CN110838462B - Mass transfer method and system of device array - Google Patents
Mass transfer method and system of device array Download PDFInfo
- Publication number
- CN110838462B CN110838462B CN201810931059.0A CN201810931059A CN110838462B CN 110838462 B CN110838462 B CN 110838462B CN 201810931059 A CN201810931059 A CN 201810931059A CN 110838462 B CN110838462 B CN 110838462B
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- wafer
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 84
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 238000000926 separation method Methods 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000006552 photochemical reaction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000003491 array Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810931059.0A CN110838462B (en) | 2018-08-15 | 2018-08-15 | Mass transfer method and system of device array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810931059.0A CN110838462B (en) | 2018-08-15 | 2018-08-15 | Mass transfer method and system of device array |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110838462A CN110838462A (en) | 2020-02-25 |
CN110838462B true CN110838462B (en) | 2022-12-13 |
Family
ID=69573052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810931059.0A Active CN110838462B (en) | 2018-08-15 | 2018-08-15 | Mass transfer method and system of device array |
Country Status (1)
Country | Link |
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CN (1) | CN110838462B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101388348A (en) * | 2007-09-14 | 2009-03-18 | 探微科技股份有限公司 | Wafer stage package cutting method protecting connection pad |
CN105210171A (en) * | 2012-10-30 | 2015-12-30 | 希百特股份有限公司 | Led die dispersal in displays and light panels with preserving neighboring relationship |
CN107768487A (en) * | 2016-08-18 | 2018-03-06 | 新世纪光电股份有限公司 | The method of flood tide transferred-electron device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100415282B1 (en) * | 2002-02-06 | 2004-01-16 | 삼성전자주식회사 | Dual die bonder for semiconductor devices |
FR2837981B1 (en) * | 2002-03-28 | 2005-01-07 | Commissariat Energie Atomique | PROCESS FOR HANDLING SEMICONDUCTOR LAYERS FOR THEIR SLOWDOWN |
JP2005252072A (en) * | 2004-03-05 | 2005-09-15 | Seiko Epson Corp | Element mounting method and conveyer |
TWI287838B (en) * | 2004-11-11 | 2007-10-01 | Yamaha Corp | Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
JP2011166002A (en) * | 2010-02-12 | 2011-08-25 | Disco Abrasive Syst Ltd | Method for processing wafer |
JP2011216729A (en) * | 2010-03-31 | 2011-10-27 | Sinfonia Technology Co Ltd | Semiconductor wafer conveying apparatus |
JP5854215B2 (en) * | 2011-02-16 | 2016-02-09 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
US8573469B2 (en) * | 2011-11-18 | 2013-11-05 | LuxVue Technology Corporation | Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer |
US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
JP5591859B2 (en) * | 2012-03-23 | 2014-09-17 | 株式会社東芝 | Substrate separation method and separation apparatus |
JP5752639B2 (en) * | 2012-05-28 | 2015-07-22 | 東京エレクトロン株式会社 | Joining system, joining method, program, and computer storage medium |
WO2014165406A1 (en) * | 2013-04-01 | 2014-10-09 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
-
2018
- 2018-08-15 CN CN201810931059.0A patent/CN110838462B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101388348A (en) * | 2007-09-14 | 2009-03-18 | 探微科技股份有限公司 | Wafer stage package cutting method protecting connection pad |
CN105210171A (en) * | 2012-10-30 | 2015-12-30 | 希百特股份有限公司 | Led die dispersal in displays and light panels with preserving neighboring relationship |
CN107768487A (en) * | 2016-08-18 | 2018-03-06 | 新世纪光电股份有限公司 | The method of flood tide transferred-electron device |
Also Published As
Publication number | Publication date |
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CN110838462A (en) | 2020-02-25 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20221104 Address after: 3-5 / F, building A2, phase I, Zhihui Industrial Park, intersection of Chongqing Road and Yan'an Road, Baohe Economic Development Zone, Hefei, Anhui 230001 Applicant after: Beike Tianhui (Hefei) laser technology Co.,Ltd. Address before: 6 / F, building B1, Dongfang Chuangzhi garden, No.18 JinFang Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province, 215125 Applicant before: SURESTAR (SUZHOU) LASER TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Massive Transfer Method and System for Device Arrays Effective date of registration: 20231025 Granted publication date: 20221213 Pledgee: Hefei Binhu fountainhead financing Company limited by guarantee Pledgor: Beike Tianhui (Hefei) laser technology Co.,Ltd. Registration number: Y2023980062596 |