KR101248028B1 - LED lighting device with structure of heat sink having high heat disspation - Google Patents

LED lighting device with structure of heat sink having high heat disspation Download PDF

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KR101248028B1
KR101248028B1 KR1020110077770A KR20110077770A KR101248028B1 KR 101248028 B1 KR101248028 B1 KR 101248028B1 KR 1020110077770 A KR1020110077770 A KR 1020110077770A KR 20110077770 A KR20110077770 A KR 20110077770A KR 101248028 B1 KR101248028 B1 KR 101248028B1
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heat sink
heat dissipation
led lighting
formed
curved
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KR1020110077770A
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Korean (ko)
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KR20130015653A (en
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김용일
최강준
김승완
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(주)솔라루체
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Abstract

The present invention relates to an LED lighting device having a heat sink maximizing heat dissipation performance. The present invention, the LED lighting body in which the LED element connected to the PCB substrate is mounted, and in the direction from the outer circumferential surface of the housing is formed to extend to surround the outside of the light emitting direction of the LED element, the curvature on the horizontal plane and vertical plane The plurality of curved fins includes a main heat dissipation unit is arranged at equal intervals.

Description

Maximizing Heat Dissipation Performance LED lighting device with structure of heat sink having high heat disspation

The present invention relates to an LED lighting device having a heat sink maximizing heat dissipation performance, and more specifically, to maximize the contact area with air by arranging the maximum number of the plurality of heat dissipation fins in a minimum space, the heat dissipation fins and the overall structure The present invention relates to an LED lighting device having a maximized heat sink structure for improving the heat dissipation effect by not only curved but also effectively disposing a space between the heat dissipation fins.

In general, cooling of high power light sources, for example high power light sources including light emitting diodes (LEDs) assembled in a small area and having a high power density is desirable, but such cooling is difficult to achieve.

Moreover, when the effective area is small, it is necessary to efficiently use the effective space between other functional parts of the lighting apparatus, for example, other functional parts such as a housing, an optical element, a driver substrate, and the like.

In addition, user-friendly thermal management is required with respect to noise or the flow of hot air.

In order to achieve these contradictory goals, LED lighting devices utilize heat sinks that arrange LEDs in a relatively large area and simultaneously perform heat dissipation.

Heat sinks are divided into passive and active. Passives typically provide relatively wide spaced cooling fins that are arranged around or under the light source and form air flow channels extending from the bottom to the top to allow for natural convection. Thus, typically, the exhaust port of hot air is placed around the fins such that the tail of the exhausted hot air is directed in the opposite direction to the direction of gravity.

In the case of the active type, it means a method of forcing air flow through a submount substrate to the heat sink side that is thermally connected to a high temperature light source.

For both active and passive types, there is a continuing need for technology development to perform more efficient heat dissipation through the structural design of heat sinks.

[Related Technical Literature]

1. Lighting system with heat sink and heat sink (Patent application number: 10-2007-0098010)

2. Heat sink and heat sink formation method (Patent Application No .: 10-2010-7016840)

In order to solve this problem, the present invention maximizes the contact area with air by arranging the maximum number of the plurality of heat sink fins in the minimum space, and not only curves the heat sink fins and the overall structure, but also efficiently arranges the spacing between the heat sink fins, It is to provide an LED lighting device having a heat sink structure to maximize heat dissipation performance to improve performance.

In addition, the present invention is to provide an LED lighting device having a heat dissipation performance maximizing heat sink structure to perform a stepwise heat dissipation in a multi-stage structure of the main heat dissipation unit, the auxiliary heat dissipation unit.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an exemplary embodiment of the present invention surrounds an LED lighting body in which an LED element connected to a PCB board is mounted, and an outside of a light emitting direction of the LED element. And a main heat dissipation unit in which a plurality of curved pins having different curvatures on the horizontal plane and the vertical plane are arranged at equal intervals in a direction from the outer circumferential surface of the housing to extend so as to be outward.

Here, the housing is preferably formed in a cylindrical shape with an upper surface opened.

In addition, it is preferable that the curved fins provide a heat dissipation surface by a vertical plate shape whose horizontal length increases toward the front end of the main heat dissipation portion.

In addition, the curved fin is preferably formed by the heat dissipation surface is curved to the first curvature (Curvature1) on the plane, the curved surface of the wave pattern inclined at a predetermined angle (α) on the vertical plane.

In addition, the wave pattern is formed in the shape of a curve having a second curvature (Curvature2) on the vertical plane, the second curvature may be changed along the shape of the curve.

In addition, the interval on the horizontal plane between the curved pin is preferably formed to be spaced apart more than the length (D1) corresponding to the thickness on the horizontal surface of the curved pin.

The LED lighting apparatus having the heat dissipation maximizing heat sink structure further includes at least one circular pin formed of a plurality of circular fins connecting the curved fins.

In addition, when the circular pin is two or more, the interval between the circular pin is preferably formed at equal intervals.

In addition, the curved pin is formed is a corner is curved, it is preferable that the protruding degree is formed to decrease toward the outside.

The LED lighting apparatus having the heat dissipation maximizing heat sink structure further includes an auxiliary heat dissipating unit formed between the LED lighting main body and the main heat dissipating unit.

In addition, it is preferable that a plurality of plate-shaped heat dissipation fins having a vertical plane angled by a predetermined angle in a linear direction toward the outside from the outer circumferential surface of the auxiliary heat dissipation unit are formed to be collected.

In addition, the heat dissipation fins of the auxiliary heat dissipation unit are preferably formed to be spaced apart from each other at equal intervals.

In addition, the heat dissipation fin of the auxiliary heat dissipation portion is formed with a curved corner, it is preferable that the degree of protrusion is formed to decrease toward the outside.

In addition, the LED lighting body is formed in a shape that increases as the diameter of the cylindrical or cylindrical toward the bottom, it is preferable that the corner of the top is formed in a curve.

In addition, the curved pin is preferably formed by branching into two curves each having a direction opposite to that of the curve having the first curvature.

In addition, it is preferable to form a plurality of rhombus-shaped patterns by staggering opposite directions among the branched curved pins.

In addition, the circular pin may be selectively formed to connect the upper surface of the curved pin or penetrate the lower end of the curved pin.

In addition, the curved pin may be formed in a form in which the central portion of all four sides of the rhombus shape is partially removed.

In addition, the curved pin may be formed by increasing or decreasing the angle on the horizontal plane toward the outside from the outer peripheral surface of the housing.

In addition, the curved pin may have a different length depending on the degree of inclination toward the housing.

In addition, the curved pin is characterized in that the two or more different wave patterns are gathered to form one.

In addition, the curved pin is preferably formed by joining two opposite curved lines to the center on the horizontal plane.

In addition, the curved pin is preferably formed by joining a curve having two opposite curvature on the vertical plane.

In addition, the curved pin includes a first wave line L1 and a second wave line L2 having different directions on a horizontal plane, and the first wave line L1 is formed in the housing, and the second wave line ( It is preferable that L2) starts at the outermost end of the main heat dissipation unit and is joined to an end at a central portion on a horizontal plane of each other.

The curved fin may be spaced apart from the second wave line L2 on a circumference of the outermost end of the main heat dissipation unit, and has a direction that is symmetrical to the wave direction of the second wave line L2. It is preferable to form in the form which cut | disconnected 2 wave line L2.

In addition, the curved pin preferably further comprises at least one auxiliary pin (S) facing vertically on the formed horizontal plane.

LED lighting device having a heat sink structure maximized heat dissipation performance according to an embodiment of the present invention, by maximizing the number of the plurality of heat dissipation fins in a minimum space to maximize the contact area with the air, and to curve the heat dissipation fins and the overall structure In addition, by efficiently disposing the interval between the radiating fins, it provides the effect of maximizing the heat dissipation performance.

In addition, the LED lighting device having a heat sink maximizing heat dissipation performance according to another embodiment of the present invention, provides the effect of maximizing the heat dissipation performance to perform stepwise heat dissipation in a multi-stage structure of the main heat dissipation unit and the auxiliary heat dissipation unit.

1 is a plan view showing a main heat dissipation unit of an LED lighting apparatus having a heat sink maximizing heat sinking structure according to a first embodiment of the present invention.
2 is a perspective view of a main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to the first embodiment of the present invention.
3 is a side view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the first embodiment of the present invention, and a view for explaining the combination of the LED lighting body and the auxiliary heat dissipation unit.
Figure 4 is a bottom view of the main heat dissipation unit of the LED lighting device having a heat sink maximizing heat sink structure according to the first embodiment of the present invention.
5 is a view for explaining the effect according to the structural features used in the LED lighting apparatus having a heat sink structure according to the first embodiment of the present invention.
6 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a second embodiment of the present invention.
7 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximized heat dissipation performance according to a third embodiment of the present invention.
8 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximized heat dissipation performance according to a fourth embodiment of the present invention.
9 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a fifth embodiment of the present invention.
10 is a view showing a main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a sixth embodiment of the present invention.
11 is a view showing a main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a seventh embodiment of the present invention.
12 is a view showing a main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an eighth embodiment of the present invention.
13 is a view showing a main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a ninth embodiment of the present invention.
14 is a view showing a main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the tenth embodiment of the present invention.
15 is a view showing a heat radiation performance simulation results for the main heat radiation of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the first embodiment of the present invention.
16 is a view showing a heat radiation performance simulation results according to the combined structure of the auxiliary heat dissipation unit and the main heat dissipation unit in the LED lighting device having a heat sink maximizing heat sink structure according to the first embodiment of the present invention.
FIG. 17 is a diagram illustrating a sills result of a conventional heat sink for comparison with a heat dissipation performance simulation result for an LED lighting device having a heat dissipation maximizing heat sink structure according to a first embodiment of the present invention.
18 is a view showing a heat radiation performance experiment simulation results for the main heat dissipation unit according to the second to tenth embodiments of FIGS. 6 to 14.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1 is a view showing a plan view of the main heat dissipation unit 10 of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the first embodiment of the present invention. 2 is a perspective view of a main heat dissipation unit 10 of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the first embodiment of the present invention. 3 is a side view (a) of the main heat dissipation unit 10 of the LED lighting apparatus having a heat sink maximizing heat dissipation structure according to the first embodiment of the present invention, and the LED light main body 20 and the auxiliary heat dissipation unit 30. Figures (b, c) for explaining the coupling state with. 4 is a bottom view of the main heat dissipation unit 10 of the LED lighting apparatus having the heat dissipation maximization heat sink structure according to the first embodiment of the present invention.

1 to 4, in the LED lighting apparatus which forms the heat sink by the main heat dissipation unit 10 and the auxiliary heat dissipation unit 30, the main heat dissipation unit 10 has a cylindrical housing having an open top surface. On the outer circumferential surface of 11), a plurality of curved pins 12 are arranged at equal intervals.

Each curved pin 12 is formed in a plate shape in which the horizontal length increases from the rear end of the main heat dissipation portion 10 toward the front end. On the other hand, the heat dissipation surface provided by the plate shape is formed curved in the first curvature (Curvature1) on the plane.

In addition, the curved pin 12 is formed as a curved surface of the wave pattern inclined at a predetermined angle (α) as a whole on the vertical plane as shown in Figure 2 (b), where the curve of the second curvature (Curvature2) formed on the vertical plane Directionality changes as shown.

Here, the spacing between the plurality of curved pins 12 described above is preferably spaced apart by more than the length (D1) corresponding to the thickness of each curved pin 12 for the thermal convection phenomenon.

On the other hand, a plurality of circular fins 13 of the main heat dissipation unit 10 is formed of circular fins connecting the upper surfaces of the curved fins 12.

As shown, the circular pin 13 may be formed of four arranged at equal intervals D2, but the number is variable. Here, the spacing between the circular pins 13 is preferably formed of at least two of the thickness of the circular pins 13.

It looks at the LED lighting body 20 directly coupled to the main heat dissipation unit 10 or through the auxiliary heat dissipation unit 30.

The LED lighting body 20 is formed in a shape in which the diameter of the cylinder or cylinder increases toward the front end, the PCB substrate, and the LED element connected to the PCB substrate is mounted therein. As shown in the LED lighting body 10, the upper edge is formed in a curved line.

More specifically, the LED lighting body 10 is a heat generating part, similar to a bell shape, and forms at least one curvature part in a direction from the center to the outside.

As a last component, the auxiliary heat dissipation unit 30 is formed in a cylindrical shape extending from the LED light main body 20 at the front end of the LED light main body 20, and partially transmits heat transferred to the main heat dissipating unit 30. Is configured to emit.

The auxiliary heat dissipation unit 30 includes an auxiliary heat dissipation fin part 32 formed by gathering a plurality of auxiliary heat dissipation fins 31 arranged on the outer circumferential surface of the cylindrical shape.

Each of the auxiliary heat dissipation fins 31 constituting the auxiliary heat dissipation fins 32 is formed in a rectangular plate shape in which a vertical plane forms an angle by a predetermined angle in a linear direction facing outward from a cylindrical outer circumferential surface.

The edge of the auxiliary heat dissipation fin 31 is formed to be curved, so that the degree of protrusion decreases toward the outside.

As a result, the heat diffusion is not limited to the edges of the auxiliary heat dissipation fins 31, but provides the effect of being evenly distributed.

The main heat dissipation unit 10 that receives heat from the LED lighting body 10 and receives the remaining heat through the auxiliary heat dissipation unit 31 receives heat in a reduced state through primary heat dissipation in the auxiliary heat dissipation unit 30. By receiving and discharging to the outside, heat dissipation can be maximized.

5 is a view for explaining the structural features used in the LED lighting apparatus having a heat sink structure according to the first embodiment of the present invention. First, referring to Figure 5 (a), if the conventional heat radiation fins are formed in a straight line, the curved fin 12 according to the present invention is formed by the heat radiation surface is curved to the first curvature (Curvature1) on a horizontal plane.

That is, since each curved pin 12 is formed extending from the center with a curvature toward the outside, the surface spacing between the curved pin 12 is added to the optimized structural features as shown in FIG. The result of improving heat dissipation efficiency is shown.

In other words, in contrast to the conventional heat dissipation fin in FIG. 5 (b) is set to an interval not being a multiple of 2, the interval between the curved fins 12 according to the present invention is composed of two or more intervals of the heat dissipation surface, The convection phenomenon is active so that the hot vortex phenomenon occurs easily.

FIG. 5C is a diagram for explaining the arrangement change of the curved pin 12. The conventional heat dissipation fin on the left side of FIG. 5 (c) is formed in a simple structure that extends in a straight line in a vertical direction from the cylindrical housing to the outside. On the contrary, a curved line forming the curved pin 12 according to the present invention may be formed as an arc, or a circular pin 13 having an arc shape may be added.

At this time, the circular fin 13 may be formed of a circular fin having a larger diameter than the housing 11 of the main heat dissipation unit 10, and causes heat exchange between the curved fins 12.

Figure 5 (d) shows the curvature of the corner, the conventional heat radiation fin is formed in the shape of the corner angled. On the contrary, the auxiliary heat dissipation fin 31 and the curved fin 12 according to the present invention are both formed with curved edges, and the protruding degree is formed to decrease toward the outer portion.

As it is formed in such a curved shape, it provides an effect that the heat diffusion is evenly distributed without being directed to the corner points of the auxiliary heat radiation fin 31 and the curved fin 12. This is because the round shape has good efficiency in terms of heat diffusion.

5 (e) is a conventional lighting body was a form having a corner, LED lighting body 20 according to the present invention is formed in a corner of the upper corner is curved, the corner of the main heat dissipation unit 10 is also formed in a curve At least one curvature from the center toward the outside.

By forming the curvature as described above, it provides an effect that the heat diffusion is evenly distributed without being directed to a point of the corner of the LED lighting body 20 and the main heat dissipation unit 10.

6 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a second embodiment of the present invention. More specifically, Figure 6 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting device having a heat sink maximizing heat sink structure according to the second embodiment of the present invention. Figure 6 (b) is a perspective view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to a second embodiment of the present invention. 6 (c) is a side view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the second embodiment of the present invention. 6 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the second embodiment of the present invention.

Referring to FIG. 6, the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the second embodiment of the present invention is each of the curved fins 12 of the main heat dissipation unit 10 according to the first embodiment. The curve having the first curvature Curvature1, not one curve, is formed by branching into two curves having the same direction and the opposite direction.

Accordingly, the branched curved pins 12 may be formed in a pattern in which a plurality of rhombus shapes appear to cross each other so as to have opposite directions.

In addition, the circular fin 13 of the first embodiment is reduced to one and the position can also be formed in a shape penetrating the lower end of the curved fin 12 at the end of the main heat dissipation unit 10.

7 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a third embodiment of the present invention. More specifically, Figure 7 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the third embodiment of the present invention. Figure 7 (b) is a perspective view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the third embodiment of the present invention. 7 (c) is a side view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximization heat sink structure according to the third embodiment of the present invention. 7 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the third embodiment of the present invention.

1 to 7, the main heat dissipation part of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the third embodiment of the present invention is removed even one circular pin 13 in the second embodiment. Here, the vertical length of the final outer edge of the main heat dissipation portion is formed higher than that of the second embodiment, indicating that the main heat dissipation portion is formed in a cylindrical shape instead of a longitudinal type.

FIG. 8 is a diagram illustrating a main heat dissipation unit of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a fourth embodiment of the present invention. More specifically, Figure 8 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the fourth embodiment of the present invention. 8 (b) is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the fourth embodiment of the present invention. 8 (c) is a side view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the fourth embodiment of the present invention. 8 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the fourth embodiment of the present invention.

1 to 8, the main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to the fourth embodiment of the present invention is a curved fin 12 of the main heat dissipation part 10 according to the second embodiment. In the pattern in which two curves having different directions of) cross and face each other, a plurality of rhombus shapes appear, and all four sides of the rhombus shape are partially removed.

Here, the circular pin 13 can be formed in the same manner as in the second embodiment.

9 is a view showing a main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a fifth embodiment of the present invention. More specifically, Figure 9 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting device having a heat sink maximizing heat sink structure according to the fifth embodiment of the present invention. 9B is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the fifth embodiment of the present invention. 9 (c) is a side view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximization heat sink structure according to the fifth embodiment of the present invention. 9 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the fifth embodiment of the present invention.

1 to 9, the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the fifth embodiment of the present invention is curved pin 12 of the main heat dissipation unit 10 according to the first embodiment. Means that the angle of branching from the cylindrical housing 11 can be formed in a changed pattern. That is, the angle on the branched horizontal plane of the curved pin 12 is formed to be inclined in the direction of the housing 11, it can be formed in a longer curve than in the case of the first embodiment.

FIG. 10 is a diagram illustrating a main heat dissipation unit of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a sixth embodiment of the present invention. More specifically, Figure 10 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the sixth embodiment of the present invention. 10 (b) is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the sixth embodiment of the present invention. 10 (c) is a side view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the sixth embodiment of the present invention. 10 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the sixth embodiment of the present invention.

1 to 10, the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the sixth embodiment of the present invention is curved pin 12 of the main heat dissipation unit 10 according to the first embodiment. The heat dissipation surface of) has a curvature that varies on a plane, and shows a curved variant.

In addition, the curved pin 12 according to the first embodiment is formed as a curved surface of one wave pattern inclined at a predetermined angle α as a whole on the vertical plane as shown in FIG. 2 (b), the curved pin of FIG. 10. 12 is formed of two wave patterns. In one embodiment, it is possible to form two or more wave patterns.

Meanwhile, in the sixth embodiment of FIG. 10, all of the circular pins 13 in the first embodiment are formed to be removed.

FIG. 11 is a view illustrating a main heat dissipation unit of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a seventh embodiment of the present invention. More specifically, Figure 11 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the seventh embodiment of the present invention. FIG. 11B is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the seventh embodiment of the present invention. 11 (c) is a side view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the seventh embodiment of the present invention. FIG. 11D is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the seventh embodiment of the present invention.

1 to 11, the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to the seventh embodiment of the present invention is curved pin 12 of the main heat dissipation unit 10 according to the first embodiment. While the heat dissipation surface of) is formed as one curve on the plane, the curved fin 12 in the seventh embodiment is formed by joining two opposite curvatures to the center on the horizontal plane.

In addition, the curved pin 12 according to the first embodiment is formed as a curved surface of one wave pattern inclined at a predetermined angle (α) as a whole on the vertical plane as shown in FIG. 2 (b), the curved pin of FIG. Denoted at 12 is a curve having two opposite curvatures formed at a central point of the curved pin 12.

Meanwhile, in the seventh embodiment of FIG. 11, all of the circular pins 13 in the first embodiment may be formed to be removed.

FIG. 12 is a view illustrating a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the eighth embodiment of the present invention. More specifically, Figure 12 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to an eighth embodiment of the present invention. 12B is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the eighth embodiment of the present invention. 12 (c) is a side view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the eighth embodiment of the present invention. 12 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the eighth embodiment of the present invention. Unlike the curved fin 12 in the first embodiment, in the eighth embodiment, heat radiation fins are formed by three wave lines, the first wave line L1, the second wave line L2, and the partial curve L3. .

Here, the first wave line L1 and the second wave line L2 have different directions on the horizontal plane, each of which starts at the outermost end of the housing 11 and the main heat dissipation unit 10, and is centered on the horizontal plane of each other. The ends are joined.

Meanwhile, the partial curve L3 is formed at a position spaced apart from the circumference of the outermost end of the main heat dissipation unit 10, like the second wave line L2, and has a direction opposite to the second wave line L2. The second wave line L2 is formed in half.

Thus, the end of the partial curve L3 is joined to the center portion on the horizontal plane of the second wave line L2.

FIG. 13 is a diagram illustrating a main heat dissipation unit of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to a ninth embodiment of the present invention. More specifically, Figure 13 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the ninth embodiment of the present invention. FIG. 13 (b) is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the ninth embodiment of the present invention. FIG. 13C is a side view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the ninth embodiment of the present invention. FIG. 13D is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the ninth embodiment of the present invention.

In the ninth embodiment of FIG. 13, all of the circular pins 13 of the first embodiment except for the innermost one are formed in a removed form.

14 is a view showing a main heat dissipation part of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the tenth embodiment of the present invention. More specifically, Figure 14 (a) is a view showing a plan view of the main heat dissipation unit of the LED lighting apparatus having a heat sink maximizing heat sink structure according to the tenth embodiment of the present invention. 14 (b) is a perspective view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the tenth embodiment of the present invention. 14 (c) is a side view of a main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the tenth embodiment of the present invention. 14 (d) is a bottom view of the main heat dissipation unit of the LED lighting apparatus having the heat dissipation maximizing heat sink structure according to the tenth embodiment of the present invention.

In the tenth embodiment, a modified example in which a plurality of auxiliary pins S vertically directed on the curved pin 12 of the first embodiment is formed.

In addition, in the tenth embodiment, the circular fin 13 of the first embodiment may be reduced to one, and the position may be formed in a shape penetrating the lower end of the fixing fin 12 at the end of the main heat dissipation unit 10.

15 is a view showing a heat radiation performance simulation results for the main heat dissipation unit 10 of the LED lighting device having a heat sink maximizing heat sink structure according to the first embodiment of the present invention.

Maximizing the heat dissipation performance in the main heat dissipation unit 10 except the auxiliary heat dissipation unit 30 In order to confirm only the heat dissipation performance of the heat sink, all unnecessary mechanisms were removed and simulations were performed. Analysis conditions were set as shown in Table 1 below.

Interpretation condition Outside temperature 20 degrees Solve area 216m Heat Source 120 W Outdoor conditions None (natural convection) Heatsink material ALDC12 Heatsink weight 2.2 kg

The results for this are shown in Table 2 below.

Simulation result PCB board 69 degrees Heat Sink Upper Temperature (Power Supply) 65 degrees Lowest temperature in heat sink 58 degrees Temperature difference of heat sink 11 degrees

16 is a view showing a heat radiation performance simulation results in a state in which the auxiliary heat dissipation unit 30 and the main heat dissipation unit 10 are combined in the LED lighting apparatus having the heat dissipation performance maximizing heat sink structure according to the first embodiment of the present invention; to be.

Maximizing the heat dissipation performance including the auxiliary heat dissipation unit 30 and the main heat dissipation unit 10 In order to confirm only the heat dissipation performance of the heat sink, all unnecessary mechanisms were removed and simulation was performed. Analysis conditions were set as in Table 3 above. It was.

Interpretation condition Outside temperature 20 degrees Solve area 216m Heat Source 120 W Outdoor conditions None (natural convection) Heatsink material ALDC12 Heatsink weight 3.1 kg

The results for this are shown in Table 4 below.

Simulation result PCB board 66 degrees Heat Sink Upper Temperature (Power Supply) 58 degrees Lowest temperature in heat sink 53 degrees Temperature difference of heat sink 13 degrees

FIG. 17 is a diagram illustrating a sills result of a conventional heat sink for comparison with a heat dissipation performance simulation result for an LED lighting apparatus having a heat dissipation maximizing heat sink structure according to a first embodiment of the present invention.

In order to confirm only the heat dissipation performance of the conventional heat sink, all unnecessary mechanisms were removed and simulation was performed. Analysis conditions were set as shown in Table 1.

The results are as shown in Table 5 below.

Simulation result PCB board 109 degrees Heat Sink Upper Temperature (Power Supply) 101 degrees Lowest temperature in heat sink 93 degrees Temperature difference of heat sink 16 degrees

As described above, in the case of a heat sink maximizing the heat dissipation performance including only the main heat sink and the main heat dissipation unit 20 according to the present invention, or the main heat dissipation unit 20 and the main heat dissipation unit 30, there is a significant difference in heat dissipation performance. Appeared.

FIG. 18 shows simulation results of a heat radiation performance test for the main heat radiation unit according to the second to tenth embodiments of FIGS. 6 to 14.

More specifically, FIG. 18 (a) shows a simulation result of heat dissipation performance of the main heat dissipation unit according to the second embodiment of FIG. 6, and FIG. 18 (b) shows the main heat dissipation unit according to the third embodiment of FIG. 18 (c) shows a simulation result of the heat radiation performance test for the main heat radiation part according to the fourth embodiment of FIG. 8, and FIG. 18 (d) shows the fifth embodiment of FIG. 9. Fig. 18 (e) shows a simulation result of the heat dissipation performance experiment for the main heat dissipation unit according to the example. 11 illustrates a simulation result of the heat radiation performance of the main heat radiation part according to the seventh embodiment of FIG. 11, and FIG. 18 (g) illustrates a simulation result of the heat radiation performance of the main heat radiation part of the eighth embodiment of FIG. 12. FIG. 18H shows the ninth embodiment of FIG. The heat radiation performance experiment simulation results for the main heat dissipation part are shown, and FIG. 18 (i) shows the heat radiation performance experiment simulation results for the main heat dissipation part according to the tenth embodiment of FIG.

Also in this case, it can be seen that the performance is significantly superior to the heat dissipation performance of the conventional heat sink of FIG.

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: main heat sink 11: housing
12: curved pin 13: round pin
L1: first wave line L2: second wave line
L3: Partial curve S: Auxiliary pin
20: LED lighting body 30: auxiliary radiator
31: auxiliary heat dissipation fin 32: auxiliary heat dissipation fin

Claims (26)

  1. LED lighting body mounted with the LED element connected to the PCB substrate; And
    A main heat dissipation unit in which a plurality of curved pins having different curvatures are arranged at equal intervals on a horizontal plane and a vertical plane in an outward direction from an outer circumferential surface of the housing formed to extend around the light emitting direction of the LED device; Including,
    The curved fin is an LED lighting device having a heat sink maximizing heat sink structure, characterized in that the horizontal length is formed in a vertical plate shape that increases toward the front end of the main heat dissipation unit to provide a heat dissipation surface.
  2. The connector according to claim 1,
    LED lighting device having a heat sink maximizing heat dissipation, characterized in that the upper surface is formed in an open cylindrical shape.
  3. delete
  4. The method according to claim 1, wherein the curved pin,
    The heat dissipation surface of the LED having a heat dissipation performance maximizing heat sink structure, characterized in that the curved surface is formed with a first curvature (Curvature1) on a horizontal plane, the curved surface of the wave pattern inclined at a predetermined angle (α) on the vertical surface Lighting equipment.
  5. The method according to claim 4, wherein the wave pattern,
    The LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed in a curved shape having a second curvature (Curvature2) on the vertical surface, the second curvature is changed along the curved shape.
  6. The method according to claim 5,
    The interval on the horizontal plane between the curved pins,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed spaced apart by a length (D1) or more corresponding to the thickness on the horizontal surface of the curved pin.
  7. The method according to claim 1,
    At least one circular pin formed of at least one circular pin connecting the curved pins; LED lighting device having a heat sink maximized heat dissipation performance, characterized in that it further comprises.
  8. The method of claim 7,
    When the circular fin is two or more, the interval between the circular pin is an LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed at equal intervals.
  9. The method according to claim 1, wherein the curved pin,
    The corner is curved is formed, the LED lighting device having a heat sink maximizing heat sink structure, characterized in that the degree of protrusion is formed to decrease toward the outside.
  10. The method according to claim 1,
    An auxiliary heat dissipation unit formed between the LED lighting body and the main heat dissipation unit; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it further comprises.
  11. The method according to claim 10, wherein the auxiliary heat dissipation unit,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that a plurality of plate-shaped heat dissipation fins forming a vertical angle as a predetermined angle in a linear direction from the outer peripheral surface to the outside.
  12. The heat dissipation fin of claim 11, wherein
    LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that is formed spaced apart from each other at equal intervals.
  13. The heat dissipation fin of claim 11, wherein
    The corner is curved is formed, the LED lighting device having a heat sink maximizing heat sink structure, characterized in that the degree of protrusion is formed to decrease toward the outside.
  14. The method according to claim 1, wherein the LED lighting body,
    The diameter of the cylindrical or cylindrical is formed in a shape that increases toward the bottom, LED lighting device having a heat sink maximizing heat sink structure, characterized in that the upper edge is formed in a curve.
  15. The method according to claim 4, wherein the curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that each branch is formed into two curves having a direction opposite to the one having the same curvature and the first curvature.
  16. The method according to claim 15,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that to form a plurality of rhombus-shaped patterns by crossing the opposite direction of the branched curved pins.
  17. The method according to claim 7, wherein the circular pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed by connecting the upper surface of the curved fin or through the lower end of the curved fin.
  18. The method according to claim 16, The curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that the central portion of all four sides of the rhombus shape is formed in a partially removed form.
  19. The method according to claim 1, wherein the curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that the angle formed on the horizontal plane toward the outside from the outer peripheral surface of the housing is increased or decreased.
  20. The method of claim 19, wherein the curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that the length is formed differently depending on the degree of inclination toward the housing.
  21. The method according to claim 4, wherein the curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that the two or more different wave patterns are formed in one.
  22. The method according to claim 4, wherein the curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that the curve having two opposite curvatures are joined to the center on the horizontal plane.
  23. The method of claim 22, wherein the curved pin,
    LED lighting device having a heat sink maximizing heat sink structure, characterized in that the curve is formed by joining two opposite curvature on the vertical plane.
  24. The method according to claim 1, wherein the curved pin,
    A first wave line L1 and a second wave line L2 having different directions on a horizontal plane; Including,
    The first wave line (L1) in the housing, the second wave line (L2) starting from the outermost end of the main heat dissipation portion, respectively, the end is joined to the central portion on the horizontal plane of each other maximize LED lighting device having a heat sink structure.
  25. delete
  26. The method according to claim 1, wherein the curved pin,
    At least one auxiliary pin (S) facing vertically on a horizontal plane formed; LED lighting device having a heat sink maximized heat dissipation performance, characterized in that it further comprises.
KR1020110077770A 2011-08-04 2011-08-04 LED lighting device with structure of heat sink having high heat disspation KR101248028B1 (en)

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Publication number Priority date Publication date Assignee Title
KR101636867B1 (en) * 2013-12-26 2016-07-06 인지전기공업 주식회사 Radiating Structure For Lighting Equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100059989A (en) * 2007-09-21 2010-06-04 쿠퍼 테크놀로지스 컴파니 Light emitting diode recessed light fixture
KR20110022073A (en) * 2008-06-24 2011-03-04 이데미쓰 고산 가부시키가이샤 Housing for lighting device and lighting device equipped with same
KR200453263Y1 (en) * 2010-08-27 2011-04-20 권송이 LED luminaires with improved heat dissipation efficiency
KR20110062493A (en) * 2009-12-03 2011-06-10 임채호 Heat sink of light emitting diode lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100059989A (en) * 2007-09-21 2010-06-04 쿠퍼 테크놀로지스 컴파니 Light emitting diode recessed light fixture
KR20110022073A (en) * 2008-06-24 2011-03-04 이데미쓰 고산 가부시키가이샤 Housing for lighting device and lighting device equipped with same
KR20110062493A (en) * 2009-12-03 2011-06-10 임채호 Heat sink of light emitting diode lamp
KR200453263Y1 (en) * 2010-08-27 2011-04-20 권송이 LED luminaires with improved heat dissipation efficiency

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