CN110845825B - 一种led封装用纳米二氧化硅改性环氧树脂组合物 - Google Patents
一种led封装用纳米二氧化硅改性环氧树脂组合物 Download PDFInfo
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Abstract
Description
【技术领域】
本发明属于聚酰亚胺光刻胶技术领域,特别是涉及一种LED封装用纳米二氧化硅改性环氧树脂组合物。
【背景技术】
随着LED照明和显示行业的成熟和兴起,LED封装材料的需求量越来越大、对品质的需求越来越高。LED封装材料主要分为两大类材料:环氧灌封材料和有机硅类灌封材料。这两种材料都各有其性能优势,有机硅材料由于硅氧键十分牢固,因此在耐热、耐紫外和耐老化黄变方面有着极大的优势,但是有机硅类灌封材料由于分子极性较弱、分子间作用力小,因此对空气中的水、氧阻隔性能不好,透湿透氧的问题会造成LED灯珠大量失效。而环氧封装材料在透湿透氧性能上优于有机硅材料,却不耐老化和黄变。在此问题基础上,越来越多的封装材料开发者及生产商采用脂环族环氧替代/部分替代容易老化黄变的芳香族环氧,并采用酸酐固化剂固化,更容易得到致密和阻隔水氧性能好的立体结构。
脂环族环氧采用酸酐固化体系,虽然耐老化耐黄变和水氧阻隔性较好的性能都得到了大幅度的提升,但是此固化体系得到的材料偏脆,三点弯曲的强度和LED行业的信赖性测试——-40℃到135℃冷热冲击测试很通过。并且水氧阻隔性能仍旧是达不到户外显示和照明的应用。
因此,需要提供一种新的LED封装用纳米二氧化硅改性环氧树脂组合物来解决上述问题。
【发明内容】
本发明的主要目的在于提供一种LED封装用纳米二氧化硅改性环氧树脂组合物,其固化得到的封装胶韧性好、三点弯曲强度高、尺寸稳定性高且气体阻隔性能好。
本发明通过如下技术方案实现上述目的:一种LED封装用纳米二氧化硅改性环氧树脂组合物,其包括组分A、C、D、E,其中,
A为脂环族环氧树脂化合物,其化学式为
C为球形纳米二氧化硅填料,其平均粒径小于50nm;
D为酸酐固化剂;
E为季铵盐类固化促进剂;
以所述组分A重量为100份计,所述组分C的重量百分比为1%~10%;所述季铵盐固化促进剂的重量百分比为0.5%~18%;所述酸酐固化剂的重量百分比为55%~175%。
进一步的,还包括组分B,组分B为液态芳香族环氧树脂;以所述组分A重量为100份计,所述组分B的重量百分比为0~70%。
进一步的,所述R基团是烃基、醚键、酯键、碳酸酯键、酰胺键羰基以及环氧环己烯残基中的一种或多种组合。所述脂环族环氧树脂化合物的具体化学结构为下述结构中的一种:
其中m、N1、N2均为1~10的整数。
进一步的,所述液态芳香族环氧树脂为液态双酚A环氧树脂、液态双酚F环氧树脂或液态萘型环氧树脂中的一种。
进一步的,在制备过程中,所述球形纳米二氧化硅以一分散液的形式加入,将含有球形纳米二氧化硅的所述分散液添加到组分A、或组分B、或组分A与组分B的混合物中,搅拌混合均匀,再在减压蒸馏的条件下脱除所述分散液中的溶剂,得到纳米二氧化硅杂化改性的环氧树脂A、或环氧树脂B、或环氧树脂A与环氧树脂B的混合物。由于纳米二氧化硅表面部分极性基团——羟基的存在,纳米二氧化硅可以与环氧官能团形成稳定的、不易团聚的氢键或共价键作用,从而使得环氧树脂的性能得到大幅度改善。
进一步的,所述分散液的溶剂为N,N-二甲基乙酰胺、丙二醇甲醚醋酸酯、γ-丁内酯、甲乙酮、丙酮、甲醇、乙醇、异丙醇、甲苯、二甲苯中的一种或多种。
进一步的,所述分散液中所述纳米二氧化硅的含量为2%~40%。
市售的光学透明级纳米二氧化硅分散液主要有日产化学生产的DMAc-ST、PGMEA-ST、MEK-ST和MA-ST等等一系列产品。
进一步的,所述酸酐固化剂包括六氢苯酐、2-甲基六氢苯酐和4-甲基六氢苯酐中的一种或多种。
进一步的,所述季铵盐固化促进剂包括苄基三乙基羧酸铵、苄基三甲基羧酸铵、苯基三乙基羧酸铵和苯基三甲基羧酸铵、苄基三乙基异辛酸铵、苄基三甲基异辛酸铵、苯基三乙基异辛酸铵和苯基三甲基异辛酸铵、苄基三乙基正癸酸铵、苄基三甲基正癸酸铵、苯基三乙基正癸酸铵和苯基三甲基正癸酸铵。
与现有技术相比,本发明一种LED封装用纳米二氧化硅改性环氧树脂组合物的有益效果在于:在脂环族环氧树脂的基础上,采用有机无机杂化的方法,真正在纳米尺度添加二氧化硅颗粒,二氧化硅平均尺寸为小于50纳米,并由于二氧化硅表面的羟基存在,与环氧基团发生作用,实现稳定的分散,从而采用改性过的环氧树脂固化得到的封装胶,韧性得到大幅度改善,三点弯曲强度明显上升;尺寸稳定性(CTE值)得到明显改善;冷热冲击500个循环过后无分层死灯;气体阻隔性能大幅度提高,可以用在户外显示领域。
【附图说明】
图1是本发明中二氧化硅杂化改性后环氧封装胶的尺寸稳定性谱图;
图2是本发明中纳米级二氧化硅在环氧树脂中的分散状态显示图。
【具体实施方式】
以下参考说明书附图介绍本发明的多个优选实施例,使其技术内容更加清楚和便于理解。本发明可以通过许多不同形式的实施例来得以体现,本发明的保护范围并非仅限于文中提到的实施例。
实施例1:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,加入日产化学产品PGMEA-ST,2g,搅拌混合均匀,在负压条件下缓慢升温到140℃,脱除少量溶剂后得到杂化改性的环氧树脂。市售酸酐甲基六氢苯酐64g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.25克,旋转真空脱泡机混合均匀,点胶1921支架(“1921支架”为测试项目中支架规格编号)100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品1号。
实施例2:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,加入日产化学产品MA-ST,5g,搅拌混合均匀,在负压条件下缓慢升温到60℃,脱除少量溶剂后得到杂化改性的环氧树脂,再加入市售双酚A环氧树脂(粘度6000CPs,环氧值为150)50g。辅剂为市售酸酐甲基六氢苯酐95g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.5克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,150度固化5小时,得到待测样品2号。
实施例3:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE8000,50g,加入日产化学产品DMAc-ST,8g,搅拌混合均匀,在负压条件下缓慢升温到120℃,脱除少量溶剂后得到杂化改性的环氧树脂。辅剂为市售酸酐甲基六氢苯酐54g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.5克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品3号。
实施例4:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE8000,50g,加入日产化学产品DMAc-ST,8g,搅拌混合均匀,在负压条件下缓慢升温到120℃,脱除少量溶剂后得到杂化改性的环氧树脂,再加入市售双酚A环氧树脂(粘度6000CPs,环氧值为150)50g。辅剂为市售酸酐甲基六氢苯酐84g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.7克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,150度固化5小时,得到待测样品4号。
实施例5:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,加入日产化学产品MA-ST,10g,搅拌混合均匀,在负压条件下缓慢升温到60℃,脱除少量溶剂后得到杂化改性的环氧树脂,再加入市售双酚F环氧树脂(粘度8000CPs,环氧值为136)35g。辅剂为市售酸酐甲基六氢苯酐80g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.5克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品5号。
实施例6:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,加入日产化学产品PGMEA-ST,2g,搅拌混合均匀,在负压条件下缓慢升温到140℃,脱除少量溶剂后得到杂化改性的环氧树脂,再加入市售双酚F环氧树脂(粘度8000CPs,环氧值为136)20g。辅剂为市售酸酐甲基六氢苯酐75g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.5克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,150度固化5小时,得到待测样品6号。
实施例7:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,加入日产化学产品MEK-ST,15g,搅拌混合均匀,在负压条件下缓慢升温到60℃,脱除少量溶剂后得到杂化改性的环氧树脂,再加入市售双酚A环氧树脂(粘度6000CPs,环氧值为150)50g。辅剂为市售酸酐甲基六氢苯酐106g,季铵盐促进剂为苄基三甲基异辛酸铵,添加1克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品7号。
实施例8:
脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,加入日产化学产品MEK-ST,10g,搅拌混合均匀,在负压条件下缓慢升温到60℃,脱除少量溶剂后得到杂化改性的环氧树脂,再加入市售双酚A环氧树脂(粘度8000CPs,环氧值为136)50g。辅剂为市售酸酐甲基六氢苯酐60g,季铵盐促进剂为苄基三甲基异辛酸铵,添加0.5克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品8号。
对比例1:脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,市售酸酐甲基六氢苯酐64g,季铵盐促进剂为苯基三乙基异辛酸铵,添加量为0.25克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,150℃固化5小时,得到待测样9号。
对比例2:脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,市售酸酐甲基六氢苯酐64g,季铵盐促进剂为苯基三甲基异辛酸铵,添加0.25克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品10号。
对比例3:脂环族环氧树脂采用Daicel株式会社制造的CELOXIDE2021P,50g,市售双酚A环氧树脂(粘度6000CPs,环氧值为150)50g,市售酸酐甲基六氢苯酐95g,季铵盐促进剂为苯基三乙基异辛酸铵,添加1克,旋转真空脱泡机混合均匀,点胶1921支架100颗并浇注条形样片,135℃固化1小时,150℃固化4小时,得到待测样品11号。
为了验证本发明采用纳米二氧化硅改性环氧树脂组合物固化得到的LED封装胶的优点,对上述待测样品1-11号进行了性能测试,其性能测试结果如表1所示,测试方法说明如下:
1)三点弯曲强度测试:苏州拓博TH-8203A拉力机三点弯曲模式,下降速度5mm/min;
2)尺寸稳定性(CTE)测试:梅特勒-托利多TMA/SDTA2+,40℃-210℃,升温速率10℃/min;
3)冷热冲击:80℃预处理24小时,-40℃和135℃各15min,循环500次,测试点亮情况,无分层和死灯为合格,LED支架尺寸为1921RGB;
4)高温高湿存储(双85实验):80℃预处理24小时,85度、85%RH,1000小时,查看点亮性能,没有死灯且衰减10%之内视为合格,LED支架尺寸为1921RGB。
5)耐焊接热:80℃预处理24小时,260度10秒过炉3次,每次过炉后查看树脂情况并做红墨水实验,室温下红墨水浸泡24小时/红墨水中煮沸2小时,红墨水均完全没有渗透即为合格,LED支架尺寸为1921RGB。
其中实施例1的环氧固化物CTE谱图见图1,其玻璃化转变大于140℃,玻璃化前的热膨胀系数为55ppm/℃,玻璃化转变之后的热膨胀系数为150ppm/℃,相对普通的环氧树脂固化物更适合LED封装使用;纳米级二氧化硅在环氧树脂中的分散状态显示图如图2所示。
表1样品1-11号性能测试结果
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。
Claims (6)
1.一种LED封装用纳米二氧化硅改性环氧树脂组合物,其特征在于:其包括组分A、C、D、E,以及任选的B;其中,
A为脂环族环氧树脂化合物,其化学式为
B为液态芳香族环氧树脂;
C为球形纳米二氧化硅填料,其平均粒径小于50nm;
D为酸酐固化剂;
E为季铵盐类固化促进剂;
以所述组分A重量为100%计,所述组分B的重量百分比为0~70%;所述组分C的重量百分比为1%~10%;所述季铵盐固化促进剂的重量百分比为0.5%~18%;所述酸酐固化剂的重量百分比为55%~175%;在制备过程中,所述球形纳米二氧化硅以分散液的形式加入,将含有球形纳米二氧化硅的所述分散液添加到组分A、或组分B、或组分A与组分B的混合物中,搅拌混合均匀,再在减压蒸馏的条件下脱除所述分散液中的溶剂,得到纳米二氧化硅杂化改性的环氧树脂A、或环氧树脂B、或环氧树脂A与环氧树脂B的混合物;所述R基团是亚烃基、醚键、酯键、碳酸酯键、酰胺键、羰基以及环氧环己烯残基中的一种或多种组合。
2.如权利要求1所述的LED封装用纳米二氧化硅改性环氧树脂组合物,其特征在于:所述液态芳香族环氧树脂为液态双酚A环氧树脂、液态双酚F环氧树脂或液态萘型环氧树脂中的一种。
3.如权利要求1所述的LED封装用纳米二氧化硅改性环氧树脂组合物,其特征在于:所述分散液的溶剂为N,N-二甲基乙酰胺、丙二醇甲醚醋酸酯、γ-丁内酯、甲乙酮、丙酮、甲醇、乙醇、异丙醇、甲苯、二甲苯中的一种或多种。
4.如权利要求1所述的LED封装用纳米二氧化硅改性环氧树脂组合物,其特征在于:所述分散液中所述纳米二氧化硅的含量为2%~40%。
5.如权利要求1所述的LED封装用纳米二氧化硅改性环氧树脂组合物,其特征在于:所述酸酐固化剂包括六氢苯酐、2-甲基六氢苯酐和4-甲基六氢苯酐中的一种或多种。
6.如权利要求4所述的LED封装用纳米二氧化硅改性环氧树脂组合物,其特征在于:所述季铵盐固化促进剂包括苄基三乙基羧酸铵、苄基三甲基羧酸铵、苯基三乙基羧酸铵和苯基三甲基羧酸铵、苄基三乙基异辛酸铵、苄基三甲基异辛酸铵、苯基三乙基异辛酸铵和苯基三甲基异辛酸铵、苄基三乙基正癸酸铵、苄基三甲基正癸酸铵、苯基三乙基正癸酸铵和苯基三甲基正癸酸铵。
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