CN110831312B - Efficient plasma gas-liquid discharge system - Google Patents
Efficient plasma gas-liquid discharge system Download PDFInfo
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- CN110831312B CN110831312B CN201911082786.5A CN201911082786A CN110831312B CN 110831312 B CN110831312 B CN 110831312B CN 201911082786 A CN201911082786 A CN 201911082786A CN 110831312 B CN110831312 B CN 110831312B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
Abstract
The invention discloses a high-efficiency plasma gas-liquid discharge system, which comprises: the device comprises a fixing plate I, a medium plate II, a medium plate III, a medium vessel and a fixing plate II which are sequentially arranged from top to bottom; the fixing plate I is sequentially connected with the dielectric plate I, the gasket II and the dielectric plate III through fixing screws; the high-voltage electrode assembly is sequentially inserted into a dielectric plate II and a dielectric plate III through a through hole I formed in the dielectric plate I; the dielectric plate II is provided with a through hole II, and the dielectric plate III is provided with a through hole III; a medium vessel is arranged in the center of the fixing plate II and is positioned between the medium plate III and the fixing plate II; the fixing plate I is connected with the medium plate III through a height adjusting screw, and the height adjusting screw is used for adjusting the distance between the lower surface of the medium plate III and the upper surface of the medium dish. The invention can directly process liquid by using plasma, can greatly enhance the processing efficiency of the plasma, has stable working operation and convenient disassembly and maintenance.
Description
Technical Field
The invention mainly relates to a plasma gas-liquid discharge system capable of directly discharging liquid.
Background
At present, with the continuous improvement of the living standard of people, the requirement of people on food safety is higher and higher, and the problems of pesticide residue on the surface of food, water source pollution and the like are more and more emphasized. The low-temperature plasma technology is widely applied to the fields of agriculture and environmental protection at present and is mainly applied to the aspects of pesticide residue removal, sewage treatment and the like. Most of the conventional low-temperature plasma technology uses plasma activated gas in the application process, and does not really utilize the energy of high-energy electrons of the plasma.
Disclosure of Invention
The invention aims to provide a plasma gas-liquid discharge system which is rapid and efficient, simple in structure, convenient to maintain and convenient to apply, and plasma can directly discharge to-be-treated liquid.
In order to realize the purpose, the following technical scheme is adopted: a high efficiency plasma gas-liquid discharge system comprising: a fixing plate I, a medium plate II, a medium plate III, a medium vessel and a fixing plate II which are arranged from top to bottom in sequence,
the fixing plate I is sequentially connected with a dielectric plate I, a gasket II and a dielectric plate III through fixing screws, and the dielectric plate II is positioned between the gasket I and the gasket II;
the high-voltage electrode assembly is sequentially inserted into a dielectric plate II and a dielectric plate III through a through hole I formed in the dielectric plate I, the upper end of the high-voltage electrode assembly is positioned above the dielectric plate I, and the lower end of the high-voltage electrode assembly is flush with the lower surface of the dielectric plate III;
the dielectric plate II is provided with a through hole II, the dielectric plate III is provided with a through hole III, and the through holes II and the through holes III are arranged in an array;
a medium vessel is arranged in the center of the fixing plate II and is positioned between the medium plate III and the fixing plate II;
the fixing plate I is connected with the medium plate III through a height adjusting screw, and the height adjusting screw is used for adjusting the distance between the lower surface of the medium plate III and the upper surface of the medium dish.
The dielectric plate I plays a role in fixing a lead in the high-voltage electrode assembly.
Further, the high-voltage electrode assembly is composed of a medium pipe and a high-voltage electrode inserted into the medium pipe.
Furthermore, the gasket I and the gasket II are provided with vent holes.
Furthermore, the vent holes of the gasket I and the gasket II form a Z-shaped air hole layout.
Further, the vent hole is a plurality of vent holes.
Furthermore, 4 air vents are formed in the gasket I and the gasket II and consist of two parts, a blind hole is formed in the outer side of the gasket I inwards firstly, the gasket II is not opened downwards, and the gasket II is opened backwards to form a Z self-air hole layout.
Furthermore, the gasket I, the gasket II and the dielectric slab II can be detachably connected, or the gasket I, the gasket II and the dielectric slab II form an integrated structure.
Furthermore, through holes II formed in the dielectric plate II and the dielectric plate III are in one-to-one correspondence.
Furthermore, the through holes I are arranged in parallel or in an array.
Further, when the through holes I are strip-shaped through holes I, the strip-shaped through holes I are arranged in parallel; or when the through holes I are round through holes I, the round through holes I are arranged in an array.
Furthermore, the through holes I are arranged in parallel or in an array.
Furthermore, the medium plate III is of a flat plate type or a structure with a boss. Compared with a flat-plate type dielectric plate III, the dielectric plate III with the boss structure has more high-voltage electrode assemblies participating in discharge under the condition of the same dielectric dish area (a fixing screw hole cannot be inserted into the dielectric dish).
Furthermore, the high-voltage electrode assemblies are multiple and are connected with each other on the dielectric plate I, and then are led out through a high-voltage wire leading-out hole in the middle of the fixing plate I and connected with a high-voltage power supply.
Furthermore, the fixing plate II is fixedly connected with a support.
Furthermore, an O-ring groove is formed in the circular ring structure of the upper half part of the fixing plate II.
Furthermore, an air inlet hole and an air outlet hole are formed in the fixing plate II.
Furthermore, a clamping groove is formed in the lower portion of the gasket I and used for fixing the dielectric plate II.
Further, the material of the fixing plate I is an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the dielectric plate I is made of an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the material of the gasket I is an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the dielectric plate II is made of an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the material of the gasket II is an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the dielectric plate III is made of an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the fixing plate II is made of an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the bottom of the medium vessel is made of an insulating material, and the insulating material includes but is not limited to bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon; the circumferential part of the dielectric vessel can be made of insulating materials or conductor materials, wherein the insulating materials include but are not limited to bakelite, quartz, ceramics, polytetrafluoroethylene, organic glass or nylon, and the conductor materials include but are not limited to metal, conductive film, conductive glue coated on the surface of the insulating medium, and the like.
Further, the material of the medium pipe is an insulating material, and the insulating material includes, but is not limited to, bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass or nylon.
Further, the high voltage electrode is made of a conductor material, and the conductor material includes, but is not limited to, aluminum, copper, steel, or the like.
Further, the high-voltage electrode is a conductive metal wire, including but not limited to an aluminum wire, a copper wire or a steel wire.
Further, the fixing screw is made of an insulating material, and the insulating material includes, but is not limited to, bakelite, quartz, ceramic, polytetrafluoroethylene, organic glass, or nylon.
Further, the high-voltage power supply is an alternating current power supply with a voltage peak value regulation range of 0-50 KV and a frequency regulation range of 1-50 KHz; or the pulse power supply has a voltage peak value adjusting range of 0-20 KV and a frequency adjusting range of 1-30 KHz.
The invention has the advantages that:
1. the liquid can be directly treated by using the plasma, and the treatment efficiency of the plasma can be greatly enhanced.
2. By changing the position of the ground electrode, the manner in which the plasma is generated can be changed. When the ground electrode is placed in the liquid to be treated (the upper surface of the dielectric dish), the mode of generating plasma is single dielectric barrier discharge, the generated plasma is violent, and the discharge wires are more and random; when the ground electrode is arranged on the lower surface of the dielectric dish, the mode of generating the plasma is double dielectric barrier discharge, the generation of the plasma is difficult at the moment, higher discharge voltage is needed, but the generated plasma is more uniform and weaker in discharge compared with single dielectric barrier discharge. The effect of one machine with multiple functions can be realized through the change of the position of the ground electrode.
3. The device can realize the height adjustment of the high-voltage electrode from the water surface through the height adjusting screw, and due to the generation characteristics of the plasma, the closer the high-voltage electrode is to the water surface, the lower the plasma generation required condition is, and the higher the energy injection density of the plasma is.
4. The device adopts a micro-plasma array form to generate plasma, and the generation of the plasma on the micron size can realize more uniformity, easier discharge and higher electron energy and electron density. Provides good support for efficient application of the device.
5. The components of the discharge gas can be freely replaced, and the gas flow can be changed.
6. The device convenient to detach and maintenance are high voltage electrode cooling through the gas velocity of flow, and when gaseous III downward flows from the dielectric plate, can avoid pending liquid to soak high voltage electrode, avoid the short circuit of high pressure and ground, protect whole discharge system simultaneously.
7. The device can effectively remove the residue of organic chemical pollutants in the liquid to be treated.
8. The working operation is stable, the number of the high-voltage electrode assemblies can be automatically enlarged or reduced according to the requirement, the adjustability is excellent, and the high-voltage electrode assembly has wide application prospect.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is an elevational, cross-sectional view of the present invention;
FIG. 3 is a schematic cross-sectional view of the main structure of the present invention;
FIG. 4 is a schematic sectional view of the main structure of the present invention viewed from the bottom (from the bottom to the top);
FIG. 5 is a schematic, diagrammatic view of the present invention fully assembled;
FIG. 6 is a schematic, diagrammatic illustration of a mounting plate I of the present invention;
FIG. 7 is a schematic diagram of a dielectric slab I with elongated through holes according to the present invention;
FIG. 8 is a schematic and diagrammatic illustration of a gasket I of the present invention;
FIG. 9 is a schematic diagram of a dielectric plate II of the present invention;
FIG. 10 is a schematic representation of washer II of the present invention;
FIG. 11 is a schematic diagram of a dielectric plate III of the present invention;
FIG. 12 is a schematic, diagrammatic illustration of a mounting plate II of the present invention;
FIG. 13 is a schematic diagram of a media dish of the present invention;
FIG. 14 is a schematic, diagrammatic view of a stent of the present invention;
FIG. 15 is a schematic, diagrammatic view of a high voltage electrode assembly of the present invention;
fig. 16 is a schematic diagram of a dielectric plate i of a circular through-hole of the present invention;
FIG. 17 is a schematic diagram of a dielectric plate II of one-piece construction of the present invention; wherein the left view is the upper surface (top view) and the right view is the lower surface (bottom view);
FIG. 18 is a schematic diagram of a media sheet III with a boss structure according to the present invention;
in the figure, 1, a height adjusting screw, 2, a fixing plate I, 3, a medium plate I, 4 with a long strip-shaped through hole, a gasket I, 5, a flat-plate-type medium plate II, 6, a gasket II, 7, a flat-plate-type medium plate III, 8, a fixing plate II, 9, a medium dish, 10, a support, 11, a fixing screw I, 12, a medium pipe, 13, a medium plate I, 14 with a circular through hole, a medium plate II, 15 with an integrated structure, a medium plate III with a boss structure, 16, an air inlet hole, 17, an O-ring groove, 18, an air outlet hole, 19, a fixing screw II, 20, a high-voltage electrode, 21, a through hole I, 22, a through hole II, 23, a high-voltage wire leading-out hole, 24, a through hole III, 25.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. Any specific values in all examples shown and discussed herein are to be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the absence of any contrary indication, these directional terms are not intended to indicate and imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be considered as limiting the scope of the present invention: the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Example 1
As shown in fig. 1 to 15, a high efficiency plasma gas-liquid discharge system includes: by last fixed plate I2 that sets gradually down, rectangular shape through-hole's medium plate I3 (this embodiment is called medium plate I3 for short), flat medium plate II 5 (called medium plate II 5 for short in this embodiment), flat medium plate III 7 (called medium plate III 7 for short in this embodiment), medium dish 9, fixed plate II 8, fixed plate I2 is connected gradually through set screw 11 and medium plate I3, packing ring I4, medium plate II 5, packing ring II 6, medium plate III 7, medium plate II 5 is located between packing ring I4 and packing ring II 6. A medium dish 9 is arranged in the center of the fixing plate II 8, and the medium dish 9 is positioned between the medium plate III 7 and the fixing plate II 8; fixed plate I2 is connected with dielectric-slab I1, packing ring I4, dielectric-slab II 5, packing ring II 6, dielectric-slab III 7 through height-adjusting screw 1. The fixing plate I2 is made of polytetrafluoroethylene materials, the outer diameter of the top of the fixing plate I2 is 19cm, the overall height of the fixing plate I is 0.8cm, the outer diameter of the lower annular structure is 15cm wide, the inner diameter of the lower annular structure is 14cm wide, the outer side of the fixing plate I is 0.8cm high, the inner side of the fixing plate I is 1.4cm high, the diameter of the middle groove part is 8.4cm high and 2cm high, and the diameter of the high-voltage wire leading-. The diameter of the height-adjusting screw hole is 0.6cm, and the length of the height-adjusting screw 1 is 5.5 cm. The height adjusting screw 1 is contacted with the upper surface of the fixing plate II 8, and the distance between the medium plate III 7 and the upper surface of the medium dish 9 is adjusted by adjusting the length of the height adjusting screw 1. The dielectric plate I3 is made of ceramic, the diameter of the dielectric plate I3 is 10.4cm, the thickness of the dielectric plate I is 0.1cm, through holes I21 corresponding to the dielectric plate II 5 and the dielectric plate III 7 are formed in the dielectric plate I3, the through holes I21 are strip-shaped through holes, the width of the through holes I21 is 0.15cm, the hole centers are 0.3cm, the through holes I21 are arranged in parallel, and annular welding discs with the width of 0.2cm are arranged around the through holes I21 to fix the high-voltage electrode assembly 12. The high-voltage electrode assembly 12 is composed of a quartz medium tube 12 with the length of 5cm, the outer diameter of 0.1cm and the inner diameter of 0.05cm and a 0.03cm thick copper wire 20 inserted into the quartz medium tube 12. The high-voltage electrode assembly 12 is inserted from the elongated through-hole i in the dielectric plate i until the lower surface reaches the lower surface of the dielectric plate iii 7. The high-voltage electrode assemblies 12 are connected with each other on the dielectric plate I3 and then led out through a high-voltage wire leading-out hole 23 in the middle of the fixing plate I2 to be connected with a high-voltage power supply. 4 air vents 25 are formed in the gasket I4 and the gasket II 6, each air vent 25 is composed of two parts, firstly, a blind hole is formed in the outer side of the gasket I4 inwards, the gasket II 6 is not opened downwards, and the blind hole is opened towards the inner side of the gasket II 6 to form a Z self-air hole layout. The method specifically comprises the following steps: the gasket I4 is made of organic glass, the height is 1cm, the outer diameter is 10.4cm, the inner diameter is 8.4cm, the lower surface is provided with an annular O-ring groove 17 for placing the dielectric plate II 5, the outer diameter of the annular O-ring groove 17 is 8.8cm, the height is 0.2cm, 4 air holes are uniformly distributed in the middle of the outer wall from top to bottom, and the diameter of each air hole is 0.4 cm. The gasket II 6 is made of a nylon material, the height is 1cm, the outer diameter is 10.4cm, the inner diameter is 8.4cm, and 4 air holes with the diameter of 0.4cm are uniformly distributed in the upper and lower centers of the inner wall. The dielectric plate II 5 is made of bakelite, the diameter is 8.8cm, the thickness is 0.2cm, through holes II 22 are formed, the hole centers of the through holes II 22 correspond to the dielectric plate I3 one by one, the through holes II 2 are circular through holes, the hole diameter is 1.2cm, the hole center distance is 3cm, and the through holes are arranged in an array. And the medium pipe 12 and the medium plate II 5 are fixed by AB glue and sealed. The dielectric plate III 7 is made of ceramic materials, the height is 0.5cm, the outer diameter is 10.4cm, hole centers of through holes III 24 formed in the dielectric plate III correspond to the dielectric plate I3 one by one, the through holes III 24 are circular through holes, the hole diameter is 1.5cm, the hole center distance is 3cm, and the through holes are distributed in an array mode. Corresponding, the fixed screw hole that the diameter is 4mm has all been seted up with medium plate I3, packing ring I4, packing ring II 6, medium plate III 7 to fixed plate I2, and I11 length of fixed screw is 4 cm. The fixed plate II 8 is made of bakelite, the side length of the square on the outer side is 30cm, the annular structure on the upper half part has an outer diameter of 19cm, an inner diameter of 15.2cm and a height of 2.2cm, and the annular structure on the lower half part has the following size: the height of the outer side is 1.9cm, the height of the inner side is 0.8cm, the outer diameter of the lower surface is 12cm, and the inner diameter is 11 cm. And the middle part of the fixing plate II 8 is provided with an air inlet 16 and an air outlet 18 in an annular structure. The dielectric dish 9 is made of quartz materials, the height is 1.7cm, the wall thickness is 0.3cm, the outer diameter of the circumferential part is 11cm, the inner diameter is 10.7cm, and the dielectric dish 9 is placed on the annular upper part of the lower half part of the fixing plate II 8. The ground electrode is connected to the lower surface of the dielectric dish 9. And the fixing plate II 8 is connected with the standard aluminum section bracket 10 through a fixing screw 19 II with the diameter of 8 mm. The length, width and height of the aluminum profile support 10 are both 30 cm.
The liquid (aqueous solution) to be treated is placed in a medium dish 9, and a discharge part is formed by inserting a fixing plate I2, a medium plate I3, a medium plate II 5, a medium plate III 7 and a high-voltage electrode assembly 12 which are connected by fixing screws 11. The distance of the discharge part from the liquid level in the dielectric dish 9 is adjusted by adjusting the height screw 1.
Example 2
As shown in fig. 1 to 18, a high efficiency plasma gas-liquid discharge system includes: by the fixed plate I2 that sets gradually from top to bottom, medium plate I13 of circular through-hole (this embodiment is called medium plate I13 for short), medium plate II 14 of integral type structure (this embodiment is called medium plate II 14 for short), medium plate III 15 with boss structure (this embodiment is called medium plate III 15 for short), medium dish 9, fixed plate II 8, medium plate II 14 of integral type structure is the integral type structure that packing ring I4, packing ring II 6 and flat medium plate II constitute, flat medium plate II is located between packing ring I4 and packing ring II 6 with medium plate II 5. Fixed plate I2 is connected gradually through set screw 11 and dielectric-slab I3, packing ring I4, dielectric-slab II 5, packing ring II 6, dielectric-slab III 7. A medium dish 9 is arranged in the center of the fixing plate II 8, and the medium dish 9 is positioned between the medium plate III 15 and the fixing plate II 8; fixed plate I2 is connected with medium plate I13, medium plate II 14, medium plate III 15 through height-adjusting screw 1. The fixed plate I2 is connected with the medium plate I13, the medium plate II 14 and the medium plate III 15 through fixing screws. The fixing plate I2 is made of bakelite, the outer diameter of the top of the fixing plate I is 19cm, the overall height of the fixing plate I is 0.8cm, the outer diameter of the lower annular structure is 15cm, the inner diameter of the lower annular structure is 14cm, the outer side of the fixing plate is 0.8cm in height, the inner side of the fixing plate is 1.4cm in height, the diameter of the middle groove part is 8.4cm and 2cm in height, and the diameter of the high-voltage wire leading-out hole 23. The diameter of the height-adjusting screw hole is 0.6cm, and the length of the height-adjusting screw 1 is 5.5 cm. Height-adjusting screw 1 contacts fixed plate II 8 upper surface, adjusts medium board III 15 distance medium ware upper surface distance through height-adjusting screw 1 length. The dielectric plate I13 is made of bakelite, has the diameter of 10.4cm and the thickness of 0.1cm, is provided with a through hole I21 corresponding to the dielectric plate II 14 and the dielectric plate III 15, and is a circular through hole, the diameter of the through hole I21 is 0.15cm, the hole center distance is 0.3cm, and an annular welding disc with the width of 0.2cm is arranged around the through hole I21 to fix the high-voltage electrode assembly 12. The high-voltage electrode assembly 12 was composed of a quartz medium tube having a length of 5cm, an outer diameter of 0.1cm and an inner diameter of 0.05cm, and a stainless steel wire having a thickness of 0.02cm inserted into the quartz medium tube 12. The high-voltage electrode assembly 12 is inserted from the through hole I21 in the dielectric plate II 14 until the lower surface reaches the lower surface of the dielectric plate III 15. A plurality of high-voltage electrode assemblies 12 are connected with each other on a dielectric plate I13 and then led out through a high-voltage wire leading-out hole 23 in the middle of a fixing plate I2 to be connected with a high-voltage power supply. The gasket I4 and the gasket II 6 are provided with 4 vent holes 25, each vent hole 25 is composed of two parts, firstly, a blind hole is formed in the inner side of the gasket I4, the gasket II 6 is not opened downwards, and the blind hole is opened towards the inner side of the gasket II 6 to form a Z self-air hole layout. The method specifically comprises the following steps: the medium plate II 14 is made of organic glass, the height is 2.4cm, the outer diameter is 10.4cm, the inner diameter is 8.4cm, the upper half outer wall is vertically and centrally provided with 4 vent holes 25, the diameter of each vent hole is 0.4cm, and the upper half inner wall is vertically and centrally provided with a vent hole with the diameter of 0.4 cm. The clamping groove is formed in the upper half part, the width of the clamping groove is 8.8cm, and the clamping groove is used for placing the dielectric plate I13. Through holes II 22 are formed in the surface of the dielectric plate II 14, the hole centers of the through holes II 22 correspond to the dielectric plate I13 one by one, the through holes II 22 are circular through holes, the hole diameter is 1.1cm, the hole center distance is 3cm, and the through holes are arranged in an array mode. And the medium pipe 12 and the medium plate II 14 are fixed by AB glue and sealed. The dielectric plate III 15 is made of ceramic materials, the height is 2cm, the outer diameter is 10.4cm, the boss height is 1.5cm, the outer diameter is 8.4cm, hole centers of the through holes formed in the dielectric plate III correspond to the dielectric plate 6 one by one, the through holes III 24 are circular through holes, the hole diameter is 1.5cm, the hole center distance is 3cm, and the through holes are arranged in an array mode. Corresponding, the diameter is 4 mm's fixed screw hole, and I11 length of fixed screw is 4cm has all been seted up with medium-plate I13, medium-plate II 14, medium-plate III 15 to fixed plate I. Fixing plate II 8 adopts the nylon material, and outside square side length is 30cm, and the first half ring structure, the external diameter is 19cm, and the internal diameter is 15.2cm, highly is 2.2cm, and the size of the latter half ring structure is: the height of the outer side is 1.9cm, the height of the inner side is 0.8cm, the outer diameter of the lower surface is 12cm, and the inner diameter is 11 cm. The middle part of the fixing plate II 8 is provided with an air inlet hole 16 and an air outlet hole 18 in an annular structure. The dielectric dish 9 is made of quartz materials, the height is 1.7cm, the wall thickness is 0.3cm, the outer diameter of the circumferential part is 11cm, the inner diameter is 10.7cm, and the dielectric dish 9 is placed on the annular upper part of the lower half part of the fixing plate II 8. The ground electrode is connected to the lower surface of the dielectric dish 9. And the fixing plate II 8 is connected with the standard aluminum section bracket 10 through a fixing screw 19 II with the diameter of 8 mm. The length, width and height of the aluminum profile support 10 are both 30 cm.
The liquid (aqueous solution) to be treated is placed in a medium dish 9, and a discharge part is formed by inserting a fixing plate I2, a medium plate I13, a medium plate II 14, a medium plate III 15 and a high-voltage electrode assembly 12 which are connected by fixing screws 11. The distance of the discharge part from the liquid level in the dielectric dish 9 is adjusted by adjusting the height screw 1.
Claims (7)
1. A plasma gas-liquid discharge system, comprising: the device comprises a fixing plate I, a medium plate II, a medium plate III, a medium vessel and a fixing plate II which are sequentially arranged from top to bottom;
the fixing plate I is sequentially connected with a dielectric plate I, a gasket II and a dielectric plate III through fixing screws, and the dielectric plate II is positioned between the gasket I and the gasket II;
the high-voltage electrode assembly is sequentially inserted into a dielectric plate II and a dielectric plate III through a through hole I formed in the dielectric plate I, the upper end of the high-voltage electrode assembly is positioned on the dielectric plate I, and the lower end of the high-voltage electrode assembly is flush with the lower surface of the dielectric plate III;
the dielectric plate II is provided with a through hole II, the dielectric plate III is provided with a through hole III, and the through holes II and the through holes III are arranged in an array;
a medium vessel is arranged in the center of the fixing plate II and is positioned between the medium plate III and the fixing plate II;
the fixing plate I is connected with the medium plate III through a height adjusting screw, and the height adjusting screw is used for adjusting the distance between the lower surface of the medium plate III and the upper surface of the medium vessel;
the high-voltage electrode assembly consists of a medium tube and a high-voltage electrode inserted into the medium tube;
the gasket I and the gasket II are provided with vent holes, each vent hole consists of two parts, a blind hole is formed inwards from the outer side of the gasket I, the gasket II is not opened downwards, and the blind hole is opened towards the inner side of the gasket II to form a Z-shaped air hole layout;
the fixing plate II is provided with an air inlet hole and an air outlet hole;
the high-voltage electrode assemblies are connected with each other on the dielectric plate I and then led out through a high-voltage wire leading-out hole in the middle of the fixing plate I to be connected with a high-voltage power supply.
2. The plasma gas-liquid discharge system according to claim 1, wherein the gasket I and the gasket II are detachably connected with the dielectric plate II, or the gasket I and the gasket II form an integrated structure with the dielectric plate II.
3. The plasma gas-liquid discharge system according to claim 1, wherein the through holes i are arranged in parallel or in an array.
4. The plasma gas-liquid discharge system according to claim 1, wherein said dielectric plate iii is a flat plate or a structure with a boss.
5. The plasma gas-liquid discharge system of claim 1, wherein the fixing plate II is fixedly connected with a bracket.
6. The plasma gas-liquid discharge system of claim 1, wherein the annular structure of the upper half of the fixing plate II is provided with an O-ring groove.
7. The plasma gas-liquid discharge system according to claim 1, wherein the fixing plate I, the dielectric plate I, the gasket I, the dielectric plate II, the gasket II, the dielectric plate III, the fixing plate II, the dielectric pipe and the fixing screw are all made of insulating materials; the high-voltage electrode is made of a conductor material; the bottom of the medium dish is made of insulating materials, and the circumferential part of the medium dish is made of insulating materials or conductor materials.
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