CN113013319A - Low-frequency active vibration suppression system based on integrated structure - Google Patents
Low-frequency active vibration suppression system based on integrated structure Download PDFInfo
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- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
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Abstract
The invention provides a low-frequency active vibration suppression system based on an integrated structure, which comprises a vibration suppression function device and an active vibration suppression system device, wherein the vibration suppression function device structure comprises a piezoelectric fiber composite layer, two metal electrode layers respectively covering the top surface and the bottom surface of the piezoelectric fiber composite layer and two packaging layers for packaging the piezoelectric fiber composite layer and the metal electrode layers into a whole; the invention aims to solve the problem of low vibration suppression efficiency in a low-frequency vibration range in the prior art, provides a design idea based on an integrated structure, and through the embedded design of a vibration suppression function device part, the vibration suppression function device can be embedded into a vibration mechanism through a packaging layer in a conformal manner by virtue of the flexible characteristic of a piezoelectric fiber composite layer when in use, so that the vibration loss in the process of transmitting the vibration energy of the vibration mechanism to the vibration suppression function device is obviously reduced, and the mechanical coupling efficiency of the vibration suppression function device and the vibration mechanism is greatly improved.
Description
Technical Field
The invention relates to the field of mechanical vibration suppression, in particular to a low-frequency active vibration suppression system based on an integrated structure.
Background
Vibration is a common natural phenomenon in daily life of people, particularly in engineering technology, such as vibration generated by scouring of a bridge body by sea waves; vibration of the rail due to the rapid friction of the train; the vibration of the airplane caused by the impact of the airflow in the flying process; vibration of the lathe and the die due to friction, and the like. Generally, the vibration in nature is divided into beneficial vibration and unfavorable vibration, and the unfavorable vibration often causes some damage, such as the precision of precision instruments is greatly reduced due to the unfavorable vibration; the member is in fatigue damage due to long-time vibration, so that the service life of the device is greatly shortened; some vibration can also cause structural destructive deformation, such as collapse of a bridge body due to resonance, and serious accidents often caused by flutter of an airplane empennage; in addition, in daily life, noise generated by vibration of some equipment causes much trouble to people. These undesirable vibrations are often undesirable, and thus how to effectively control them is highly desirable.
According to the amount of external energy required for vibration control, researchers have divided it into three main categories: passive vibration control, active vibration control, and semi-active vibration control. The passive vibration control reduces the vibration of the structure mainly through vibration absorption or vibration isolation, extra energy is not needed to be provided, the applicable frequency range is narrow, the environment adaptability is lacked, and when the structure is disturbed by a broadband with high uncertainty, the passive vibration control has great limitation. The active vibration control is realized by introducing a driving force opposite to the vibration direction of the main structure as a part of a vibration suppression element and then controlling the structural body through different algorithms, so that the structural body has better response characteristic to interference. When the structure is actively controlled by vibration, the vibration signal of the structure must be fed back to the control system, and then the control system responds correspondingly to control the structure, so that the introduced vibration suppression element is required to have sensing and driving capabilities at the same time.
The intelligent material forming the vibration suppression element is a product of modern technology development, and the appearance of intelligent materials such as Shape Memory Alloy (SMA), piezoelectric material, electrorheological material, giant magnetostrictive material and the like enables the vibration active control technology to be developed rapidly. The piezoelectric material is an intelligent material for realizing mutual conversion between mechanical energy and electric energy, has the characteristics of strong driving performance, outstanding sensing capability, high response speed and the like, and is widely applied to the fields of driving, sensing and the like. Therefore, the piezoelectric material is used as a vibration suppression element to carry out active vibration control on the main body structure, and the piezoelectric material has a great application prospect.
The traditional piezoelectric type active vibration suppression system has the problem of mechanical coupling efficiency between a vibration source mechanism and a piezoelectric vibration suppression device, and because the vibration source mechanism and the piezoelectric vibration suppression device are independent, the mechanical connection between the vibration source mechanism and the piezoelectric vibration suppression device is generally realized by means of simple local chemical bonding, local welding, physical fastening and the like, the problems of vibration loss and low coupling efficiency are more or less existed in the process of transmitting unfavorable vibration generated by the vibration source mechanism to the piezoelectric vibration suppression device.
Disclosure of Invention
In order to solve the problem of low vibration suppression efficiency in a low-frequency vibration range in the prior art, the invention aims to provide a low-frequency active vibration suppression system based on an integrated structure, and the device can be embedded into a vibration mechanism in a conformal manner through a packaging layer by virtue of the flexible characteristic of a piezoelectric fiber composite layer, so that the vibration loss in the process of transmitting the vibration energy of the vibration mechanism to a vibration suppression functional device is remarkably reduced, and the mechanical coupling efficiency of the vibration suppression functional device and the vibration mechanism is greatly improved.
The invention is realized by adopting the following technical scheme:
a low-frequency active vibration suppression system based on an integrated structure comprises a vibration suppression functional device and an active vibration suppression system device;
the vibration suppression device comprises a piezoelectric fiber composite layer, two metal electrode layers and two packaging layers, wherein the two metal electrode layers are respectively covered on the top surface and the bottom surface of the piezoelectric fiber composite layer, the piezoelectric fiber composite layer and the two metal electrode layers form a piezoelectric fiber composite sheet, and the piezoelectric fiber composite layer and the metal electrode layers are packaged into a whole by the two packaging layers from two sides of the piezoelectric fiber composite sheet;
the piezoelectric fiber composite layer comprises a plurality of piezoelectric ceramic fibers which are parallel to each other and spaced, and a plurality of epoxy resin fibers which are respectively filled between every two adjacent piezoelectric ceramic fibers, wherein each piezoelectric ceramic fiber and each epoxy resin fiber are alternately arranged in the piezoelectric fiber composite layer.
Furthermore, in order to realize the application of low-frequency active vibration suppression, the active vibration suppression system device comprises a signal generator, a high-voltage amplifier and a controller which are electrically connected;
the controller controls the signal generator to generate an alternating current signal, and the high-voltage amplifier amplifies the alternating current signal and drives the vibration suppression functional device.
Further, the thickness of the piezoelectric fiber composite layer is 0.1mm-3 mm; in the piezoelectric fiber composite layer, the width of each piezoelectric ceramic fiber is 0.01mm-0.1mm, and the width of each epoxy resin fiber is 0.01mm-0.1 mm.
Furthermore, the piezoelectric fiber composite layer is a fiber sheet formed by precisely and mechanically cutting a large-size piezoelectric ceramic plate with the thickness T of 0.1mm-3mm in parallel at an equal interval d of 0.01mm-0.1mm, filling epoxy resin adhesive in gaps of the large-size piezoelectric ceramic plate, and curing, wherein the cutting thickness T1 is controlled to be 0.1mm-3mm, the cutting length is not limited, and the length of the piezoelectric ceramic plate can be controlled according to actual needs by adjusting the length of the piezoelectric ceramic plate.
Further, the material of the piezoelectric ceramic sheet for forming the piezoelectric fiber composite layer, i.e., the material of the piezoelectric ceramic fiber, may be a series ceramic material such as lead zirconate titanate (PTZ), potassium sodium niobate (KNN), Barium Titanate (BT), or the like.
Furthermore, the metal electrode layer is sputtered on the top/bottom surface of the piezoelectric fiber composite layer in an ion sputtering mode, the material of the metal electrode layer comprises gold, silver, copper, platinum and other common conductive metal materials, the thickness T2 of the metal electrode layer can be accurately controlled within the range of 10nm-1000nm by regulating and controlling the sputtering time, and the area covered by the metal electrode layer is the top/bottom surface of the piezoelectric fiber composite layer.
Furthermore, the vibration suppression functional device further comprises two metal leading-out foil strips which are respectively connected with the two metal electrode layers, the two metal electrode layers are respectively led out from the packaging layer through the two metal leading-out foil strips, and the metal leading-out foil strips can be any commercialized conductive metal foil strips.
Further, the packaging layer is made of a glass fiber reinforced plastic sheet; the glass fiber reinforced plastic sheet used for the packaging layer is formed by soaking single-layer or multi-layer glass fiber cloth with an epoxy resin adhesive and then curing. The thickness T3 of the glass fiber sheet adopting the single-layer glass fiber cloth is 0.1mm, and in the practical application process, the thickness T4 of the glass fiber sheet can be regulated and controlled by adjusting the number n of layers of the glass fiber cloth, wherein T4 is n multiplied by T3.
Further, the preparation process of the vibration suppression function device is an integrated structural component process, and the integrated structural component process comprises the following steps: firstly, adhering the bottom surface of a piezoelectric fiber composite material sheet with the thickness of T5 ═ T1+2 XT 2 to a semi-cured glass steel sheet with the thickness of T4, and utilizing a semi-cured epoxy resin adhesive on the glass steel sheet to realize the bonding and curing of a metal electrode layer and the piezoelectric fiber composite layer; secondly, in order to realize the encapsulation of the vibration suppression function device, another semi-solidified glass steel sheet with the thickness of T4 is attached to the top surface of the piezoelectric fiber composite sheet with the thickness of T5-T1 +2 xT 2 and solidified; wherein two metal lead-out foil strips must be ensured extending from the interior of the package.
Further, the low-frequency active vibration suppression system based on the integrated structure has the resonant frequency f range of 10Hz-50Hz and the low-frequency vibration suppression efficiency e range of 50% -90%.
Furthermore, the working mode of the vibration suppression device mainly adopts a piezoelectric material d31 mode and has a partial piezoelectric material d33 mode.
Compared with the prior art, the invention has the beneficial effects that:
(1) the traditional vibration suppression functional device is mainly used for realizing the mechanical coupling function between the traditional vibration suppression functional device and the vibration mechanism by local chemical bonding, local welding or physical fastening on the vibration mechanism.
(2) Due to the characteristics of ultrathin piezoelectric fiber composite layer and fiber flexibility, in the application aspect of a curved surface vibration mechanism, the vibration suppression device related by the invention can also realize the conformal function of a low-frequency active vibration suppression system and the vibration mechanism, and has wider application range compared with the traditional vibration suppression device.
Drawings
FIG. 1 is a structural analysis diagram of a vibration suppression function device in a low-frequency active vibration suppression system based on an integrated structure according to the present invention;
FIG. 2 is a diagram of an active vibration suppression system device and a performance test platform of a low-frequency active vibration suppression system based on an integrated structure according to an embodiment of the present invention;
FIG. 3 is a diagram of a physical object of a vibration suppressing device in the form of a cantilever beam vibration suppressing sheet;
FIG. 4 is a cross-sectional metallographic view of the piezoelectric fiber composite sheet of FIG. 3;
FIG. 5 is a graph showing the measurement of the resonant frequency of the cantilever beam of the device with vibration suppression function of the cantilever beam type shown in FIG. 3;
fig. 6 is a driving performance test chart of the vibration suppressing device of the cantilever beam type in fig. 3.
Detailed Description
The technical solutions in the embodiments of the present invention are described in detail below with reference to the drawings in the patent embodiments of the present invention. It should be understood that the embodiment described in this embodiment is merely a general case of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step other than that described in the claims, are within the scope of protection of the present invention.
The invention provides a low-frequency active vibration suppression system based on an integrated structure, which comprises a vibration suppression functional device and an active vibration suppression system device. As shown in fig. 1, the vibration suppression device includes a piezoelectric fiber composite layer 1, two metal electrode layers 2 respectively covering the top surface and the bottom surface of the piezoelectric fiber composite layer 1, and two encapsulation layers 3 encapsulating the piezoelectric fiber composite layer 1 and the metal electrode layers 2 into a whole, wherein the piezoelectric fiber composite layer 1 and the two metal electrode layers 2 form a piezoelectric fiber composite material sheet, and the two encapsulation layers 3 are respectively encapsulated from two sides of the piezoelectric fiber composite material sheet. In addition to the vibration suppressing function device, in order to realize the low-frequency active vibration suppressing application, the active vibration suppressing system apparatus needs to include a signal generator 6, a high-voltage amplifier 7 and a controller 8 which are electrically connected.
Specifically, the piezoelectric fiber composite layer 1 includes a plurality of piezoelectric ceramic fibers 11 spaced in parallel and a plurality of epoxy resin fibers 12 respectively filled between every two adjacent piezoelectric ceramic fibers 11, and each piezoelectric ceramic fiber 11 and each epoxy resin fiber 12 are alternately arranged in the layer of the piezoelectric fiber composite layer 1.
Specifically, the thickness of the piezoelectric fiber composite layer 1 is 0.1mm-3 mm; in the piezoelectric fiber composite layer 1, the width of each piezoelectric ceramic fiber 11 is 0.01mm-0.1mm, and the width of each epoxy resin fiber 12 is 0.01mm-0.1 mm.
Specifically, the specific preparation process of the piezoelectric fiber composite layer 1 is as follows: arranging a plurality of piezoelectric ceramic pieces in parallel at equal intervals, wherein the thickness of each piezoelectric ceramic piece is 0.01-0.1 mm, and the interval between every two adjacent piezoelectric ceramic pieces is 0.01-0.1 mm; then filling and injecting epoxy resin adhesive into the gaps of the piezoelectric ceramic plates which are arranged in parallel, obtaining a composite material block after curing, then cutting out fiber sheets from the composite material block along the direction vertical to the plane of the piezoelectric ceramic plates, wherein the cutting thickness is T1 and is controlled to be 0.1mm-3mm, the cutting length is not limited, the cutting length can be controlled by adjusting the length of the piezoelectric ceramic plates according to actual requirements, and the fiber sheets can be used as piezoelectric fiber composite layers.
Specifically, the material of the piezoelectric ceramic sheet for forming the piezoelectric fiber composite layer, i.e., the material of the piezoelectric ceramic fiber, may be a PTZ, KNN, BT, or other series ceramic material.
Specifically, the metal electrode layer 2 is sputtered onto the top/bottom surface of the piezoelectric fiber composite layer 1 in an ion sputtering manner, the material of the metal electrode layer comprises common conductive metal materials such as gold, silver, copper, platinum and the like, the thickness T2 of the metal electrode layer can be accurately controlled within a range of 10nm to 1000nm by regulating and controlling the sputtering time, and the region covered by the metal electrode layer 2 is the top/bottom surface of the piezoelectric fiber composite layer 1; further, the two metal electrode layers 2 are respectively led out through two metal lead-out foil strips (not shown), and the metal lead-out foil strips can be any commercial conductive metal foil strips.
Specifically, one end of the metal lead-out foil strip is connected with the metal electrode layer 2, and the other end of the metal lead-out foil strip extends out of the packaging layer 3.
Specifically, the material of the encapsulation layer 3 is a glass fiber reinforced plastic sheet; the preparation process of the glass steel sheet used as the packaging layer 3 specifically comprises the following steps: soaking the single-layer or multi-layer glass fiber cloth in an epoxy resin adhesive, and then taking out and curing to obtain the glass fiber cloth; the thickness T3 of the glass fiber sheet adopting the single-layer glass fiber cloth is 0.1mm, and in the practical application process, the thickness T4 of the glass fiber sheet can be regulated and controlled by adjusting the number n of layers of the glass fiber cloth, wherein T4 is n multiplied by T3.
Specifically, the preparation process of the vibration suppression function device is a component process of an integrated structure, and the component process of the integrated structure is as follows: firstly, adhering the bottom surface of a piezoelectric fiber composite material sheet with the thickness of T5 ═ T1+2 XT 2 to a semi-cured glass steel sheet with the thickness of T4, and utilizing a semi-cured epoxy resin adhesive on the glass steel sheet to realize the bonding and curing of the metal electrode layer 2 and the piezoelectric fiber composite layer 1; secondly, in order to realize the encapsulation of the vibration suppression function device, another semi-solidified glass steel sheet with the thickness of T4 is attached to the top surface of the piezoelectric fiber composite sheet with the thickness of T5-T1 +2 xT 2 and solidified; wherein two metal lead-out foil strips must be ensured extending from the interior of the package. Therefore, the main functional component of the low-frequency active vibration suppression device based on the integrated structure can be formed.
FIG. 3 is a diagram of a physical object of a vibration suppressing device in the form of a cantilever beam vibration suppressing sheet; FIG. 4 is a cross-sectional metallographic view of the piezoelectric fiber composite sheet of FIG. 3; wherein the cantilever beam vibration suppression sheet in fig. 3 is exclusively used for intrinsic performance test of the vibration suppression function device; as can be seen from the cross-sectional metallographic diagram shown in fig. 4, in the piezoelectric fiber composite layer, the epoxy resin fibers and the piezoelectric ceramic fibers are in close contact, no bubbles are generated, and in addition, the metal electrode layer formed by sputtering is attached to the piezoelectric fiber composite layer, and no falling-off phenomenon occurs; the compactness of the material of the vibration suppression device is good.
In order to test the low-frequency vibration suppression performance of the low-frequency active vibration suppression system based on the integrated structure, the following embodiment adopts the vibration suppression functional device of the cantilever beam vibration suppression sheet in fig. 3 and builds a set of performance test platform for the vibration suppression functional device. As shown in fig. 2, the performance testing platform includes a signal generator 6, a high voltage amplifier 7, a controller 8, an excitation stage 9 and an MT3 laser displacement sensor 10, wherein the signal generator 6, the high voltage amplifier 7 and the controller 8 form a complete set of active vibration suppression system device, and the signal generator 6, the high voltage amplifier 7, the controller 8, the excitation stage 9 and the MT3 laser displacement sensor 10 form the performance testing platform. The controller 8 controls the signal generator 6 to generate an alternating current signal, and the high-voltage amplifier 7 amplifies the alternating current signal and drives the vibration suppression functional device; the excitation platform 9 is used for generating vibration, and the MT3 laser displacement sensor 10 is used for detecting the tail end displacement condition of the cantilever beam vibration suppression sheet. The specific test process is as follows:
firstly, carrying out polarization treatment on the piezoelectric fiber composite layer: and (3) placing the prepared cantilever beam vibration suppression sheet in organic silicon oil, wherein the polarization electric field is 2-3kV/mm and the polarization time is about 10-20min at normal temperature.
And secondly, determining the resonant frequency of the cantilever beam vibration suppression sheet: the cantilever beam vibration suppression sheet is fixed on the excitation platform 9, an electric frequency scan of 1-50Hz is applied to the cantilever beam vibration suppression sheet, when the electric frequency is consistent with the natural frequency of the cantilever beam vibration suppression sheet, the cantilever beam vibration suppression sheet resonates, and the deformation of the cantilever beam vibration suppression sheet reaches the maximum value, so that the size of the natural frequency (resonant frequency) of the cantilever beam vibration suppression sheet is obtained. As can be seen from FIG. 5, the tip displacement of the cantilever beam vibration suppression sheet reaches the maximum at a frequency of about 24Hz, so that the resonant frequency of the cantilever beam vibration suppression sheet is about 24 Hz.
Thirdly, testing the driving performance of the low-frequency active vibration suppression system based on the integrated structure by using the performance testing platform shown in fig. 2, wherein the testing result is shown in fig. 6, the polarized cantilever beam vibration suppression sheet is fixed on the excitation table 9, the driving voltage is applied to the cantilever beam vibration suppression sheet to test the driving performance, the tip displacement of the cantilever beam vibration suppression sheet is gradually increased along with the increase of the driving voltage under the resonance frequency of 24Hz, and the tip displacement of the piezoelectric cantilever beam reaches the maximum value of 0.177mm when the driving voltage is 600V.
Fourthly, testing the vibration suppression performance of the low-frequency active vibration suppression system based on the integrated structure by using the performance test platform shown in fig. 2, fixing the cantilever beam vibration suppression sheet on the excitation table 9 with the vibration frequency of about 24Hz, and keeping the cantilever beam vibration suppression sheet in the maximum sinusoidal motion of 24Hz vibration amplitude without applying driving voltage. When a driving voltage is applied, the piezoelectric phase in the piezoelectric cantilever beam generates driving force and deformation vibration due to the force-electricity coupling effect, and the driving force and the deformation vibration are superposed with the vibration waves generated by the vibration table 9 to achieve the effect of reducing the amplitude, and when the driving voltage with the electric frequency of 24Hz and the voltage intensity of 600V is applied, the amplitude of the piezoelectric cantilever beam is reduced by about 52.8 percent, and the vibration suppression effect is obvious.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in any other specific form without departing from the spirit or essential attributes thereof. Thus, the present embodiments are merely exemplary and non-limiting. The scope of the invention is indicated by the appended claims rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A low-frequency active vibration suppression system based on an integrated structure is characterized by comprising a vibration suppression functional device and an active vibration suppression system device;
the vibration suppression device comprises a piezoelectric fiber composite layer, two metal electrode layers and two packaging layers, wherein the two metal electrode layers are respectively covered on the top surface and the bottom surface of the piezoelectric fiber composite layer, the piezoelectric fiber composite layer and the two metal electrode layers form a piezoelectric fiber composite sheet, and the piezoelectric fiber composite layer and the metal electrode layers are packaged into a whole by the two packaging layers from two sides of the piezoelectric fiber composite sheet;
the piezoelectric fiber composite layer comprises a plurality of piezoelectric ceramic fibers which are parallel to each other and spaced, and a plurality of epoxy resin fibers which are respectively filled between every two adjacent piezoelectric ceramic fibers, wherein each piezoelectric ceramic fiber and each epoxy resin fiber are alternately arranged in the piezoelectric fiber composite layer.
2. The integrated structure based low frequency active vibration suppression system according to claim 1, wherein the thickness of the piezoelectric fiber composite layer is 0.1mm-3 mm;
in the piezoelectric fiber composite layer, the width of each piezoelectric ceramic fiber is 0.01mm-0.1mm, and the width of each epoxy resin fiber is 0.01mm-0.1 mm.
3. The integrated structure-based low-frequency active vibration suppression system according to any one of claims 1-2, wherein the piezoelectric fiber composite layer is prepared by the following steps: arranging a plurality of piezoelectric ceramic pieces in parallel at equal intervals, wherein the thickness of each piezoelectric ceramic piece is 0.01-0.1 mm, and the interval between every two adjacent piezoelectric ceramic pieces is 0.01-0.1 mm; and then filling and injecting an epoxy resin adhesive into the gaps of the piezoelectric ceramic plates which are arranged in parallel, curing to obtain a composite material block, and then cutting a fiber sheet from the composite material block along the direction vertical to the plane of the piezoelectric ceramic plates, wherein the cutting thickness of the fiber sheet is 0.1-3 mm, so as to obtain the piezoelectric fiber composite layer.
4. The integrated structure-based low-frequency active vibration suppression system according to claim 1, wherein in the piezoelectric fiber composite layer, the piezoelectric ceramic fiber material is one or more of lead zirconate titanate series ceramic materials, potassium sodium niobate series ceramic materials and barium titanate series ceramic materials.
5. The integrated structure-based low-frequency active vibration suppression system according to claim 1, wherein the thickness of the metal electrode layer is 10nm-1000nm, and the material of the metal electrode layer is one or more of gold, silver, copper and platinum; the metal electrode layer is formed on the surface of the piezoelectric fiber composite layer in a sputtering mode through ions.
6. The integrated structure-based low-frequency active vibration suppression system according to claim 1, wherein the vibration suppression device further comprises two metal lead-out foil strips connected to the two metal electrode layers, respectively, one end of each metal lead-out foil strip is connected to the metal electrode layer, and the other end of each metal lead-out foil strip extends out of the packaging layer.
7. The integrated structure based low frequency active vibration suppression system according to claim 1, wherein the material of said encapsulation layer is glass fiber reinforced plastic; the packaging layer is formed by soaking single-layer or multi-layer glass fiber cloth with an epoxy resin adhesive and then curing.
8. The integrated structure-based low-frequency active vibration suppression system according to claim 7, wherein the vibration suppression function device is prepared by an integrated structure component process which comprises the following steps: firstly, attaching the bottom surface of a piezoelectric fiber composite material sheet to a semi-cured glass steel sheet, and utilizing a semi-cured epoxy resin adhesive on the glass steel sheet to realize bonding and curing of a metal electrode layer and a piezoelectric fiber composite layer; and secondly, in order to realize the packaging of the vibration suppression functional device, attaching another semi-cured glass steel sheet to the top surface of the piezoelectric fiber composite material sheet and curing.
9. The integrated structure-based low-frequency active vibration suppression system according to claim 1, wherein the resonant frequency range is 10Hz-50Hz, and the low-frequency vibration suppression efficiency range is 50% -90%;
the working mode of the vibration suppression function device has a piezoelectric material d31 mode and a partial piezoelectric material d33 mode.
10. The integrated structure based low frequency active vibration suppression system according to claim 1, wherein said active vibration suppression system device comprises a signal generator, a high voltage amplifier and a controller which are electrically connected;
the controller controls the signal generator to generate an alternating current signal, and the high-voltage amplifier amplifies the alternating current signal and drives the vibration suppression functional device.
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