CN110767617A - 一种分拣倒装芯片的封盖平衡性填充封装结构及工艺 - Google Patents

一种分拣倒装芯片的封盖平衡性填充封装结构及工艺 Download PDF

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CN110767617A
CN110767617A CN201911048861.6A CN201911048861A CN110767617A CN 110767617 A CN110767617 A CN 110767617A CN 201911048861 A CN201911048861 A CN 201911048861A CN 110767617 A CN110767617 A CN 110767617A
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flip chip
substrate
metal cover
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flip
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阳芳芳
陆海琴
马军
张光明
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Taiji Semiconductor (suzhou) Co Ltd
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Abstract

本发明公开了一种分拣倒装芯片的封盖平衡性填充封装结构及工艺，包含基板、倒装芯片、硅垫片和金属盖，金属盖焊接在基板上，倒装芯片位于金属盖内；倒装芯片与基板之间设置填充胶，倒装芯片背面的左右两侧上均设置有硅垫片；硅垫片的上下两侧均通过导热粘接层与金属盖盒倒装芯片粘连；本方案采用上下双层导热界面胶与左右两块硅垫片相结合的结构，保证最小散热接触面积，也保证金属盖粘贴时左右平衡无位置偏移，最终实现散热优良的封盖产品封装；导热界面胶的散热系数为3.4W/Mk，硅垫片的散热系数为149W/mK，实现了热量从薄型分拣倒装芯片到金属盖的快速传递，同时满足客户对封装类型的个性化追求，其工艺也具备较高的量产操作性。

Description

一种分拣倒装芯片的封盖平衡性填充封装结构及工艺
技术领域
本发明涉及一种分拣倒装芯片的封盖平衡性填充封装结构及工艺，属于集成电路倒装芯片封装技术领域。
背景技术
芯片倒装焊接在基板或其他载板上时，一般需要在芯片凸块（bump）间埋入底部填充胶（underfiller），金属盖（Lid cover）底端通过粘接剂（adhensive）强力连接在基板或其他载板上予以支撑；金属盖的腔体顶端通过界面散热材料（TIM胶）连通到芯片背面（非电性能面）实现热传导，然后植球，切割成形。
而当分拣倒装芯片的厚度小于500μm，常规金属盖腔体深度高于800μm时，正常刷界面散热胶无法完全填满最小约300μm，甚至更大的间隙空间，并实现高效散热；从而只能采用塑封（EMC）类FCBGA封装，不能满足客户对封装形式的个性化要求；特别是在金属盖共享模具，统一大小，以保证成本最小化的前提下。
发明内容
针对上述存在的技术问题，本发明的目的是：提出了一种分拣倒装芯片的封盖平衡性填充封装结构及工艺封装工艺。
本发明的技术解决方案是这样实现的：一种分拣倒装芯片的封盖平衡性填充封装结构，包含基板、倒装芯片、硅垫片和金属盖，金属盖的边框通过焊接剂焊接在基板上，倒装芯片位于金属盖内；所述倒装芯片的正面具有多个凸块，倒装芯片与基板之间设置填充胶，倒装芯片背面的左右两侧上均设置有硅垫片；所述硅垫片通过其下侧的下导热粘接层粘贴在倒装芯片的背面，硅垫片的上侧通过上导热粘接层与金属盖粘连。
优选的，所述填充胶充满倒装芯片与基板之间的间隙，以及凸块与凸块之间的间隙。
优选的，所述下导热粘接层和上导热粘接层均由界面散热胶点涂形成。
优选的，所述基板的底部焊有锡球。
其封装工艺包含以下步骤：
第一步：芯片倒装焊接；
将倒装芯片倒装在基板上,实现信号的100%对应连接；
第二步：芯片底部填充；
通过虹吸现象使填充胶布满倒装芯片与基板的全部间隙，并固化以增强芯片凸块与基板焊盘的连接牢固度；
第三步：第一次点涂界面散热胶；
将界面散热胶均匀点涂在倒装芯片背面的两个短边，保证相近的点胶宽度和相同的点胶量，之后送进烘箱固化，形成两侧的下导热粘接层；
第四步：贴硅垫片并烘烤；
将硅垫片通过下导热粘接层粘贴在倒装芯片背面的两个短边上，保证两侧具有相同的压合高度；
第五步：第二次点涂界面散热胶；
将界面散热胶分别点涂在左右两边的硅垫片上，保证相近的点胶宽度和相同的点胶量，形成上导热粘接层；
第六步：点涂焊接剂；
将焊接剂点涂在基板的环形贴盖区；
第七步：粘贴金属盖；
将金属盖对准基板的环形贴盖区，并控制位移和压合高度；
第八步：全固化；
将完成金属盖压合的半成品放入烘箱中，并填充压块，之后烘烤使整体全固化；
第九步：植球；
将锡球焊接在基板的球垫上，完成芯片信号单元通过基板到锡球的有效连通；
第十步：切单；
使用切刀将整板产品切割成单颗单元。
由于上述技术方案的运用，本发明与现有技术相比具有下列优点：
本方案采用上下双层导热界面胶与左右两块硅垫片相结合的结构，保证最小散热接触面积，也保证金属盖粘贴时左右平衡无位置偏移，最终实现散热优良的封盖产品封装；导热界面胶的散热系数为3.4W/Mk，硅垫片的散热系数为149W/mK，实现了热量从薄型分拣倒装芯片到金属盖的快速传递，同时满足客户对封装类型的个性化追求，其工艺也具备较高的量产操作性。
附图说明
下面结合附图对本发明技术方案作进一步说明：
附图1为本发明所述的一种分拣倒装芯片的封盖平衡性填充封装结构的示意图；
附图2为本发明所述的加工过程的第一步示意图；
附图3为本发明所述的加工过程的第二步示意图；
附图4为本发明所述的加工过程的第三步示意图；
附图5为本发明所述的加工过程的第四步示意图；
附图6为本发明所述的加工过程的第五步示意图；
附图7为本发明所述的加工过程的第六步示意图；
附图8为本发明所述的加工过程的第七步示意图；
附图9为本发明所述的加工过程的第八步示意图；
附图10为本发明所述的加工过程的第九步示意图。
具体实施方式
下面结合附图来说明本发明。
如附图1所示，本发明所述的一种分拣倒装芯片的封盖平衡性填充封装结构，包含基板11、倒装芯片12和金属盖7，基板11的底部焊有锡球9，金属盖7的边框通过焊接剂6焊接在基板11上，倒装芯片12位于金属盖7内；所述倒装芯片12的正面具有多个凸块，倒装芯片12与基板11之间设置填充胶2，填充胶2充满倒装芯片12与基板11之间的间隙，以及凸块与凸块之间的间隙；所述倒装芯片12背面的左右两侧上均设置有硅垫片4，硅垫片4通过其下侧的下导热粘接层3粘贴在倒装芯片12的背面，硅垫片4的上侧通过上导热粘接层5与金属盖7粘连，下导热粘接层3和上导热粘接层5均由点涂的界面散热胶形成。
此种分拣倒装芯片的封盖平衡性填充封装结构，主要为实现热量从薄型分拣倒装芯片到金属盖的快速传递，保证最小散热接触面积，并保证金属盖粘贴时左右平衡无位置偏移，最终实现散热优良的封盖产品封装。
如图2-10所示，该封装结构的加工过程如下：
第一步：芯片倒装焊接；
将薄型分拣芯片倒装在基板或其他载板上,实现信号的100%对应连接。
第二步：芯片底部填充；
通过虹吸现象使底部填充材料布满薄型分拣芯片与基板或其他载板的全部间隙，并固化以增强芯片凸块与基板焊盘的连接牢固度。
第三步：第一次点涂界面散热胶；
将界面散热胶均匀点涂在倒装芯片背面的两个短边，保证相近的点胶宽度和相同的点胶量，之后送进烘箱固化，形成两侧的下导热粘接层。
第四步：贴硅垫片并烘烤；
将硅垫片通过下导热粘接层粘贴在倒装芯片背面的两个短边上，保证两侧具有相同的压合高度。
第五步：第二次点涂界面散热胶；
将界面散热胶分别点涂在左右两边的硅垫片上，保证相近的点胶宽度和相同的点胶量，形成上导热粘接层。
第六步：点涂焊接剂；
将焊接剂点涂在基板或其他载板的环形贴盖区，保证均匀BLT及一致焊接宽度。
第七步：粘贴金属盖；
将金属盖对准基板或其他载板的环形贴盖区，即焊接剂点涂区，并控制位移和压合高度。
第八步：全固化；
将完成金属盖压合的半成品放入烘箱81中，并填充压块82，之后烘烤使整体全固化。
第九步：植球；
将锡球焊接在基板或其他载板的球垫（ball pad）上，完成芯片信号单元通过基板到锡球的有效连通。
第十步：切单；
使用切刀将整板产品切割成单颗单元。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并加以实施，并不能以此限制本发明的保护范围，凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围内。

Claims (5)

1.一种分拣倒装芯片的封盖平衡性填充封装结构，其特征在于：包含基板（11）、倒装芯片（12）、硅垫片（4）和金属盖（7），金属盖（7）的边框通过焊接剂（6）焊接在基板（11）上，倒装芯片（12）位于金属盖（7）内；所述倒装芯片（12）的正面具有多个凸块，倒装芯片（12）与基板（11）之间设置填充胶（2），倒装芯片（12）背面的左右两侧上均设置有硅垫片（4）；所述硅垫片（4）通过其下侧的下导热粘接层（3）粘贴在倒装芯片（12）的背面，硅垫片（4）的上侧通过上导热粘接层（5）与金属盖（7）粘连。
2.根据权利要求1所述的分拣倒装芯片的封盖平衡性填充封装结构，其特征在于：所述填充胶（2）充满倒装芯片（12）与基板（11）之间的间隙，以及凸块与凸块之间的间隙。
3.根据权利要求1所述的分拣倒装芯片的封盖平衡性填充封装结构，其特征在于：所述下导热粘接层（3）和上导热粘接层（5）均由界面散热胶点涂形成。
4.根据权利要求1所述的分拣倒装芯片的封盖平衡性填充封装结构，其特征在于：所述基板（11）的底部焊有锡球（9）。
5.一种分拣倒装芯片的封盖平衡性填充封装工艺，其特征在于，包含以下步骤：
第一步：芯片倒装焊接；
将倒装芯片（12）倒装在基板（11）上,实现信号的100%对应连接；
第二步：芯片底部填充；
通过虹吸现象使填充胶（2）布满倒装芯片（12）与基板（11）的全部间隙，并固化以增强芯片凸块与基板焊盘的连接牢固度；
第三步：第一次点涂界面散热胶；
将界面散热胶均匀点涂在倒装芯片（12）背面的两个短边，保证相近的点胶宽度和相同的点胶量，之后送进烘箱（32）固化，形成两侧的下导热粘接层（3）；
第四步：贴硅垫片并烘烤；
将硅垫片（4）通过下导热粘接层（3）粘贴在倒装芯片（12）背面的两个短边上，保证两侧具有相同的压合高度；
第五步：第二次点涂界面散热胶；
将界面散热胶分别点涂在左右两边的硅垫片（4）上，保证相近的点胶宽度和相同的点胶量，形成上导热粘接层（5）；
第六步：点涂焊接剂；
将焊接剂（6）点涂在基板（11）的环形贴盖区；
第七步：粘贴金属盖；
将金属盖（7）对准基板（11）的环形贴盖区，并控制位移和压合高度；
第八步：全固化；
将完成金属盖压合的半成品放入烘箱（81）中，并填充压块（82），之后烘烤使整体全固化；
第九步：植球；
将锡球（9）焊接在基板（11）的球垫上，完成芯片信号单元通过基板到锡球的有效连通；
第十步：切单；
使用切刀将整板产品切割成单颗单元。
CN201911048861.6A 2019-10-31 2019-10-31 一种分拣倒装芯片的封盖平衡性填充封装结构及工艺 Pending CN110767617A (zh)

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