KR101735548B1 - Radiator with hollow cylinder type structure and lighting equipment comprising the same - Google Patents

Radiator with hollow cylinder type structure and lighting equipment comprising the same Download PDF

Info

Publication number
KR101735548B1
KR101735548B1 KR1020150067633A KR20150067633A KR101735548B1 KR 101735548 B1 KR101735548 B1 KR 101735548B1 KR 1020150067633 A KR1020150067633 A KR 1020150067633A KR 20150067633 A KR20150067633 A KR 20150067633A KR 101735548 B1 KR101735548 B1 KR 101735548B1
Authority
KR
South Korea
Prior art keywords
heat sink
heat
base
heat dissipation
cylindrical structure
Prior art date
Application number
KR1020150067633A
Other languages
Korean (ko)
Other versions
KR20160134133A (en
Inventor
이관수
박승재
장대석
Original Assignee
한양대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한양대학교 산학협력단 filed Critical 한양대학교 산학협력단
Priority to KR1020150067633A priority Critical patent/KR101735548B1/en
Publication of KR20160134133A publication Critical patent/KR20160134133A/en
Application granted granted Critical
Publication of KR101735548B1 publication Critical patent/KR101735548B1/en

Links

Images

Classifications

    • F21V29/004—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

Abstract

A heat dissipating device using a cylindrical structure according to an embodiment of the present invention includes a heat sink formed in a circular plate shape and having a base on which a heating element is disposed; And a cylindrical structure coupled to an upper surface of the heat sink to reduce the area of the air inflow path to the heat sink to increase a flow velocity of the inflow air.

Description

TECHNICAL FIELD [0001] The present invention relates to a heat dissipating device using a cylindrical structure, and a lighting device including the same. BACKGROUND ART < RTI ID = 0.0 >

Embodiments of the present invention relate to a heat dissipating device using a cylindrical structure and a lighting device including the same.

An LED is a light emitting diode device that generates a light having a characteristic wavelength by applying a forward voltage to a P-N junction structure of a semiconductor. The emission of LED is energy efficient because the energy of electrons in P-N junction is directly converted into light energy, and the lifetime is also considerably long.

However, in this process, 60% of the power consumption is divergent to heat, and dissipating this heat is an important issue in LED design. The reason is that the larger the heat generation is, the higher the temperature of the junction becomes, and therefore the allowable current decreases and the light output decreases. Also, the lifetime is reduced when exposed to a high temperature for a long time. Therefore, it is necessary to provide a sufficient heat dissipation system for the LED lighting to ensure the reliability of the LED.

The circular heat sink uses natural convection, which is characterized by its low density when the air temperature rises. The overall shape of the cooling air flow is that air is introduced from the outside of the heat sink and heated by the heat sink. Because the heated air is less dense than the ambient air, it becomes lighter than ambient air and rises inside the heat sink.

Recently, as the output of LED lighting has increased, the size and weight of the heat sink have been increased to provide a corresponding heat dissipation system. However, as the mass of the heatsink increases, not only does the cost of production increase, but also safety and market competitiveness decline.

A related prior art is Korean Patent Laid-Open Publication No. 10-2011-0089737 (entitled: Heat Dissipation Device and LED Illumination Device Including It, Published on Aug. 9, 2011).

In an embodiment of the present invention, a cylindrical structure is coupled to an upper surface of a heat sink to completely cover an upper portion of the heat sink, thereby blocking air inflow to an upper portion of the heat sink and allowing air to flow only to a side portion of the heat sink, There is provided a heat dissipating device using a cylindrical structure capable of reducing the area of the air inflow path to the heat sink to increase the flow velocity of the inflow air and thereby improving the heat transfer efficiency of the heat sink and a lighting apparatus including the same .

The problems to be solved by the present invention are not limited to the above-mentioned problem (s), and another problem (s) not mentioned can be clearly understood by those skilled in the art from the following description.

A heat dissipating device using a cylindrical structure according to an embodiment of the present invention includes a heat sink formed in a circular plate shape and having a base on which a heating element is disposed; And a cylindrical structure coupled to an upper surface of the heat sink to reduce the area of the air inflow path to the heat sink to increase a flow velocity of the inflow air.

The heat sink may further include a heat radiating fin radially arranged on an upper surface of the base.

The cylindrical structure is coupled to an upper surface of the heat dissipation fin so as to completely cover an upper portion of the heat sink, thereby blocking air inflow to the upper portion of the heat sink and allowing air to flow only to a side portion of the heat sink.

The cylindrical structure includes a chimney portion coupled to an upper surface of the heat dissipation fin so as to cover an upper portion of the heat sink; And an air inflow blocking portion extending horizontally in the circumferential direction from the outer peripheral surface of the lower end of the chimney portion so as to cover the upper remaining portion of the heat sink.

A lighting device according to an embodiment of the present invention includes a light source module including a light emitting device package including a heating element, and a substrate on which at least one light emitting device package is mounted; A heat sink including a base formed in a circular plate shape on an upper surface of the light source module; And a cylindrical structure coupled to an upper surface of the heat sink so as to increase the flow velocity of the inflow air by reducing the area of the air inflow path to the heat sink.

The heat sink may further include a heat radiating fin radially arranged on an upper surface of the base.

The cylindrical structure is coupled to an upper surface of the heat dissipation fin so as to completely cover an upper portion of the heat sink, thereby blocking air inflow to the upper portion of the heat sink and allowing air to flow only to a side portion of the heat sink.

The cylindrical structure includes a chimney portion coupled to an upper surface of the heat dissipation fin so as to cover an upper portion of the heat sink; And an air inflow blocking portion extending horizontally in the circumferential direction from the outer peripheral surface of the lower end of the chimney portion so as to cover the upper remaining portion of the heat sink.

A thermal conductive grease may be inserted between the heat sink and the substrate to reduce thermal contact resistance.

The details of other embodiments are included in the detailed description and the accompanying drawings.

According to an embodiment of the present invention, a cylindrical structure is coupled to an upper surface of a heat sink to completely cover an upper portion of the heat sink, thereby preventing inflow of air into the upper portion of the heat sink, Accordingly, the flow rate of the inflow air can be increased by reducing the area of the air inflow path to the heat sink, thereby improving the heat transfer efficiency of the heat sink.

1 is a perspective view of a heat dissipating device using a cylindrical structure according to an embodiment of the present invention.
2 is a side view of a lighting device including the heat sink of Fig.
3 is a perspective view of a heat dissipating device using a cylindrical structure according to another embodiment of the present invention.
4 is a side view of a lighting device including the heat sink of Fig.
FIGS. 5 and 6 are diagrams showing the flow of air as a numerical analysis result of a circular heat sink (conventional model) without a cylindrical structure and a circular heat sink (improved model) provided with a cylindrical structure, respectively.
Fig. 7 is a table showing the results of numerical analysis of Figs. 5 and 6. Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and / or features of the present invention, and how to accomplish them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a heat dissipating device using a cylindrical structure according to an embodiment of the present invention.

Referring to FIG. 1, a heat dissipating apparatus 100 using a cylindrical structure according to an embodiment of the present invention includes a heat sink 110 and a cylindrical structure 120.

The heat sink 110 is formed in a circular plate shape and has a base 112 on which a heating element such as an LED element is disposed and a radiating fin 114 and 116 arranged radially on the upper surface of the base 112 ). ≪ / RTI >

The base 112 receives the heat of high temperature generated from the heating element and primarily discharges the heat to cool the heating element.

Accordingly, the base 112 may be made of a metal material having excellent thermal conductivity such as aluminum for smooth heat dissipation. In addition, the base 112 may be formed in a circular shape as shown in the drawing, but may be formed in various shapes according to the structure installed in the frame of the illumination device.

In addition, the base 112 has a heat dissipating hole 118 penetrating the center portion so that the heat generated from the heat emitting body can be directly transferred to the opposite side of the base 112.

A plurality of the heat dissipation fins 114 and 116 are provided on the other side surface of the side having the mounting region where the heat generating element can be mounted on the base 112, and are radially arranged along the circumferential direction.

The heat dissipation fins 114 and 116 may have a rectangular panel shape and one end of the heat dissipation fins 114 and 116 may be perpendicular to the base 112 and may extend from an edge portion of the base 112 toward a heat dissipation hole 118 And a plurality of protrusions are provided.

The heat dissipation fins 114 and 116 may include a first heat dissipation fin 114 and a second heat dissipation fin 116.

The first radiating fins 114 are provided on the upper surface of the base 112 and may be radially arranged along the circumferential direction.

The second radiating fins 116 are provided on the upper surface of the base 112 and may be radially arranged between the first radiating fins 114 with a shorter length than the first radiating fins 114 .

At this time, the length of the first radiating fins 114 and the length of the second radiating fins 116 may have a ratio value between 0.4 and 0.7.

As the number of the heat dissipation fins 114 and 116 increases, the heat transfer area increases and the average of the heat sinks 110 is increased. The temperature decreases. However, since the flow rate of the cooling air is reduced due to the reduction of the flow area between the inlet area of the cooling air and the heat dissipation fins and the temperature rises rapidly as the cooling air moves toward the inner center portion, the temperature difference with respect to the heat dissipation fins 114 and 116 is small Thereby reducing heat transfer.

Therefore, as the number of the heat dissipation fins 114 and 116 increases, the heat transfer coefficient decreases due to the decrease of the air inflow amount rather than the increase of the heat transfer coefficient due to the increase in the heat transfer area. Rise.

Similarly, when the length of the heat dissipation fins 114 and 116 increases, the heat transfer area increases and the average temperature of the heat sink 110 decreases. However, when the length of the heat radiating fins 114 and 116 becomes longer than a predetermined length, the temperature of the cooling air increases toward the central portion of the heat sink 110 and becomes similar to the temperature of the heat radiating fins 114 and 116 , The average temperature of the heat sink 110 does not decrease any more.

Accordingly, as the length of the heat dissipation fins 114 and 116 increases, the heat transfer area increases and the heat transfer coefficient increases. However, as the center part approaches, the local heat transfer coefficient decreases due to the superheated air.

Accordingly, in one embodiment of the present invention, the plurality of heat dissipation fins having different length ratios, that is, the first and second heat dissipation fins 114 and 116 are alternately arranged in the radial direction to increase the heat transfer area, The flow amount of the heat sink 110 and the flow path area at the center portion are not reduced, and the average temperature of the heat sink 110 can be reduced.

Meanwhile, as described above, the ratio of the length of the first radiating fin 114 to the length of the second radiating fin 116 may have a value between 0.4 and 0.7. When the ratio is less than 0.4, The area of the flow path at the central portion is narrowed to reduce the inflow amount of the cooling air and the temperature of the cooling air at the central portion is increased so that the average temperature of the heat sink 110 Is increased without decreasing.

The cylindrical structure 120 is coupled to the upper surface of the heat sink 110 so as to reduce the area of the air inflow path to the heat sink 110 to increase the flow rate of the inflow air.

At this time, the cylindrical structure 120 may be coupled to the upper surface of the heat radiating fins 114 and 116 to completely cover the upper portion of the heat sink 110. Accordingly, the cylindrical structure 120 can block the inflow of air into the upper portion of the heat sink 110 and allow air to flow only to the side portion of the heat sink 110.

As described above, in the embodiment of the present invention, the cylindrical structure 120 is coupled to the upper surface of the heat sink 110 to completely cover the upper portion of the heat sink 110, The flow rate of the inflow air can be increased by reducing the area of the air inflow path to the heat sink 110 by allowing the inflow of air only to the side of the heat sink 110 by blocking the inflow of air into the heat sink 110, The heat transfer efficiency of the heat sink 110 can be improved.

The heat dissipating device 100 using the cylindrical structure according to an embodiment of the present invention includes not only a heat sink including the first and second heat radiating fins 114 and 116 but also a heat sink The present invention is not limited thereto.

2 is a side view of a lighting device including the heat sink 100 of Fig.

As shown in FIG. 2, the lighting device 200 may include a light source module 210, a heat sink 110, and a cylindrical structure 120.

The light source module 210 may include a light emitting device package 212 including a heating element such as an LED element and a substrate 214 on which at least one light emitting device package 212 is mounted.

1, the heat sink 110 includes a base 112 formed in a circular plate shape on an upper surface of the light source module 210, and a heat dissipation plate And may include pins 114 and 116.

The heat dissipation fins 114 and 116 are provided on the upper surface of the base 112 and include a first heat dissipation fin 114 radially arranged along the circumferential direction and a second heat dissipation fin 114 disposed on the upper surface of the base 112, And a second heat dissipation fin 116 disposed between the first heat dissipation fins 114 and having a shorter length than the first heat dissipation fin 114 and arranged radially.

Between the heat sink 110 and the substrate 214, a thermal conductive grease for reducing thermal resistance may be inserted. That is, a thermal conductive grease may be applied between the heat sink 110 and the substrate 214, so that the contact heat resistance between the heat sink 110 and the light source module 210 may be reduced.

The cylindrical structure 120 is coupled to the upper surface of the heat sink 110 so as to reduce the area of the air inflow path to the heat sink 110 to increase the flow rate of the inflow air.

1, the cylindrical structure 120 is coupled to the upper surface of the heat radiating fins 114 and 116 to completely cover the upper portion of the heat sink 110, So that only the inflow of air to the side of the heat sink 110 can be permitted.

3 is a perspective view of a heat dissipating device using a cylindrical structure according to another embodiment of the present invention.

Referring to FIG. 3, a heat dissipating device 300 using a cylindrical structure according to another embodiment of the present invention includes a heat sink 310 and a cylindrical structure 320.

The heat sink 310 is formed in a circular plate shape and has a base 312 on which a heating element (for example, an LED element) is disposed. The heat sink 310 has heat radiating fins 314 and 316 ). ≪ / RTI >

The base 312 receives high temperature heat generated from the heating element and primarily discharges the heat to cool the heating element.

Accordingly, the base 312 may be made of a metal material having excellent thermal conductivity such as aluminum for smooth heat dissipation. In addition, the base 312 may be formed in a circular shape as shown in the drawing, but may be formed in various shapes according to a structure installed in the frame of the lighting device.

The base 312 has a heat dissipating hole 318 penetrating the center portion so that the heat generated from the heat emitting body can be directly transferred to the opposite side of the base 312.

A plurality of the heat dissipation fins 314 and 316 are provided on the other side surface of the side having the mounting region where the heat generating element can be mounted on the base 312, and are radially arranged along the circumferential direction.

The heat dissipation fins 314 and 316 may have a rectangular panel shape and one end of the heat dissipation fins 314 and 316 is perpendicular to the base 312 to extend from an edge portion of the base 312 toward a heat dissipation hole 318 And a plurality of protrusions are provided.

The heat dissipation fins 314 and 316 may include a first heat dissipation fin 314 and a second heat dissipation fin 316.

The first radiating fins 314 are provided on the upper surface of the base 312 and may be radially arranged along the circumferential direction.

The second radiating fins 316 are provided on the upper surface of the base 312 and may be radially arranged between the first radiating fins 314 and shorter than the first radiating fins 314 .

At this time, the length of the first radiating fins 314 and the length of the second radiating fins 316 may have a ratio value between 0.4 and 0.7.

As the number of the heat dissipation fins 314 and 316 increases, the heat transfer area increases, and the average of the heat sink 310 is increased. The temperature decreases. However, since the flow rate of the cooling air is reduced by reducing the area of the passage between the inlet area of the cooling air and the heat dissipation fins, the temperature rises rapidly as the cooling air moves toward the inner center portion, and the temperature difference from the heat dissipation fins (314, 316) Thereby reducing heat transfer.

Therefore, as the number of the heat dissipation fins 314 and 316 increases, the heat transfer coefficient decreases due to the decrease of the air inflow amount rather than the increase of the heat transfer coefficient due to the increase in the heat transfer area, Rise.

Likewise, when the length of the heat radiating fins 314 and 316 increases, the heat transfer area increases and the average temperature of the heat sink 310 decreases. However, when the length of the heat radiating fins 314 and 316 is longer than the predetermined length, the temperature of the cooling air rises toward the central portion of the heat sink 310 and becomes similar to the temperature of the heat radiating fins 314 and 316 , The average temperature of the heat sink 310 does not decrease any more.

Accordingly, as the length of the heat dissipation fins 314 and 316 increases, the heat transfer area increases and the heat transfer coefficient increases. However, as the heat transfer fins 314 and 316 approach the center portion, the local heat transfer coefficient decreases due to the superheated air.

Accordingly, in one embodiment of the present invention, the plurality of heat dissipation fins having different length ratios, that is, the first and second heat dissipation fins 314 and 316 are alternately arranged in the radial direction to increase the heat transfer area, So that the average temperature of the heat sink 310 can be reduced.

Meanwhile, as described above, the ratio of the length of the first radiating fins 314 to the length of the second radiating fins 316 may have a value between 0.4 and 0.7. When the ratio is less than 0.4, The heat transfer coefficient decreases. When the heat transfer coefficient is larger than 0.7, the flow path area at the central portion becomes narrow to reduce the inflow amount of the cooling air, and the temperature of the cooling air at the center portion rises, Is increased without decreasing.

The cylindrical structure 320 serves to improve the heat transfer efficiency of the heat sink 310 by reducing the area of the air inflow path to the heat sink 310 to increase the flow velocity of the inflow air.

For this, the cylindrical structure 320 may include a chimney portion 322 and an air inflow blocking portion 324.

The chimney portion 322 may be coupled to the upper surface of the heat radiating fins 312 and 314 so as to cover an upper portion of the heat sink 310. For example, the chimney portion 322 may be formed in a cylindrical shape and may be coupled to the heat radiating fins 312 and 314 located at a midpoint between the center portion and the edge portion of the heat sink 310.

The air flow cut-off portion 324 may extend horizontally in the circumferential direction from the outer peripheral surface of the lower end of the chimney portion 322 to cover the upper remaining portion of the heat sink 310.

The cylinder structure 320 includes the chimney portion 322 and the air inflow blocking portion 324 to completely cover the upper portion of the heat sink 310. The heat sink 310 And allows air to flow only to the sides of the heat sink 310. [0051] As shown in FIG.

As described above, according to another embodiment of the present invention, the cylindrical structure 320 in the shape of a chimney is coupled to the upper surface of the heat sink 310 to completely cover the upper portion of the heat sink 310, So that the flow rate of the inflow air can be increased by reducing the area of the air inflow path to the heat sink 310 The heat transfer efficiency of the heat sink 310 can be improved.

The heat dissipating device 300 using the cylindrical structure according to another embodiment of the present invention includes not only a heat sink including the first and second heat radiating fins 114 and 116 but also a heat sink The present invention is not limited thereto.

4 is a side view of a lighting device including the heat sink 300 of Fig.

As shown in FIG. 4, the illumination device 400 may include a light source module 410, a heat sink 310, and a cylindrical structure 320.

The light source module 410 may include a light emitting device package 412 including a heating element such as an LED element and a substrate 414 on which at least one light emitting device package 412 is mounted.

3, the heat sink 310 includes a base 312 formed in a circular plate shape on an upper surface of the light source module 410, and a heat dissipation plate 340 disposed radially on the upper surface of the base 312. [ Pins 314 and 316, respectively.

The heat dissipation fins 314 and 316 are provided on the upper surface of the base 312 and include a first heat dissipation fin 314 radially arranged in the circumferential direction, And a second radiating fin 316 disposed between the first radiating fins 314 and having a shorter length than the first radiating fins 314 and arranged radially.

Between the heat sink 310 and the substrate 414, a thermal conductive grease for reducing thermal resistance may be inserted. That is, the thermal conductive grease may be applied between the heat sink 310 and the substrate 414, thereby reducing the contact thermal resistance between the heat sink 310 and the light source module 410.

The cylindrical structure 320 is coupled to the upper surface of the heat sink 310 to reduce the area of the air inflow path to the heat sink 310 to increase the flow velocity of the inflow air.

3, the cylindrical structure 320 is coupled to the upper surface of the heat radiating fins 314 and 316 so as to completely cover the upper portion of the heat sink 310, So that only the inflow of air to the side of the heat sink 310 can be allowed.

5 and 6 are diagrams showing the flow of air as a numerical analysis result of a circular heat sink (existing model) without a cylindrical structure and a circular heat sink (improved model) provided with a cylindrical structure, Fig. 7 is a table showing the results of numerical analysis of Figs. 5 and 6. Fig.

Referring to FIGS. 5 to 7, the improvement model shows that the average temperature of the heat sink is lowered by 13.5 DEG C and the heat resistance of the heat sink is improved by 35% than the conventional model. In addition, in the improvement model, the inflow air velocity of the heat sink increased 3.5 times as compared with the conventional model due to the cylinder installation.

Accordingly, it can be seen that the heat dissipating device using the cylindrical structure according to the embodiment of the present invention has superior heat dissipation performance as compared with the existing products.

On the other hand, as a result of a numerical analysis on a cylindrical structure of various materials, it has been found through experiments that the material of the cylindrical structure does not greatly affect the heat radiation performance of the heat sink.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Modification is possible. Accordingly, the spirit of the present invention should be understood only in accordance with the following claims, and all equivalents or equivalent variations thereof are included in the scope of the present invention.

110, 310: Heatsink
112, 312: base
114, 314: first heat radiating fin
116, 316: second heat dissipation pin
118, 318: heat dissipation hole
120, 320: Cylindrical structure
210, 410: Light source module
212, 412: Light emitting device package
214, 414: substrate
322: chimney section
324: Air inflow block

Claims (9)

A heat sink formed in a circular plate shape and including a base on which a heating element is disposed; And
The heat sink may include a cylindrical structure that is coupled to an upper surface of the heat sink so as to increase an inflow air flow rate by reducing an area of an air inflow path to the heat sink.
/ RTI >
The heat sink
A first radiating fin provided on an upper surface of the base and arranged in a radial direction along the circumferential direction; And
And a second heat dissipation fin provided on an upper surface of the base and having a length shorter than the first heat dissipation fin and radially arranged between the first heat dissipation fin,
Further comprising:
The length of the first radiating fins and the length of the second radiating fins have a ratio value between 0.4 and 0.7,
The cylindrical structure
A chimney portion coupled to an upper surface of the heat dissipation fin to cover an upper portion of the heat sink; And
An air inflow blocking portion disposed horizontally extending from the lower end peripheral surface of the chimney in the circumferential direction so as to cover the upper remaining portion of the heat sink,
Lt; / RTI >
Wherein the base includes a heat dissipating hole formed in a central portion thereof.
delete delete delete A light emitting device package including a heating element, and a substrate on which at least one light emitting device package is mounted;
A heat sink including a base formed in a circular plate shape on an upper surface of the light source module; And
The heat sink may include a cylindrical structure that is coupled to an upper surface of the heat sink so as to increase an inflow air flow rate by reducing an area of an air inflow path to the heat sink.
/ RTI >
The heat sink
A first radiating fin provided on an upper surface of the base and arranged in a radial direction along the circumferential direction; And
And a second heat dissipation fin provided on an upper surface of the base and having a length shorter than the first heat dissipation fin and radially arranged between the first heat dissipation fin,
Further comprising:
The length of the first radiating fins and the length of the second radiating fins have a ratio value between 0.4 and 0.7,
The cylindrical structure
A chimney portion coupled to an upper surface of the heat dissipation fin to cover an upper portion of the heat sink; And
An air inflow blocking portion disposed horizontally extending from the lower end peripheral surface of the chimney in the circumferential direction so as to cover the upper remaining portion of the heat sink,
Lt; / RTI >
The base includes a heat dissipating hole formed in a central portion thereof,
Between the heat sink and the substrate
Wherein thermal conductive grease is inserted to reduce contact thermal resistance.
delete delete delete delete
KR1020150067633A 2015-05-14 2015-05-14 Radiator with hollow cylinder type structure and lighting equipment comprising the same KR101735548B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150067633A KR101735548B1 (en) 2015-05-14 2015-05-14 Radiator with hollow cylinder type structure and lighting equipment comprising the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150067633A KR101735548B1 (en) 2015-05-14 2015-05-14 Radiator with hollow cylinder type structure and lighting equipment comprising the same

Publications (2)

Publication Number Publication Date
KR20160134133A KR20160134133A (en) 2016-11-23
KR101735548B1 true KR101735548B1 (en) 2017-05-15

Family

ID=57541452

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150067633A KR101735548B1 (en) 2015-05-14 2015-05-14 Radiator with hollow cylinder type structure and lighting equipment comprising the same

Country Status (1)

Country Link
KR (1) KR101735548B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101452464B1 (en) 2013-06-14 2014-11-03 임은자 Enhanced heat lighting
JP2015008114A (en) * 2013-05-31 2015-01-15 東芝ライテック株式会社 Lighting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015008114A (en) * 2013-05-31 2015-01-15 東芝ライテック株式会社 Lighting device
KR101452464B1 (en) 2013-06-14 2014-11-03 임은자 Enhanced heat lighting

Also Published As

Publication number Publication date
KR20160134133A (en) 2016-11-23

Similar Documents

Publication Publication Date Title
JP4668292B2 (en) LED lighting device and heat dissipation member of LED lighting device
EP2444724B1 (en) LED bulb
US20090071624A1 (en) Heat sink
BR102013009729A2 (en) heat dissipating device having side-by-side heat dissipation and heat dissipating conductive structure
WO2017173778A1 (en) Omni-directional, convectional, active heat sink and stage light using same
WO2014131269A1 (en) Radiator
KR101376110B1 (en) LED cooling device of air inflow type from side and bottom, and LED lighting lamp thereby
KR101010351B1 (en) heatsink using Nanoparticles
EP3667163B1 (en) Finned heat exchange system
CN103827579A (en) Heat sink and lighting apparatus having same
KR101759085B1 (en) The radiant heat structure for a LED lamp
KR101181156B1 (en) Air cool type heat sink
KR101735548B1 (en) Radiator with hollow cylinder type structure and lighting equipment comprising the same
KR20100003923U (en) Radiation member structure for cooling device
JP5705570B2 (en) Electronic component cooling system
JP5910893B2 (en) LED lamp
KR20100094210A (en) Heat sink and led package having the same
KR101150317B1 (en) Metal base circuit board
KR101573394B1 (en) Heat sink for led lighting device
KR101320935B1 (en) Method for manufacturing heat spreader
KR101548323B1 (en) heat sink and heat radiator apparatus having thereof
JP2020047570A (en) Light-weight heat radiation structure and manufacturing method of heat-conductive polymer heat sink
CN219300690U (en) Bionic honeycomb type LED radiator
CN216556619U (en) Radiator and lamp
KR20190128341A (en) LED Lighting Apparatus

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant