CN110708930A - Modularized and encircling type graphite radiator and forming method thereof - Google Patents
Modularized and encircling type graphite radiator and forming method thereof Download PDFInfo
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Abstract
The invention discloses a modularized and encircling graphite radiator and a forming method thereof, belonging to the technical field of electronic device heat dissipation. The heat dissipation structure comprises a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate which are sequentially arranged from bottom to top, wherein the circle centers of the first heat dissipation substrate, the second heat dissipation substrate and the third heat dissipation substrate are positioned on the same straight line; the tail end of the first radiating connecting sheet is fixed on the upper surface of the first radiating substrate and radially extends by taking the circle center of the first radiating substrate as the center, so that the head end of the first radiating connecting sheet is fixed between the second radiating substrate and the third radiating substrate; the first radiating base plate, the second radiating base plate, the third radiating base plate, the plurality of first radiating connecting pieces and the plurality of second radiating connecting pieces form a modularized and encircling radiator, so that the convection space is increased, the convection heat transfer coefficient is improved, and a better heat transfer effect can be obtained.
Description
Technical Field
The invention belongs to the technical field of electronic device heat dissipation, and particularly relates to a modularized and encircling type graphite radiator and a forming method thereof.
Background
At present, the demand of life to electronic devices is increasing day by day, but electronic devices or equipment can produce very big heat at work, if the heat dissipation is not good will produce higher temperature, influence the normal work of components and parts and can lead to the unstability of system or even damage, consequently to its thermal diffusivity's higher requirement.
At present, most of radiators adopted by electronic devices are fin-shaped radiators made of aluminum or copper and alloys thereof, and in order to increase the heat exchange performance of the radiators in a limited space, designers generally improve the appearance of the radiators or make simple hollow structures, but the heat dissipation capacity of the radiators is insufficient, the coefficient of heat conductivity of pure copper is 398W/m ∙ K, and the coefficient of heat conductivity of pure aluminum is 273W/m ∙ K, so that the heat dissipation effect is not good.
Disclosure of Invention
The invention provides a modularized and encircling graphite radiator and a forming method thereof, aiming at solving the technical problems in the background technology.
The invention is realized by adopting the following technical scheme: a modularized and encircling graphite radiator structurally comprises a first radiating substrate, a second radiating substrate, a third radiating substrate, a plurality of first radiating connecting sheets and a plurality of second radiating connecting sheets;
the first radiating substrate, the second radiating substrate and the third radiating substrate are sequentially arranged from bottom to top, and the circle centers of the first radiating substrate, the second radiating substrate and the third radiating substrate are positioned on the same straight line;
the tail end of the first radiating connecting sheet is fixed on the upper surface of the first radiating substrate and radially extends by taking the circle center of the first radiating substrate as the center, so that the head end of the first radiating connecting sheet is fixed between the second radiating substrate and the third radiating substrate;
the second heat dissipation connecting sheet is arranged between the second heat dissipation substrate and the third heat dissipation substrate; the first radiating connecting sheets and the second radiating connecting sheets are equidistantly distributed at intervals; the lower surface of the first heat dissipation substrate is provided with a through hole corresponding to the first heat dissipation connecting sheet.
In a further embodiment, the first heat dissipation connecting piece comprises a connecting portion and a clamping portion, the height of the connecting portion is equal to the vertical distance between the first heat dissipation substrate and the second heat dissipation substrate, and the connecting portion and the clamping portion form a structure with a corresponding sine function period larger than that of the first heat dissipation substrate and the second heat dissipation substrateA sinusoidal surface less than pi.
By adopting the technical scheme: the first radiating connecting sheet is a sine curved surface, so that the contact area with airflow is increased, and the heat exchange coefficient is improved.
In a further embodiment, the second heat sink connecting piece has a corresponding sine function period not greater than
The sinusoidal surface of (2).
By adopting the technical scheme: the second radiating connecting sheet is also a sine curved surface, so that the contact area with airflow is increased, and the heat exchange coefficient is improved; meanwhile, corresponding convection channels are formed between the first heat dissipation connecting sheets to form convection channels, and the heat dissipation effect is improved.
In a further embodiment, the first and second heat dissipating attachment tabs divide the third heat dissipating substrate into 16 equal portions.
In a further embodiment, the vertical distance between the first and second heat dissipating substrates is 30 mm.
In a further embodiment, an inner diameter of the first heat dissipation substrate is smaller than an inner diameter of the second heat dissipation substrate, and the inner diameter of the second heat dissipation substrate is equal to the inner diameter of the third heat dissipation substrate.
In a further embodiment, the vertical distance between the third heat dissipation substrate and the second heat dissipation substrate is 25 mm.
The molding method of the modularized and encircling graphite radiator specifically comprises the following steps:
step one, preparing mixed powder: mixing graphite powder and a binder, gradually adding the mixture into a ball mill, uniformly mixing, and degassing the ball mill by using a vacuum pump in the mixing process to obtain a mixture;
step two, preparing a first radiating substrate, a second radiating substrate and a third radiating substrate: respectively compacting the mixture obtained in the step one to prepare a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate;
step three, preparing a first radiating connecting sheet and a second radiating connecting sheet: taking the mixture obtained in the step one into an epoxy resin solution to obtain a mixed solution, putting the mixed solution into an ultrasonic cleaning machine for ultrasonic treatment for 40min to uniformly disperse mixed powder in the mixed solution and improve the fluidity and uniformity of the mixed solution, and then carrying out injection molding; after injection molding is finished, the mold is placed in a blast drier at the temperature of 80 ℃ to be dried into a blank, and after 1 hour, the blank is naturally cooled and demoulded to obtain a first heat dissipation connecting sheet and a second heat dissipation connecting sheet;
step four, preparing a graphite radiator blank: assembling the first radiating substrate, the second radiating substrate and the third radiating substrate prepared in the second step with the first radiating connecting sheet and the second radiating connecting sheet prepared in the third step according to requirements, embedding AIN powder at each connecting position before assembling, and starting the fifth step after assembling;
step five, sintering of the green body: putting the assembled blank into a high-temperature furnace protected by nitrogen, and comprising four stages: the temperature is raised to 200 ℃ at the speed of 30 ℃/h in the first stage, to 570 ℃ at the speed of 40 ℃/h in the second stage, to 800 ℃ at the speed of 60 ℃/h in the third stage, and finally, the temperature is maintained for 1 hour at 800 ℃;
step six, carbonization: raising the temperature to 2000 ℃ at the speed of 80 ℃/h, and preserving the temperature for 2 hours to obtain the graphite radiator.
In a further embodiment, the binder in step one is asphalt.
The invention has the beneficial effects that: firstly, the invention utilizes the property of super heat conductivity of graphite to prepare the radiator, and compared with metal copper, the radiator better meets the heat dissipation requirement of electronic devices; secondly, the first radiating substrate, the second radiating substrate, the third radiating substrate, the plurality of first radiating connecting sheets and the plurality of second radiating connecting sheets form a modular and encircling radiator, so that the convection space is increased, the convection heat transfer coefficient is improved, and a better heat transfer effect can be obtained; finally, the preparation method adopted in the invention can avoid the problems of hair cracks, more gaps and the like in the preparation process in the prior art.
Drawings
Fig. 1 is a schematic structural diagram of a modular and encircling graphite heat sink according to the present invention.
Fig. 2 is a schematic structural diagram of a modular and encircling graphite heat sink according to the present invention.
Fig. 3 is a bottom view of a modular, wraparound graphite heat sink of the present invention.
Fig. 4 is a schematic diagram of a partial structure of a modular and encircling graphite heat sink according to the present invention.
Each of fig. 1 to 4 is labeled as: the heat dissipation structure comprises a first heat dissipation substrate 1, a second heat dissipation substrate 2, a third heat dissipation substrate 3, a first heat dissipation connecting sheet 4, a second heat dissipation connecting sheet 5, a through hole 6, a connecting portion 401 and a clamping portion 402.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
The applicant is for solving the technical problems existing in the current electronic devices: most of radiators adopted by electronic devices are fin-shaped radiators made of aluminum or copper and alloys thereof, and in order to increase the heat exchange performance of the radiators in a limited space, designers generally improve the appearance of the radiators or make simple hollow structures, but the radiators are limited to insufficient heat dissipation capacity of the copper, the aluminum and the alloys thereof, the heat conductivity of pure copper is 398W/m ∙ K, and the heat conductivity of pure aluminum is 273W/m ∙ K, so that the heat dissipation effect is not good. The applicant develops a modular and encircling graphite heat sink and a molding method thereof in combination with the properties of 2000W/m ∙ K thermal conductivity and light weight of graphite material.
Example 1
First, as shown in fig. 1 to 3, the present embodiment provides a modular, wraparound graphite heat sink, including: the heat dissipation structure comprises a first heat dissipation substrate 1, a second heat dissipation substrate 2, a third heat dissipation substrate 3, eight first heat dissipation connecting pieces 4 and eight second heat dissipation connecting pieces 5;
first heat dissipation base plate 1, second heat dissipation base plate 2 and third heat dissipation base plate 3 are arranged from supreme down in proper order, the vertical distance between first heat dissipation base plate 1 and the second heat dissipation base plate 2 is 30mm, the vertical distance between third heat dissipation base plate 3 and the second heat dissipation base plate 2 is 25 mm.
The centers of circles of the first radiating substrate 1, the second radiating substrate 2 and the third radiating substrate 3 are located on the same straight line, and the centers of circles of the first radiating substrate 1, the second radiating substrate 2 and the third radiating substrate 3 are located on the same straight line; the internal diameter of first heat dissipation base plate 1 is less than the internal diameter of second heat dissipation base plate 2, the internal diameter of second heat dissipation base plate 2 equals the internal diameter of third heat dissipation base plate 3 constitutes from supreme formula structure of embracing that increases gradually down, has increased gradient relation formation powerful convection space between first heat dissipation base plate 1, second heat dissipation base plate 2 and the third heat dissipation base plate 3, increases the convection heat transfer.
As shown in fig. 4, the tail end of the first heat dissipating connecting piece 4 is fixed on the upper surface of the first heat dissipating substrate 1 and extends radially with the center of the first heat dissipating substrate 1 as the center, so that the head end of the first heat dissipating connecting piece 4 is fixed between the second heat dissipating substrate 2 and the third heat dissipating substrate 3; the first heat dissipation connecting piece 4 comprises a connecting portion 401 and a clamping portion 402, the height of the connecting portion 401 is equal to the vertical distance between the first heat dissipation substrate 1 and the second heat dissipation substrate 2, and the connecting portion 401 and the clamping portion 402 form a sine curved surface corresponding to a sine function with the period larger than pi/2 and smaller than pi. The first radiating connecting sheet 4 is a sine curved surface, so that the contact area with air flow is increased, and the heat exchange coefficient is improved.
In order to prevent the second radiating connecting sheet 5 from affecting the convection effect, the second radiating connecting sheet 5 is arranged between the second radiating substrate 2 and the third radiating substrate 3; the first radiating connecting pieces 4 and the second radiating connecting pieces 5 are distributed at intervals at equal intervals; the lower surface of the first radiating substrate 1 is provided with a through hole 6 corresponding to the first radiating connecting sheet 4, so that convection is increased. The second radiating connecting sheet 5 forms a sine curved surface corresponding to a sine function with the period not more than pi/2. The second radiating connecting sheet 5 is also a sine curved surface, so that the contact area with airflow is increased, and the heat exchange coefficient is improved; meanwhile, a corresponding convection channel is formed between the first heat dissipation connecting sheet 4 to form a convection channel, so that the heat dissipation effect is improved.
The forming method of the modularized encircling graphite radiator specifically comprises the following steps:
step one, preparing mixed powder: mixing graphite powder and asphalt according to a mass ratio of 10:3, gradually adding the mixture into a ball mill, uniformly mixing, and degassing the ball mill by using a vacuum pump in the mixing process to obtain a mixture;
step two, preparing a first radiating substrate, a second radiating substrate and a third radiating substrate: respectively compacting the mixture obtained in the step one to prepare a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate;
step three, preparing a first radiating connecting sheet and a second radiating connecting sheet: taking the mixture obtained in the step one into an epoxy resin solution to obtain a mixed solution, putting the mixed solution into an ultrasonic cleaning machine for ultrasonic treatment for 40min to uniformly disperse mixed powder in the mixed solution and improve the fluidity and uniformity of the mixed solution, and then carrying out injection molding; after injection molding is finished, the mold is placed in a blast drier at the temperature of 80 ℃ to be dried into a blank, and after 1 hour, the blank is naturally cooled and demoulded to obtain a first heat dissipation connecting sheet and a second heat dissipation connecting sheet;
step four, preparing a graphite radiator blank: assembling the first radiating substrate, the second radiating substrate and the third radiating substrate prepared in the second step with the first radiating connecting sheet and the second radiating connecting sheet prepared in the third step according to requirements, embedding AIN powder at each connecting position before assembling, and starting the fifth step after assembling;
step five, sintering of the green body: putting the assembled blank into a high-temperature furnace protected by nitrogen, and comprising four stages: the temperature is raised to 200 ℃ at the speed of 30 ℃/h in the first stage, to 570 ℃ at the speed of 40 ℃/h in the second stage, to 800 ℃ at the speed of 60 ℃/h in the third stage, and finally, the temperature is maintained for 1 hour at 800 ℃;
step six, carbonization: raising the temperature to 2000 ℃ at the speed of 80 ℃/h, and preserving the temperature for 2 hours to obtain the graphite radiator.
In order to study the heat dissipation effect of the graphite heat radiator prepared by the invention, the common fin-shaped graphite heat radiator and the aluminum heat radiator, the following tests are carried out: an LED lamp wick is taken as a heat source, the ambient temperature is 20 ℃, the power of an LED chip is 100W, the graphite radiator prepared in the embodiment 1, a common fin-shaped graphite radiator and an aluminum radiator are respectively installed on the LED lamp wick for testing (other parameters are ensured to be the same), the temperature of the LED after working for 1 hour is taken as the junction temperature, and the result is shown in Table 1.
TABLE 1
| Example 1 | Common fin-shaped graphite radiator | Aluminum radiator | |
| Junction temperature (DEG C) | 53 | 69 | 65 |
As can be seen from Table 1, the heat dissipation effect of the radiator of the invention is obviously higher than that of the common fin-shaped graphite radiator and the aluminum radiator, and the heat resistance of the radiator of the invention is 0.05cm through detection2The temperature/W is obviously beneficial to common fin-shaped graphite radiators and aluminum radiators.
Example 2
Example 3
In order to study the influence of the number of the first radiating connecting pieces and the second radiating connecting pieces on the radiating effect, the following detection is carried out: an LED lamp wick is taken as a heat source, the ambient temperature is 20 ℃, the power of the LED chip is 100W, the graphite radiators prepared in the embodiments 1 to 3 are respectively installed on the LED lamp wick for testing (the other parameters are ensured to be the same), and the results are shown in Table 2.
TABLE 2
| Example 1 | Example 2 | Example 3 | |
| Junction temperature (DEG C) | 53 | 56 | 57 |
According to the data provided in table 2, when the number of the first heat-dissipating connecting pieces and the second heat-dissipating connecting pieces is 8, the heat-dissipating effect is the best, and at this time, the contact area between the first heat-dissipating connecting pieces and the air and the convection space between the first heat-dissipating connecting pieces and the second heat-dissipating connecting pieces and the air have the strongest comprehensiveness on the heat-dissipating effect.
Example 4
Example 4 differs from example 1 in that: the vertical distance between the first heat dissipation substrate and the second heat dissipation substrate is 25 mm. The other structures and steps are the same as those of embodiment 1.
Example 5
Example 5 differs from example 1 in that: the vertical distance between the first heat dissipation substrate and the second heat dissipation substrate is 35 mm. The other structures and steps are the same as those of embodiment 1.
Example 6
Example 6 differs from example 1 in that: the vertical distance between the third heat dissipation substrate and the second heat dissipation substrate is 30 mm. The other structures and steps are the same as those of embodiment 1.
Example 7
Example 7 differs from example 1 in that: the vertical distance between the third heat dissipation substrate and the second heat dissipation substrate is 20 mm. The other structures and steps are the same as those of embodiment 1.
In order to study the influence of the mutual distance among the first heat dissipation substrate, the second heat dissipation substrate and the third heat dissipation substrate on the heat dissipation effect, the following detection is carried out: an LED wick was used as a heat source, the ambient temperature was 20 ℃, the power of the LED chip was 100W, and the graphite heat sinks prepared in examples 1 and 4 to 7 were mounted on the LED wick, respectively, and tested (the other parameters were the same), and the results are shown in table 3.
TABLE 3
| Example 1 | Example 4 | Example 5 | Example 6 | Example 7 | |
| Junction temperature (DEG C) | 53 | 59 | 60 | 58 | 62 |
As can be seen from table 3, when the vertical distance between the first heat dissipation substrate 1 and the second heat dissipation substrate 2 is 30mm, and the vertical distance between the third heat dissipation substrate 3 and the second heat dissipation substrate 2 is 25mm, the heat dissipation effect is optimal, that is, the convection among the first heat dissipation substrate 1, the second heat dissipation substrate 2, and the third heat dissipation substrate 3 is significant, so as to facilitate heat exchange.
Finally, the graphite heat sink, the ordinary fin-shaped graphite heat sink, and the aluminum heat sink prepared in example 1 were subjected to bending resistance tests, and the bending resistance of the graphite heat sink prepared in example 1 was 51Mpa, and the bending resistance of the ordinary fin-shaped graphite heat sink and the bending resistance of the aluminum heat sink were 48 Mpa and 42 Mpa, respectively, by the most conventional bending resistance test method.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. The invention is not described in detail in order to avoid unnecessary repetition.
Claims (9)
1. A modularized and encircling type graphite radiator is characterized in that the structure of the radiator comprises a first radiating substrate, a second radiating substrate, a third radiating substrate, a plurality of first radiating connecting sheets and a plurality of second radiating connecting sheets;
the first radiating substrate, the second radiating substrate and the third radiating substrate are sequentially arranged from bottom to top, and the circle centers of the first radiating substrate, the second radiating substrate and the third radiating substrate are positioned on the same straight line;
the tail end of the first radiating connecting sheet is fixed on the upper surface of the first radiating substrate and radially extends by taking the circle center of the first radiating substrate as the center, so that the head end of the first radiating connecting sheet is fixed between the second radiating substrate and the third radiating substrate;
the second heat dissipation connecting sheet is arranged between the second heat dissipation substrate and the third heat dissipation substrate; the first radiating connecting sheets and the second radiating connecting sheets are equidistantly distributed at intervals; the lower surface of the first heat dissipation substrate is provided with a through hole corresponding to the first heat dissipation connecting sheet.
2. The modular, wraparound graphite heat sink as recited in claim 1, wherein the first heat-dissipating connecting piece comprises a connecting portion and a clip portion, the connecting portion has a height equal to a vertical distance between the first heat-dissipating substrate and the second heat-dissipating substrate, and the connecting portion and the clip portion have a corresponding sine function period greater than or equal to a period of the sine function period
A sinusoidal surface less than pi.
3. The modular, wraparound graphite heat sink of claim 1, wherein the second heat sink tabs are configured to correspond to a sine function having a period no greater than about
The sinusoidal surface of (2).
4. The modular, wraparound graphite heat sink of claim 1, wherein the first and second heat dissipating tabs divide the third heat dissipating substrate into 16 equal portions.
5. The modular, wraparound graphite heat sink of claim 1, wherein the vertical distance between the first heat-dissipating substrate and the second heat-dissipating substrate is 30 mm.
6. The modular, wraparound graphite heat sink of claim 1, wherein an inner diameter of the first heat dissipating substrate is smaller than an inner diameter of the second heat dissipating substrate, and the inner diameter of the second heat dissipating substrate is equal to an inner diameter of the third heat dissipating substrate.
7. The modular, wraparound graphite heat sink of claim 1, wherein the vertical distance between the third heat-dissipating substrate and the second heat-dissipating substrate is 25 mm.
8. The method for forming a modular, wraparound graphite heat sink according to any one of claims 1 to 7, comprising the steps of:
step one, preparing mixed powder: mixing graphite powder and a binder, gradually adding the mixture into a ball mill, uniformly mixing, and degassing the ball mill by using a vacuum pump in the mixing process to obtain a mixture;
step two, preparing a first radiating substrate, a second radiating substrate and a third radiating substrate: respectively compacting the mixture obtained in the step one to prepare a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate;
step three, preparing a first radiating connecting sheet and a second radiating connecting sheet: putting the mixture obtained in the step one into an epoxy resin solution to obtain a mixed solution, putting the mixed solution into an ultrasonic cleaning machine for ultrasonic treatment for 40min, and then performing injection molding; after injection molding is finished, the mold is placed in a blast drier at the temperature of 80 ℃ to be dried into a blank, and after 1 hour, the blank is naturally cooled and demoulded to obtain a first heat dissipation connecting sheet and a second heat dissipation connecting sheet;
step four, preparing a graphite radiator blank: assembling the first radiating substrate, the second radiating substrate and the third radiating substrate prepared in the second step with the first radiating connecting sheet and the second radiating connecting sheet prepared in the third step according to requirements, embedding AIN powder at each connecting position before assembling, and starting the fifth step after assembling;
step five, sintering of the green body: putting the assembled blank into a high-temperature furnace protected by nitrogen, and comprising four stages: the temperature is raised to 200 ℃ at the speed of 30 ℃/h in the first stage, to 570 ℃ at the speed of 40 ℃/h in the second stage, to 800 ℃ at the speed of 60 ℃/h in the third stage, and finally, the temperature is maintained for 1 hour at 800 ℃;
step six, carbonization: raising the temperature to 2000 ℃ at the speed of 80 ℃/h, and preserving the temperature for 2 hours to obtain the graphite radiator.
9. The method as claimed in claim 8, wherein the binder in the first step is asphalt.
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| JPS57143439A (en) * | 1981-03-02 | 1982-09-04 | Nippon Steel Corp | Batchwise annealing method for cold rolled steel strip |
| CN101520685A (en) * | 2009-04-17 | 2009-09-02 | 深圳市东维丰电子科技股份有限公司 | Carbon nanometer material radiating module |
| CN205987655U (en) * | 2016-06-28 | 2017-02-22 | 昆山立茂国际贸易有限公司 | Combined heat radiator |
| CN107606982A (en) * | 2017-08-02 | 2018-01-19 | 三峡大学 | A kind of heat radiator and its integral forming method |
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2019
- 2019-09-20 CN CN201910893595.0A patent/CN110708930B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143439A (en) * | 1981-03-02 | 1982-09-04 | Nippon Steel Corp | Batchwise annealing method for cold rolled steel strip |
| CN101520685A (en) * | 2009-04-17 | 2009-09-02 | 深圳市东维丰电子科技股份有限公司 | Carbon nanometer material radiating module |
| CN205987655U (en) * | 2016-06-28 | 2017-02-22 | 昆山立茂国际贸易有限公司 | Combined heat radiator |
| CN107606982A (en) * | 2017-08-02 | 2018-01-19 | 三峡大学 | A kind of heat radiator and its integral forming method |
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