CN114094008B - Two-step packaging method of flexible piezoelectric fiber composite material - Google Patents
Two-step packaging method of flexible piezoelectric fiber composite material Download PDFInfo
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Abstract
The invention discloses a two-step packaging method of a flexible piezoelectric fiber composite material, which comprises the steps of wiping and cleaning interdigital electrodes or planar electrodes to be packaged and a piezoelectric fiber composite layer or a piezoelectric fiber array adhered on a viscous polymer film by absolute ethyl alcohol, then adding polymer glue solution between the interdigital electrodes or the planar electrodes and the piezoelectric fiber composite layer and the piezoelectric fiber array and overlapping and aligning with the effective area of a lower electrode to form a first-step packaging part, sequentially placing a heat-conducting metal layer, a buffer layer, the first-step packaging part, the buffer layer and the heat-conducting metal layer to form a first-step packaging part, separating after vacuum, pressurization and temperature rise, repeating the operations with an upper electrode to complete two-step packaging, and obtaining the flexible piezoelectric fiber composite material. The method is simple, short in time and efficient, has high stability and high driving and sensing performance, and can select interdigital electrodes or planar electrodes with different sizes to carry out integrated packaging according to the use requirements of the flexible piezoelectric fiber composite material.
Description
Technical Field
The invention relates to the technical field of flexible piezoelectric fiber composite material packaging, in particular to a two-step packaging method of a flexible piezoelectric fiber composite material.
Background
The flexible piezoelectric fiber composite material is formed by compounding piezoelectric ceramic fibers, epoxy resin and other high polymer polymers, the structure of the flexible piezoelectric fiber composite material is a sandwich structure formed by covering piezoelectric fiber composite layers with upper and lower polyimide plane electrodes or interdigital electrodes, the middle piezoelectric fiber composite layer is formed by alternately arranging unidirectional rectangular piezoelectric ceramic fibers, epoxy resin and other high polymer polymers, the integral packaging is adopted, the material overcomes the problems of high brittleness and poor toughness of the traditional piezoelectric ceramic material, has good flexibility and rigidity, is widely applied to the fields of sensing, driving and health monitoring, and particularly can be used on some curved surface structures to realize the sensing, driving and structural health monitoring of the curved surface structures. At present, the flexible piezoelectric fiber composite material is widely applied to the fields of military and civil use.
For the flexible piezoelectric fiber composite material, the size of the flexible piezoelectric fiber composite material affects the driving performance of the flexible piezoelectric fiber composite material, the large-size flexible piezoelectric fiber composite material has the advantages of providing a large driving force and high sensing capacity and being used for active inhibition control and deformation control, and the composite material is sealed in a polyimide film through a packaging technology to enable the composite material to have good mechanical stability. However, at present, the packaging process of the flexible piezoelectric fiber composite material is less, and the method at the present stage is packaged in one step by a hot press, but the packaging process has obvious defects, has the problems of poor packaging stability and high difficulty in electrode alignment, and is particularly more difficult to package large-size and micro-size flexible piezoelectric fiber composite materials. For example, the publication number is CN110767799B, and the patent name is: an interdigital electrode type piezoelectric fiber composite material packaging method mainly aims at packaging of flexible piezoelectric fiber composite materials with medium and proper sizes, alignment difficulty of small-size electrodes is small, however, an intermediate piezoelectric fiber composite layer is prone to sliding in the alignment process, time consumption and efficiency are low, if the size of the piezoelectric fiber composite layer is large, the manual alignment difficulty of an upper electrode, a lower electrode and the intermediate piezoelectric fiber composite layer is increased, meanwhile, dislocation degree of the upper electrode and the lower electrode in hot pressing can be increased, product performance is affected, and yield is low. Therefore, the packaging method is urgently needed to be invented, the efficient and stable packaging of the flexible piezoelectric fiber composite material with any size can be effectively realized, and the preparation process level of the flexible intelligent material is improved.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a two-step packaging method of a flexible piezoelectric fiber composite material, which solves the problems mentioned in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a two-step packaging method of a flexible piezoelectric fiber composite material comprises the following steps:
s1, wiping and cleaning an interdigital electrode or a planar electrode to be packaged and a piezoelectric fiber composite layer or a piezoelectric fiber array adhered on a viscous polymer film by using absolute ethyl alcohol;
s2, overlapping and aligning a piezoelectric fiber composite layer or a piezoelectric fiber array adhered to the viscous polymer film with the effective area of the lower electrode, and adding polymer glue solution between the piezoelectric fiber composite layer and the piezoelectric fiber array to form a first-step packaging piece;
s3, placing the heat-conducting metal layer, the buffer layer, the first-step packaging part, the buffer layer and the heat-conducting metal layer on a hot-pressing table in sequence to form a first-step packaging part;
s4, placing the first-step packaging assembly in a vacuum hot press for vacuumizing, starting to pressurize when the vacuum degree reaches a set value, starting to heat when the pressure reaches the set value, taking out the first-step packaging assembly after the temperature is raised to the set temperature and the pressure is maintained for a period of time, and wiping and cleaning the first-step packaging assembly by using absolute ethyl alcohol;
s5, overlapping and aligning the first-step packaging piece with the upper electrode, and adding a polymer glue solution between the first-step packaging piece and the upper electrode to form a second-step packaging piece;
s6, placing the heat-conducting metal layer, the buffer layer, the second-step packaging part, the buffer layer and the heat-conducting metal layer on a hot-pressing table in sequence to form a second-step packaging part;
and S7, placing the second-step packaging assembly in a vacuum hot press for vacuumizing, starting to pressurize when the vacuum degree reaches a set value, starting to heat when the pressure reaches the set value, taking out the second-step packaging assembly after the temperature is raised to the set temperature and the pressure is maintained for a period of time, and wiping and cleaning the second-step packaging assembly by using absolute ethyl alcohol to obtain the flexible piezoelectric fiber composite material.
Preferably, in step S2, the piezoelectric fiber array adhered to the adhesive polymer film is overlapped and aligned with the effective area of the lower electrode, and a polymer adhesive solution is added therebetween to form a first-step package, and then the adhesive polymer film is peeled off from the first-step package.
Preferably, in the first-step package and the second-step package, the length direction of the piezoelectric fiber in the piezoelectric fiber composite layer or the piezoelectric fiber array is perpendicular to the electrode finger direction of the interdigital electrode or the planar electrode.
Preferably, the overlapping alignment in step S2 and step S5 specifically means that the overlapping is tightly attached without bubbles.
Preferably, the polymer glue solution is a thermosetting resin glue solution.
Preferably, the adhesive polymer film is a UV film, a blue film, a polyimide tape or a high temperature tape.
Preferably, the buffer layer material is silica gel or sponge.
Preferably, in the step S4 and the step S7, the set value of the vacuum degree is-0.08 MPa to-0.09 MPa; the pressure set value is 0.01 MPa-0.9 MPa; the temperature setting value is the curing temperature of the polymer glue solution; and maintaining the pressure and preserving the heat for a period of time of 20-120 min.
Preferably, the pressure and heat preservation time of the second step of packaging is longer than that of the first step of packaging.
The beneficial effects of the invention are: the packaging method can realize efficient and stable packaging of flexible piezoelectric fiber composite materials with different electrode types and any sizes, two-step packaging reduces electrode alignment difficulty and sliding probability of the middle layer, efficiency, stability and yield are improved, equipment requirements are low, heat conducting metal layers in the first-step packaging assembly and the second-step packaging assembly guarantee uniformity of heat transfer, and the buffer layer guarantees that the packaging assemblies cannot be broken due to direct contact of pressure. The method is added with a vacuumizing process, so that small bubbles in the packaging process can be better removed, the combination is easier and tighter, the prepared flexible piezoelectric fiber composite material is uniform in thickness, tight in combination with an interface between phases, excellent and stable in performance, can be applied to the fields of sensing, driving and energy collection, and can be adjusted at will in size to adapt to actual conditions, so that the size is greatly actively inhibited in an aerospace structure, and the size is reduced to the size for collecting micro mechanical energy of a human body.
Drawings
FIG. 1 is a flowchart illustrating steps of a packaging method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a first step package formed by using a piezoelectric fiber composite layer according to an embodiment;
FIG. 3 is a schematic diagram of a first step package formed using an array of piezoelectric fibers according to an embodiment;
FIG. 4 is a schematic diagram of a package assembly formed by a second step using a piezoelectric fiber composite layer according to an embodiment;
FIG. 5 is a schematic structural diagram of an interdigital electrode type and a planar electrode type flexible piezoelectric fiber composite material in the embodiment;
FIG. 6 is a graph showing voltage signals of the planar electrode type flexible piezoelectric fiber composite prepared in example 2;
FIG. 7 is a free strain curve of the interdigital electrode type flexible piezoelectric fiber composite prepared in example 3;
in the figure, 1-heat conducting metal layer, 2-buffer layer, 3-lower electrode, 4-piezoelectric fiber array, 5-viscous polymer film, 6-piezoelectric fiber composite layer, 7-upper electrode, 8-interdigital electrode layer, 9-polymer layer and 10-planar electrode.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-7, the present invention provides a technical solution: a two-step packaging method of a flexible piezoelectric fiber composite material is disclosed, as shown in figure 1, and comprises the following steps:
s1, wiping and cleaning an interdigital electrode or a planar electrode to be packaged and a piezoelectric fiber composite layer or a piezoelectric fiber array adhered on a viscous polymer film by using absolute ethyl alcohol;
s2, overlapping and aligning a piezoelectric fiber composite layer or a piezoelectric fiber array adhered to the viscous polymer film with the effective area of the lower electrode, and adding polymer glue solution between the piezoelectric fiber composite layer and the piezoelectric fiber array to form a first-step packaging piece;
s3, placing the heat conduction metal layer, the buffer layer, the first-step packaging part, the buffer layer and the heat conduction metal layer on a hot-pressing table in sequence to form a first-step packaging part;
s4, placing the first-step packaging assembly in a vacuum hot press for vacuumizing, starting to pressurize when the vacuum degree reaches a set value, starting to heat when the pressure reaches the set value, taking out the first-step packaging assembly after the temperature is raised to the set temperature and the pressure is maintained for a period of time, and wiping and cleaning the first-step packaging assembly by using absolute ethyl alcohol;
s5, overlapping and aligning the first-step packaging piece with the upper electrode, and adding a polymer glue solution between the first-step packaging piece and the upper electrode to form a second-step packaging piece;
s6, placing the heat-conducting metal layer, the buffer layer, the second-step packaging part, the buffer layer and the heat-conducting metal layer on a hot-pressing table in sequence to form a second-step packaging part;
and S7, placing the second-step packaging assembly in a vacuum hot press for vacuumizing, starting to pressurize when the vacuum degree reaches a set value, starting to heat when the pressure reaches the set value, taking out the second-step packaging assembly after the temperature is raised to the set temperature and the pressure is maintained for a period of time, and wiping and cleaning the second-step packaging assembly by using absolute ethyl alcohol to obtain the flexible piezoelectric fiber composite material.
For step S2, the first step packages with different structures are obtained by case for different cases:
the first condition is as follows: for the case where the piezoelectric fibers have been compounded with a polymer to form a piezoelectric fiber composite layer (i.e., the piezoelectric fiber composite layer has been prepared in advance), the first step of the package structure is shown in fig. 2.
And a second condition: for the case where only the piezoelectric fiber array is prepared before packaging, and the piezoelectric fiber composite layer is not formed (i.e. only the piezoelectric fiber array is prepared), the structure of the package in the first step is shown in fig. 3. The piezoelectric fiber array is adhered to the viscous polymer film, and the viscous polymer film needs to be peeled off from the first-step packaging piece after the first-step packaging is finished.
And finally forming a piezoelectric fiber composite layer of the flexible piezoelectric fiber composite material, wherein the components of the polymer and the polymer glue solution which are alternately and compositely arranged in the piezoelectric fiber array are consistent.
Further, in the first-step package and the second-step package:
the polymer glue solution is uniformly coated on the inner surface of the electrode and the piezoelectric fiber composite layer or the piezoelectric fiber array.
The middle-layer piezoelectric fiber array or the piezoelectric fiber composite layer is overlapped with the effective areas of the upper electrode and the lower electrode, aligned and tightly attached to the effective areas of the upper electrode and the lower electrode without bubbles, wherein the areas of the effective areas of the electrodes are consistent with those of the middle-layer piezoelectric fiber array or the piezoelectric fiber composite layer.
The viscous polymer film has viscosity (adhesive) on one surface, and can be UV film, blue film, polyimide tape, high temperature tape, etc.
The polymer glue solution is thermosetting resin glue solution, such as epoxy resin, phenolic resin, unsaturated polyester, polyurethane and the like, and finally forms a polymer layer in the flexible piezoelectric fiber composite material.
The interdigital electrode and the planar electrode are both composed of a polyimide film and a copper, gold or silver circuit plated on the film, and the structures of the interdigital electrode type and the planar electrode type flexible piezoelectric fiber composite material are shown in figure 5.
The flexible piezoelectric fiber composite material obtained by the two-step packaging method is characterized in that the piezoelectric fiber composite layer is formed by compositely communicating piezoelectric materials and polymers, and the piezoelectric materials can be PZT, PMN-PT and LiNbO 3 、ZnO、BaTiO 3 The polymer can be PDMS, PVDF and epoxy resin, and the composite communication mode can be 1-3 type, 2-2 type and 0-3 type.
In the first-step packaging part and the second-step packaging part, the length direction of the piezoelectric fibers in the piezoelectric fiber composite layer or the piezoelectric fiber array is perpendicular to the electrode finger direction of the interdigital electrode or the planar electrode.
Further, in the first-step package assembly and the second-step package assembly:
the buffer layer is generally made of flexible polymer materials, such as silica gel, sponge and the like, the area of the buffer layer is larger than that of the electrode, and the thickness of the buffer layer is about 1-3mm.
The heat conducting metal layer is made of metal easy to conduct heat, such as copper, stainless steel, aluminum and the like, the thickness of the heat conducting metal layer is about 1-3mm, the area of the heat conducting metal layer is larger than that of the buffer layer, and the heat conducting metal layer is required to be smooth in surface, low in roughness and moderate in hardness.
Further, in the first step packaging and the second step packaging vacuum degree, pressure, temperature and time:
the vacuum degree value set by the first step of packaging and the second step of packaging is-0.08 MPa to-0.09 MPa.
The pressure value set by the first step packaging pressure and the second step packaging pressure is 0.01 MPa-0.9 MPa. The size of the flexible piezoelectric fiber composite material can be adjusted correspondingly according to actual steps.
The first step packaging temperature and the second step packaging temperature are the curing temperature of the polymer glue solution.
The pressure maintaining and heat preserving time of the first step packaging and the second step packaging can be 20 min-120 min. And the packaging pressure maintaining and heat preserving time in the second step is longer than that in the first step so as to ensure the full solidification of the polymer glue solution.
Example 2
The planar electrode type flexible piezoelectric fiber composite material with the size of 10.5mm 8mm 2mm is packaged by a two-step packaging method, the output voltage signal of the planar electrode type flexible piezoelectric fiber composite material is tested, and the two-step packaging specific process comprises the following steps:
1. firstly, preparing a piezoelectric fiber composite layer, and wiping and cleaning the piezoelectric fiber composite layer and the planar electrode by using absolute ethyl alcohol before packaging. The area occupied by the piezoelectric fiber array is 5mm x 5mm, the thickness is 0.2mm, the planar electrode is composed of a polyimide film and copper plated on the polyimide film, and the area of an effective electrode area is 5mm x 5mm.
2. 10g of epoxy resin was weighed using an electronic balance, and a polymer adhesive solution was prepared.
3. And performing first-step packaging, namely uniformly coating a layer of polymer glue solution on the inner surface of the lower planar electrode, simultaneously uniformly coating the polymer glue solution on the upper surface of the piezoelectric fiber composite layer, and overlapping and aligning the upper surface of the piezoelectric fiber composite layer with the effective area of the inner surface of the lower planar electrode to form the first-step packaging piece. The length direction of the piezoelectric fiber is vertical to the electrode finger direction of the planar electrode, and the piezoelectric fiber composite layer is required to be tightly attached to the lower planar electrode without air bubbles, wherein the area of the effective area of the lower planar electrode is consistent with that of the piezoelectric fiber composite layer.
3. The brass plate, the silica gel pad, the first-step package member, the silica gel pad, and the brass plate are sequentially placed on a hot-pressing table to form a first-step package member, as shown in fig. 2. Wherein the silica gel pads are of dimensions 15cm x 1.5mm and the brass plates are of dimensions 18cm x 1mm.
4. Slightly placing the vacuum heat-preserving and pressure-maintaining device into a vacuum hot press, vacuumizing, wherein the set value of the vacuum degree is-0.08 MPa, starting a pressure switch after the vacuum degree reaches the set value, starting pressurization, the set value of the pressure is 0.04MPa, starting a temperature rise switch after the pressure reaches the set value, starting temperature rise, controlling the heat-preserving and pressure-maintaining time of the hot press after the temperature reaches the set temperature, the heat-preserving and pressure-maintaining time is 20min, and separating and taking out the packaging part in the first step after the target time is reached.
5. And (3) performing second-step packaging, namely uniformly coating a layer of polymer glue solution on the inner surface of the upper plane electrode, coating the polymer glue solution on the upper surface of the piezoelectric fiber composite layer of the first-step packaging piece, and overlapping and aligning the upper surface of the piezoelectric fiber composite layer of the first-step packaging piece with the effective area of the inner surface of the upper plane electrode to form the second-step packaging piece. The length direction of the piezoelectric fiber is vertical to the electrode finger direction of the planar electrode, and the piezoelectric fiber composite layer is required to be tightly attached to the upper planar electrode without air bubbles, wherein the area of the effective area of the upper planar electrode is consistent with that of the piezoelectric fiber composite layer.
6. And sequentially placing the brass plate, the silica gel pad, the first-step packaging part, the silica gel pad and the brass plate on a hot-pressing table to form a second-step packaging combined part, as shown in fig. 4. Wherein the size of silica gel pad is 15cm 1.5mm, and the size of brass plate is 18cm.
7. Slightly placing the vacuum heat-preserving and pressure-maintaining device into a vacuum hot press, vacuumizing, wherein the set value of the vacuum degree is-0.08 MPa, starting a pressure switch after the vacuum degree reaches the set value, starting pressurization, the set value of the pressure is 0.09MPa, starting a temperature rise switch after the pressure reaches the set value, starting temperature rise, the set value of the temperature is 100 ℃, controlling the heat-preserving and pressure-maintaining time of the hot press after the temperature rises to the set temperature, the heat-preserving and pressure-maintaining time is 20min, and separating and taking out the packaging part in the second step after the target time is reached.
8. And taking out the packaged part in the second step after packaging is finished, and wiping and cleaning the packaged part by using absolute ethyl alcohol to obtain the planar electrode type flexible piezoelectric fiber composite material.
As shown in FIG. 6, a voltage signal diagram of the planar electrode type flexible piezoelectric fiber composite material prepared by the two-step packaging method has a voltage value of 2V under a horizontal impact force of 10N and a frequency of 1 Hz. Can be used as a pressure sensor, an energy collector and the like.
Example 3
Packaging the interdigital electrode type flexible piezoelectric fiber composite material with the size of 82mmx 42mmx 3mm by using a two-step packaging method, and testing the strain, wherein the two-step packaging specific process comprises the following steps:
1. firstly, preparing a piezoelectric fiber array adhered on a viscous polymer film, and wiping and cleaning the piezoelectric fiber array and the interdigital electrode by using absolute ethyl alcohol before packaging. The area occupied by the piezoelectric fiber array is 65mm 33mm, the thickness is 0.2mm, the interdigital electrode is composed of a polyimide film and copper plated on the polyimide film, the area of an effective electrode area is 65mm 33mm, and the viscous polymer film is a UV film.
2. 10g of epoxy resin was weighed using an electronic balance, and a polymer adhesive solution was prepared.
3. And performing first-step packaging, namely uniformly coating a layer of polymer glue solution on the inner surface of the lower interdigital electrode, simultaneously fully coating the polymer glue solution on the piezoelectric fiber array on the viscous polymer film, scraping the redundant glue solution after completely filling gaps among the piezoelectric fiber arrays, and overlapping and aligning the upper surface of the piezoelectric fiber array and the effective area of the inner surface of the lower interdigital electrode to form a first-step packaging piece. The length direction of the piezoelectric fibers is perpendicular to the electrode finger direction of the interdigital electrode, and the piezoelectric fiber array is required to be tightly attached to the lower interdigital electrode without bubbles, wherein the effective area of the lower interdigital electrode is consistent with the area of the piezoelectric fiber array.
3. The brass plate, the silica gel pad, the first-step package member, the silica gel pad, and the brass plate are sequentially placed on a hot-pressing table to form a first-step package member, as shown in fig. 3. Wherein the size of silica gel pad is 15cm 1.5mm, and the size of brass plate is 18cm.
4. Slightly putting the packaging piece into a vacuum hot press, vacuumizing, wherein the set value of the vacuum degree is-0.08 MPa, starting a pressure switch after the vacuum degree reaches the set value, starting pressurizing, the set value of the pressure is 0.04MPa, starting a temperature rise switch after the pressure reaches the set value, starting temperature rise, the set value of the temperature is 70 ℃, controlling the heat preservation and pressure maintenance time of the hot press after the temperature rises to the set temperature, the heat preservation and pressure maintenance time is 20min, separating and taking out the packaging piece in the first step after the target time is reached, wherein the viscous polymer film in the packaging piece in the first step needs to be stripped, and absolute ethyl alcohol is used for wiping and cleaning.
5. And (4) performing second-step packaging, namely uniformly coating a layer of polymer glue solution on the inner surface of the upper interdigital electrode, coating the polymer glue solution on the upper surface of the piezoelectric fiber composite layer of the first-step packaging piece, and overlapping and aligning the upper surface of the piezoelectric fiber composite layer of the first-step packaging piece with the effective area of the inner surface of the upper interdigital electrode to form the second-step packaging piece. The length direction of the piezoelectric fiber is vertical to the electrode finger direction of the interdigital electrode, and the piezoelectric fiber composite layer and the upper interdigital electrode are required to be tightly attached without bubbles, wherein the area of the effective area of the upper interdigital electrode is consistent with that of the piezoelectric fiber composite layer.
6. The brass plate, the silica gel pad, the first-step package member, the silica gel pad, and the brass plate are sequentially placed on a hot-pressing table to form a second-step package member, as shown in fig. 4. Wherein the silica gel pads are of dimensions 15cm x 1.5mm and the brass plates are of dimensions 18cm x 1mm.
7. Slightly putting the vacuum heat-preserving packaging piece into a vacuum hot press, vacuumizing, wherein the set value of the vacuum degree is-0.08 MPa, starting a pressure switch after the vacuum degree reaches the set value, starting pressurizing, the set value of the pressure is 0.13MPa, starting a temperature rise switch after the pressure reaches the set value, starting temperature rise, the set value of the temperature is 100 ℃, controlling the heat-preserving and pressure-maintaining time of the hot press after the temperature rises to the set temperature, the heat-preserving and pressure-maintaining time is 60min, and separating and taking out the packaging piece in the second step after the target time is reached.
8. And taking out the packaged part in the second step after packaging is finished, and wiping and cleaning the packaged part by using absolute ethyl alcohol to obtain the interdigital electrode type flexible piezoelectric fiber composite material.
The free strain curve of the interdigital electrode type flexible piezoelectric fiber composite material prepared by the two-step packaging method is shown in figure 7, and the longitudinal strain can reach 1918.7 mu epsilon and the transverse strain can reach 716.4 mu epsilon under the drive of a sinusoidal alternating voltage with the voltage of-500V to +1500V and the frequency of 0.1 Hz. The method can be applied to active suppression of aerospace structures, structural member deformation control and the like.
The packaging method can realize efficient and stable packaging of flexible piezoelectric fiber composite materials with different electrode types and any sizes, the two-step packaging reduces the electrode alignment difficulty and the sliding probability of the middle layer, the efficiency, the stability and the yield are improved, meanwhile, the equipment requirement is low, the heat conduction metal layers in the first-step packaging assembly and the second-step packaging assembly guarantee the uniformity of heat transfer, and the buffer layer guarantees that the packaging assemblies cannot be broken due to direct contact of pressure. The prepared flexible piezoelectric fiber composite material has the advantages of uniform thickness, tight interface combination between phases, excellent and stable performance, application in the fields of sensing, driving and energy collection, and random size adjustment to adapt to actual conditions, such as active inhibition of aerospace structures and small collection of human body micro mechanical energy.
In terms of size and area, the alignment of the electrode fingers and the intermediate layer is manually realized in the current packaging process, and the intermediate layer and the upper and lower electrodes slide relatively. When the area is large, the effective area of the electrode is large, the number of pairs of electrode fingers is large, all the electrode fingers are difficult to align manually, the consumed time is long, and the electrode fingers need to be readjusted after slight deviation; when the area is small, the contact area of the middle layer on the polymer glue solution is small, the middle layer can slide on the glue solution by a tiny force, particularly, when the middle layer is pressed when the electrode fingers are aligned, the middle layer can slide very easily, and the middle layer cannot be packaged in a polyimide electrode (in the example, the 10.5mm x 8mm x 2mm planar electrode type flexible piezoelectric fiber composite material which is tried by people is packaged by a two-step packaging method, and is difficult to package by a one-step packaging method).
The method can realize integrated forming and packaging of the flexible piezoelectric fiber composite material, is simple, short in time and efficient, the packaged flexible piezoelectric fiber composite material has high stability and high driving sensing performance, and simultaneously, interdigital electrodes or planar electrodes with different sizes can be selected for integrated packaging according to the use requirements of the flexible piezoelectric fiber composite material.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (7)
1. A two-step packaging method of a flexible piezoelectric fiber composite material is characterized by comprising the following steps:
s1, wiping and cleaning an interdigital electrode or a planar electrode to be packaged and a piezoelectric fiber array stuck on a viscous polymer film by using absolute ethyl alcohol;
s2, overlapping and aligning the piezoelectric fiber array adhered to the viscous polymer film with the effective area of the lower electrode, uniformly coating a layer of polymer glue solution on the inner surface of the lower electrode, simultaneously fully coating the polymer glue solution on the piezoelectric fiber array on the viscous polymer film, and scraping redundant glue solution after completely filling gaps between the piezoelectric fiber arrays to form a first-step packaging piece;
s3, placing the heat-conducting metal layer, the buffer layer, the first-step packaging part, the buffer layer and the heat-conducting metal layer on a hot-pressing table in sequence to form a first-step packaging part;
s4, placing the first-step packaging assembly in a vacuum hot press for vacuumizing, starting to pressurize after the vacuum degree reaches a set value, starting to heat after the pressure reaches the set value, taking out the first-step packaging assembly after the temperature is raised to the set temperature and the pressure is maintained for a period of time, and wiping and cleaning the first-step packaging assembly by using absolute ethyl alcohol;
s5, overlapping and aligning the first-step packaging piece with the upper electrode, and adding a polymer glue solution between the first-step packaging piece and the upper electrode to form a second-step packaging piece;
s6, placing the heat-conducting metal layer, the buffer layer, the second-step packaging part, the buffer layer and the heat-conducting metal layer on a hot-pressing table in sequence to form a second-step packaging part;
s7, placing the second-step packaging assembly in a vacuum hot press for vacuumizing, starting to pressurize when the vacuum degree reaches a set value, starting to heat when the pressure reaches the set value, taking out the second-step packaging assembly after the temperature is raised to the set temperature and the pressure is maintained for a period of time, and wiping and cleaning the second-step packaging assembly by using absolute ethyl alcohol to obtain the flexible piezoelectric fiber composite material;
in the step S4 and the step S7, the set value of the vacuum degree is-0.08 MPa to-0.09 MPa; the pressure setting value is 0.01 MPa-0.9 MPa; the temperature set value is the curing temperature of the polymer glue solution; the heat preservation and pressure maintaining time is 20min to 120min;
and the packaging heat preservation and pressure maintaining time in the step S7 is longer than that in the step S4.
2. The two-step packaging method of the flexible piezoelectric fiber composite material according to claim 1, wherein: in step S2, after the first step package is formed, the adhesive polymer film is peeled off from the first step package.
3. The two-step packaging method of the flexible piezoelectric fiber composite material according to claim 1, wherein: in the first-step packaging part and the second-step packaging part, the length direction of the piezoelectric fibers in the piezoelectric fiber array is perpendicular to the electrode finger direction of the interdigital electrodes or the planar electrodes.
4. The two-step packaging method of the flexible piezoelectric fiber composite material according to claim 1, wherein: the overlapping alignment in the step S2 and the step S5 specifically means overlapping and close fitting without bubbles.
5. The two-step packaging method of the flexible piezoelectric fiber composite material according to claim 1, wherein: the polymer glue solution is thermosetting resin glue solution.
6. The two-step packaging method of the flexible piezoelectric fiber composite material according to claim 1 or 2, wherein: the viscous polymer film is a UV film, a blue film, a polyimide adhesive tape or a high-temperature adhesive tape.
7. The two-step packaging method of the flexible piezoelectric fiber composite material according to claim 1, wherein: the buffer layer is made of silica gel or sponge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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