CN110875234A - 静电卡盘、具有静电卡盘的附接设备以及附接方法 - Google Patents

静电卡盘、具有静电卡盘的附接设备以及附接方法 Download PDF

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Publication number
CN110875234A
CN110875234A CN201910798852.2A CN201910798852A CN110875234A CN 110875234 A CN110875234 A CN 110875234A CN 201910798852 A CN201910798852 A CN 201910798852A CN 110875234 A CN110875234 A CN 110875234A
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CN
China
Prior art keywords
workpiece
electrostatic chuck
support block
electrostatic
expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910798852.2A
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English (en)
Chinese (zh)
Inventor
金相午
朴熙寅
林炯文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aps Holding Co Ltd
AP Systems Inc
Original Assignee
Aps Holding Co Ltd
AP Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aps Holding Co Ltd, AP Systems Inc filed Critical Aps Holding Co Ltd
Publication of CN110875234A publication Critical patent/CN110875234A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
CN201910798852.2A 2018-08-29 2019-08-27 静电卡盘、具有静电卡盘的附接设备以及附接方法 Pending CN110875234A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180102193A KR102266890B1 (ko) 2018-08-29 2018-08-29 정전척, 이를 포함하는 합착 설비 및 합착 방법
KR10-2018-0102193 2018-08-29

Publications (1)

Publication Number Publication Date
CN110875234A true CN110875234A (zh) 2020-03-10

Family

ID=69668681

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910798852.2A Pending CN110875234A (zh) 2018-08-29 2019-08-27 静电卡盘、具有静电卡盘的附接设备以及附接方法

Country Status (4)

Country Link
JP (1) JP2020036004A (ko)
KR (1) KR102266890B1 (ko)
CN (1) CN110875234A (ko)
TW (1) TWI807080B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102600409B1 (ko) * 2018-11-21 2023-11-10 에이피시스템 주식회사 가압 장치, 접합 설비 및 접합 방법
KR102154685B1 (ko) 2020-05-19 2020-09-10 ㈜ 엘에이티 정전력을 이용한 폴더블 디스플레이 제조용 라미네이터
KR102154686B1 (ko) 2020-05-19 2020-09-10 ㈜ 엘에이티 정전척 방식의 폴더블 디스플레이 제조용 라미네이터
CN113325624B (zh) * 2021-06-10 2022-10-18 业成科技（成都）有限公司 可移除黏接件及显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004058246A (ja) * 2002-07-31 2004-02-26 Sharp Corp チャック装置
US20120006489A1 (en) * 2009-03-26 2012-01-12 Shogo Okita Plasma processing apparatus and plasma processing method
US20140002975A1 (en) * 2012-06-29 2014-01-02 Kyung-su Lee Display device, and method and apparatus for manufacturing the same
KR20140089053A (ko) * 2013-01-02 2014-07-14 세메스 주식회사 플라즈마를 이용한 기판처리장치
KR20150011560A (ko) * 2013-07-23 2015-02-02 에이피시스템 주식회사 기판 지지 모듈 및 이를 구비하는 기판 처리 장치
US20160105971A1 (en) * 2014-10-08 2016-04-14 Samsung Display Co., Ltd. Deposition apparatus and deposition method using the same
JP2018078174A (ja) * 2016-11-08 2018-05-17 株式会社アルバック 静電チャック付きトレイ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124299A (ja) * 1998-10-16 2000-04-28 Hitachi Ltd 半導体装置の製造方法および半導体製造装置
JP2003213430A (ja) * 2002-01-18 2003-07-30 Mitsubishi Heavy Ind Ltd 製膜装置の基板加熱装置
KR101619783B1 (ko) 2014-02-26 2016-05-23 안성룡 플렉시블 소재 곡면 합착장치
KR101578442B1 (ko) * 2015-04-22 2015-12-21 (주)제이스텍 다이어프램을 이용한 엣지 윈도우 타입 패널의 합착장치
KR20170029707A (ko) * 2015-09-07 2017-03-16 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
CN106920830B (zh) * 2017-03-30 2018-09-04 武汉华星光电技术有限公司 曲面屏贴合装置及其贴合方法
CN107481958B (zh) * 2017-07-31 2020-02-18 京东方科技集团股份有限公司 对位贴合设备和对位贴合方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004058246A (ja) * 2002-07-31 2004-02-26 Sharp Corp チャック装置
US20120006489A1 (en) * 2009-03-26 2012-01-12 Shogo Okita Plasma processing apparatus and plasma processing method
US20140002975A1 (en) * 2012-06-29 2014-01-02 Kyung-su Lee Display device, and method and apparatus for manufacturing the same
KR20140089053A (ko) * 2013-01-02 2014-07-14 세메스 주식회사 플라즈마를 이용한 기판처리장치
KR20150011560A (ko) * 2013-07-23 2015-02-02 에이피시스템 주식회사 기판 지지 모듈 및 이를 구비하는 기판 처리 장치
US20160105971A1 (en) * 2014-10-08 2016-04-14 Samsung Display Co., Ltd. Deposition apparatus and deposition method using the same
JP2018078174A (ja) * 2016-11-08 2018-05-17 株式会社アルバック 静電チャック付きトレイ

Also Published As

Publication number Publication date
JP2020036004A (ja) 2020-03-05
TW202010037A (zh) 2020-03-01
TWI807080B (zh) 2023-07-01
KR20200025204A (ko) 2020-03-10
KR102266890B1 (ko) 2021-06-21

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