KR20160095408A - Heat sink - Google Patents

Abstract

The present invention relates to a heat sink. The heat sink comprises: a base (10) wherein an electric component is installed on one side; and multiple heat radiating arrays installed on the other side of the base (10) and arranged around the center of the base (10). The multiple heat radiating arrays individually comprise multiple heat radiating pins. The heat radiating array which is relatively far from the center of the base (10) is installed around the adjacent inner heat radiating array. And, the heat radiating pins individually forming the heat radiating arrays adjacent to each other are alternately installed but not arranged in a fixed direction toward the center of the base (10). The heat radiating pins forming the heat radiating arrays installed on upon another in the heat sink (1) are alternately installed, so a cooling fluid (air) flowing into the center of the heat sink (1) actively heat-exchanges with not only an outermost heat radiating array but also an inner heat radiating array respectively. Therefore, the heat sink improves heat transmission performance. So, heat radiating performance of the heat sink (1) is improved.

Description

Heat sink

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat sink, and more particularly, to a heat sink provided at one side of an electronic component including a LED and a heat generating member to perform a heat radiating function and having a plurality of heat dissipating fins staggered from each other.

LED is a light emitting diode device which generates light of a characteristic wavelength by applying a forward voltage to a P-N junction structure of a semiconductor. The emission of LED is energy efficient because the energy of electrons in P-N junction is directly converted into light energy, and the lifetime is also considerably long. However, in this process, 60% of the power consumption is divergent to heat, and dissipating this heat is an important issue in LED design. This is because the higher the heat generation, the higher the temperature of the junction, which causes the allowable current to decrease and the light output to decrease. Therefore, in order to secure the reliability of LED lighting, it is necessary to develop a heat sink, which is a radiator for LED lighting.

A commonly used heatsink uses natural convection, which uses a feature that the density rises when the temperature of the air rises. That is, the overall flow of cooling air flows from the outside of the heat sink and is heated by the heat sink, so that the heated air is lighter than the surrounding air and is raised inside the heat sink .

In the conventional heat sink, as shown in FIG. 1, the heat radiating fins are arranged in a straight line to the center of the heat sink, so that the air heated by the heat radiating fins of the external heat provided on the edge is heat- The heat transfer performance is drastically reduced from the heat dissipating fin of the second row.

Korean Patent No. 10-1137888

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to improve the heat transfer performance by heat-exchanging a plurality of heat-

Another object of the present invention is to improve the heat radiation performance by changing the structure of the heat radiation array without increasing the weight or the heat transfer area of the heat sink.

According to an aspect of the present invention, there is provided a plasma display apparatus including a base on which an electronic component is mounted on one surface, and a plurality of heat radiation arrays provided on the other surface of the base and arranged around the center of the base And the plurality of heat radiation arrays are each composed of a plurality of heat radiation fins, and the heat radiation arrays at positions relatively far from the center of the base are surrounded by inner heat radiation arrays adjacent to each other, Are arranged in a staggered manner without being arranged in a certain direction toward the center of the base.

The plurality of heat dissipation arrays are provided around the other surface of the base with different radii with respect to the center of the base.

The plurality of heat dissipation arrays are composed of a first heat dissipation array to a fourth heat dissipation array having radially different radii with respect to the center of the base and radially surrounding the other surfaces of the base.

The first heat-radiating array to the fourth heat-radiating array are formed of different numbers of radiating fins.

The radiating fins constituting the radiating array toward the center of the base are spaced apart from the imaginary extension line by a predetermined distance from a virtual extension line connecting the center of the base and the radiating fins constituting the outermost radiating array .

And at least one of the radiating fins is formed so as to have a smaller cross-sectional area in a direction toward the outside from the center of the base.

At least one of the heat radiating fins is formed in a triangular prism shape, and one of the three corners forming the triangular prism is formed to be directed outward from the center of the base.

The plurality of heat dissipation arrays are formed to have a height higher toward the center of the base.

The plurality of heat dissipation arrays are formed so that their height decreases toward the center of the base.

The following effects can be expected in the heat sink according to the present invention as described above.

In the present invention, since the heat dissipating fins constituting the heat dissipating array layered in the heat sink are staggered from each other, the cooling fluid (air) flowing into the center portion of the heat sink is heat-exchanged not only with the outermost heat dissipating array but also with the relatively inside heat dissipating array So that the heat radiation performance of the heat sink is improved.

Particularly, in the present invention, the heat radiation performance can be improved by heat exchange with the cooling fluid evenly with the cooling fins through the structural change of the heat radiation array without increasing the weight of the heat sink. Therefore, The weight can be relatively reduced.

Further, in the present invention, since the area of heat exchange with the radiating fins increases in the process of moving the cooling fluid along the flow path formed in the heat sink, the heat radiation performance can be further improved, and more uniform heat transfer performance can be ensured.

1 is a perspective view showing a structure of a conventional heat sink;
2 is a perspective view showing a structure of a heat sink according to an embodiment of the present invention;
3 is a perspective view showing a bottom structure of the heat sink according to FIG. 2;
Fig. 4 is a perspective view showing a part of the embodiment of Fig. 2; Fig.
5 is a plan view showing a part of the embodiment of Fig. 2;
6 is a plan view showing a part of a structure of a heat sink according to a second embodiment of the present invention;
7 is a plan view showing a part of the structure of a heat sink according to a third embodiment of the present invention;
8 is a plan view showing a part of the structure of a heat sink according to a fourth embodiment of the present invention.
9 is a plan view showing a part of the structure of a heat sink according to a fifth embodiment of the present invention.
10 is a plan view showing a part of the structure of a heat sink according to a sixth embodiment of the present invention.
11 is a numerical analysis data comparing heat dissipation performance of a heat sink according to a conventional heat sink and heat sink according to an embodiment of the present invention shown in FIG.
12 is a graph comparing the heat transfer coefficients of the heat sink according to the prior art and the heat transfer coefficient of each array according to the embodiment of the present invention shown in Fig.
13 is a structural view showing an experimental apparatus for verifying the heat radiation performance of the embodiment shown in Fig.
14 is a graph comparing the experimental results of the experimental apparatus of FIG. 13 with the numerical analysis results of the heat sink of the embodiment shown in FIG.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference numerals whenever possible, even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the understanding why the present invention is not intended to be interpreted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

Hereinafter, a heat sink which is coupled to the LED lighting and performs the heat radiation function of the LED illumination will be described as an example.

FIG. 2 is a perspective view illustrating a structure of a heat sink according to an embodiment of the present invention, and FIG. 3 is a perspective view illustrating a bottom structure of the heat sink shown in FIG.

A heat sink 1 according to an embodiment of the present invention includes a base 10 on one side of which a substrate 15 on which a plurality of LEDs 25 are disposed and a base 10 And a plurality of heat radiation arrays (30, 40, 50, 60)

As shown in FIG. 3, the substrate 15 is provided with a plurality of LEDs 25, which is one example, and the size, type, and arrangement of the LEDs 25 may be varied have. The heat sink 1 according to the present invention is attached to one surface of a substrate 15 to which a plurality of LEDs 25 are attached.

A base 10 is provided on the opposite side of the substrate 15. The base 10 is preferably formed in the same shape as the substrate 15 in terms of heat transfer. 3, the substrate 15 and the base 10 are each provided in a circular thin plate shape. A through hole 20 is formed in the substrate 15 and the base 10. 2 and 3, the through hole 20 is formed in the center of the base 10, but the present invention is not limited thereto.

Although not shown, the substrate 15 and the base 10 may be coupled together by fasteners such as screws, and the surfaces to be joined may be provided with a thermal grease to reduce the thermal resistance. .

The base 10 is provided with a plurality of heat radiation arrays 30, 40, 50, and 60. The heat dissipation arrays 30, 40, 50 and 60 are provided on the other surface of the base 10, that is, opposite to the surface on which the substrate 15 is in contact, do. As shown in FIG. 2, the plurality of heat dissipation arrays 30, 40, 50, and 60 are stacked on the other surface of the base 10.

The plurality of heat dissipation fins 31, 41, 51, and 61 provided along the circumferential direction of the base 10 are connected to the heat dissipation arrays 30, 40, , 60). The radiating fins 31, 41, 51 and 61 are bar-shaped extending in a direction orthogonal to the base 10, and the radiating fins 31, 41, 51 and 61 having a rectangular cross-section are shown in Fig.

The heat dissipation arrays 30, 40, 50 and 60 are formed of a plurality of heat dissipation fins 31, 41, 51 and 61, So that one heat radiation array is enclosed by the other heat radiation arrays adjacent to each other or surrounded by other heat radiation arrays adjacent to each other. That is, the heat radiation arrays located at positions relatively far from the center of the base 10 are surrounded by the neighboring heat radiation arrays.

In this embodiment, the plurality of heat-radiating fins 31, 41, 51, and 61 constituting the heat-radiating arrays 30, 40, 50, and 60 are provided in the circumferential direction with respect to the center of the base 10, But a plurality of radiating fins 31, 41, 51, and 61 may be arranged to form various polygonal shapes.

In this embodiment, the heat radiating arrays 30, 40, 50, and 60 are composed of four heat radiating arrays, that is, the first heat radiating arrays to the fourth heat radiating arrays 30, 40, For convenience of explanation, the outermost heat radiation array will be referred to as a first heat radiation array 30, and the innermost heat radiation array will be referred to as a fourth heat radiation array 60. [ Of course, the heat dissipation array may be constituted by the first heat dissipation array 30 and the second heat dissipation array 40, the first heat dissipation array to the third heat dissipation arrays 30, 40 and 50, Array.

At this time, the heat radiation fins constituting the adjacent heat radiation arrays are provided so as to be offset from each other. As best shown in FIGS. 4 and 5, the heat radiation fins of the adjacent heat radiation arrays are not arranged in a certain direction toward the center of the base 10 but are staggered from each other.

That is, a virtual extension line connecting the center of the base 10 with the first radiating fins 31 constituting the first radiating array 30 is formed by the second radiating fins 41 constituting the second radiating array 40 And the imaginary extension line connecting the centers of the base 10 and the base 10.

Accordingly, air, which is a cooling fluid flowing into the center of the base 10 through the radiating arrays 30, 40, 50, and 60, can be evenly exchanged with more radiating fins. That is, a part of the air introduced from the outside comes into contact with the first radiating fins 31 of the first radiating array 30 provided at the outermost side to perform heat exchange, and the remaining part of the air contacts the first radiating fins 31 So that heat exchange is performed.

Accordingly, the air whose temperature has not yet risen by the first radiating fins 31 can be brought into contact with the second radiating fins 41 to raise the temperature. This is because the more the radiating fins, especially the relatively located inside the base 10 The radiating fins also actively exchange heat with the air as the cooling fluid, thereby improving the heat transfer performance.

As shown in FIG. 5, the second radiating fins 41 are located between the first radiating fins 31. At this time, the second radiating fins 41 may be provided at exactly half the distance between the two first radiating fins 31. In this case, the length of A in Fig.

The third radiating fins 51 are again positioned between the second radiating fins 41 and the fourth radiating fins 61 are positioned between the third radiating fins 51 as well.

Accordingly, the air flowing through the first heat radiation array 30 flows while interfering with the second heat radiation array through the fourth heat radiation arrays 40, 50, 60 so as to reach the center of the base 10, Active heat exchange is performed.

6 shows a second embodiment of the heat sink 1 according to the present invention. As shown in FIG. 6, the heat dissipation array includes the first heat dissipation array to the third heat dissipation array 30, . In this case, the second radiating fins 41 constituting the second radiating array 40 are provided between the first radiating fins 31 constituting the first radiating array 30. The third radiating fins 51 constituting the third radiating array 50 are located between the second radiating fins 41.

7 shows a third embodiment of the heat sink 1 according to the present invention. As shown in FIG. 7, the first heat radiating array 30, the second heat radiating array 30, the second heat radiating array 30, And the fourth radiating fins 31, 41, 51, and 61 may be spaced apart from each other by a predetermined distance.

That is, with reference to a virtual extension line connecting the center of the base 10 and the first radiating fins 31 forming the outermost first radiating array 30, Each of the radiating fins constituting the array is spaced apart from the virtual extension line by a predetermined distance.

5, the first radiating fins 31 and the third radiating fins 51 and the second radiating fins 41 and the fourth radiating fins 61 are provided at positions where they coincide with each other, The imaginary extension lines connecting the centers of the first to fourth radiating fins 31, 41, 51, and 61 with the center of the base 10 do not coincide with each other but are formed differently. That is, in the embodiment shown in FIG. 7, the first to fourth radiating fins 31, 41, 51, and 61 are staggered from each other.

Alternatively, the first to fourth heat radiation arrays 30, 40, 50, and 60 may have different numbers of heat dissipation fins and may have a staggered structure.

8 shows a fourth embodiment of the heat sink 1 according to the present invention. At least one of the heat radiating fins constituting the plurality of heat radiating arrays 30, 40, 50, and 60 has a cross- And may be formed in a triangular shape. In Fig. 8, the second radiating fins 41, the third radiating fins 51, and the fourth radiating fins 61 are shown to have a triangular cross-section.

More precisely, the radiating fin is formed to have a triangular prism shape, and is provided so that one vertex of a triangle is positioned in a direction toward the outside from the center of the base 10. Accordingly, the air introduced from the outside comes into contact with both outer surfaces 45 of the outer surface of the triangular pillar centered on the vertexes, so that at the initial stage of the inflow of air, Can be contacted. Preferably, the radiating fin has an isosceles triangular-shaped cross-section so as to widen the contact area with air.

Of course, the radiating fins do not necessarily need to have a triangular cross-section, but may be formed so as to have a smaller cross-sectional area in the direction toward the outside from the center of the base 10. That is, the outer surface of the radiating fin may have a curved surface.

In addition, since the radiating fin has a shape as shown in Fig. 8, the air can flow more smoothly toward the center of the base 10. [ That is, since the area of the air, which is the cooling fluid, initially contacts with the radiating fin is reduced, the resistance is relatively reduced, and thus the airflow can be smoothly performed.

9 shows a fifth embodiment of the heat sink 1 according to the present invention. As described above, the heat dissipation fins constituting the plurality of heat dissipation arrays are formed so that their heights become lower toward the center of the base 10. That is, the first radiating fins 31 constituting the first radiating array 30 are formed to be longer than the second radiating fins 41 constituting the second radiating array 40, and the second radiating fins 41 The third radiating fins 51 and the third radiating fins 51 are formed longer than the fourth radiating fins 61.

Thus, since the height of the heat dissipation fin decreases from the first heat dissipation array 30 to the fourth heat dissipation array 60, the heat dissipation fin at the central portion of the base 10, which is relatively less heat-transferable, It is possible to increase the heat transfer area in direct contact with the cooling fluid by raising the heat radiating fins at the outer edge or edge of the base 10 having a high thermal conductivity.

Therefore, the flow rate to the heat sink 1 according to the fifth embodiment of the present invention can be increased more than two times, and as a result, the heat radiation performance can be improved.

More specifically, the radiating fins of the first to fourth radiating arrays 30, 40, 50, and 60 have the first radiating fins 31 at the outermost radiating fins formed along the radial direction of the base 10, It is possible to increase the area in contact with the initial cooling fluid which is not yet heat-transferred, and to increase the inflow flow rate of the unheated cooling fluid. That is, by making the height of the first radiating fins 31 at the edge side the largest, it is possible to increase the flow rate of the cooling fluid that flows first without being heated.

9, each of the heat radiating fins 31, 41, 51, and 61 of the first heat radiating array to the fourth heat radiating array 30, 40, 50, and 60 may constitute a neighboring heat radiating array So that heat transfer performance is improved through active heat exchange.

Fig. 10 shows a sixth embodiment of the heat sink 1 according to the present invention. As described above, the heat dissipation fins constituting the plurality of heat dissipation arrays are formed to have a height higher toward the center of the base 10. That is, the first radiating fins 31 constituting the first radiating array 30 are formed to be shorter than the second radiating fins 41 constituting the second radiating array 40, and the second radiating fins 41 The third radiating fins 51 are formed shorter than the third radiating fins 51 and the third radiating fins 51 are formed shorter than the fourth radiating fins 61.

Thus, the height of the radiating fin increases from the first radiating array 30 toward the fourth radiating array 60, so that the area of contact between the radiating fin and the cooling fluid heated by the central portion of the base 10 And uniform heat transfer to the heat sink 1 can be achieved.

At this time, the cooling fluid first making contact with the first radiating fins 31 of the first radiating array 30 at the edge first comes into contact with the second radiating fins 41 relatively located on the inner side. That is, the portion of the entire height of the second radiating fins 41, which is higher than the first radiating fins 31, first comes into contact with the unheated cooling fluid. Likewise, a portion of the entire height of the third radiating fin 51 located at the center than the second radiating fins 41 also comes into contact with the unheated cooling fluid for the first time.

As described above, the second to fourth radiating fins (41) to (61) are first brought into contact with the unheated cooling fluid at a portion formed higher than other neighboring radiating fins, so that the heat radiation performance can be improved and the cooling flow rate can be increased.

10, each of the heat radiation fins 31, 41, 51, and 61 of the first heat radiation array to the fourth heat radiation arrays 30, 40, 50, and 60 may constitute a neighboring heat radiation array So that heat transfer performance is improved through active heat exchange.

Hereinafter, numerical analysis results of the heat sink 1 according to the present invention will be described. In the numerical analysis, the heat sink 1 according to the embodiment of the present invention and the heat sink according to the related art, that is, the heat radiating fins (not shown) are arranged in a single direction without being staggered, Were compared. 11 is a numerical analysis result of a conventional heat sink, and the lower graph of FIG. 11 is a numerical analysis result of the heat sink 1 according to an embodiment of the present invention shown in FIG. 2, And the temperature distribution on the horizontal plane. In Fig. 11, the red portion indicates a high temperature and the blue portion indicates a low temperature.

The shape and operating conditions of the heat sink 1 according to an embodiment of the present invention are as follows. _{N A = 20, L L =} 40 mm, L M = 20 mm, L F = 4 mm, L S = 5 mm, R o = 90 mm, R i = 10 mm, H = 40mm, t = 3 mm, outside temperature = 30 ° C, the heat flux = 1000 W / m ^2, emissivity = 0.9, the shape of the conventional heat sink is N _a = 20, L _L = 40 mm, L _m = 20 mm, L _F = 4 mm, L _S = 5 mm, R _o = 90 mm, R _i = 10 mm, H = 40 mm, t = 3. Wherein, N _A is the number of each radiating fin array, L _L is the distance between the end of the fourth radiating array 60 from one end of the first heat radiating array 30, L _M is from one end of the first heat radiating array 30 a second distance between the ends of the radiating array (40), L _F is the length of the radiating fin, Ls is the distance, R _o is the radius, R _i of the base 10 between neighboring heat dissipating fins is formed in the center of the base 10 H is the height of the radiating fin, and t is the thickness of the radiating fin.

FIG. 11 shows the temperature distribution on a plane surface and a plane surface perpendicular to the ground, as a result of numerical analysis for an existing model and an improved model. In comparison, it can be seen that the temperature of the center portion of the base 10 is significantly lower than that of the conventional heat sink in the case of the heat sink 1 according to the present invention, and the temperature distribution is uniform throughout the whole section .

In the case of the conventional heat sink 1, the temperature of the central portion of the base 10 is approximately 49.4 캜, whereas in the case of the heat sink 1 according to the present invention, the average temperature is approximately 46.7 캜, Lt; 0 > C. The exact numerical result data is shown in [Table 1] below.

Heat transfer area (mm ² ) Average temperature (℃) Weight (kg) Conventional technology 5191 49.4 0.401 Invention of the present invention 5191 46.7 0.401

As shown in Table 1, the heat sink according to the prior art and the heat sink 1 according to the present invention have the same mass as the heat transfer area, but have a result of lowering the average temperature through the structure change of the heat radiation array It comes.

This result is caused by the fact that the heat transfer amount is increased while the second to fourth radiating fins 41, 51, and 61 flow through the first radiating fins 31 and perform heat exchange with the air that has not yet been heated.

FIG. 12 is a graph showing a comparison between the heat sinks according to the related art and the heat transfer coefficients of the heat radiating arrays according to an embodiment of the present invention shown in FIG. As can be seen from the above, the heat transfer coefficient of the first heat radiation array 30 is not significantly different between the prior art and the present invention, but the heat transfer performance of the second heat radiation array 40 is improved by about 35% It can be confirmed that the heat radiation array 50 and the fourth heat radiation array 60 are somewhat improved.

In the case of the present invention, heat exchange is actively performed not only in the first heat radiation array 30 but also in the relatively inner second heat radiation array 40, thereby improving the heat transfer performance.

Next, Table 2 below compares the fifth embodiment of the present invention shown in Fig. 9 and the sixth embodiment of the present invention shown in Fig. 10 with other embodiments. More precisely, A-1 shows the embodiment shown in Fig. 9, and A-2 shows a structure in which the radiating fins are not staggered although the radiating fins vary in height as in the embodiment of Fig. B-1 shows the embodiment shown in Fig. 10, and B-2 shows a structure in which the radiating fins are not staggered although the radiating fins vary in height as in the embodiment of Fig.

Heat transfer area (mm2) Average temperature (℃) Weight (kg) A-1 (Example of Fig. 9) 5511 44.5 0.417 A-2 5511 46.4 0.417 B-1 (Example of Fig. 10) 4871 49.03 0.384 B-2 4871 51.7 0.384

As shown in Table 2, when the heat dissipation fins are arranged at different heights, the heat sink 1 has a lower average temperature.

Finally, in order to verify the validity of the numerical analysis result of FIG. 11, an apparatus for testing the performance of the heat sink 1 according to an embodiment of the present invention shown in FIG. 2 was made and an experiment was conducted. The numerical analysis results of FIG.

As shown in FIG. 13, the material of the tested circular heat sink 1 is aluminum 6061, the shape of the experimental model is a disk shape, the number N _a of the radiating fin arrays is 25, The distance L _L to the distal end of the heat dissipation array 60 is 40 mm and the distance L _M from the one end of the first heat dissipating array 30 to the distal end of the second heat dissipating array 40 is 40 mm and the length of the heat dissipating fin L _F = mm, the distance between neighboring radiating fins L _S = 5 mm, the radius of the base 10 R _O = 90 mm, the radius R _I of the through hole 20 = 10 mm, the height H of the radiating fin H = 40 mm, t = 3 mm.

The experimental apparatus includes a film heater 70, a circular heat sink 1, a heat insulator 72, a thermocouple 74, a data collecting device 76, a computer 75, a power supply 79 and a wattage meter 78 And the like. The experimental apparatus can insert a thin aluminum plate (not shown) of about 1 mm on the upper surface and the lower surface of the film heater 70 to transmit a uniform heat flow rate to the heat sink for illumination 1.

In addition, thermal grease can be applied to each contact surface to minimize contact thermal resistance. An acrylic plate having a thickness of about 5 mm (heat flux of 0.2 W / m 占 폚) may be provided under the film heater 70 in order to calculate the heat loss exiting downward of the film heater 70.

Referring to FIG. 14, it can be seen that the results of the numerical analysis (solid line graph) and the experimental results (square display) agree very well because the numerical analysis model uses natural convection, (1) is accurately simulated. As a result, it is possible to accurately confirm that the heat dissipation performance can be improved by performing heat exchange evenly with the cooling fluid through the structure change of the heat dissipation array as in the present invention.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the scope of the present invention but to limit the scope of the technical idea of the present invention. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Although the heat sink 1 for radiating the illumination of the LED 25 is taken as an example in the above embodiment, the present invention can also be applied to various electronic components generating heat such as general lighting, CPU, GPU, resistance and the like.

10: Base 20: Through hole
30: first heat radiation array 40: second heat radiation array
50: Third heat dissipation array 60: Fourth heat dissipation array

Claims (10)

A base on which an electronic component is mounted,
And a plurality of heat radiating arrays provided on the other surface of the base and disposed around the center of the base,
The plurality of heat dissipation arrays are each composed of a plurality of heat dissipation fins,
The heat radiation arrays located at positions relatively far from the center of the base are disposed around the neighboring inner heat radiation arrays,
Wherein the heat radiation fins constituting the heat radiation arrays adjacent to each other are not arranged in a certain direction toward the center of the base but are staggered from each other.
The heat sink as set forth in claim 1, wherein the plurality of heat dissipation arrays are formed to surround the other surfaces of the base with different radii with respect to the center of the base.
The apparatus of claim 1 or 2, wherein the plurality of heat dissipation arrays are formed of a first heat dissipation array to a fourth heat dissipation array having radially different radii with respect to a center of the base, Heatsink.
The heat sink according to claim 3, wherein the first to fourth heat dissipation arrays are formed of different numbers of heat dissipating fins.
The radiating fin as claimed in claim 1, wherein a radiating fin constituting the radiating array toward the center of the base is formed to extend from the imaginary extension line toward the center of the base with a virtual extension line connecting the center of the base and the radiating fins constituting the outermost radiating array The heat sink is installed spaced apart by an interval.
The heat dissipation device according to claim 3, wherein the first heat dissipation array and the third heat dissipation array are arranged in a predetermined direction toward the center of the base, and the second heat dissipation array and the fourth heat dissipation array are arranged in a predetermined direction toward the center of the base .
The heat sink according to claim 1, wherein at least one of the heat radiating fins is formed so that a cross-sectional area of the heat radiating fins decreases toward the outer side from the center of the base.
The heat sink as set forth in claim 1, wherein at least one of the heat radiating fins is formed in a triangular prism shape, and one of three corners forming the triangular prism is formed to face outward from the center of the base.
The heat sink as set forth in claim 1, wherein the plurality of heat dissipation arrays are formed to have a height higher toward the center of the base.
The heat sink as set forth in claim 1, wherein the plurality of heat dissipation arrays are formed to have a height lower toward the center of the base.

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