1与所述柔性接点板3的对应接点之间用高导电率的金属丝4连接，这些金属丝4可以是白金或银丝。这种信息卡要比布尔公司用五层构件迭压而成的信息卡结构要简单。

Claims (4)

1、一种集成电路电子储存信息卡的封装方法，其特征是包括如下步骤：
a)将IC芯片用集成电路粘合胶直接固定在其横截面积大于IC芯片的横截面积的柔性接点板上；
b)用超声点焊的方法将所述IC芯片和所述柔性接点板上的对应接点用高导电率的金属丝连接起来；
c)连接好的所述IC芯片和所述柔性接点板构成一个总成，其外面加上集成电路封装胶；
d)在电路测验合格的基础上将所述总成用粘接剂固定在预先模制好的其形状与所述总成的外形一致的卡基的凹槽内，使所述柔性接点板的上表面与所述卡基的表面保持齐平。
2、按照权利要求1的封装方法，其特征是所述高导电率的金属丝为白金丝或银丝。
3、一种集成电路电子储存信息卡，包括具有凹槽的卡基，IC芯片和柔性接点板，其特征是所述IC芯片与所述柔性接点板的对应接点之间用高导电率的金属丝连接。
4、按照权利要求3的集成电路电子储存信息卡，其特征是所述高导电率的金属丝是白金丝或银丝。
CN94116968A 1994-10-19 1994-10-19 集成电路电子信息储存卡及其封装方法 Pending CN1108811A (zh)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1116655C (zh) * 1996-08-02 2003-07-30 施伦贝格尔体系公司 具有两种连接方式的集成电路卡
WO2008061450A1 (en) * 2006-11-24 2008-05-29 Beijing Watch Data System Co, Ltd. Card with interface contact and its manufacturing method
CN100412891C (zh) * 2005-09-20 2008-08-20 财团法人工业技术研究院 射频识别卷标结合微组件的封装结构与方法
CN102298724A (zh) * 2011-08-03 2011-12-28 谢忠 一种ic卡电子元件的胶合式整装工艺
CN101490196B (zh) * 2006-07-25 2012-12-19 东亚合成株式会社 固定ic模块用热熔胶粘剂、使用该胶粘剂的叠层带和ic卡
CN102917886A (zh) * 2010-03-11 2013-02-06 联邦印刷厂有限公司 含电路的安全文件和/或有价值文件

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1116655C (zh) * 1996-08-02 2003-07-30 施伦贝格尔体系公司 具有两种连接方式的集成电路卡
CN100412891C (zh) * 2005-09-20 2008-08-20 财团法人工业技术研究院 射频识别卷标结合微组件的封装结构与方法
CN101490196B (zh) * 2006-07-25 2012-12-19 东亚合成株式会社 固定ic模块用热熔胶粘剂、使用该胶粘剂的叠层带和ic卡
WO2008061450A1 (en) * 2006-11-24 2008-05-29 Beijing Watch Data System Co, Ltd. Card with interface contact and its manufacturing method
CN102917886A (zh) * 2010-03-11 2013-02-06 联邦印刷厂有限公司 含电路的安全文件和/或有价值文件
CN102917886B (zh) * 2010-03-11 2016-09-14 联邦印刷厂有限公司 含电路的安全文件和/或有价值文件
CN102298724A (zh) * 2011-08-03 2011-12-28 谢忠 一种ic卡电子元件的胶合式整装工艺

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