CN110752177A - Reflective flip chip bonding machine and chip bonding method - Google Patents
Reflective flip chip bonding machine and chip bonding method Download PDFInfo
- Publication number
- CN110752177A CN110752177A CN201910963693.7A CN201910963693A CN110752177A CN 110752177 A CN110752177 A CN 110752177A CN 201910963693 A CN201910963693 A CN 201910963693A CN 110752177 A CN110752177 A CN 110752177A
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- chip
- flip chip
- adsorption device
- infrared light
- beam splitter
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001179 sorption measurement Methods 0.000 claims abstract description 44
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000001259 photo etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a reflective flip chip bonding machine and a chip bonding method, which can improve alignment and bonding precision and reduce the complexity of a chip process. This reflection-type flip-chip bonding machine includes: an upper adsorption device for mounting the upper chip; a lower suction device for mounting the lower chip; a through hole provided on the lower adsorption device; an infrared light emitting diode; the beam splitter is arranged along the infrared light path direction of the infrared light-emitting diode; an objective lens optically connected to the exit of the beam splitter and disposed opposite to the through hole; an industrial camera interfaced with the beam splitter for reflected light; a display coupled to the industrial camera. The observation device has simple structure, does not need to insert other complex optical systems between the two chips for observation, greatly reduces the manufacturing complexity and cost, greatly reduces errors and improves the bonding precision.
Description
Technical Field
The invention relates to the technical field of chip bonding, in particular to a reflective flip chip bonding machine and a chip bonding method.
Background
The die bonding is to clean two chips with devices, and then bond the two chips together by some means (such as heating, applying pressure, etc.) under certain conditions, so that the two chips are bonded into a whole. A very important step involved in this process is chip alignment. The alignment of flip chip bonding device on the market at present mostly is two piece upper and lower chips that need the bonding with visible light difference irradiation, carries out the relative distance measurement of two chips through the alignment pattern on the chip, moves and aligns according to relative distance. In the method, two chips to be bonded need to be separated in the alignment stage, an observation device is inserted between the two chips, and the distance between the two chips is shortened for bonding after the observation is finished.
In the prior art, two chips are respectively a part of marks of two chips to be aligned. And inserting a total reflection mirror into the two chips to enable the light to return to the camera to obtain the chip mark patterns, and then carrying out alignment treatment. Such a structure is complex, and because the bonding process can not be observed in real time, it is difficult to ensure whether the horizontal distance between the two chips is kept unchanged in the approaching process, and the precision is difficult to improve. The flip chip bonder needs to observe the alignment mark on the surface of the chip, and the traditional bonder needs to turn over the chip during observation so as to facilitate observation or insert an observation device into two chips to be attached. For example, systematic errors and displacement errors are increased.
Disclosure of Invention
The invention provides a reflective flip chip bonding machine and a chip bonding method, which can improve alignment and bonding precision and reduce the complexity of a chip process.
A reflective flip chip bonder comprising:
an upper adsorption device for mounting the upper chip;
a lower suction device for mounting the lower chip;
a through hole provided on the lower adsorption device;
an infrared light emitting diode for emitting infrared light;
the beam splitter is arranged along the infrared light path direction of the infrared light-emitting diode;
an objective lens optically connected to the exit of the beam splitter and disposed opposite to the through hole;
an industrial camera interfaced with the beam splitter to reflect light;
a display coupled to the industrial camera.
According to the invention, the infrared light emitted by the infrared light emitting diode firstly passes through the beam splitter, then passes through the objective lens and then passes through the through hole to irradiate the surface of the chip, the reflected light passes through the objective lens, the beam splitter reflects the light to the industrial camera and transmits the light to the display through the data line, the observation device has a simple structure, other complex optical systems do not need to be inserted between the two chips for observation, and the manufacturing complexity and the cost are greatly reduced. Due to the special light path design, light penetrates through the lower chip from the lower part and irradiates the surface of the upper chip, so that the upper chip does not need double-sided photoetching and polishing, namely, the bottom of the upper chip does not have process requirements, the process limitation and the process complexity of the upper chip are reduced, and the applicable objects of the equipment are greatly expanded.
The upper chip and the lower chip are both relative concepts, indicating that two chips are needed for bonding, and the upper adsorption device and the lower adsorption device are also relative changes, indicating that two adsorption devices are oppositely arranged. Also writable, a first suction device for mounting a first chip; and a second adsorption device for mounting a second chip.
The upper adsorption device and the lower adsorption device are oppositely arranged and matched with each other. Namely, the first adsorption device and the second adsorption device are oppositely arranged and matched with each other.
The upper adsorption device is connected with a three-dimensional moving device, in particular to an upper adsorption device support frame. The upper adsorption device can move along with the movement of the support frame which can move horizontally and vertically.
The lower adsorption device is connected with a three-dimensional moving device, in particular to a support frame of the lower adsorption device. In the same way, the adsorption device can move along with the movement of the support frame which can move horizontally and vertically.
The lower adsorption device is connected with a temperature control device, and can provide corresponding working temperature for chip bonding.
The through holes can allow light to pass through, and allow incidence of infrared light and emitted light on the surface of the chip to pass through.
The beam splitter is used for enabling infrared light emitted by the infrared light emitting diode to smoothly pass through and splitting and reflecting reflected light to the industrial camera.
And a reflector is arranged between the infrared light-emitting diode and the beam splitter. The infrared light emitting diode emits infrared light, the infrared light firstly passes through the reflector and the beam splitter, then passes through the objective lens and the through hole to irradiate the surface of the chip, the reflected light passes through the objective lens, the beam splitter reflects the light to the industrial camera and is transmitted to the display through the data line.
The reflector adopts a 45-degree reflection structure and is arranged on a reflector displacement table.
The industrial camera is arranged on the industrial camera displacement table.
The invention discloses a flip chip bonding method, which adopts a reflective flip chip bonding machine and comprises the following steps:
the method comprises the following steps: respectively fixing an upper chip and a lower chip which need to be bonded by an upper adsorption device and a lower adsorption device;
step two: adjusting the upper adsorption device support frame and the lower adsorption device support frame to enable the two chips to be close to each other and enable the mark patterns on the two chips to be clearly seen on the display;
step three: changing the position of the upper chip according to the mark pattern until the mark pattern of the upper chip is aligned with the mark pattern of the lower chip;
step four: and opening the heating function of the temperature control device, and adjusting the lower adsorption device support frame to press the upper chip on the lower chip to complete bonding.
Compared with the prior art, the invention has the following advantages:
the observation device is simple in structure, other complex optical systems do not need to be inserted between the two chips for observation, and manufacturing complexity and cost are greatly reduced.
Secondly, as the distance between the upper chip and the lower chip is infinitely close in the alignment process, the integration of bonding and alignment can be achieved by utilizing the special alignment mode. Different from the traditional bonder which carries out alignment and bonding firstly, the invention does not need to carry out the movement of the observation device and the large-stroke displacement of the upper chip and the lower chip, and can carry out direct bonding after alignment, thereby realizing the synchronization of alignment and bonding. Greatly reducing the error and improving the bonding precision.
And thirdly, due to the special light path design, light penetrates through the lower chip from the lower part and irradiates the surface of the upper chip, so that the upper chip does not need double-sided photoetching and polishing, namely, the bottom of the upper chip does not have process requirements, the process limitation and the process complexity of the upper chip are reduced, and the applicable objects of the equipment are greatly expanded.
Drawings
FIG. 1 is a schematic structural diagram of a reflective flip chip bonder in accordance with the present invention;
fig. 2 is a schematic flow chart of the flip chip bonding method of the present invention.
Detailed Description
As shown in fig. 1, a reflective flip chip bonder includes: an upper adsorption device 1 for mounting an upper chip 2; a lower adsorption device 4 matched with the upper adsorption device 1 and used for installing the lower chip 3; a through hole 14 provided on the lower adsorption device 4; an infrared light emitting diode 10 for emitting infrared light; a beam splitter 8 for allowing infrared light emitted from the infrared light emitting diode 10 to pass smoothly and reflecting the emitted light; an objective lens 7 connected to the beam splitter 8 and disposed opposite to the through hole 14; an industrial camera 9 interfaced with the objective lens 7; a display 12 connected to the industrial camera 9. The industrial camera 9 is disposed on the displacement table 15. A reflector 11 is arranged between the infrared light emitting diode 10 and the beam splitter 8.
The upper adsorption device 1 is connected with a three-dimensional moving device, specifically a support frame 13, and the upper adsorption device 1 can move along with the movement of the support frame 13 which can move horizontally and vertically.
The lower adsorption device 4 is connected with a three-dimensional moving device, specifically a support frame 6. The adsorption device 4 can move along with the movement of the support frame 6 which can move horizontally and vertically.
The lower adsorption device 4 is connected with a temperature control device 5, and can provide corresponding working temperature for chip bonding.
As shown in fig. 1, in a reflective flip chip bonder, two chips to be bonded, an upper chip 2 and a lower chip 3 are fixed by an upper suction device 1 and a lower suction device 4, respectively. The lower adsorption device 4 is connected with a temperature control device 5, and can provide corresponding working temperature for chip bonding. The upper suction device 1 is movable in accordance with the movement of the support frame 13 which is movable horizontally and vertically. The adsorption device 4 can move along with the movement of the support frame 6 which can move horizontally and vertically. The microscope device (comprising an infrared light emitting diode 10, a reflector 11, a beam splitter 8, an objective lens 7, an industrial camera 9 and a display 12) is arranged below the support frame 13 and the support frame 6. The light emitted by the infrared light emitting diode 10 passes through the reflector 11, then the beam splitter 8, then the objective lens 7, and finally the through hole 14 to irradiate the chip. The reflected image passes through the objective lens 7 and the beam splitter 8 reflects to the industrial camera 9 and passes through the data line to the display 12. In order to facilitate adjustment of the field range, a displacement table 16 and a displacement table 15 which can be horizontally and vertically moved are installed below the reflecting mirror 11 and the industrial camera 9, respectively.
The reflecting angle of the reflecting mirror 11 can be adjusted at will, in the above example, 45 ° reflection is adopted, and other reflecting structures can be adopted according to actual needs.
The lower adsorption device 4 is made of copper material with low cost, and a through hole 14 is formed in the middle of the lower adsorption device to allow light to pass through. Other thermally conductive materials may also be used.
The present example also provides a flip chip bonding method. Referring to the figures in combination, the flip chip bonding method includes the following steps, please refer to fig. 1 and fig. 2 simultaneously for understanding:
the method comprises the following steps: the upper chip 2 and the lower chip 3 to be bonded are fixed by the upper suction device 1 and the lower suction device 4, respectively.
Step two: the supports 6 and 13 are adjusted so that the chips are infinitely close and the pattern of marks on the chips is clearly visible on the display 12.
Step three: the position of the upper chip 2 is changed according to the mark pattern until the mark pattern of the upper chip 2 and the mark pattern of the lower chip 3 are aligned.
Step four: and opening the heating function of the temperature control device 5, and adjusting the support frame 13 to press the upper chip 2 on the lower chip 3 to complete bonding.
The invention adopts the special light path design of the infrared light source, the infrared light has the capability of penetrating through the chip, so the chip does not need to be turned over or inserted into an observation device, only direct observation is needed, the system error is greatly reduced, and the displacement error is infinitely close to 0 because the chip does not need to be turned over or moved greatly, and the predicted bonding precision is about 200nm when the error is about 15nm (determined according to the displacement error of the used automatic displacement platform). Therefore, the error is greatly reduced, and the bonding precision is improved.
Claims (10)
1. A reflective flip chip bonder, comprising:
an upper adsorption device for mounting the upper chip;
a lower suction device for mounting the lower chip;
a through hole provided on the lower adsorption device;
an infrared light emitting diode for emitting infrared light;
the beam splitter is arranged along the infrared light path direction of the infrared light-emitting diode;
an objective lens optically connected to the exit of the beam splitter and disposed opposite to the through hole;
an industrial camera interfaced with the beam splitter to reflect light;
a display coupled to the industrial camera.
2. The reflective flip chip bonder of claim 1, wherein said upper and lower suction devices are disposed opposite and cooperate with each other.
3. The reflective flip chip bonder of claim 1, wherein said upper suction device is coupled to an upper suction device support.
4. The reflective flip chip bonder of claim 1, wherein said lower attachment means is coupled to a lower attachment means support frame.
5. The reflective flip chip bonder of claim 1, wherein a temperature control device is coupled to said lower attachment device.
6. The reflective flip chip bonder of claim 1, wherein a mirror is disposed between said infrared light emitting diode and said beam splitter.
7. The reflective flip chip bonder of claim 1, wherein said mirror is configured to reflect 45 °.
8. The reflective flip chip bonder of claim 1, wherein said mirror is disposed on a mirror displacement stage.
9. The reflective flip chip bonder of claim 1, wherein said industrial camera is disposed on an industrial camera translation stage.
10. A flip chip bonding method using the reflective flip chip bonding machine according to any one of claims 1 to 9, comprising the steps of:
the method comprises the following steps: respectively fixing an upper chip and a lower chip which need to be bonded by an upper adsorption device and a lower adsorption device;
step two: adjusting the upper adsorption device support frame and the lower adsorption device support frame to enable the two chips to be close to each other and enable the mark patterns on the two chips to be clearly seen on the display;
step three: changing the position of the upper chip according to the mark pattern until the mark pattern of the upper chip is aligned with the mark pattern of the lower chip;
step four: and opening the heating function of the temperature control device, and adjusting the lower adsorption device support frame to press the upper chip on the lower chip to complete bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910963693.7A CN110752177A (en) | 2019-10-11 | 2019-10-11 | Reflective flip chip bonding machine and chip bonding method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910963693.7A CN110752177A (en) | 2019-10-11 | 2019-10-11 | Reflective flip chip bonding machine and chip bonding method |
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| Publication Number | Publication Date |
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| CN110752177A true CN110752177A (en) | 2020-02-04 |
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| CN201910963693.7A Pending CN110752177A (en) | 2019-10-11 | 2019-10-11 | Reflective flip chip bonding machine and chip bonding method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584415A (en) * | 2020-06-22 | 2020-08-25 | 中国科学院长春光学精密机械与物理研究所 | Alignment system for wafer bonding |
| CN113327879A (en) * | 2021-05-14 | 2021-08-31 | 长江存储科技有限责任公司 | Chuck adjusting device and method and wafer bonding device and method |
| CN114695229A (en) * | 2022-03-31 | 2022-07-01 | 深圳市联得自动化装备股份有限公司 | Bonding alignment device, flip chip bonding machine and bonding method |
| WO2023133956A1 (en) * | 2022-01-11 | 2023-07-20 | 长鑫存储技术有限公司 | Wafer bonding device and wafer bonding method |
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| CN1264493A (en) * | 1997-06-18 | 2000-08-23 | 微机器人系统公司 | Method and apparatus for chip placement |
| CN1853320A (en) * | 2003-09-22 | 2006-10-25 | 株式会社村田制作所 | Method and device for installing light emitting element |
| CN108172527A (en) * | 2017-12-28 | 2018-06-15 | 长春长光精密仪器集团有限公司 | A kind of Systems for optical inspection |
| CN109932829A (en) * | 2019-04-10 | 2019-06-25 | 武汉锐科光纤激光技术股份有限公司 | A kind of lens positioning device and method |
-
2019
- 2019-10-11 CN CN201910963693.7A patent/CN110752177A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264493A (en) * | 1997-06-18 | 2000-08-23 | 微机器人系统公司 | Method and apparatus for chip placement |
| CN1853320A (en) * | 2003-09-22 | 2006-10-25 | 株式会社村田制作所 | Method and device for installing light emitting element |
| CN108172527A (en) * | 2017-12-28 | 2018-06-15 | 长春长光精密仪器集团有限公司 | A kind of Systems for optical inspection |
| CN109932829A (en) * | 2019-04-10 | 2019-06-25 | 武汉锐科光纤激光技术股份有限公司 | A kind of lens positioning device and method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584415A (en) * | 2020-06-22 | 2020-08-25 | 中国科学院长春光学精密机械与物理研究所 | Alignment system for wafer bonding |
| CN113327879A (en) * | 2021-05-14 | 2021-08-31 | 长江存储科技有限责任公司 | Chuck adjusting device and method and wafer bonding device and method |
| WO2023133956A1 (en) * | 2022-01-11 | 2023-07-20 | 长鑫存储技术有限公司 | Wafer bonding device and wafer bonding method |
| CN114695229A (en) * | 2022-03-31 | 2022-07-01 | 深圳市联得自动化装备股份有限公司 | Bonding alignment device, flip chip bonding machine and bonding method |
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Application publication date: 20200204 |