CN115145007A - Optical lens, optical camera shooting mechanism and chip mounter - Google Patents
Optical lens, optical camera shooting mechanism and chip mounter Download PDFInfo
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- CN115145007A CN115145007A CN202210741816.4A CN202210741816A CN115145007A CN 115145007 A CN115145007 A CN 115145007A CN 202210741816 A CN202210741816 A CN 202210741816A CN 115145007 A CN115145007 A CN 115145007A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 158
- 238000012634 optical imaging Methods 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 10
- 235000009537 plain noodles Nutrition 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B37/00—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
The invention relates to an optical lens, an optical camera shooting mechanism and a chip mounter, wherein the optical lens comprises a glass body and a light splitting layer, and the glass body is provided with an optical surface; the light splitting layer is arranged on the optical surface, so that part of light can pass through the optical surface to be refracted, and part of light can be reflected through the optical surface. The optical imaging system includes a camera and an optical lens. The optical lens can play both a reflection role and a refraction role, so that one of the chip and the binder can be reflected by the optical surface to be received by the camera through the optical lens, the other of the chip and the binder can be received by the camera through the refraction of the optical surface, and when the virtual image of the chip on the camera and the virtual image of the binder are superposed, the alignment of the chip and the binder is completed. Not only can greatly save the production cost, but also is more convenient to use.
Description
Technical Field
The invention relates to the technical field of chip bonding, in particular to an optical lens, an optical camera shooting mechanism and a chip mounter.
Background
In the chip mounter in the related art, usually, a plurality of cameras are needed to respectively shoot positions of a chip on a combining part and a suction nozzle on a substrate, then, a relative position relation between the chip and the combining part is calculated through a background system, and then, the positions of the substrate and the suction nozzle are moved, so that the chip on the suction nozzle and the combining part on the substrate are aligned; moreover, a complex calculation program is required to calculate the relative position relationship between the chip and the connector, and the calculation result is also affected by various basic parameters, for example, when the height of the substrate is changed or the signal of the chip is changed, the parameters in the calculation program need to be adjusted correspondingly, which causes inconvenience in use and high difficulty in use. And if one camera is used, a complex moving mechanism is needed to drive the camera to shoot the positions of the combining piece on the substrate and the chip on the suction nozzle respectively in front and back, so that the cost of equipment cannot be reduced, and the camera is inconvenient to use and high in use difficulty.
Therefore, a new optical lens, an optical pick-up mechanism and a chip mounter are needed to solve the above problems.
Disclosure of Invention
The invention aims to provide an optical lens, an optical camera shooting mechanism and a chip mounter which are simpler in structure and lower in cost.
According to an aspect of the invention, there is provided an optical lens comprising:
the glass body is provided with an optical surface; and
the light splitting layer is arranged on the optical surface, so that part of light can pass through the optical surface to be refracted, and the part of light can pass through the optical surface to be reflected.
As an embodiment of the present invention, the glass body includes a first triangular prism and a second triangular prism, the first triangular prism is formed with a first optical surface and a first light incident surface, the first light incident surface and the first optical surface are arranged at an included angle of 45 degrees, and the first optical surface and the first light incident surface are both four-sided surfaces on the first triangular prism; the second prism is formed with second optical surface and second income plain noodles, the second income plain noodles with second optics is personally submitted 45 degrees contained angles and is set up, the optical surface includes first optical surface and/second optical surface, the second optical surface with the second income plain noodles is all four sides face on the second prism, first prism with the second prism is in the same place through first optical surface and second optical surface, just first income plain noodles with second income plain noodles parallel arrangement, the light splitting layer is established on the first optical surface and/or on the second optical surface.
As an embodiment of the present invention, the first optical surface and the second optical surface are hermetically bonded by UV glue, and the light splitting layer is formed by the UV glue.
As an embodiment of the present invention, a light shielding layer is coated on another four side surfaces of the first triangular prism, which are adjacent to the first optical surface and the first light incident surface respectively; or
And a shading layer is coated on the other four side surfaces of the second triangular prism, which are adjacent to the second optical surface and the second light incident surface respectively.
As an embodiment of the present invention, the light-shielding layer is an aluminum powder layer.
As an embodiment of the present invention, the light splitting layer is a light splitting film.
According to another aspect of the present invention, there is provided an optical imaging system comprising a camera and an optical lens as described in any one of the above; the shooting direction of the camera and the optical surface are arranged at an angle of 45 degrees.
As an embodiment of the present invention, the optical imaging system further includes:
the camera is fixed on the fixed seat;
the adjusting seat is arranged on the fixed seat in a rotatable manner around the first shaft;
the first fine-tuning micrometer is arranged on the fixed seat, a movable head of the first fine-tuning micrometer abuts against the adjusting seat, and the adjusting seat can be driven to rotate around the first shaft by adjusting the first fine-tuning micrometer;
the lens seat is rotatably arranged on the adjusting seat around a second shaft and is used for fixing the optical lens;
the second fine-tuning micrometer is arranged on the adjusting seat, a movable head of the second fine-tuning micrometer abuts against the lens seat, and the lens seat can be driven to rotate around the second shaft by adjusting the second fine-tuning micrometer;
the first axis is perpendicular to the second axis.
According to a further aspect of the present invention, there is provided a chip mounter including the optical lens as set forth in any one of the above.
According to another aspect of the present invention, there is provided a chip mounter, comprising a pickup mechanism for sucking a chip, a processing base for placing a bonding member bonded to the chip, the chip and the bonding member being respectively located on both sides of an optical surface, wherein the bonding member is capable of being refracted by the optical surface and projected to the camera, and a virtual image of the bonding member is formed on the camera, the chip is capable of being reflected by the optical surface and projected to the camera, and a virtual image of the chip is formed on the camera, and when the virtual image of the chip and the virtual image of the bonding member coincide, the chip and the bonding member are aligned.
The embodiment of the invention has the following beneficial effects:
in the optical imaging mechanism in this embodiment, the optical lens can perform both reflection and refraction, so that one of the chip and the bonding member can be reflected by the optical surface and received by the camera through the optical lens, and the other of the chip and the bonding member can be reflected by the optical surface and received by the camera through the optical surface, and when the virtual image of the chip on the camera and the virtual image of the bonding member coincide, the alignment between the chip and the bonding member is completed. In this embodiment, through the cooperation of the camera and the optical lens, not only can the alignment of the chip and the connector be completed through one camera, but also the chip and the connector are directly formed on the camera at the same time without designing a complex moving structure to drive the camera to shoot the positions of the chip on the connector and the suction nozzle on the substrate respectively, and the alignment is completed through the position comparison of the connector and the chip, so that the production cost can be greatly saved, and the use is more convenient.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip mounter according to an embodiment of the present invention;
fig. 2 is a schematic structural view of the optical imaging mechanism in fig. 1;
FIG. 3 is a partially exploded schematic view of the optical camera mechanism of FIG. 2;
FIG. 4 is a schematic structural diagram of the optical lens of FIG. 2;
FIG. 5 is a schematic diagram of an optical path of the optical lens of FIG. 2;
wherein: 10. a camera mechanism; 20. a pickup mechanism; 30. processing a base platform; 40. a chip; 50. a binder; 100. a camera; 200. an optical lens; 210. a glass body; 210a, an optical surface; 211. a first triangular prism; 211a, a first optical surface; 211b, a first light incident surface; 212. a second triangular prism; 212a, a second optical surface; 212b, a second light incident surface; 220. a light splitting layer; 230. a light-shielding layer; 300. a fixed seat; 310. a first shaft; 400. an adjusting seat; 410. a second shaft; 500. a first vernier micrometer; 600. a lens holder; 700. and a second vernier micrometer.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for purposes of illustration only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-4, an embodiment of the invention provides a chip mounter, which includes an optical imaging mechanism 10, a pick-up mechanism 20, and a processing base 30, wherein the optical imaging mechanism 10 is used for imaging positions of a chip 40 and a bonding element 50 bonded to the chip 40, so that the pick-up mechanism 20 picks up the chip 40 and the bonding element 50 are aligned.
Specifically, the bonding member 50 is placed on the processing base 30, the pickup mechanism 20 is located above the base, and the chip 40 adsorbed on the pickup mechanism 20 can be moved to a position corresponding to the processing base 30 by moving the pickup mechanism 20, thereby placing the chip 40 on the bonding member 50. The optical imaging mechanism 10 of the present application can complete the alignment between the chip 40 and the bonding member 50 by using one camera 100.
Referring to fig. 1 to 4, in particular, an embodiment of the invention provides an optical imaging mechanism 10, the optical imaging mechanism 10 in this embodiment includes a camera 100 and an optical lens 200, the camera 100 can receive the images of the chip 40 and the bonding elements 50 reflected and refracted by the optical lens 200, so as to complete the alignment of the chip 40 and the bonding elements 50 by one camera 100.
Referring to fig. 4-5, in particular, an embodiment of the invention provides an optical lens 200 applied to the chip mounter, the optical lens 200 includes a glass body 210 and a light splitting layer 220, the glass body 210 has an optical surface 210a; the light splitting layer 220 is disposed on the optical surface 210a, so that a part of the light can pass through the optical surface 210a for refraction, and a part of the light can be reflected by the optical surface 210 a. Since the optical lens 200 can perform both reflection and refraction, one of the chip 40 and the bonding element 50 can be reflected by the optical surface 210a and received by the camera 100 through the optical lens 200, and the other of the chip 40 and the bonding element 50 can be reflected by the optical surface 210a and received by the camera 100 through the refraction, when the virtual image of the chip 40 on the camera 100 and the virtual image of the bonding element 50 are overlapped, the alignment between the chip 40 and the bonding element 50 is completed. In this embodiment, by matching the camera 100 and the optical lens 200, not only the alignment between the chip 40 and the bonding element 50 can be completed by one camera 100, but also the chip 40 and the bonding element 50 are directly formed on the camera 100 at the same time without designing a complicated moving structure to drive the camera 100 to respectively shoot the positions of the bonding element 50 on the substrate and the chip 40 on the suction nozzle, and the alignment is completed by comparing the positions of the bonding element 50 and the chip 40, so that not only can the production cost be greatly saved, but also the use is more convenient.
In one embodiment, the shooting direction of the camera 100 is set at an angle of 45 degrees with respect to the optical surface 210 a. In this embodiment, the chip 40 and the bonding element 50 are respectively located on two sides of the optical surface 210a, specifically, the chip 40 is located above the optical surface 210a, the bonding element 50 is located below the optical surface 210a, the incident angle of the chip 40 projected on the optical surface 210a is 45 degrees, the incident angle of the bonding element 50 projected on the optical surface 210a is also 45 degrees, the bonding element 50 can be refracted by the optical surface 210a and projected onto the camera 100 arranged at an angle of 45 degrees with respect to the optical surface 210a, and a virtual image of the bonding element 50 is formed on the camera 100, the chip 40 can be reflected by the optical surface 210a and projected onto the camera 100 arranged at an angle of 45 degrees with respect to the optical surface 210a, and a virtual image of the chip 40 is formed on the camera 100, and when the virtual image of the chip 40 is overlapped with the virtual image of the bonding element 50, the chip 40 and the bonding element 50 are aligned. In this embodiment, the positions of the chip 40 and the bonding element 50 are reasonably set by reasonably utilizing the reflection and refraction principles of the optical lens 200, so that the chip 40 and the bonding element 50 can be conveniently and quickly aligned by one camera 100.
Referring to fig. 4-5, in a specific embodiment, the glass body 210 includes a first prism 211 and a second prism 212, the first prism 211 is formed with a first optical surface 211a and a first light incident surface 211b, the first light incident surface 211b and the first optical surface 211a form an included angle of 45 degrees, and both the first optical surface 211a and the first light incident surface 211b are four sides of the first prism 211 (one of the four sides of the first prism 211 is three); the second prism 212 is formed with a second optical surface 212a and a second light incident surface 212b, the second light incident surface 212b and the second optical surface 212a form an included angle of 45 degrees, the optical surface 210a includes a first optical surface 211a and/or a second optical surface 212a, the second optical surface 212a and the second light incident surface 212b are both four side surfaces (one of the four side surfaces on the second prism 212 is three) on the second prism 212, the first prism 211 and the second prism 212 are spliced together through the first optical surface 211a and the second optical surface 212a, the first light incident surface 211b and the second light incident surface 212b are arranged in parallel, and the light splitting layer 220 is arranged on the first optical surface 211a and/or the second optical surface 212 a.
In this embodiment, the specific principle of the chip 40 being imaged on the camera 100 is that the chip 40 is located on the first light incident surface 211b side, the bonding element 50 is located on the second light incident surface 212b side: first, the chip 40 enters the first triple prism 211 through the first light incident surface 211b, then part of the light rays are emitted after passing through the light splitting layer 220 on the first optical surface 211a and/or the second optical surface 212a, and the reflected light rays are normally emitted to the camera 100, so that a virtual image of the chip 40 is formed on the camera 100. The specific principle of imaging the joint 50 on the camera 100 is as follows: the combining member 50 enters the second prism 212 through the second light incident surface 212b, and then a part of the light rays are refracted after passing through the light splitting layer 220 on the first optical surface 211a and/or the second optical surface 212a, and the refracted light rays are normally emitted to the camera 100, so that a virtual image of the combining member 50 is formed on the camera 100. Then, by moving the pickup mechanism 20 or the processing base 30, the chip 40 and the bonding member 50 are positionally aligned, and thus, the alignment between the chip 40 and the bonding member 50 is completed.
In a specific embodiment, the first optical surface 211a and the second optical surface 212a are sealed and adhered by UV glue, and the light splitting layer 220 is formed by UV glue. Since the UV glue has a semitransparent property, after the first optical surface 211a and the second optical surface 212a are sealed and bonded by the UV glue, the UV glue can achieve the purpose of reflecting light and refracting light, so that the optical lens 200 in this embodiment can be matched with one camera 100 to complete the alignment between the chip 40 and the bonding member 50.
Further, a light shielding layer 230 is coated on the other four side surfaces of the first prism 211, which are adjacent to the first optical surface 211a and the first light incident surface 211b respectively; or the other four side surfaces of the second triangular prism 212 adjacent to the second optical surface 212a and the second light incident surface 212b are coated with the light shielding layer 230.
Further, a light shielding layer 230 is coated on the other four side surfaces of the first prism 211, which are adjacent to the first optical surface 211a and the first light incident surface 211b respectively; the other four-side surface of the second triangular prism 212, which is adjacent to the second optical surface 212a and the second light incident surface 212b, corresponds to the camera 100, because the four-side surface of the second triangular prism 212, which corresponds to the camera 100, is arranged opposite to the light shielding layer 230 on the first triangular prism 211, and because of the light shielding layer 230, the virtual image of the chip 40 and the virtual image of the joint element 50 on the camera 100 can be improved to be clearer, and the imaging effect is better.
It should be noted that, the light shielding layer 230 may be coated on the other four side surfaces of the second triangular prism 212, which are respectively adjacent to the second optical surface 212a and the second light incident surface 212 b; the other four sides of the first prism 211 adjacent to the first optical surface 211a and the first light incident surface 211b, respectively, correspond to the camera 100.
Further, the light-shielding layer 230 is an aluminum powder layer.
In some embodiments, the light splitting layer 220 is a light splitting film. The light splitting module can refract a part of light and reflect a part of light, so that the optical lens 200 in this embodiment can achieve both the reflection and refraction effects.
Referring to fig. 1-4, in an embodiment, the optical imaging system further includes: the camera comprises a fixed seat 300, an adjusting seat 400, a first micro-adjustment micrometer 500, a lens seat 600 and a second micro-adjustment micrometer 700, wherein the camera 100 is fixed on the fixed seat 300; the adjusting base 400 is rotatably disposed on the fixing base 300 around the first shaft 310; the first micrometer 500 is arranged on the fixing base 300, a movable head of the first micrometer 500 abuts against the adjusting base 400, and the adjusting base 400 can be driven to rotate around the first shaft 310 by adjusting the first micrometer 500; the lens base 600 is rotatably arranged on the adjusting base 400 around the second shaft 410, the lens base 600 is used for fixing the optical lens 200, the second micrometer 700 is arranged on the adjusting base 400, the movable head of the second micrometer 700 is abutted against the lens base 600, and the adjusting of the second micrometer 700 can drive the lens base 600 to rotate around the second shaft 410; the first axis 310 is perpendicular to the second axis 410. Before aligning the chip 40 and the connector 50, if the mounting accuracy of the optical lens 200 is not high enough, for example, if the optical lens 200 is tilted, the precise alignment between the chip 40 and the connector 50 still cannot be successfully completed, so when the mounting accuracy of the optical lens 200 is not high enough, the adjusting seat 400 can be adjusted by the first micrometer 500, so that the adjusting seat 400 rotates around the first shaft 310, and the lens seat 600 can also be adjusted by the second micrometer 700, so that the lens seat 600 rotates around the second shaft 410, so that the optical lens 200 in this embodiment can be precisely adjusted to a pre-mounting angle before use, for example, the optical surface 210a of the optical lens 200 is precisely adjusted to form an angle of 45 degrees with the shooting direction of the camera 100. So that the precise alignment of the chip 40 and the bonding members 50 can be achieved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An optical lens, it is applied to chip mounter, its characterized in that, optical lens includes:
the glass body is provided with an optical surface; and
the light splitting layer is arranged on the optical surface, so that partial light can pass through the optical surface to be refracted, and the partial light can pass through the optical surface to be reflected.
2. The optical lens according to claim 1, wherein the glass body comprises a first prism and a second prism, the first prism is formed with a first optical surface and a first light incident surface, the first light incident surface is arranged at an included angle of 45 degrees with the first optical surface, and the first optical surface and the first light incident surface are both four-sided surfaces on the first prism; the second prism is formed with second optical surface and second income plain noodles, the second income plain noodles with second optics is personally submitted 45 degrees contained angles and is set up, the optical surface includes first optical surface and/second optical surface, the second optical surface with the second income plain noodles is all four sides face on the second prism, first prism with the second prism is in the same place through first optical surface and second optical surface, just first income plain noodles with second income plain noodles parallel arrangement, the light splitting layer is established on the first optical surface and/or on the second optical surface.
3. The optical lens of claim 2, wherein the first optical surface and the second optical surface are sealingly bonded by a UV glue, and the dichroic layer is formed by the UV glue.
4. The optical lens according to claim 2, wherein a light shielding layer is coated on the other four side surfaces of the first prism adjacent to the first optical surface and the first light incident surface respectively; or
And a light shielding layer is coated on the other four side surfaces of the second prism, which are adjacent to the second optical surface and the second light incident surface respectively.
5. The optical lens of claim 4 wherein the light-shielding layer is an aluminum powder layer.
6. The optical lens of claim 1, wherein the light-splitting layer is a light-splitting film.
7. An optical imaging system, characterized in that it comprises a camera and an optical lens according to any one of the claims 1-6 above; the shooting direction of the camera and the optical surface are arranged at an angle of 45 degrees.
8. The optical imaging system according to claim 7, further comprising:
the fixed seat is fixed on the camera;
the adjusting seat is arranged on the fixed seat in a rotatable manner around the first shaft;
the first fine-tuning micrometer is arranged on the fixed seat, a movable head of the first fine-tuning micrometer abuts against the adjusting seat, and the adjusting seat can be driven to rotate around the first shaft by adjusting the first fine-tuning micrometer;
the lens seat is rotatably arranged on the adjusting seat around a second shaft and is used for fixing the optical lens;
the second fine-tuning micrometer is arranged on the adjusting seat, a movable head of the second fine-tuning micrometer abuts against the lens seat, and the lens seat can be driven to rotate around the second shaft by adjusting the second fine-tuning micrometer;
the first axis is perpendicular to the second axis.
9. A mounter characterized by comprising the optical lens according to any one of claims 1 to 6.
10. A chip mounter comprising a pick-up mechanism, a processing base and the optical imaging system as set forth in claim 7 or 8, wherein the pick-up mechanism is used for adsorbing a chip, the processing base is used for placing a bonding member bonded with the chip, the chip and the bonding member are respectively located on two sides of an optical surface, wherein the bonding member can be refracted by the optical surface and projected to the camera, and a virtual image of the bonding member is formed on the camera, the chip can be reflected by the optical surface and projected to the camera, and a virtual image of the chip is formed on the camera, and when the virtual image of the chip and the virtual image of the bonding member coincide, the chip and the bonding member are aligned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210741816.4A CN115145007A (en) | 2022-06-27 | 2022-06-27 | Optical lens, optical camera shooting mechanism and chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210741816.4A CN115145007A (en) | 2022-06-27 | 2022-06-27 | Optical lens, optical camera shooting mechanism and chip mounter |
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| CN115145007A true CN115145007A (en) | 2022-10-04 |
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| CN202210741816.4A Pending CN115145007A (en) | 2022-06-27 | 2022-06-27 | Optical lens, optical camera shooting mechanism and chip mounter |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283010A (en) * | 2009-06-02 | 2010-12-16 | Adwelds:Kk | Alignment device, mounting device therewith, and alignment method |
| CN103118498A (en) * | 2011-11-16 | 2013-05-22 | 西安中科麦特电子技术设备有限公司 | Imaging system used for ball grid array (BGA) repair work |
| CN106154485A (en) * | 2016-08-25 | 2016-11-23 | 武汉华工激光工程有限责任公司 | A kind of rotary angular adjustment mirror holder and method |
| CN106919007A (en) * | 2017-04-05 | 2017-07-04 | 无锡影速半导体科技有限公司 | One kind alignment demarcates integrated system |
| JP2017203769A (en) * | 2016-05-10 | 2017-11-16 | ハンミ セミコンダクター カンパニー リミテッド | Vision inspection device |
| CN109557681A (en) * | 2018-12-25 | 2019-04-02 | 东莞市宇瞳光学科技股份有限公司 | A kind of aligning jig mechanism and aligning camera lens |
| CN109950191A (en) * | 2019-03-20 | 2019-06-28 | 纳研科技(上海)有限公司 | A kind of vision system and alignment methods of double-sided alignment |
| CN110108627A (en) * | 2019-05-21 | 2019-08-09 | 苏州大学 | A kind of cell in-situ observation and operating device based on microsphere lens |
| CN110739257A (en) * | 2019-11-20 | 2020-01-31 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Operation method of micro laser system for aligning chip and substrate and fine leveling |
| CN210514608U (en) * | 2019-07-01 | 2020-05-12 | 深圳晶尹阳光电有限公司 | Optical device capable of being seen from top to bottom |
| CN212321958U (en) * | 2020-06-09 | 2021-01-08 | 西安科峰光电科技有限公司 | Plane reflector |
| CN212933157U (en) * | 2020-10-31 | 2021-04-09 | 重庆市天实精工科技有限公司 | Eccentric correction tool of module of making a video recording |
-
2022
- 2022-06-27 CN CN202210741816.4A patent/CN115145007A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283010A (en) * | 2009-06-02 | 2010-12-16 | Adwelds:Kk | Alignment device, mounting device therewith, and alignment method |
| CN103118498A (en) * | 2011-11-16 | 2013-05-22 | 西安中科麦特电子技术设备有限公司 | Imaging system used for ball grid array (BGA) repair work |
| JP2017203769A (en) * | 2016-05-10 | 2017-11-16 | ハンミ セミコンダクター カンパニー リミテッド | Vision inspection device |
| CN106154485A (en) * | 2016-08-25 | 2016-11-23 | 武汉华工激光工程有限责任公司 | A kind of rotary angular adjustment mirror holder and method |
| CN106919007A (en) * | 2017-04-05 | 2017-07-04 | 无锡影速半导体科技有限公司 | One kind alignment demarcates integrated system |
| CN109557681A (en) * | 2018-12-25 | 2019-04-02 | 东莞市宇瞳光学科技股份有限公司 | A kind of aligning jig mechanism and aligning camera lens |
| CN109950191A (en) * | 2019-03-20 | 2019-06-28 | 纳研科技(上海)有限公司 | A kind of vision system and alignment methods of double-sided alignment |
| CN110108627A (en) * | 2019-05-21 | 2019-08-09 | 苏州大学 | A kind of cell in-situ observation and operating device based on microsphere lens |
| CN210514608U (en) * | 2019-07-01 | 2020-05-12 | 深圳晶尹阳光电有限公司 | Optical device capable of being seen from top to bottom |
| CN110739257A (en) * | 2019-11-20 | 2020-01-31 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Operation method of micro laser system for aligning chip and substrate and fine leveling |
| CN212321958U (en) * | 2020-06-09 | 2021-01-08 | 西安科峰光电科技有限公司 | Plane reflector |
| CN212933157U (en) * | 2020-10-31 | 2021-04-09 | 重庆市天实精工科技有限公司 | Eccentric correction tool of module of making a video recording |
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