CN110870396A - 一种屏蔽罩和终端 - Google Patents

一种屏蔽罩和终端 Download PDF

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Publication number
CN110870396A
CN110870396A CN201780092999.9A CN201780092999A CN110870396A CN 110870396 A CN110870396 A CN 110870396A CN 201780092999 A CN201780092999 A CN 201780092999A CN 110870396 A CN110870396 A CN 110870396A
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CN201780092999.9A
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CN110870396B (zh
Inventor
刘静平
叶连杰
靳宏伟
曹胜辉
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Honor Device Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN202110310881.7A priority Critical patent/CN113226002B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明实施例提供了一种屏蔽罩和终端。所述屏蔽罩(300)包括：罩体侧面(302)和罩体上表面(304)；所述罩体上表面(304)包括至少一个第一半切线结构(310)；所述第一半切线结构(310)围成一个半封闭或封闭的形状，所述第一半切线结构(310)包括位于所述罩体外侧的第一凹槽(312)；所述罩体上表面(304)中除所述至少一个第一半切线结构(310)以外的罩体的厚度为第一厚度，所述第一凹槽(312)处的罩体的厚度为第二厚度，所述第二厚度小于所述第一厚度。本发明实施例提供的屏蔽罩体积小、成本低，且易于维修屏蔽罩内的电子元件。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN201780092999.9A 2017-07-31 2017-07-31 一种屏蔽罩和终端 Active CN110870396B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110310881.7A CN113226002B (zh) 2017-07-31 2017-07-31 一种屏蔽罩和终端

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/095196 WO2019023855A1 (zh) 2017-07-31 2017-07-31 一种屏蔽罩和终端

Related Child Applications (1)

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CN202110310881.7A Division CN113226002B (zh) 2017-07-31 2017-07-31 一种屏蔽罩和终端

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CN110870396A true CN110870396A (zh) 2020-03-06
CN110870396B CN110870396B (zh) 2021-03-30

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WO (1) WO2019023855A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113747776B (zh) * 2021-08-12 2022-09-20 荣耀终端有限公司 屏蔽罩、电路板组件及电子设备
CN117459867A (zh) * 2023-12-07 2024-01-26 瑞声光电科技(常州)有限公司 麦克风

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2840619Y (zh) * 2005-07-29 2006-11-22 林江俊 防电磁干扰遮蔽罩结构
CN2877210Y (zh) * 2005-09-29 2007-03-07 洪进富 防电磁干扰遮蔽罩结构
CN202121923U (zh) * 2011-06-08 2012-01-18 鸿富锦精密工业（深圳）有限公司 可拆式遮蔽装置
CN206005102U (zh) * 2016-09-20 2017-03-08 青岛海信移动通信技术股份有限公司 一种屏蔽罩、电路板以及移动终端

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503944B (zh) * 2013-04-18 2015-10-11 矽品精密工業股份有限公司 屏蔽罩、半導體封裝件及其製法暨具有該屏蔽罩之封裝結構
CN104768340A (zh) * 2014-01-03 2015-07-08 富泰华精密电子（郑州）有限公司 移动终端
KR102223618B1 (ko) * 2014-02-21 2021-03-05 삼성전자주식회사 쉴드캔 고정구조
CN105101763A (zh) * 2014-05-09 2015-11-25 国基电子（上海）有限公司 屏蔽罩
CN104602480B (zh) * 2015-01-15 2017-11-14 青岛海信电器股份有限公司 一种电路板支架
CN205249700U (zh) * 2015-11-20 2016-05-18 上海凌云天博光电科技有限公司 一种屏蔽罩及屏蔽系统
CN105338772A (zh) * 2015-11-24 2016-02-17 小米科技有限责任公司 电子设备的前壳组件和金属前壳结构
CN106028626A (zh) * 2016-07-22 2016-10-12 深圳天珑无线科技有限公司 印制电路板和电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2840619Y (zh) * 2005-07-29 2006-11-22 林江俊 防电磁干扰遮蔽罩结构
CN2877210Y (zh) * 2005-09-29 2007-03-07 洪进富 防电磁干扰遮蔽罩结构
CN202121923U (zh) * 2011-06-08 2012-01-18 鸿富锦精密工业（深圳）有限公司 可拆式遮蔽装置
CN206005102U (zh) * 2016-09-20 2017-03-08 青岛海信移动通信技术股份有限公司 一种屏蔽罩、电路板以及移动终端

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Publication number Publication date
CN110870396B (zh) 2021-03-30
WO2019023855A1 (zh) 2019-02-07
CN113226002B (zh) 2022-12-20
CN113226002A (zh) 2021-08-06

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Patentee after: Honor Device Co.,Ltd.

Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen

Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd.