CN1478642A - Gas subfebrile temperature in pression shaping method - Google Patents
Gas subfebrile temperature in pression shaping method Download PDFInfo
- Publication number
- CN1478642A CN1478642A CNA021319693A CN02131969A CN1478642A CN 1478642 A CN1478642 A CN 1478642A CN A021319693 A CNA021319693 A CN A021319693A CN 02131969 A CN02131969 A CN 02131969A CN 1478642 A CN1478642 A CN 1478642A
- Authority
- CN
- China
- Prior art keywords
- target
- pressure
- impressed
- mould
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C2043/3205—Particular pressure exerting means for making definite articles
- B29C2043/3238—Particular pressure exerting means for making definite articles pressurized liquid acting directly or indirectly on the material to be formed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3647—Membranes, diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3649—Inflatable bladders using gas or fluid and related details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
A high-pressure pneumatic hot embossing technology for shaping the object includes such steps as laying an object to be embossed on a die, covering it with a sealed cavity to form a sealed space, heating to make it become plastic state, and introducing high-pressure air in it.
Description
(1) technical field
The gas subfebrile temperature in pression shaping method of the relevant a kind of micro-structural of the present invention.
(2) background technology
Since the nineties, MEMS (Micro-Electro-Mechanical Systems, abbreviation MEMS) development all gets most of the attention all over the world, it has comprised the technology of multiple science and technology such as machinery, optics, electronics, material, control, chemistry and has integrated, wish to utilize this new manufacturing technology can make the product microminiaturization and then improve its performance, quality, reliability and surcharge, reduce production costs simultaneously and the exhausting of the energy, make and produce and life is used convenient.
And the main micro-structural that subfebrile temperature in pression method (Hot Embossing) belongs in the MEMS field is duplicated (Replication) technology, and wherein, micro-structural is meant that with μ m or nm be size measures unit.The micro-structural of being made can directly be used as spare part, or utilizes through other processing procedures again.Because this processing procedure is easy and can use manufacturing in batches,, can become one of crucial processing procedure that improves micro electronmechanical product production capacity if can effectively control the forming accuracy and the quality of finished product.
The subfebrile temperature in pression processing procedure all was to utilize oil hydraulic cylinder, pneumatic cylinder or motor/screw rod pressing mechanism in the past, directly drove pressing plate and pushed down plastic cement and mould and come hot-forming.In order more to understand background of the present invention, now known subfebrile temperature in pression shaping apparatus and method are done an explanation.
With reference to figure 6; known hot padding process is at first being fixed on mould 102 on the top board 103a; mould 102 tops are cushioning one deck padded coaming (normally silica gel) more usually; and as waiting that the plastic material 101 that impresses target is placed in lower platen 103b place; pressing plate is a heating-cooling device 105 structures, and this pressing plate can be in order to heating and cooling plastic cement and mould.Afterwards by oil hydraulic cylinder, pneumatic cylinder or motor/screw rod pressing mechanism 106, drive directly that pressing plate is pushed down plastic cement and mould comes hot-forming; Treat through one suitable impression period, and cool off die sinking again and take out finished product.
Utilize above-mentioned known hot padding manufacturing method thereof, have the force of impression skewness, and then influence the size accuracy of repetition problem of finished product; And direct pressing plate hot padding mechanism mode, when carrying out the large tracts of land hot padding, the pressure distribution problem is the extremely challenge of difficulty especially.Therefore, the hot padding area all is confined to small size at present.As current global maximum heat marking press manufactory, the most advanced type HEX-03 of German JENOPTIK Mikrotechnik company, its maximum heat impression area has only 4 inch.
The subfebrile temperature in pression shaping method be mainly used in MEMS (Micro-Electro-Mechanical Systems, MEMS) make the field in, be that considerable micro-structural is duplicated forming technique.This manufacturing method thereof is to be used for turning over system silicon wafer mould or the micro-structural above the electroformed nickel mould, to finish the quick copy of high accuracy and high-quality micro electronmechanical finished product.The method has superior forming characteristic, because the material turnover rate is low, flow apart from weak point, forming step is simple and finished product has been not easy problems such as stress warpage, is fit to very much be used for being shaped optical element or various fine structure.Its application can be divided into micro optical element moulding such as lenticule, low-light grid, little diffraction element; Little living skill moulding such as microorganism chip, microchannel, little sensor; Micromechanical component moulding such as thin-walled, groove, little gear; Little acceleration rule etc. have the element moulding of microelectronic circuit and micro-structural etc.If cooperate automation, can improve output, reach the purpose of batch process.So the hot padding processing procedure is considered in micro electronmechanical industry, is to reduce production costs, improve the crucial processing procedure of production capacity.
Subfebrile temperature in pression processing procedure basic principle is: get the raw materials ready, heating, hot pressing, pressurize cooling, the demoulding take out finished product, and finish whole processing procedure.The temperature of plastic material must just can begin to soften more than its glass transition temperature (GlassTransition Temperature) during hot padding, treats that pressing plate exerts pressure to descend to push down plastic cement/mould, and plastic cement produces the little die cavity of flow deformation filling because of force of impression.After the plastics filling finishes, must cool the temperature under the glass transition temperature and can carry out the demoulding.At this moment, temperature decline can make plastic material produce contraction, therefore must keep certain force of impression is used as packing pressure, allow in the die cavity plastics produce shrink in, can continue to have plastics filling die cavity, the part that additional plastic shrink is fallen treats that temperature reduces under the glass transition temperature demoulding and take out finished product.
Known subfebrile temperature in pression processing procedure all is to utilize oil hydraulic cylinder, pneumatic cylinder or motor/screw rod pressing mechanism, directly drives pressing plate and pushes down plastic cement and mould and come hot-forming.For example, current global maximum heat marking press manufactory, the 5th, 993, No. 189 patents of the U.S., 196,48, No. 844 patents of Germany that German JENOPTIK Mikrotechnik company is proposed are all taked with pressing plate direct heat press mechanism mode.In addition, United States Patent (USP) the 5th, 772, hot padding micro shadow method (the Hot Embossing Lithography that No. 905 (Stephen Y.Chou etc.) are disclosed, HEL or title Nano Imprint Lithography NIL), also take the direct thermoforming way of pressing plate.
When hot padding, place's force of impression is big in the middle of the pressing plate, and then force of impression is little near the platen edge place.Therefore, processing procedure can closely fit mould and thing to be impressed with silica gel plate (Silicone Rubber) as the buffer pad of mould usually, to relax the influence with equalizing pressure, reaches uniform moulding.Yet silica gel plate is upheld distortion easily, and is subject to the extension characteristic of solid-state material itself, and force of impression can't reach desirable evenly distribution.At packing stage, the inequality that force of impression distributes can cause plastic cement to differ in each little die cavity filling; At cooling stage, the inequality of pressurize force of impression then can cause inhomogeneous that plastic cement shrinks, and has a strong impact on the size after the transcription of finished product micro-structural, makes micro electronmechanical finished product can't reach high accuracy and high-quality requirement.This defective makes that present hot padding processing procedure acceptance rate is not high, duplicates the volume production function and has a greatly reduced quality.
In addition, along with advancing by leaps and bounds of semiconductor industry technology, it is also more and more big that the silicon processing procedure is made area.4 inch wafers from early stage advance to 6 inch, 8 inch gradually, 12 inch wafers of current even high-order technology.The increase of chip area means that the cost of manufacture of per unit area reduces, the lifting of overall production capacity.And MEMS mainly is to be based upon on the silicon processing procedure, and development trend also is towards the large tracts of land wafer fabrication.Present stage hot padding process technique generally also rests on 4 inch grades, and as the most advanced type HEX-03 of German JENOPTIK Mikrotechnik company, its maximum heat impression area is 4 inch, and hot-press method is still the direct marking press configuration of pressing plate formula.Present global academia, industrial circle all are devoted to large-area subfebrile temperature in pression research and development, disclosed technology, and another purpose promptly is the carrying out of large tracts of land subfebrile temperature in pression.
Secondly, in the hot padding processing procedure, known techniques when mould is fragile material (for example silicon wafer, glass master), is easy to produce the situation of breaking owing to be to adopt direct pressing plate impression mode at present.Therefore, commonly using the practice is the silicon wafer electroforming to be turned over make the nickel mould, utilizes this nickel mould to impress again.But in the electroforming process, owing to be electrochemical reaction, need use each huge heavy metal species electroforming acid solution of quantity, various additives (for example stress remover, washing agent, wetting agent ... Deng), these chemical solutions are difficult for post processing and are expensive, and this increases the burden of environment greatly.In addition, electroforming processing procedure defective is many, as duplicating efficiency, pin hole, warpage, surface accuracy, coral reef, thickness evenness difference etc., still has multinomial problem to be solved.
Therefore, desire to make the MEMS finished product to commercially produce in a large number, and can reach high accuracy and high-quality quality requirements, just must solve problems such as force of impression skewness and hot pressing area be limited.
(3) summary of the invention
The purpose of this invention is to provide a kind of evenly gas subfebrile temperature in pression shaping method of distribution pressure.
A kind of gas subfebrile temperature in pression shaping method that is used for molded micro-structural is provided according to an aspect of the present invention, comprises the steps: the mould with micro-structural is located on the operating desk; To wait to impress target and flatly place on the mould and fully hide mould, the surface area of waiting to impress target is enough to make fluid-tight engagement with operating desk to being enough to hide mould fully and staying remaining part greatly; Cover the remaining part of waiting to impress target with closed chamber, and make closed chamber inside wait that with what be positioned at closed chamber inside impressing target forms enclosure space with die assembly; Target to be impressed is heated to the plasticity state and feeds gases at high pressure to the enclosure space of closed chamber, wait to impress on the target to this, use the microstructure transfer printing on the mould to target to be impressed to exert pressure equably.
A kind of gas subfebrile temperature in pression shaping method that is used for molded micro-structural is provided according to a further aspect of the invention, be used for microstructure transfer printing to waiting to impress the two-sided of target, comprise the steps: on operating desk, with the mold that is formed with required micro-structural respectively and the opposed mode of face out of the ordinary of bed die, target to be impressed is sandwiched in therebetween and forms the sandwich stacked combination of mold/target/bed die to be impressed; The sealing film that will be used to seal is covered in the sandwich stacked combination, and forming four layers of stacked combination of diaphragm seal/mold/target/bed die to be impressed, the surface area of diaphragm seal piles up and stays remaining part and be enough to and the operating desk fluid-tight engagement to being enough to cover fully sandwich greatly; Cover the remaining part of sealing film with closed chamber, and these four layers of stacked combination are in the seal cavity of closed chamber fully; Target to be impressed is heated to the plasticity state and gases at high pressure is fed in the seal cavity of closed chamber, to exert pressure equably, use the micro structured pattern on mold and the bed die is transferred to this respectively waits to impress up and down on two of target to four layers of stacked combination.
Be provided for the gas subfebrile temperature in pression method of molded micro-structural according to another aspect of the invention, comprise the following steps: on operating desk, the substrate that is coated with the macromolecule individual layer that hardens is placed on the mould with micro-structural, contact with suprabasil high polymer monomer layer with the one side that has micro-structural in the mould, and form mould/substrate stacked combination; The diaphragm seal that will be used to seal is covered in mould/substrate stacked combination, and forms the stacked combination of diaphragm seal/mould/substrate, and the surface area of diaphragm seal piles up and stays remaining part and be enough to and the operating desk fluid-tight engagement to being enough to cover fully sandwich greatly; Closed chamber is covered the remaining part of diaphragm seal, and stacked combination is in the seal cavity of closed chamber fully; This high polymer monomer layer is heated to the plasticity state; And gases at high pressure are fed in the seal cavity of closed chamber, to exert pressure equably to this stacked combination, the micro structured pattern of using mould is transferred to this high polymer monomer layer.
In addition, when carrying out hot padding, the pressure of gases at high pressure is 10kg/cm2 to 200kg/cm2, and the hot pressing time of carrying out is 1 to 30 minute.
According to the present invention, in confined space, use gases at high pressure to carry out subfebrile temperature in pression shaping, can reach the state that complete uniform pressure distributes.By the isobaric distribution character of gas molecule, the hot padding area is unrestricted, can carry out the hot padding of very big area, and the dimensional accuracy of made finished product is good.
In addition,,, therefore can directly impress silicon wafer, need not again silicon wafer be turned over and make the electroformed nickel mould, can simplify processing procedure and reduce cost because using gases pressurization can be exempted the direct pressuring method of known press plate mechanism according to the present invention.
For further specifying purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
(4) description of drawings
Fig. 1 (a) to 1 (d) be schematic diagram, in order to first embodiment of explanation according to the operation of gas subfebrile temperature in pression shaping method of the present invention.
Fig. 2 (a) to 2 (d) be schematic diagram, in order to second embodiment of explanation according to the operation of gas subfebrile temperature in pression shaping method of the present invention.
Fig. 3 (a) to 3 (e) be schematic diagram, in order to three embodiment of explanation according to the operation of gas subfebrile temperature in pression shaping method of the present invention.
Fig. 4 (a) to 4 (e) be schematic diagram, in order to four embodiment of explanation according to the operation of gas subfebrile temperature in pression shaping method of the present invention.
Fig. 5 (a) to 5 (e) be schematic diagram, in order to five embodiment of explanation according to the operation of gas subfebrile temperature in pression shaping method of the present invention.
Fig. 6 is the schematic diagram that shows known subfebrile temperature in pression process.
(5) specific embodiment
Fig. 1 (a) is first embodiment that shows according to gas subfebrile temperature in pression shaping method of the present invention to 1 (d).Shown in Fig. 1 (a), in advance will be as waiting that 1 tiling such as plastic film material (PC film) that impresses target is placed on the mould 2 with predetermined micro-structural, the one side that has micro-structural with mould 2 contacts with target to be impressed.The stacked combination of the plastic cement/mould of Xing Chenging is provided in a side of on the heating cooler pan 10 as operating desk like this, and this heating cooler pan can be in order to heating and cooling plastic cement.
Then shown in Fig. 1 (b), a closed chamber 12 is covered in this plastic cement/mold stack combination, and formed a confined space with plastic cement/mold stack, closed chamber is connected to oil pressure or crank (not shown on the figure) moves to carry out the quickly opening and closing closed chamber.This closed chamber is connected to a high-pressure compressor 18 and a pressure-control valve 16 via pipeline 14.
Then shown in Fig. 1 (c), utilize heating cooler pan 10 to add thermoplastic, temperature is increased to more than the glass transition temperature of this plastic cement, make plastic cement be in softening plasticity state, and utilize high-pressure compressor 18 to feed gases at high pressure, simultaneously this gas pressure is transferred to the briquetting pressure condition of plastic film via pressure-control valve, for example, about 10 ~ 200kg/cm
2Gas pressure.This moment, plastic film began the filling of die cavity because of being subjected to force of impression, treat a period of time after, begin to cool off and lasting simultaneously pressurize.
Finish the filling of one-piece machine member profile when plastic cement after, gas is released, open closed chamber again, take out finished product (shown in Fig. 1 (d)) via pressure-control valve 16.
Fig. 2 (a) is to show that gas low-grade fever according to the present invention is printed as second embodiment of type method to 2 (d), it is to push down as the plastic film 1 of waiting to impress target to cover fully remaining part behind the mould 2 directly is not pressed on the mould 2 except employed hot padding mould 2 for fragile material (as silicon wafer master mold, glass master mold) and closed chamber 12, and other methods of operating and condition all are same as the foregoing description 1.
Embodiment 3
Fig. 3 (a) is to show a third embodiment in accordance with the invention to 3 (e), in order to molded pair of surface micro-structure element.Shown in Fig. 3 (a), in advance will be as waiting that the moulding that impresses target folds up between upper and lower mould 2a, 2b with plastic film material (as the PC film) 1, makes it become the sandwich stacked combination of one mold/plastic film/bed die.Mold and bed die have micro-structural respectively and are formed at, and when forming sandwich and pile up, are that to be provided with the face of micro-structural individually with mold and bed die in opposition to each other and plastic film 1 is clipped in therebetween.Wherein the sandwich stacked combination of this mold/plastic film/bed die is to be placed on one as on the heating cooler pan of operating desk 10, and this heating cooler pan 10 can be in order to heating and cooling plastic cement.
Then as scheme again a slice diaphragm seal 8 to be tiled on this sandwich stacked combination shown in (3b), four layers of stacked combination of diaphragm seal/mold/plastic film/bed die have been formed.This diaphragm seal 8 can cover the sandwich stacked combination and stay remaining part fully to be enough to and heating cooler pan 10 fluid-tight engagement, described as follows the pressure thereon by closed chamber 12 like that and form confined space.
Then, shown in Fig. 3 (c), be pressed on the heating cooler pan 10 with the remaining part of a closed chamber 12, and these four layers of stacked combination are placed in the closed chamber 12 fully plastic film 1 and diaphragm seal 8.Closed chamber 12 is connected to oil pressure or crank (not shown on the figure) moves to carry out the quickly opening and closing closed chamber.This closed chamber 12 is connected to a high-pressure compressor 18 and a pressure-control valve 16 via pipeline 14.
Then shown in Fig. 3 (d), utilize 10 heating of heating cooler pan, and make temperature be increased to it more than glass transition temperature as the plastic film 1 of waiting to impress target, make plastic film 1 be in softening plasticity state, and utilize high-pressure compressor 18 to feed gases at high pressure, simultaneously this gas pressure is transferred to the briquetting pressure condition of plastic film 1 via pressure-control valve, for example, about 10 ~ 200kg/cm
2Gas pressure.This moment, plastic film 1 began the filling of die cavity because of being subjected to force of impression, treat a period of time after, begin to cool off and lasting simultaneously pressurize.This hot pressing time is preferably at 1-30 minute.In addition, the glass transition temperature of diaphragm seal 8 preferably is higher than the glass transfer printing temperature as the plastic film 1 of waiting to impress target.
After whole micro-structural profile intactly is needed on plastic film 1, via pressure-control valve 16 gas is released, open closed chamber 12 again, take out finished product (shown in Fig. 3 (e)).
Embodiment 4
Fig. 4 (a)-4 (e) shows a fourth embodiment in accordance with the invention, and it is that micro-structured component is overmolded on the tabular target.Shown in Fig. 4 (a), in advance will be (for example as the plastic plate 3 of waiting to impress target, the PMMA plate) is placed on the mould 2 with micro-structural, contact with the one side with micro-structural of mould 2, and the stacked combination of formed plastic plate/mould is placed on the heating cooler pan 10, this heating cooler pan 10 can be in order to heating and cooling plastic cement.
Then, shown in Fig. 4 (b), the more airtight film 8 of a slice is tiled in the combination of this plastic plate/mold stack on, and formed the three level stack combination of diaphragm seal/plastic plate/mould.The function of this diaphragm seal is to be used for cooperating closed chamber to carry out the gas subfebrile temperature in pression shaping of plate micro-structured component.
Then shown in Fig. 4 (c), a closed chamber 12 is covered this three level stack combination, make it become a confined space, closed chamber 12 is connected to oil pressure or crank (not shown on the figure) moves to carry out the quickly opening and closing closed chamber.This closed chamber is connected to a high-pressure compressor 18 and a pressure-control valve 16 via pipeline 14.
Then shown in Fig. 4 (d), utilize heating cooler pan 10 heating plastic plates 3, temperature is increased to more than the glass transition temperature of this plastic plate, make plastic plate be in softening plasticity state, and utilize high-pressure compressor 18 to feed gases at high pressure, simultaneously via pressure-control valve 16 this gas pressure is transferred to the briquetting pressure condition of plastic plate 3, for example, about 10 ~ 200kg/cm
2Gas pressure.This moment, plastic cement began the filling of die cavity because of being subjected to force of impression, treat a period of time after, begin to cool off and lasting simultaneously pressurize.
Finish the filling of one-piece machine member profile when plastic plate 3 after, gas is released, open closed chamber 12 again, take out finished product (shown in Fig. 4 (e)) via pressure-control valve 16.
Embodiment 5
Fig. 5 (a) is the 5th embodiment that shows according to gas subfebrile temperature in pression shaping method of the present invention to 5 (e).Shown in Fig. 5 (a), in advance will be for example high polymer monomer such as photoresistance for example coat in the substrate 5 such as silicon wafer, baking hardening and form and treat embossed layer 4 in addition again, the one side that will have the mould 2 of micro-structural then places to be treated on the embossed layer 4, becomes mould/silicon wafer stacked combination.This stacked combination is seated on the heating cooler pan 10, and heating cooler pan 10 can be treated embossed layer 4 in the substrate 5 in order to heating and cooling.
Then, shown in Fig. 5 (b), the more airtight film 8 of a slice is tiled in this mould/silicon wafer stacked combination on, and formed the stacked in layers combination of diaphragm seal/mould/substrate.The function of this diaphragm seal is to be used for cooperating closed chamber to carry out gas subfebrile temperature in pression.
Come, shown in Fig. 5 (c), a closed chamber 12 is covered this stacked in layers combination, make it become a confined space, closed chamber 12 is connected to oil pressure or crank (not shown on the figure) moves to carry out quickly opening and closing closed chamber 12.This closed chamber 12 is connected to a high-pressure compressor 18 and a pressure-control valve 16 via pipeline 14.
Then shown in Fig. 5 (d), utilize 10 heating of heating cooler pan to treat embossed layer 4, temperature is increased to this more than glass transition temperature for the treatment of embossed layer 4, make this treat that embossed layer 4 is in softening plasticity state, and utilize high-pressure compressor 18 to feed gases at high pressure, simultaneously via pressure-control valve 16 this gas pressure is transferred to the briquetting pressure condition for the treatment of embossed layer 4, for example, about 10 ~ 200kg/cm
2Gas pressure.Treat that embossed layer 4 is subjected to force of impression and begins the filling of die cavity this moment, treat a period of time after, begin to cool off and continue simultaneously pressurize.
When the whole micro-structural profile on the mould 2 be transferred to fully treat on the embossed layer 4 after, via pressure-control valve 16 gas is released, open closed chamber again, take out finished product (shown in Fig. 5 (e)).
Though with preferred embodiment the present invention is described in above-mentioned; but; its only as an illustration usefulness be not in order to limit the present invention; any person skilled in the art person without departing from the spirit and scope of the present invention; can do to change and revise to the foregoing description, scope of the present invention be that the scope of patent protection that is limited with claim is as the criterion.
For example, according to the present invention, carrying out the employed gas of gas subfebrile temperature in pression shaping is air, or other inert gas (as argon gas, nitrogen etc.), or the mist of these gases.
For example, wait to impress target except high polymer monomers such as plastic cement mould, plastic plate, photoresistance, still can use for example metal forming such as aluminium foil, goldleaf.In addition, the plastic plate of indication is meant more than the thickness 0.2mm in this specification, and plastic film is meant below thickness 0.2 mm.
For example, subfebrile temperature in pression mould used in the present invention (mother matrix) comprising: the silicon wafer mother matrix mould of producing via the micro-machined mould of micromechanics, via the silicon processing procedure (for example, 4 inch, 6 inch, 8 inch, 12 inch or bigger all can), electroforming turns over system nickel mould, glass substrate mould or other via the micro-mould of various microfabrication etc.
Now characteristics of the present invention and advantage thereof are described as follows:
1. according to gas subfebrile temperature in pression shaping method of the present invention, using gases is directly treated the impression target and is carried out subfebrile temperature in pression shaping, and without any need for other actuator and/or pressure exerting arrangement.Because the tropism such as grade of gas molecule, isotone pressure distribution characteristic can reach the subfebrile temperature in pression shaping that complete uniform pressure distributes.
2. according to gas subfebrile temperature in pression shaping method of the present invention, can reach the progressive effect that complete uniform pressure distributes.Because the isobaric distribution character of gas, so the hot padding area is unrestricted, can carry out very big area hot padding (for example 4 inch, 6 inch, 8 inch, 12 inch or with first-class all can).
3. compared to hot padding located by prior art in the past, according to gas subfebrile temperature in pression shaping method of the present invention, on processing procedure,, can exempt the direct pressuring method of traditional press plate mechanism because using gases pressurizes, therefore can directly impress silicon wafer, need not again silicon wafer be turned over and make the electroforming mould.Can simplify manufacturing step, reduce cost, and have the feature of environmental protection, spatter property concurrently and save the energy.
4. according to gas subfebrile temperature in pression shaping method of the present invention, can allow to carry out double-side micro structure hot padding moulding, processing procedure elasticity is big.
5. compared to the subfebrile temperature in pression technology of commonly using, according to gas subfebrile temperature in pression shaping method of the present invention, on processing procedure, can avoid using cost an arm and a leg, hot padding make-up machine that function limitation, Machinery Design complexity, maintenance are difficult for.
Certainly, those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, and be not to be used as limitation of the invention, as long as in connotation scope of the present invention, all will drop in the scope of claims of the present invention variation, the modification of the above embodiment.
Claims (18)
1. gas subfebrile temperature in pression shaping method that is used for molded micro-structural, this method is that the target to be impressed on being located at mould is heated to when softening plastic state in confined chamber, directly exert pressure and wait to impress the combination of target and the formation of this mould to this, with with the microstructure transfer printing on this mould to this target to be impressed, it is characterized in that: this target to be impressed will be separated into first and second space in this confined chamber, this mould and this wait that the combination that impresses target is in second space, in first space, apply gases at high pressure, directly exert pressure with these gases at high pressure and to wait to impress the combination of target and this mould to this, do not exert pressure and wait to impress the combination of target and this mould to this by any pressure exerting arrangement.
2. the method for claim 1 is characterized in that, is 10KG/CM at this high-pressure gas pressure
2To 200KG/CM
2Carry out hot padding 1 to 30 minute down.
3. the method for claim 1 is characterized in that, this target to be impressed is a plastic foil.
4. method as claimed in claim 3 is characterized in that, this plastic foil thickness is in the scope of 0.025MM to 0.2MM.
5. the method for claim 1 is characterized in that, this target to be impressed is a metal forming.
6. the method for claim 1 is characterized in that, these gases at high pressure are one of air, inert gas, nitrogen and their mist.
7. gas subfebrile temperature in pression shaping method that is used for molded micro-structural, this method is in confined chamber, diaphragm seal, set of molds, with wait to impress target and form and treat the impression combination, when this target to be impressed is heated to softening plastic state, directly exert pressure and treat the impression combination to this, with with the microstructure transfer printing on this set of molds to this target to be impressed, it is characterized in that: the sealing film is separated into first space and second space with this confined chamber, this impression configuration is in second space, in first space, apply gases at high pressure, directly exert pressure with these gases at high pressure and to treat impression combination, do not exert pressure and treat the impression combination to this by any pressure exerting arrangement to this.
8. method as claimed in claim 7, it is characterized in that, this set of molds by two minutes on other and bed die forms, this target to be impressed is to be located on this to reach between the bed die, so that these two surfaces up and down of waiting to impress target contact with the face that last and bed die are provided with micro-structural respectively.
9. as claim 7 or 8 described methods, it is characterized in that, is 10KG/CM at this high-pressure gas pressure
2To 200KG/CM
2Carry out hot padding 1 to 30 minute down.
10. as claim 7 or 8 described methods, it is characterized in that this target to be impressed is a plastic foil.
11. method as claimed in claim 10 is characterized in that, this plastic foil thickness is in the scope of 0.025MM to 0.2MM.
12., it is characterized in that this target to be impressed is that plastic plate and thickness are 0.2MM to 5MM as claim 7 or 8 described methods.
13., it is characterized in that this target to be impressed is a metal forming as claim 7 or 8 described methods.
14., it is characterized in that this target to be impressed is to be coated in the substrate and the high polymer monomer layer that solidifies as claim 7 or 8 described methods.
15. method as claimed in claim 14 is characterized in that, this substrate is one of silicon wafer, glass, plastic plate.
16., it is characterized in that the sealing film is a plastic foil as claim 7 or 8 described methods.
17., it is characterized in that the sealing film is a metal forming as claim 7 or 8 described methods.
18., it is characterized in that these gases at high pressure are one of air, inert gas, nitrogen and their mist as claim 7 or 8 described methods.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021319693A CN1478642A (en) | 2002-08-30 | 2002-08-30 | Gas subfebrile temperature in pression shaping method |
| US10/647,850 US20040040644A1 (en) | 2002-08-30 | 2003-08-25 | Micro hot embossing method for quick heating and cooling, and uniformly pressing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021319693A CN1478642A (en) | 2002-08-30 | 2002-08-30 | Gas subfebrile temperature in pression shaping method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1478642A true CN1478642A (en) | 2004-03-03 |
Family
ID=34145069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021319693A Pending CN1478642A (en) | 2002-08-30 | 2002-08-30 | Gas subfebrile temperature in pression shaping method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1478642A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100405085C (en) * | 2004-06-28 | 2008-07-23 | 鸿富锦精密工业（深圳）有限公司 | Method and device for producing optical module |
| US7972553B2 (en) | 2004-05-07 | 2011-07-05 | Obducat Ab | Method for imprint lithography at constant temperature |
| CN101157317B (en) * | 2007-10-19 | 2011-08-03 | 张纪元 | A manufacturing method of surface concave-convex type wood board |
| CN102285112A (en) * | 2010-06-18 | 2011-12-21 | 晟铭电子科技股份有限公司 | Isostactic pressing device and isostactic pressing system |
| US8147235B2 (en) | 2003-12-05 | 2012-04-03 | Obducat Ab | Device and method for large area lithography |
| CN102442143A (en) * | 2010-10-11 | 2012-05-09 | 晟铭电子科技股份有限公司 | Isostactic pressing method and isostactic pressing system |
| CN102530840A (en) * | 2012-01-09 | 2012-07-04 | 浙江大学 | Method and device for performing hot embossing of parts by self-polishing die |
| CN103042681A (en) * | 2011-10-11 | 2013-04-17 | 晟铭电子科技股份有限公司 | Hot press molding device and method thereof |
| CN103129287A (en) * | 2011-11-29 | 2013-06-05 | 纬创资通股份有限公司 | Embossing method and embossing die |
| CN101780699B (en) * | 2009-01-20 | 2014-01-08 | 晟铭电子科技股份有限公司 | Microstructure forming device and method and light guide plate thereof |
| CN105818363A (en) * | 2011-06-28 | 2016-08-03 | 泰克瑞典公司 | Device and method for heating mould or tool |
| CN109318472A (en) * | 2018-11-09 | 2019-02-12 | 五邑大学 | A kind of stamping die for film |
| CN110035888A (en) * | 2016-12-16 | 2019-07-19 | 斯道拉恩索公司 | The method of product and the production product with micro- pattern |
| CN110767799A (en) * | 2019-11-11 | 2020-02-07 | 南京航空航天大学 | Packaging method of interdigital electrode type piezoelectric fiber composite material |
| CN113534606A (en) * | 2021-08-06 | 2021-10-22 | 宁波舜宇奥来技术有限公司 | Pressurization structure |
-
2002
- 2002-08-30 CN CNA021319693A patent/CN1478642A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8147235B2 (en) | 2003-12-05 | 2012-04-03 | Obducat Ab | Device and method for large area lithography |
| US7972553B2 (en) | 2004-05-07 | 2011-07-05 | Obducat Ab | Method for imprint lithography at constant temperature |
| US7997890B2 (en) | 2004-05-07 | 2011-08-16 | Obducat Ab | Device and method for lithography |
| CN100405085C (en) * | 2004-06-28 | 2008-07-23 | 鸿富锦精密工业（深圳）有限公司 | Method and device for producing optical module |
| CN101157317B (en) * | 2007-10-19 | 2011-08-03 | 张纪元 | A manufacturing method of surface concave-convex type wood board |
| CN101780699B (en) * | 2009-01-20 | 2014-01-08 | 晟铭电子科技股份有限公司 | Microstructure forming device and method and light guide plate thereof |
| CN102285112A (en) * | 2010-06-18 | 2011-12-21 | 晟铭电子科技股份有限公司 | Isostactic pressing device and isostactic pressing system |
| CN102285112B (en) * | 2010-06-18 | 2014-06-04 | 晟铭电子科技股份有限公司 | Isostactic pressing device and isostactic pressing system |
| CN102442143A (en) * | 2010-10-11 | 2012-05-09 | 晟铭电子科技股份有限公司 | Isostactic pressing method and isostactic pressing system |
| CN102442143B (en) * | 2010-10-11 | 2015-03-18 | 晟铭电子科技股份有限公司 | Isostactic pressing method and isostactic pressing system |
| CN105818363A (en) * | 2011-06-28 | 2016-08-03 | 泰克瑞典公司 | Device and method for heating mould or tool |
| US9962861B2 (en) | 2011-06-28 | 2018-05-08 | Tctech Sweden Ab | Device and method for heating a mould or tool |
| CN105818363B (en) * | 2011-06-28 | 2019-08-09 | 泰克瑞典公司 | Device and method for being heated to mold or tool |
| CN103042681A (en) * | 2011-10-11 | 2013-04-17 | 晟铭电子科技股份有限公司 | Hot press molding device and method thereof |
| CN103042681B (en) * | 2011-10-11 | 2016-06-01 | 晟铭电子科技股份有限公司 | Hot press molding device and method thereof |
| CN103129287A (en) * | 2011-11-29 | 2013-06-05 | 纬创资通股份有限公司 | Embossing method and embossing die |
| CN102530840A (en) * | 2012-01-09 | 2012-07-04 | 浙江大学 | Method and device for performing hot embossing of parts by self-polishing die |
| CN110035888A (en) * | 2016-12-16 | 2019-07-19 | 斯道拉恩索公司 | The method of product and the production product with micro- pattern |
| CN109318472A (en) * | 2018-11-09 | 2019-02-12 | 五邑大学 | A kind of stamping die for film |
| CN110767799A (en) * | 2019-11-11 | 2020-02-07 | 南京航空航天大学 | Packaging method of interdigital electrode type piezoelectric fiber composite material |
| CN113534606A (en) * | 2021-08-06 | 2021-10-22 | 宁波舜宇奥来技术有限公司 | Pressurization structure |
| CN113534606B (en) * | 2021-08-06 | 2024-04-19 | 宁波舜宇奥来技术有限公司 | Pressurizing structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1478642A (en) | Gas subfebrile temperature in pression shaping method | |
| TWI388418B (en) | Precision imprinting device and its embossing load control method | |
| Chang et al. | Gas pressurized hot embossing for transcription of micro-features | |
| CN1457505A (en) | Fluid pressure imprint lithography | |
| CN101780699B (en) | Microstructure forming device and method and light guide plate thereof | |
| CN1778568A (en) | Hot-press printing method | |
| CN1518070A (en) | Press manufacturing method, its manufacturing device, manufacturing method of magnetic recording medium and its manufacturing device | |
| CN106094429B (en) | Imprinting apparatus and its working method | |
| CN101028730A (en) | Draw-expanding composite forming method and apparatus for built-in piece injection membrane in mould | |
| TWI222925B (en) | Hot-embossing forming method featuring fast heating/cooling and uniform pressurization | |
| CN105058770B (en) | A kind of rapid polymerization object micro-structure isothermal tablet thermal imprint process | |
| CN101114120A (en) | A stamper and production method thereof and imprinting process of substrate using the stamper | |
| CN101160203A (en) | Machining method of microstructure and machining system of microstructure | |
| CN107473177B (en) | Manufacturing method of 3D (three-dimensional) micro-nano structure | |
| CN208052583U (en) | A kind of roller of two-dimension vibration auxiliary is to plane hot stamping device | |
| CN108892099B (en) | Method for preparing uniform surface microstructure by impressing ultrathin material | |
| CN106799830B (en) | A kind of polymer surfaces micro-structure thermal marking method of plasmaassisted | |
| US20040040644A1 (en) | Micro hot embossing method for quick heating and cooling, and uniformly pressing | |
| JP2003062845A (en) | Method and apparatus for press molding | |
| CN100541326C (en) | The impression manufacture method and the device thereof of Nano grade figure | |
| CN205080364U (en) | Composite nanowire impression soft mode board | |
| CN1858896A (en) | Pressure equalizing device for micro nano transfer printing | |
| CN208013664U (en) | A kind of imprinting apparatus of two dimension ancillary vibration | |
| KR100955453B1 (en) | Fabrication Method of High Aspect Ratio Nano/Micro Patterns by Vibration-assisted Filling Process | |
| CN1300635C (en) | Vacuum negative pressure nanometer press printing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |