CN110739257A - Operation method of micro laser system for aligning chip and substrate and fine leveling - Google Patents
Operation method of micro laser system for aligning chip and substrate and fine leveling Download PDFInfo
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- CN110739257A CN110739257A CN201911143853.XA CN201911143853A CN110739257A CN 110739257 A CN110739257 A CN 110739257A CN 201911143853 A CN201911143853 A CN 201911143853A CN 110739257 A CN110739257 A CN 110739257A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8013—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
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Abstract
The invention discloses an operation method of chip-substrate alignment and fine leveling micro laser system, which solves the problem of how to combine a laser fine positioning and a micro optical system at to realize bonding fine positioning, the invention realizes the alignment of a chip and a substrate by returning coaxial light rays emitted by a micro imaging camera with a coaxial light source to the micro imaging camera after being reflected by a chip target reflector and a substrate target reflector respectively, forms three positioning laser points on three target reflectors on the chip by using the same light path system through a two-way laser respectively so as to obtain the accurate position of the horizontal plane of the chip, forms three positioning laser points on three target reflectors on the substrate by using the same light path system through the two-way laser respectively so as to obtain the accurate position of the horizontal plane of the substrate, thereby completing the accurate adjustment of the parallelism of the two planes.
Description
Technical Field
The invention relates to large-scale integrated circuit device manufacturing equipment, in particular to an operation method of a micro laser system for aligning and finely leveling a chip and a substrate in bonding process equipment for flip chip.
Background
The flip chip bonding equipment is mainly used for the flip chip bonding process of large-scale integrated circuit device manufacturing, direct interconnection bonding of a chip and a substrate is completed, a package has more excellent high-frequency, low-delay and low-crosstalk circuit characteristics, the reliability of assembly interconnection of a circuit, a component or a system can be effectively improved, the flip chip bonding equipment mainly comprises a part, a Z-direction lifting arm mechanism, a pitching and deflecting platform, an optical system, a lifting arm mechanism, a lifting and deflecting platform, a chip suction disc, a lifting and deflecting platform, wherein the lifting and deflecting platform is arranged at the lower end of the lifting and deflecting platform, the chip suction disc is arranged on the lifting and deflecting platform, the lifting and deflecting arm mechanism has the main functions of realizing bonding of the chip and the substrate by pressing, the suction disc and the substrate are realized by the lifting and deflecting adjustment of the lifting and the lifting arm mechanism, before bonding, the optical system is arranged on the lifting and deflecting platform, the lifting and deflecting platform, the optical system is pressed on the lifting and deflecting platform, the lifting and deflecting platform are used for realizing the bonding of the chip, the chip bonding of the substrate, the lifting and the reading and the chip bonding of the substrate, the lifting and reading of the lifting and the substrate are realized by the lifting and reading of the lifting and the.
The parallelism of a suction cup of a chip to be bonded and a suction cup of a reading circuit substrate are measured by a laser system in the optical system, the parallelism of the two suction cups reaches the requirement of the designed bonding parallelism by adjusting a pitching and deflecting platform according to the parallelism measurement result of the two suction cups, then a pre-bonded chip is sucked onto the chip suction cup, the reading circuit substrate is placed on the reading circuit substrate suction cup with a reflecting mirror surface, the microscope system is started, the chip sucked onto the chip suction cup is aligned with the reading circuit substrate sucked onto the substrate suction cup, after the alignment is completed, a Z-direction lifting arm is pressed down, the chip and the reading circuit substrate are bonded at through pressure connection, the existing optical system only completes the parallelism detection and adjustment of the chip suction cup and the reading circuit substrate suction cup, but does not determine and adjust the parallelism of two bodies of the bonded chip and the reading circuit substrate, when the chip and the reading circuit substrate are bonded, the parallel system and the bonding system are arranged independently, and the existing optical system can not ensure the parallelism of the two bodies to be directly arranged in the bonding system, and the existing bonding system can not occupy the large working space when the bonding system is used.
The on-site operation steps comprise that a reading circuit substrate is placed on an XY theta positioning platform below, a bonded chip is adsorbed on an upper pitching deflection platform, accurate alignment of the chip and the substrate is firstly carried out, then the pitching deflection platform is controlled to enable the reading circuit substrate to be parallel to the bonded chip, finally, a Z-direction lifting arm presses down the pitching deflection platform, the bonded chip and the reading circuit substrate are bonded at through compression, and therefore the flip chip bonding process is completed.
Before bonding, the chip and the substrate are aligned and adjusted to ensure the coincidence of the pre-bonding positions on the chip and the substrate, so that the chip is accurately inversely bonded at . As the prior art only adjusts the parallelism of the chip sucker and the substrate sucker in place, does not adjust the parallelism of the chip and the substrate, and does not adjust the precise positioning and leveling to the positioning point on the chip and the positioning point on the substrate, how to combine the laser precise positioning and the microscopic optical system at , the occupied space of the optical system can be reduced, the precise positioning of bonding can be realized, and the practical problem to be solved on site is solved.
Disclosure of Invention
The invention provides an operation method of micro laser systems for aligning and precisely leveling chips and a substrate, and solves the technical problem of how to realize bonding precise positioning by combining laser precise positioning and a micro optical system at .
The invention solves the technical problems by the following technical scheme:
bonding process equipment for flip chip comprises a marble reference platform, a Y-direction moving guide rail mounting base arranged on the marble reference platform, a Y-direction moving platform guide rail arranged on the Y-direction moving guide rail mounting base, a Y-direction moving platform guide rail arranged on the positioning platform, a Y-direction moving slider arranged on the Y-direction moving platform guide rail, an X-direction moving guide rail arranged on the top end surface of the Y-direction moving slider, an X-direction moving slider arranged on the X-direction moving guide rail, a X-direction moving slider arranged on the X-direction moving guide rail via the bottom surface of the X-direction moving slider, an air-floating support pad arranged on the bottom surface of the X-direction moving slider, a theta rotation platform and a rotation driving motor arranged on the top surface of the X-direction moving slider, a substrate placing platform arranged on the top surface of the theta rotation platform, a substrate suction cup with a reflection mirror surface arranged on the substrate placing platform, a substrate suction cup with a reflection mirror surface for reading circuit substrate, a pitching adjustment system for adjusting the Z-direction swing chip, a lifting adjustment system with a lifting and lifting system for adjusting the Z-direction chip.
The optical system operation box is provided with a collimation light path for leveling a chip adsorption sucker and a reading circuit substrate sucker, the collimation light path consists of a red LED point light source, a blue LED point light source, a semi-transparent semi-reflective mirror, a collimation objective lens, a reflector, a target image generating plate, a light filter, a substrate sucker with a reflecting mirror surface, a chip sucker with a reflecting mirror surface and a collimation imaging camera, an icon generated by irradiating the light of the red LED point light source on the target image generating plate is reflected by the chip sucker with the reflecting mirror surface, a chip sucker position state image A is generated in the collimation imaging camera, an icon generated by irradiating the light of the blue LED point light source on the target image generating plate is reflected by the substrate sucker with the reflecting mirror surface, and a substrate sucker position state image B is generated in the collimation imaging camera.
bonding method for flip chip is characterized by that a microscopic optical path for aligning chip and substrate is set in the operation box of optical system, said microscopic optical path is composed of semi-transparent semi-reflecting mirror, collimating objective, reflecting mirror, focusing objective, pentagonal prism and microscopic imaging camera with light source, the light of light source in the microscopic imaging camera with light source is irradiated onto the reflecting surface of mark point on chip, the reflected light can image the chip mark point image C in the microscopic imaging camera, at the same time, the light of light source in the microscopic imaging camera with light source is irradiated onto the reflecting surface of mark point on substrate, the reflected light can image the substrate mark point image D in the microscopic imaging camera, if the chip mark point image C is not overlapped with the substrate mark point image D, the placing table of read circuit substrate is adjusted until the chip mark point image C is overlapped with the substrate mark point image D, so as to complete the alignment of chip and read circuit substrate.
A collimated light path structure for adjusting parallelism between a chip sucker and a substrate sucker comprises an optical system operation box, a chip sucker with a reflector and a substrate sucker with a reflector, wherein a red LED point light source is arranged in the optical system operation box, a semi-transparent semi-reflective mirror is arranged on the right side of the red LED point light source, a collimating objective lens is arranged on the right side of a semi-transparent semi-reflective mirror, a target image generating plate is arranged on the right side of an collimating objective lens, a reflector forming an angle of 45 degrees with the horizontal plane is arranged on the right side of the target image generating plate, a second semi-transparent semi-reflective mirror is arranged under a 4837 reflector, a second reflector forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the second semi-reflective mirror, a third reflector forming an angle of 135 degrees with the horizontal plane is arranged right above the second reflector, a chip sucker with a reflector is arranged right above a filter, a chip sucker with a reflector is arranged right side of the second semi-transparent semi-reflective mirror, a third reflector forming an angle of 135 degrees with the horizontal plane is arranged on the left side of the second semi-transparent semi-reflective mirror, a fifth reflector forming an angle with a blue reflector under a positive reflector, a fifth reflector, a blue reflector is arranged under a positive reflector, a fifth reflector forming an image with a positive reflector under a positive reflector, and a positive reflector, and a blue reflector, and a positive reflector are arranged under a positive reflector, and a negative reflector, and a positive reflector are arranged under a positive reflector, and a negative reflector.
A target generation image A of a target image reflected by a chip sucker with a reflector and a target generation image B of the target image reflected by a substrate sucker with a reflector are respectively generated in the collimation imaging camera.
method for adjusting parallelism between chip sucker and substrate sucker by using collimated light path, which is characterized by the following steps:
red light rays emitted by a red LED point light source are sequentially transmitted by an th half-mirror and a th collimating objective lens, target image red light rays are formed on a target image generating plate, the formed target image red light rays are sequentially reflected by a th reflecting mirror, a second half-mirror and a second reflecting mirror, are filtered by a th optical filter, are irradiated on a reflecting mirror surface of a chip sucker with a reflecting mirror surface, and are reflected by the reflecting mirror surface, are sequentially filtered by the th optical filter, reflected by the second reflecting mirror, transmitted by the second half-mirror, reflected by a third reflecting mirror, reflected by a fourth reflecting mirror and transmitted by the second collimating objective lens, and then a target image A is generated in a collimating imaging camera after the target image is reflected by the chip sucker with the reflecting mirror surface;
blue light rays emitted by a blue LED point light source are reflected by an th semi-transparent semi-reflective mirror and transmitted by a th collimating objective lens in sequence, then target image blue light rays are formed on a target image generating plate, the formed target image blue light rays are reflected by a th semi-transparent semi-reflective mirror, transmitted by a second semi-transparent semi-reflective mirror, reflected by a fifth mirror and reflected by a sixth mirror in sequence, filtered by a second optical filter, irradiated onto a reflecting mirror surface of a substrate sucker with a reflecting mirror surface, reflected by the reflecting mirror surface of the substrate sucker, filtered by the second optical filter, reflected by the sixth mirror, reflected by the fifth mirror, reflected by the second semi-transparent semi-reflective mirror, reflected by a third mirror, reflected by a fourth mirror and transmitted by the second collimating objective lens, and then a target generation image B of the target image reflected by the substrate sucker with the reflecting mirror surface is generated in a collimating imaging camera;
and if the target generation image A and the target generation image B are not coincident, adjusting the pitching and yawing adjusting platform, changing the posture of the chip sucker with the reflecting mirror surface until the target generation image A after the target image is reflected by the chip sucker with the reflecting mirror surface is coincident with the target generation image B after the target image is reflected by the substrate sucker with the reflecting mirror surface, and finishing the adjustment operation of the parallelism of the chip sucker and the substrate sucker.
A microscopic laser system for aligning and fine leveling of chip and substrate comprises a microscopic imaging camera with coaxial light source, a two-way laser, a chip and a reading circuit substrate, wherein the microscopic imaging camera with coaxial light source is arranged in an optical system operation box, the right side of the microscopic imaging camera with coaxial light source is provided with a focusing objective lens, the right side of a focusing objective lens is provided with a third collimating objective lens, the right side of the third collimating objective lens is provided with a third semi-transmitting semi-reflecting mirror forming an angle of 45 degrees with the horizontal plane, the right side of the third semi-transmitting semi-reflecting mirror is provided with a fourth semi-transmitting semi-reflecting mirror forming an angle of 135 degrees with the horizontal plane, the right side of the fourth semi-reflecting mirror forming an angle of 135 degrees with the horizontal plane is provided with a seventh reflecting mirror, a second semi-reflecting objective lens is arranged right above the seventh reflecting mirror, a chip is arranged right above the second semi-reflecting mirror, a chip target reflecting mirror is arranged on the chip, an eighth semi-reflecting mirror is arranged right side of the third semi-reflecting mirror, a fifth semi-reflecting mirror is arranged right side of the semi-transmitting mirror, a reading semi-transmitting objective lens is arranged below the third semi-transmitting mirror, and a fifth semi-transmitting objective lens is arranged below the semi-transmitting objective lens, and.
A right-angle prism is arranged between the fourth semi-transmitting semi-reflecting mirror and the fifth semi-transmitting semi-reflecting mirror, and a double-path laser is arranged on the right side of the right-angle prism.
method for operating a micro laser system for aligning and precisely leveling a chip and a substrate, which is characterized by comprising the following steps:
by moving an optical system operation box suspended on an XY direction moving platform of an optical system, a reflector image C of an th chip target on a chip and a reflector image D of a th substrate target on a substrate are imaged in a microscopic imaging camera with a coaxial light source, and the specific process is as follows:
after the light of the coaxial light source in the microscopic imaging camera with the coaxial light source is focused by the th focusing objective lens and is transmitted by the third collimating objective lens;
partial light sequentially passes through the third half-mirror transmission, the fourth half-mirror transmission, the seventh mirror reflection and the second focusing objective lens focusing, then irradiates on the chip target reflector arranged on the chip, the light reflected on the chip target reflector sequentially passes through the second focusing objective lens transmission, the seventh mirror reflection, the fourth half-mirror transmission, the third collimating objective lens transmission and the focusing objective lens transmission, and then forms a reflector image C of the chip target in the microscopic imaging camera with a coaxial light source;
partial light rays sequentially pass through the third half-mirror reflection, the eighth mirror reflection, the fifth half-mirror transmission, the pentagonal prism refraction and the third focusing objective lens to be irradiated on the substrate target reflection mirror arranged on the reading circuit substrate, and after being reflected by the substrate target reflection mirror, the light rays sequentially pass through the third focusing objective lens transmission, the pentagonal prism refraction, the fifth half-mirror transmission, the eighth mirror reflection, the third half-mirror reflection, the third collimating objective lens transmission and the focusing objective lens transmission, a reflection mirror image D of the substrate target is formed in the microscopic imaging camera with the coaxial light source;
starting the two-way laser, wherein th laser rays on the two-way laser are reflected by the upper side reflecting surface of the right-angle prism, then sequentially reflected by the fourth semi-transparent semi-reflective emitter, reflected by the seventh reflector and focused by the second focusing objective lens, and then irradiate on the chip target reflector arranged on the chip to form a laser spot on a th chip target reflector image C on the chip;
after being reflected by the lower side reflecting surface of the right-angle prism, the second path of laser light on the two-path laser device sequentially passes through the reflection of a fifth semi-transparent semi-reflective emitter, the refraction of a pentagonal prism and the focusing of a third focusing objective lens and irradiates a substrate target reflector arranged on a read circuit substrate to form a laser spot on an th substrate target reflector image D;
moving the optical system operation box suspended on the XY direction moving platform of the optical system again, and repeating the steps from the step to the step four to obtain a laser point on a second chip target reflector image E on the chip and a second substrate target reflector image F on the substrate corresponding to the laser point;
continuing to move the optical system suspended on the XY-direction moving platform of the optical system, and repeating the steps from step to step four to obtain a laser point on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser point;
making planes from the laser point on the th chip target reflector image C, the laser point on the second chip target reflector image E and the laser point on the third chip target reflector image G to obtain a chip horizontal state plane, and making planes from the laser point on the th substrate target reflector image D, the laser point on the second substrate target reflector image F and the laser point on the third substrate target reflector image H to obtain a substrate horizontal state plane;
and (3) calculating a parallelism included angle between the horizontal state plane of the chip and the horizontal state plane of the substrate, finishing fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching and yawing adjusting platform if the parallelism included angle is greater than the design requirement index, and repeating the steps from step to step seven after adjustment until the parallelism included angle meets the design requirement index.
The invention realizes the alignment of a chip and a substrate by respectively reflecting coaxial light rays emitted by a microscopic imaging camera with a coaxial light source by a chip target reflector and a substrate target reflector and then returning the reflected coaxial light rays to the microscopic imaging camera for imaging, forms three positioning laser points on the three target reflectors on the chip by a same light path system through a two-way laser respectively so as to obtain the accurate position of the horizontal plane of the chip, forms three positioning laser points on the three target reflectors on the substrate by a same light path system through the two-way laser respectively so as to obtain the accurate position of the horizontal plane of the substrate, calculates the included angle formed by the two planes, finally obtains the included angle of the parallelism of the two planes, compares the obtained included angle of the parallelism with the index required by design, and completes the accurate adjustment of the parallelism of the two planes.
Drawings
FIG. 1 is a schematic diagram of the optical path structure of the laser microscope ;
FIG. 2 is a schematic view of the structure of the microscopic light path of the present invention;
FIG. 3 is a schematic diagram of the laser beam path structure of the present invention;
FIG. 4 is a diagram of a collimated light path for adjusting parallelism between a chip chuck and a substrate chuck in accordance with the present invention;
FIG. 5 is a schematic diagram of the general structure of the bonding process equipment for flip chip of the present invention;
fig. 6 is a schematic view of the structure of XY θ stage on the marble reference stage 21 of the present invention;
FIG. 7 is a schematic diagram of the optical system operation platform of the present invention;
fig. 8 is a schematic structural view of the Z-direction lift arm mechanism of the present invention.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
bonding process equipment for flip chip comprises a marble reference platform 21, a Y-direction moving guide mounting base 9 arranged on the marble reference platform 21, a Y-direction moving guide rail 8 arranged on the Y-direction moving guide mounting base 9, a Y-direction moving slider 7 arranged on the Y-direction moving guide rail 8, a X-direction moving guide rail 6 arranged on the top end surface of the Y-direction moving slider 7, an X-direction moving slider 22 arranged on the X-direction moving guide rail 6, a theta rotation platform 3 and a rotation drive motor 11 arranged on the top end surface of the X-direction moving slider 22 via the bottom end surface thereof, a read circuit substrate placement platform 1 arranged on the top surface of the theta rotation platform 3, a read circuit substrate placement platform 1 arranged on the read circuit substrate placement platform 1, a tilt adjustment platform 12 arranged on the bottom surface of the Z-direction moving slider, a tilt adjustment platform 14 arranged on the tilt adjustment platform, a tilt adjustment platform 12 arranged on the bottom surface of the Z-direction moving slider, a tilt adjustment platform with a tilt adjustment mechanism, a tilt adjustment mechanism 13 arranged on the Z-direction moving slider, a tilt adjustment platform 12 with a tilt adjustment mechanism, a tilt adjustment mechanism with a tilt adjustment mechanism, a tilt adjustment mechanism 12 arranged on the tilt adjustment mechanism, a tilt adjustment mechanism with a tilt adjustment mechanism 12 arranged on the tilt adjustment mechanism, a tilt adjustment mechanism with a tilt adjustment mechanism, a tilt adjustment mechanism with a tilt adjustment mechanism 12 arranged on the tilt adjustment mechanism, a tilt adjustment mechanism with a tilt adjustment mechanism 12 arranged on the tilt adjustment mechanism, a tilt.
A collimation light path for leveling a chip adsorption sucker and a reading circuit substrate sucker is arranged in an optical system operation box 20 and consists of a red LED point light source, a blue LED point light source, a semi-transparent semi-reflective mirror, a collimation objective lens, a reflector, a target image generating plate, a light filter, a substrate sucker 2 with a reflective mirror surface, a chip sucker 14 with a reflective mirror surface and a collimation imaging camera, an icon generated by irradiating the target image generating plate with light of the red LED point light source is reflected by the chip sucker 14 with the reflective mirror surface, a chip sucker position state image A is generated in the collimation imaging camera, an icon generated by irradiating the target image generating plate with light of the blue LED point light source is reflected by the substrate sucker 2 with the reflective mirror surface, and a substrate sucker position state image B is generated in the collimation imaging camera.
bonding method for flip chip is characterized in that a microscopic light path for aligning chip and substrate is set in the operation box 20 of optical system, the microscopic light path is composed of semi-transparent semi-reflecting mirror, collimating objective, reflecting mirror, focusing objective, pentagonal prism and microscopic imaging camera with light source, the light of light source in the microscopic imaging camera with light source irradiates on the reflecting surface of the mark point on the chip, the reflected light images the mark point image C of the chip in the microscopic imaging camera, at the same time, the light of light source in the microscopic imaging camera with light source irradiates on the reflecting surface of the mark point on the substrate, the reflected light images the mark point image D of the substrate in the microscopic imaging camera, if the mark point image C of the chip does not coincide with the mark point image D of the substrate, the placing table 1 of read circuit substrate is adjusted until the mark point image C of the chip coincides with the mark point image D of the substrate, thereby completing the alignment work of chip and read circuit substrate, the light source is combined in the microscopic imaging camera, the microscopic imaging camera irradiates the mark point image C of the chip and the mark point image D of the chip coincides with the mark point image D of the chip, thereby realizing the accurate alignment work of the chip.
collimated light path structure for adjusting parallelism of chip sucker and substrate sucker, comprising optical system operation box 20, chip sucker 14 with reflector, and substrate sucker 2 with reflector, red LED point light source 23 is set in optical system operation box 20, half-mirror 24 is set on right side of red LED point light source 23, collimating objective lens 25 is set on right side of half-mirror 24, target image generating plate 26 is set on right side of collimating objective lens 25, reflector 27 with 45 degree angle to horizontal plane is set on right side of target image generating plate 26, second half-mirror 28 is set under 27 of 7 reflector 27, second half-mirror 29 with 135 degree angle to horizontal plane is set on right side of second half-mirror 28, filter 30 is set on right side of second reflector 29, chip sucker 14 with reflector is set on right side of , second half-mirror 34 with reflector is set on left side of second half-mirror 28, fifth half-mirror 34 is set on left side of second half-mirror 34 with reflector 34 degree angle to horizontal plane, fifth half-mirror 34 is set on left side of reflector 34, second half-mirror 34 is set under positive reflector 34 with positive reflector 32, fourth half-mirror 34 is set on right side of collimating objective lens 34, second half-mirror 34, fifth reflector 34 is set on right side of half-mirror 34, fifth reflector 32, fourth reflector is set on right side of half-mirror 34 with positive reflector 32, and positive reflector 34, and positive reflector 32.
In the collimating and imaging camera 34, a target generation image a in which the target image is reflected by the chip chuck 14 with a mirror surface and a target generation image B in which the target image is reflected by the substrate chuck 2 with a mirror surface are generated, respectively.
method for adjusting parallelism between chip sucker and substrate sucker by using collimated light path, which is characterized by the following steps:
the red light emitted by the red LED point light source 23 is sequentially transmitted by the th half mirror 24 and the th collimator objective 25, and then the target image red light is formed on the target image generating plate 26, and the formed target image red light is sequentially reflected by the th mirror 27, the second half mirror 28, the second mirror 29, filtered by the optical filter 30, and then irradiated onto the reflecting mirror surface of the chip suction cup 14 with a reflecting mirror surface, and after being reflected by the reflecting mirror surface, is sequentially filtered by the optical filter 30, reflected by the second mirror 29, transmitted by the second half mirror 28, reflected by the third mirror 31, reflected by the fourth mirror 32, and transmitted by the second collimator objective 33, and then the target generating image a in the collimator imaging camera 34 is generated with the target image after being reflected by the chip suction cup 14 with a reflecting mirror surface;
blue light rays emitted by the blue LED point light source 35 are reflected by the semi-transparent semi-reflective mirror 24 and transmitted by the collimating objective lens 25 in sequence, and then target image blue light rays are formed on the target image generating plate 26, and the formed target image blue light rays are reflected by the reflecting mirror 27, transmitted by the second semi-transparent semi-reflective mirror 28, reflected by the fifth reflecting mirror 36 and reflected by the sixth reflecting mirror 37 in sequence, are filtered by the second optical filter 38, irradiate onto the reflecting mirror surface of the substrate suction cup 2 with a reflecting mirror surface, are reflected by the reflecting mirror surface of the substrate suction cup 2, are filtered by the second optical filter 38, reflected by the sixth reflecting mirror 37, reflected by the fifth reflecting mirror 36, reflected by the second semi-transparent semi-reflective mirror 28, reflected by the third reflecting mirror 31, reflected by the fourth reflecting mirror 32 and transmitted by the second collimating objective lens 33 in sequence, and then target generating a target generating image B of the target image reflected by the substrate suction cup 2 with a reflecting mirror surface in the collimating imaging camera 34;
if the target generation image A and the target generation image B are not coincident, the pitching and yawing adjusting platform 12 is adjusted, the posture of the chip sucker 14 with the reflecting mirror surface is changed until the target generation image A after the target image is reflected by the chip sucker 14 with the reflecting mirror surface is coincident with the target generation image B after the target image is reflected by the substrate sucker 2 with the reflecting mirror surface, and the adjustment operation of the parallelism of the chip sucker and the substrate sucker is completed.
A microscopic laser system for aligning and fine leveling of chip and substrate comprises a microscopic imaging camera 39 with coaxial light source, a two-way laser 51, a chip 15 and a reading circuit substrate 4, wherein the microscopic imaging camera 39 with coaxial light source is arranged in an optical system operation box 20, a focusing objective 40 is arranged on the right side of the microscopic imaging camera 39 with coaxial light source, a third collimating objective 41 is arranged on the right side of the focusing objective 40, a third half-transmitting half-reflecting mirror 42 forming an angle of 45 degrees with the horizontal plane is arranged on the right side of the third collimating objective 41, a fourth half-transmitting mirror 43 forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the third half-transmitting half-reflecting mirror 42, a seventh reflecting mirror 44 is arranged on the right side of the fourth half-transmitting half-reflecting mirror 43 forming an angle of 135 degrees with the horizontal plane, a second focusing objective 45 is arranged right above the seventh reflecting mirror 44, the chip 15 is arranged right above the second half-transmitting mirror 45, a chip target reflecting mirror is arranged on the chip 15, an eighth half-transmitting mirror 46 is arranged right side of the third half-transmitting mirror 42, an eighth reflecting mirror 47 is arranged below the fifth half-transmitting mirror 46, and a reading circuit substrate 49 is arranged below the fifth half-transmitting mirror 48.
A rectangular prism 50 is provided between the fourth half mirror 43 and the fifth half mirror 47, and a two-way laser 51 is provided on the right side of the rectangular prism 50.
method for operating a micro laser system for aligning and precisely leveling a chip and a substrate, which is characterized by comprising the following steps:
the optical system operation box 20 suspended on the optical system XY direction moving platform 19 is moved to image the th chip target reflection mirror image C on the chip 15 and the th substrate target reflection mirror image D on the substrate in the microscopic imaging camera 39 with coaxial light source, the specific process is as follows:
after the light of the coaxial light source in the microscopic imaging camera 39 with the coaxial light source is focused by the -th focusing objective lens 40 and is transmitted by the third collimating objective lens 41;
partial light rays sequentially pass through the third half mirror 42 transmission, the fourth half mirror 43 transmission, the seventh mirror 44 reflection and the second focusing objective 45 focusing, then irradiate on the chip target reflector arranged on the chip 15, the light rays reflected on the chip target reflector sequentially pass through the second focusing objective 45 transmission, the seventh mirror 44 reflection, the fourth half mirror 43 transmission, the third half mirror 42 transmission, the third collimating objective 41 transmission and the focusing objective 40 transmission, and then a reflector image C of the th chip target is formed in the microscopic imaging camera 39 with a coaxial light source;
partial light rays are reflected by the third half mirror 42, reflected by the eighth mirror 46, reflected by the fifth half mirror 47, refracted by the pentagonal prism 48 and focused by the third focusing objective 49 in sequence, irradiate onto the substrate target mirror arranged on the read circuit substrate 4, are reflected by the substrate target mirror, and then are transmitted by the third focusing objective 49, refracted by the pentagonal prism 48, transmitted by the fifth half mirror 47, reflected by the eighth mirror 46, reflected by the third half mirror 42, transmitted by the third collimating objective 41 and transmitted by the focusing objective 40 in sequence, so that a mirror image D of the th substrate target is formed in the microscopic imaging camera 39 with a coaxial light source;
starting the two-way laser 51, after th laser rays on the two-way laser 51 are reflected by the upper side reflecting surface of the right-angle prism 50, and then are reflected by the fourth semi-transparent semi-reflective reflector 43, reflected by the seventh reflector 44 and focused by the second focusing objective 45 in sequence, the laser rays irradiate on the chip target reflector arranged on the chip 15 to form a laser point on a th chip target reflector image C on the chip;
after being reflected by the lower side reflecting surface of the right-angle prism 50, the second path of laser light on the two-path laser 51 sequentially passes through reflection of the fifth half-mirror 47, refraction of the pentagonal prism 48 and focusing of the third focusing objective 49, and irradiates on a substrate target reflector arranged on the read-out circuit substrate 4 to form a laser spot on an th substrate target reflector image D;
moving the optical system operation box 20 suspended on the XY direction moving platform 19 again, repeating the steps from step to step four to obtain a laser spot on the second chip target reflector image E on the chip and a second substrate target reflector image F on the substrate corresponding to the laser spot;
continuously moving the optical system operation box 20 suspended on the XY direction moving platform 19 of the optical system, repeating the steps from the th step to the fourth step to obtain a laser point on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser point;
making planes from the laser point on the th chip target reflector image C, the laser point on the second chip target reflector image E and the laser point on the third chip target reflector image G to obtain a chip horizontal state plane, and making planes from the laser point on the th substrate target reflector image D, the laser point on the second substrate target reflector image F and the laser point on the third substrate target reflector image H to obtain a substrate horizontal state plane;
and (3) calculating a parallelism included angle between the horizontal state plane of the chip and the horizontal state plane of the substrate, finishing fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching and yawing adjusting platform 12 if the parallelism included angle is greater than the design requirement index, and repeating the steps from step to step seven after adjustment until the parallelism included angle meets the design requirement index.
Claims (1)
1, kinds of chips and the operation method of the micro laser system of base plate contraposition and fine leveling, which is characterized in that the following steps:
the reflector image C of the th chip target on the chip (15) and the reflector image D of the th substrate target on the substrate are imaged in a microscopic imaging camera (39) with a coaxial light source by moving an optical system operation box (20) hung on an optical system XY direction moving platform (19), and the specific process is as follows:
the light of the coaxial light source in the microscopic imaging camera (39) with the coaxial light source is focused by a focusing objective lens (40) and is transmitted by a third collimating objective lens (41);
partial light rays are transmitted by a third half-mirror (42), transmitted by a fourth half-mirror (43), reflected by a seventh mirror (44) and focused by a second focusing objective lens (45), then irradiate on a chip target reflector arranged on a chip (15), the light rays reflected on the chip target reflector are transmitted by a second focusing objective lens (45), reflected by the seventh mirror (44), transmitted by the fourth half-mirror (43), transmitted by a third half-mirror (42), transmitted by a third collimating objective lens (41) and transmitted by a focusing objective lens (40), and then a reflector image C of a chip target is formed in a microscopic imaging camera (39) with a coaxial light source;
partial light rays are reflected by a third half mirror (42), an eighth mirror (46), a fifth half mirror (47), a pentagonal prism (48) and a third focusing objective lens (49) in sequence, irradiate onto a substrate target mirror arranged on a reading circuit substrate (4), are reflected by the substrate target mirror, and then are transmitted by the third focusing objective lens (49), refracted by the pentagonal prism (48), transmitted by the fifth half mirror (47), reflected by the eighth mirror (46), reflected by the third half mirror (42), transmitted by a third collimating objective lens (41) and transmitted by a focusing objective lens (40) in sequence, so that a substrate target reflecting mirror image D is formed in the microscopic imaging camera (39) with a coaxial light source;
starting a two-way laser (51), after th laser rays on the two-way laser (51) are reflected by an upper side reflecting surface of a right-angle prism (50), sequentially reflected by a fourth semi-transparent semi-reflective mirror (43), reflected by a seventh reflecting mirror (44) and focused by a second focusing objective lens (45), irradiating laser points on a th chip target reflecting mirror image C on a chip formed on a chip target reflecting mirror arranged on the chip (15);
after being reflected by a lower side reflecting surface of a right-angle prism (50), a second path of laser light on a two-path laser (51) sequentially passes through reflection of a fifth half-transmitting and half-reflecting mirror (47), refraction of a pentagonal prism (48) and focusing of a third focusing objective lens (49) and irradiates a substrate target reflecting mirror arranged on a read-out circuit substrate (4) to form a laser spot on an substrate target reflecting mirror image D;
moving the optical system operation box (20) hung on the XY direction moving platform (19) of the optical system again, repeating the steps from the step to the step four to obtain a laser point on a second chip target reflector image E on the chip and a second substrate target reflector image F on the substrate corresponding to the laser point;
continuously moving an optical system operation box (20) hung on an XY direction moving platform (19) of the optical system, and repeating the steps from the step to the step four to obtain a laser point on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser point;
making planes from the laser point on the th chip target reflector image C, the laser point on the second chip target reflector image E and the laser point on the third chip target reflector image G to obtain a chip horizontal state plane, and making planes from the laser point on the th substrate target reflector image D, the laser point on the second substrate target reflector image F and the laser point on the third substrate target reflector image H to obtain a substrate horizontal state plane;
and (3) calculating a parallelism included angle between the horizontal state plane of the chip and the horizontal state plane of the substrate, finishing fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching deflection adjusting platform (12) if the parallelism included angle is greater than the design requirement index, and repeating the steps from step to step seven after adjustment until the parallelism included angle meets the design requirement index.
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