CN110767799A - Packaging method of interdigital electrode type piezoelectric fiber composite material - Google Patents
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Abstract
The invention discloses a packaging method of an interdigital electrode type piezoelectric fiber composite material. The packaging method comprises the following steps: wiping the piezoelectric fiber composite layer and the interdigital electrode to be packaged by absolute ethyl alcohol; covering an interdigital electrode on the upper surface and the lower surface of the piezoelectric fiber composite layer respectively to form a laminated structure; the first hot-pressing layer, the laminated structure and the second hot-pressing layer are laminated in sequence to form a hot-pressing tool; putting the hot-pressing tool into a hot-pressing table, and starting a pressure device to apply pressure; after the pressure reaches a set pressure value, starting a heating device to heat the hot pressing plate to a set temperature; and after the temperature of the hot pressing plate reaches the set temperature, controlling the press to keep the temperature and the pressure for a set time, and finishing packaging. The invention can fill the blank of the prior art, realizes the packaging of the interdigital electrode type piezoelectric fiber composite material and improves the level of the preparation technology of intelligent materials and functional devices.
Description
Technical Field
The invention relates to the field of functional device preparation, in particular to a packaging method of an interdigital electrode type piezoelectric fiber composite material.
Background
Interdigital electrode type piezoelectric Fiber Composites (Macro Fiber Composites)MFCs) is a sandwich type composite material formed by coating piezoelectric fiber composite layers by upper and lower flexible interdigital electrodes in mirror symmetry, wherein the piezoelectric fiber composite layers are formed by arranging piezoelectric fibers with rectangular sections in a polymer matrix in a unidirectional and parallel manner. In the composite material, the piezoelectric performance of the composite material is ensured by using the piezoelectric fiber composite layer, and meanwhile, the composite material has better flexibility, adaptability and designability. The introduction of the interdigital electrode leads the polarization electric field and the driving electric field of the composite material to be distributed in a segmented way along the length direction of the fiber, thus reducing the polarization voltage and the driving voltage in certain application occasions to a certain extent; more importantly, the composite material can be made to have a d orientation parallel to the fiber direction33Mode operation in the direction perpendicular to the fibre direction with d31The mode work, the longitudinal strain performance of the composite material is effectively exerted, and meanwhile, the orthogonal anisotropy of the composite material is further enhanced. Finally, the polyimide layer is environmentally-friendly and hermetically packaged, so that the flexibility and the applicability of the composite material are further improved, and the composite material has good durability. In summary, compared with piezoelectric ceramics and other structural piezoelectric composite materials, the interdigital electrode type piezoelectric fiber composite material has the advantages of thin thickness, light weight, high strain energy density, directional driving/sensing, capability of being applied to a curved surface complex main body structure as an additional structure and the like, and has great advantages and market prospects in various fields such as vibration control, structural health monitoring, guided wave sensors and energy collection. Therefore, since the concept of the interdigital electrode type piezoelectric fiber composite material was first proposed in 2000, researchers made a great deal of research on its preparation.
Some related documents firstly adopt a tape casting method to prepare a piezoelectric ceramic sheet; then cutting the ceramic wafer into a fiber array by adopting a precise numerical control cutting machine; finally, preparing the interdigital electrode type piezoelectric fiber composite material by epoxy encapsulation. In related documents, PZT and carbon black green body pug with certain thickness are respectively obtained by a viscous plastic processing method, then a PZT/carbon black multilayer green body structure is obtained by a superposition process and is sintered, then epoxy resin is used for filling, and the PZT/resin multilayer structure with the specified thickness is obtained after cutting and thinning; and finally, packaging the interdigital electrode and epoxy resin to obtain the interdigital electrode type piezoelectric fiber composite material. In related documents, piezoelectric thin layers with different thicknesses are prepared by a cutting method or a die pressing method, thermosetting polymer thin layers with different thicknesses are prepared by a hot pressing method, and the polymer thin layers are cut to be consistent with the piezoelectric thin layers in length and width; then alternately stacking and aligning the piezoelectric thin layers and the polymer thin layers from bottom to top, coating polymer glue solution between the piezoelectric thin layers and the polymer thin layers, and performing hot-pressing curing on the stacked body by adopting a hot-pressing method to obtain a 2-2 type piezoelectric composite structure; and cutting the 2-2 type piezoelectric composite structure along the stacking direction according to the thickness requirement of the finished piezoelectric composite structure layer to obtain a required piezoelectric fiber composite layer, and finally packaging to obtain the piezoelectric fiber composite material.
From the above, it can be seen that most of the current reports on the preparation of the interdigital electrode type piezoelectric fiber composite material are focused on the preparation of the piezoelectric fiber composite layer. However, the complex and unique structure of the interdigital electrode type piezoelectric fiber composite material enables the preparation of piezoelectric fibers and composite layers thereof which are orderly and uniformly arranged and have good uniformity in the preparation process, and a more important technical difficulty, namely the integrated packaging of the interdigital electrode layer and the piezoelectric fiber composite layer. How to effectively and rapidly complete the packaging and obtain the interdigital electrode type piezoelectric fiber composite material which has excellent performance and can be successfully applied to practical engineering becomes a problem to be solved urgently.
Disclosure of Invention
The invention aims to provide a packaging method of an interdigital electrode type piezoelectric fiber composite material, which is used for making up the blank of the prior art, realizing packaging of the interdigital electrode type piezoelectric fiber composite material and improving the level of intelligent material and functional device preparation technology.
In order to achieve the purpose, the invention provides the following scheme:
an interdigital electrode type piezoelectric fiber composite material packaging method comprises the following steps:
wiping the piezoelectric fiber composite layer and the interdigital electrode to be packaged by absolute ethyl alcohol;
covering an interdigital electrode on the upper surface and the lower surface of the piezoelectric fiber composite layer respectively to form a laminated structure;
the first hot-pressing layer, the laminated structure and the second hot-pressing layer are laminated in sequence to form a hot-pressing tool;
putting the hot-pressing tool into a hot-pressing table, and starting a pressure device to apply pressure; after the pressure reaches a set pressure value, starting a heating device to heat the hot pressing plate to a set temperature; and after the temperature of the hot pressing plate reaches the set temperature, controlling the press to keep the temperature and the pressure for a set time, and finishing packaging.
Optionally, the upper surface and the lower surface of the piezoelectric fiber composite layer are respectively covered with one interdigital electrode to form a laminated structure, which specifically includes:
uniformly coating a polymer glue solution on the upper surface of the piezoelectric fiber composite layer, and covering a first interdigital electrode on the upper surface of the piezoelectric fiber composite layer coated with the polymer glue solution to obtain a first laminated structure;
and turning over the first laminated structure, uniformly coating polymer glue solution on the lower surface of the piezoelectric fiber composite layer, and covering the second interdigital electrode on the lower surface of the piezoelectric fiber composite layer coated with the polymer glue solution to obtain a second laminated structure.
Optionally, the polymer glue solution is a thermosetting resin glue solution.
Optionally, the first hot-pressing layer and the second hot-pressing layer each include a first hot-pressing material layer and a second hot-pressing material layer that are stacked, and the first hot-pressing layer and the second hot-pressing layer are symmetrically arranged with respect to the stacked structure.
Optionally, the first hot-pressing material layer is a surface-polished bulk metal material layer, the second hot-pressing material layer is a flexible material layer, and the second hot-pressing material layer is attached to the laminated structure.
Optionally, the size of the first hot-pressing material layer is larger than that of the second hot-pressing material layer, and the size of the second hot-pressing material layer is larger than that of the interdigital electrode.
Optionally, in the laminated structure, the interdigital electrodes on the upper surface of the piezoelectric fiber composite layer and the interdigital electrodes on the lower surface of the piezoelectric fiber composite layer have the same structure and are mirror-symmetric with respect to the piezoelectric fiber composite layer;
the length direction of piezoelectric fibers in the piezoelectric fiber composite layer is perpendicular to the electrode finger direction of the interdigital electrode, and the effective areas of the piezoelectric fiber composite layer and the interdigital electrode are completely attached without bubbles.
Optionally, the effective size of the effective area of the interdigital electrode is consistent with the size of the piezoelectric fiber composite layer.
Optionally, the set pressure value is 1 MPa-5 MPa per unit area; the set temperature is the curing temperature of the polymer glue solution; the set time length of the heat preservation and pressure maintaining is 30-240 min.
Optionally, the piezoelectric fiber composite layer is formed by combining a piezoelectric material and a polymer material in a communication manner, the piezoelectric material is PZT, PMN-PT, KNN or BT piezoelectric ceramics, the polymer material is thermosetting resin, and the communication manner is 1-3 type or 2-2 type;
the interdigital electrode is a single-sided printed flexible circuit board which is composed of a polyimide film and a metal conductor material plated on the polyimide film; the electrodes of the interdigital electrodes are copper electrodes and are comb-shaped.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the packaging method provided by the invention is simple to operate, easy to control, low in equipment requirement, good in repeatability and suitable for packaging interdigital electrode type piezoelectric fiber composite materials in different size ranges and different types. The thickness of a polymer layer between the interdigital electrode and the piezoelectric fiber can be effectively reduced by controlling the packaging pressure, so that the piezoelectric fiber is in direct contact with the electrode, the problem that an effective electric field applied to the inside of the piezoelectric fiber actually is greatly reduced due to low dielectric constant of the polymer is solved or reduced, the electric field utilization rate is effectively improved, the polarization and driving voltage are reduced, the energy density and the driving capability of the interdigital electrode type piezoelectric fiber composite material are increased, and the driving performance of the interdigital electrode type piezoelectric fiber composite material is effectively exerted. In addition, the use of the hot pressing tool avoids the direct contact between the hot pressing plate and the interdigital electrode type piezoelectric fiber composite material while ensuring uniform stress and realizing heat transfer, solves the problem of fiber breakage in the packaging process and has high production yield.
The interdigital electrode type piezoelectric fiber composite material prepared by the packaging method has uniform thickness, firm combination of interfaces of all phases, excellent performance and long service period, and can be applied to the fields of vibration control of rotor blades of helicopters, rudder control of unmanned planes, tissue health monitoring, deformation of wings, vibration control of artificial satellites and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a process flow chart of the packaging method of the interdigital electrode type piezoelectric fiber composite material of the present invention;
FIG. 2 is a schematic view of a lamination of the hot press tooling of the present invention;
fig. 3 is a schematic structural view of an interdigital electrode type piezoelectric fiber composite material to be encapsulated in embodiment 1 of the present invention;
fig. 4 is a free strain performance curve of the interdigital electrode type piezoelectric fiber composite material obtained by encapsulation in example 1 of the present invention.
Description of reference numerals: 1 is a first hot-pressing material layer, 2 is a second hot-pressing material layer, 3 is a laminated structure, 4 is an interdigital electrode, 5 is a polymer layer, and 6 is a piezoelectric fiber composite layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Fig. 1 is a process flow chart of the packaging method of the interdigital electrode type piezoelectric fiber composite material of the invention. As shown in fig. 1, the packaging method includes the following steps:
step 100: and wiping the piezoelectric fiber composite layer and the interdigital electrode to be packaged by using absolute ethyl alcohol. Before packaging, the piezoelectric fiber composite layer to be packaged and the interdigital electrode are wiped clean by absolute ethyl alcohol, so that the influence of impurities is avoided. The piezoelectric fiber composite layer is formed by compounding a piezoelectric material and a polymer material in a certain communication mode, the piezoelectric material can adopt PZT, PMN-PT, KNN or BT series piezoelectric ceramics, and the communication mode can be preferably 1-3 type and 2-2 type. The interdigital electrode layer is a single-sided printed flexible circuit board which is composed of a polyimide film and metal conductor materials such as gold, silver or platinum plated on the polyimide film, preferably, the electrode materials are copper electrodes, the electrodes are in a comb-shaped structure, namely, a pair of opposite main electrodes respectively lead out a series of branch electrodes, namely electrode fingers, and the opposite electrode fingers on two sides are alternately arranged.
Step 200: covering an interdigital electrode on the upper surface and the lower surface of the piezoelectric fiber composite layer respectively to form a laminated structure. The effective size (length and width) of the effective area of the interdigital electrode is consistent with the size (length and width) of the piezoelectric fiber composite layer, the interdigital electrode on the upper surface of the piezoelectric fiber composite layer and the interdigital electrode on the lower surface of the piezoelectric fiber composite layer have the same structure and are mirror-symmetrical with respect to the piezoelectric fiber composite layer; the length direction of piezoelectric fibers in the piezoelectric fiber composite layer is perpendicular to the electrode finger direction of the interdigital electrode, and the effective areas of the piezoelectric fiber composite layer and the interdigital electrode are completely attached without bubbles.
The specific process is as follows: firstly, uniformly coating a polymer glue solution on the upper surface of a piezoelectric fiber composite layer, taking an interdigital electrode, marking the interdigital electrode as a first interdigital electrode, covering the interdigital electrode on the upper surface of the piezoelectric fiber composite layer coated with the polymer glue solution to obtain a first laminated structure, wherein the length direction of piezoelectric fibers in the piezoelectric fiber composite layer in the first laminated structure is vertical to the electrode finger direction of an interdigital electrode layer, and the effective areas of the piezoelectric fiber composite layer and the interdigital electrode are completely attached without bubbles; and then, turning over the first laminated structure, uniformly coating polymer glue solution on the lower surface of the piezoelectric fiber composite layer, taking another interdigital electrode, marking as a second interdigital electrode, covering the second interdigital electrode on the surface, coated with the polymer glue solution, of the piezoelectric fiber composite layer to obtain a second laminated structure, wherein in the second laminated structure, the upper and lower interdigital electrode layers which cover the two sides of the piezoelectric fiber composite layer are completely identical in structure, the electrode fingers correspond to each other and are in a mirror symmetry structure. Wherein, the polymer glue solution can adopt thermosetting resin glue solution such as epoxy resin base or phenolic resin base and the like.
Step 300: and sequentially laminating the first hot-pressing layer, the laminated structure and the second hot-pressing layer to form the hot-pressing tool. The first hot-pressing layer and the second hot-pressing layer respectively comprise a first hot-pressing material layer and a second hot-pressing material layer which are arranged in a stacked mode, and the first hot-pressing layer and the second hot-pressing layer are symmetrically arranged relative to the stacked structure. Fig. 2 is a schematic stacking diagram of the hot pressing tool of the present invention, and as shown in fig. 2, the stacking sequence of the layers in the hot pressing tool includes, from top to bottom, a first hot pressing material layer 1, a second hot pressing material layer 2, a stacked structure 3, a second hot pressing material layer 2, and the first hot pressing material layer 1, wherein the size (length and width) of the second hot pressing material layer 2 is slightly larger than the size (length and width) of the interdigital electrode layer; the size (length and width) of the first hot-pressed material layer 1 is slightly larger than the size (length and width) of the second hot-pressed material layer 2. The first hot-pressing material layer 1 is a block metal material with good heat conductivity, high hardness, good parallelism and polished surface, and is preferably stainless steel or iron; the second hot-pressing material layer 2 is made of a flexible material, and is preferably a silica gel pad.
Step 400: putting the hot-pressing tool into a hot-pressing table, and starting a pressure device to apply pressure; after the pressure reaches a set pressure value, starting a heating device to heat the hot pressing plate to a set temperature; and after the temperature of the hot pressing plate reaches the set temperature, controlling the press to keep the temperature and the pressure for a set time, and finishing packaging. According to actual requirements, corresponding set pressure value, set temperature and set duration can be set. For example, the set pressure value may be 1 to 5MPa per unit area; the set temperature can be the curing temperature of the polymer glue solution; the set time length of the heat preservation and pressure maintaining can be 30-240 min.
And after the packaging is finished, controlling the press to cool and reduce the pressure, and taking out the hot pressing tool to obtain the packaged interdigital electrode type piezoelectric fiber composite material. The method can be used for packaging interdigital electrode type piezoelectric fiber composite materials in different size ranges and different types, and corresponding parameters are set correspondingly according to the actual interdigital electrode type piezoelectric fiber composite materials to be packaged.
Three specific examples are provided below to further illustrate the protocol of the present invention.
Example 1
The size of the interdigital electrode type 2-2 piezoelectric fiber composite material is 40 × 30 × 0.4mm, fig. 3 is a schematic structural diagram of the interdigital electrode type piezoelectric fiber composite material to be encapsulated in embodiment 1 of the present invention, as shown in fig. 3, the interdigital electrode type piezoelectric fiber composite material to be encapsulated includes an interdigital electrode 4, a polymer layer 5 and a piezoelectric fiber composite layer 6, and the polymer layer 5 is a polymer glue layer.
The packaging process is as follows:
step 1: wiping a piezoelectric fiber composite layer to be packaged and an interdigital electrode layer by absolute ethyl alcohol for later use, wherein the piezoelectric fiber composite layer is a 2-2 type PZT-based piezoelectric fiber/epoxy resin composite material, the length is 40mm, the width is 30mm, and the thickness is 0.22 mm; the substrate material of the interdigital electrode is a polyimide film, the electrode material is tin-plated copper, and the length and the width of the effective electrode are 40mm and 30mm respectively.
Step 2: 50g of E-44 epoxy resin, 45g of low-molecular-weight 650 polyamide resin, 5g of dibutyl ester and 10g of acetone are weighed by an analytical balance to prepare a polymer glue solution.
Step 3: and uniformly coating the prepared polymer glue solution on the upper surface of the 2-2 type PZT-based piezoelectric fiber/epoxy resin composite layer, taking an interdigital electrode, marking as an upper interdigital electrode, covering the upper surface of the piezoelectric fiber composite layer coated with the polymer glue solution, ensuring that the length direction of the piezoelectric fiber in the piezoelectric fiber composite layer is vertical to the electrode finger direction of the interdigital electrode layer, and completely attaching the piezoelectric fiber composite layer and the effective area of the interdigital electrode layer without bubbles to obtain a first laminated structure.
Step 4: and turning over the first laminated structure, uniformly coating polymer glue solution on the other surface of the piezoelectric fiber composite layer, taking another interdigital electrode with the same structure as the upper interdigital electrode, marking the interdigital electrode as a lower interdigital electrode, covering the lower interdigital electrode on the surface of the piezoelectric fiber composite layer coated with the polymer glue solution, ensuring that electrode fingers of the upper and lower interdigital electrode layers covering two sides of the piezoelectric fiber composite layer correspond to each other, namely, the electrode fingers are in a mirror symmetry structure, and obtaining a second laminated structure.
Step 5: and sequentially stacking the stainless steel plate, the silica gel leather pad, the second laminated structure, the silica gel leather pad and the stainless steel plate from top to bottom to form the hot-pressing tool, wherein the size of the silica gel leather pad is 50 x 40 x 3mm, and the size of the stainless steel plate is 70 x 50 x 3 mm.
Step 6: sending the laminated whole set of hot pressing tool into a hot pressing table, and starting a pressure device to set the packaging pressure to be 1.5MPa per unit area; and after the pressure reaches a set value, starting a heating device to heat the hot pressing plate to 80 ℃, and controlling the press to keep the temperature and the pressure for 60min to finish packaging.
Step 7: and controlling the press to cool and reduce the pressure, and taking out the hot pressing tool to obtain the packaged interdigital electrode type piezoelectric fiber composite material.
Fig. 4 is a free strain performance curve of the interdigital electrode type piezoelectric fiber composite material obtained by encapsulation in embodiment 1 of the present invention, and as shown in fig. 4, under the driving of an ac voltage with an amplitude of 2500V, a bias of 750V, and a frequency of 0.1Hz, the longitudinal strain thereof can reach 2021 μ ∈, and the interdigital electrode type piezoelectric fiber composite material can be used in the fields of structure control, vibration suppression, structure health monitoring, and the like.
Example 2
The packaging method of the interdigital electrode type 1-3 piezoelectric fiber composite material with the size of 85 × 57 × 0.4mm comprises the following steps:
step 1: wiping a piezoelectric fiber composite layer to be packaged and an interdigital electrode layer by absolute ethyl alcohol for later use, wherein the piezoelectric fiber composite layer is a 1-3 type KNN-based piezoelectric fiber/epoxy resin composite material, the length is 85mm, the width is 57mm, and the thickness is 0.25 mm; the substrate material of the interdigital electrode is a polyimide film, the electrode material is gold, and the length and the width of the effective electrode are 85mm and 57mm respectively.
Step 2: 50g of E-44 epoxy resin, 10g of dioctyl phthalate, 20g of porcelain powder and 10g of xylylenediamine are weighed respectively by an analytical balance to prepare polymer glue solution.
Step 3: and uniformly coating the prepared polymer glue solution on the upper surface of the 1-3 KNN-based piezoelectric fiber/epoxy resin composite layer, taking an interdigital electrode, marking as an upper interdigital electrode, covering the upper surface of the piezoelectric fiber composite layer coated with the polymer glue solution, ensuring that the length direction of the piezoelectric fiber in the piezoelectric fiber composite layer is vertical to the electrode finger direction of the interdigital electrode, and completely attaching the piezoelectric fiber composite layer and the effective area of the interdigital electrode without bubbles to obtain a first laminated structure.
Step 4: and turning over the first laminated structure, uniformly coating polymer glue solution on the other surface of the piezoelectric fiber composite layer, taking another interdigital electrode with the same structure as the upper interdigital electrode, marking the interdigital electrode as a lower interdigital electrode, covering the lower interdigital electrode on the surface of the piezoelectric fiber composite layer coated with the polymer glue solution, ensuring that the electrode fingers of the upper and lower interdigital electrodes covering the two sides of the piezoelectric fiber composite layer correspond to each other, namely, are in a mirror symmetry structure, and obtaining a second laminated structure.
Step 5: and (3) sequentially stacking the second laminated structure, the stainless steel plate and the silica gel leather pad from top to bottom to form a hot-pressing tool, wherein the silica gel leather pad is 95 x 65 x 3mm in size, and the stainless steel plate is 105 x 75 x 3mm in size.
Step 6: sending the laminated whole set of hot pressing tool into a hot pressing table, and starting a pressure device to set the packaging pressure to be 4MPa in unit area; and after the pressure reaches a set value, starting a heating device to heat the hot pressing plate to 120 ℃, and controlling the press to keep the temperature and the pressure for 120min to finish packaging.
Step 7: and finally, controlling the press to cool and reduce the pressure, and taking out the hot pressing tool to obtain the packaged interdigital electrode type piezoelectric fiber composite material.
Example 3
The packaging method of the interdigital electrode type gradient piezoelectric fiber composite material with the size of 40 × 30 × 0.4mm adopts a 2-2 type gradient PZT-based piezoelectric fiber/epoxy resin composite material, the length is 40mm, the width is 30mm, and the thickness is 0.3 mm. The encapsulation process refers to example 1.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (10)
1. A packaging method of an interdigital electrode type piezoelectric fiber composite material is characterized by comprising the following steps:
wiping the piezoelectric fiber composite layer and the interdigital electrode to be packaged by absolute ethyl alcohol;
covering an interdigital electrode on the upper surface and the lower surface of the piezoelectric fiber composite layer respectively to form a laminated structure;
the first hot-pressing layer, the laminated structure and the second hot-pressing layer are laminated in sequence to form a hot-pressing tool;
putting the hot-pressing tool into a hot-pressing table, and starting a pressure device to apply pressure; after the pressure reaches a set pressure value, starting a heating device to heat the hot pressing plate to a set temperature; and after the temperature of the hot pressing plate reaches the set temperature, controlling the press to keep the temperature and the pressure for a set time, and finishing packaging.
2. The method for encapsulating an interdigital electrode type piezoelectric fiber composite material according to claim 1, wherein the upper surface and the lower surface of the piezoelectric fiber composite layer are respectively covered with one interdigital electrode to form a laminated structure, specifically comprising:
uniformly coating a polymer glue solution on the upper surface of the piezoelectric fiber composite layer, and covering a first interdigital electrode on the upper surface of the piezoelectric fiber composite layer coated with the polymer glue solution to obtain a first laminated structure;
and turning over the first laminated structure, uniformly coating polymer glue solution on the lower surface of the piezoelectric fiber composite layer, and covering the second interdigital electrode on the lower surface of the piezoelectric fiber composite layer coated with the polymer glue solution to obtain a second laminated structure.
3. The packaging method of the interdigital electrode type piezoelectric fiber composite material according to claim 2, wherein the polymer glue solution is a thermosetting resin glue solution.
4. The method for encapsulating an interdigital electrode type piezoelectric fiber composite material according to claim 1, wherein the first and second thermocompression layers each comprise a first and second thermocompression material layer disposed on top of each other, and the first and second thermocompression layers are symmetrically disposed with respect to the stacked structure.
5. The packaging method of the interdigital electrode type piezoelectric fiber composite material according to claim 4, wherein the first hot-pressing material layer is a bulk metal material layer with a polished surface, the second hot-pressing material layer is a flexible material layer, and the second hot-pressing material layer is attached to the laminated structure.
6. The packaging method of the interdigital electrode type piezoelectric fiber composite material according to claim 5, wherein the size of the first hot-pressing material layer is larger than that of the second hot-pressing material layer, and the size of the second hot-pressing material layer is larger than that of the interdigital electrode.
7. The method for encapsulating an interdigital electrode type piezoelectric fiber composite material according to claim 1, wherein in the laminated structure, the interdigital electrodes on the upper surface of the piezoelectric fiber composite layer and the interdigital electrodes on the lower surface of the piezoelectric fiber composite layer have the same structure and are mirror-symmetrical with respect to the piezoelectric fiber composite layer;
the length direction of piezoelectric fibers in the piezoelectric fiber composite layer is perpendicular to the electrode finger direction of the interdigital electrode, and the effective areas of the piezoelectric fiber composite layer and the interdigital electrode are completely attached without bubbles.
8. The method for encapsulating an interdigital electrode type piezoelectric fiber composite material according to claim 1, wherein the effective size of the effective area of the interdigital electrode is the same as the size of the piezoelectric fiber composite layer.
9. The packaging method of the interdigital electrode type piezoelectric fiber composite material according to claim 1, wherein the set pressure value is 1MPa to 5MPa per unit area; the set temperature is the curing temperature of the polymer glue solution; the set time length of the heat preservation and pressure maintaining is 30-240 min.
10. The method for encapsulating the interdigital electrode type piezoelectric fiber composite material according to claim 1, wherein the piezoelectric fiber composite layer is formed by compounding a piezoelectric material and a polymer material in a communication manner, the piezoelectric material is PZT, PMN-PT, KNN or BT piezoelectric ceramics, the polymer material is thermosetting resin, and the communication manner is 1-3 type or 2-2 type;
the interdigital electrode is a single-sided printed flexible circuit board which is composed of a polyimide film and a metal conductor material plated on the polyimide film; the electrodes of the interdigital electrodes are copper electrodes and are comb-shaped.
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| CN113013319A (en) * | 2021-02-24 | 2021-06-22 | 武汉理工大学 | Low-frequency active vibration suppression system based on integrated structure |
| CN114094008A (en) * | 2021-10-26 | 2022-02-25 | 中南大学 | Two-step packaging method of flexible piezoelectric fiber composite material |
| CN116496102A (en) * | 2023-04-27 | 2023-07-28 | 大连理工大学 | Method for preparing piezoelectric ceramic fiber composite material driver based on freezing casting method |
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| CN113013319A (en) * | 2021-02-24 | 2021-06-22 | 武汉理工大学 | Low-frequency active vibration suppression system based on integrated structure |
| CN114094008A (en) * | 2021-10-26 | 2022-02-25 | 中南大学 | Two-step packaging method of flexible piezoelectric fiber composite material |
| CN114094008B (en) * | 2021-10-26 | 2022-10-14 | 中南大学 | Two-step packaging method of flexible piezoelectric fiber composite material |
| CN116496102A (en) * | 2023-04-27 | 2023-07-28 | 大连理工大学 | Method for preparing piezoelectric ceramic fiber composite material driver based on freezing casting method |
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