CN110692232A

CN110692232A - Drive assembly, camera module and electronic equipment thereof

Info

Publication number: CN110692232A
Application number: CN201880033058.2A
Authority: CN
Inventors: 王明珠; 姚立锋; 张建龙; 方银丽; 陈振宇; 郭楠; 陈飞帆; 吴业
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-06-02
Filing date: 2018-05-31
Publication date: 2020-01-14
Also published as: CN108989630A; CN108989629B; WO2018219324A1; CN209046728U; CN108989629A; CN208581284U

Abstract

The electronic device comprises a driving component, a camera module and electronic equipment, wherein the driving component comprises a magnetic element; the lens driving device comprises a coil and a lens carrier, wherein the lens carrier is used for carrying an optical lens therein, the coil and the lens carrier are integrally formed, and the magnetic elements are arranged on the outer side of the coil at intervals and correspondingly, so that when the coil is conducted, the coil and the magnetic elements interact with each other to drive the lens carrier to carry the optical lens to move. This allows the drive assembly to have a more miniature size.

Description

Drive assembly, camera module and electronic equipment thereof

Technical Field

The present invention relates to the field of optics, and in particular, to a driving assembly, a camera module and an electronic device using the same.

Background

With the advancement and development of science and technology, electronic devices and smart devices are increasingly developing towards high performance and light weight, and a camera module, which is one of the core configurations of electronic products and smart devices, is inevitably required to be adaptively adjusted in performance and size. Accordingly, in the course of this revolution of technological innovation, the various components of the camera module need to be changed in performance and size.

Fig. 1 shows a conventional camera module with a driver, which includes an optical lens 10P, a driver 20P and a circuit board assembly 30P, wherein the optical lens 10P is held on a photosensitive path of a photosensitive chip 32P of the circuit board assembly 30P by the driver 20P. The driver 20P can drive the optical lens 10P to move, so as to realize the functions of auto-focusing and optical anti-shake of the camera module. The conventional driver 20P is usually assembled as a separate accessory on a mirror base 33P of a circuit board assembly, and a set of pins of the driver 20P is electrically connected to a circuit board 31P of the circuit board assembly by electrical connection means such as soldering, so as to electrically connect the circuit board assembly 30P and the driver 20P, so that the circuit board assembly 30P can provide the driver 20P with electric energy required for operation. However, the existing driver 20P has many disadvantages in practical applications.

First, the driver 20P is mounted on the top surface of the mirror seat 33P of the circuit board assembly 30P and is used to mount the optical lens 10P, so that the matching accuracy of the driver 20P and the circuit board assembly 30P is ensured in order to ensure the matching accuracy of the optical lens and the circuit board assembly. In other words, if there is a tilt or offset between the driver 20P and the circuit board assembly 30P during the process of assembling the driver 20P, this error will be transferred between the optical lens 10P and the photosensitive element 32P of the circuit board assembly 30P to affect the imaging quality.

Next, the pins of the driver 20 are connected to the circuit board 31P of the circuit board assembly 30P, usually by soldering, to supply power and control signals to the driver through the circuit board 31P. Accordingly, during the soldering process, it is necessary to prevent other electronic components assembled on the circuit board assembly 30P from being contaminated by the soldering material, especially the photosensitive element 32P of the circuit board assembly 30P, i.e., the soldering process is difficult. To put it back, even if the soldering process is perfectly carried out, however, since the soldering material itself has a large resistance, the soldering material is conducted during operation to generate a large amount of heat, which undoubtedly puts higher demands on the heat dissipation of the circuit board.

It is worth mentioning that, in order to ensure the stability of soldering, it is usually appropriate to increase the area of the soldering region, which undoubtedly affects the overall aesthetic appearance of the structure of the circuit board assembly 30P: the soldering material is applied to the wiring board 31P like a patch. In addition, during subsequent use, the pins of the driver 20P may be separated from the circuit board 31P due to shaking, vibration, etc., thereby causing open-circuit failure. Further, in the process of soldering the pins of the driver 20P to the wiring board 31P, the driver 20P is slightly moved. Meanwhile, due to the uneven soldering material of each pin, the stress between each pin of the driver 20P and the circuit board 31P is different, so that there are matching tolerances such as inclination and offset between the driver 20P and the lens holder 33P, thereby affecting the subsequent matching precision between the optical lens 10P and the photosensitive element 31P. In other words, the conventional welding process is difficult to meet the packaging requirements of the camera module.

Further, the actuator 20P operates by the law of electromagnetic induction, and includes a coil 211P, a magnetic element 212P and a lens carrier 213P. In general, the coil 211P is wound around the lens carrier 213P, and interacts with the magnetic element 212P to form a driving force after being energized, so as to drive the optical lens 10P to move and change the relative position relationship between the optical lens and the photosensitive chip 32P, thereby achieving the functions of auto-focusing and optical anti-shake. However, the conventional drive 20P has many drawbacks in structure and performance.

Specifically, the coil 211P of the conventional actuator 20P is usually formed at the side of the lens carrier 213P by winding, and the coil wire body 211P is tightly and tightly bound to the side of the lens carrier 213P in order to ensure that a stable magnetic field can be formed after power is applied. Thus, not only the lens carrier 213P itself but also the coil wire body 211P itself is required to have a sufficient strength. In other words, when the coil 211P is formed on the side of the lens carrier 213P by winding, the thickness of the lens carrier 213P and the diameter of the wire of the coil 211P are increased to ensure that the lens carrier 213P is not deformed and the coil 211P is not broken during the winding process of the coil 211P.

It is well known that the strength of the magnetic field generated by a coil is affected by the number of turns of the coil, and that the number of turns of the coil for the same volume is limited by the diameter of the wire body. However, in the coil 211P of the conventional driver 20P, the diameter of the body of the coil 211P needs to be increased correspondingly due to the requirement of the body of the coil 211P for strength, so that the relative number of turns of the coil is reduced in the same volume. For example, take the coil 211P of the conventional audio motor driver 20P as an example, wherein the line width of the coil 211P is 40-50 μm, the line pitch (assuming tight winding and 2 times the thickness of the insulation layer) is 10 μm-20, and the number of turns is 50-70 (4-8 layers in the axis parallel direction, 5-12 layers in the vertical direction).

Further, during the winding of the coil 211P, the coil body 211P is tightly wound on the side of the lens carrier 213P and the gap between every two turns of the coil needs to be reduced as much as possible. Thus, the magnetic field formed by electromagnetic induction after the coil 211P is energized is uniform and controllable. However, in an actual winding process, since the coil wire bodies 211P are generally elongated and circular and have a certain diameter, a certain gap may exist between the coils 211P due to incomplete fitting between every two turns of the coil 211P, and as the number of turns of the coil 211P increases, the gap between the coil wire bodies 211P is accumulated to finally affect the characteristics of the magnetic field.

Furthermore, during the assembly of the conventional actuator 20P, a positioning structure and a safety space are required for the subsequent installation of the magnetic element 212P, and a certain installation tolerance is required for the magnetic element 212P for the convenience of later calibration and adjustment, which results in a corresponding increase in the size of the actuator 20P.

Disclosure of Invention

An object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the driving assembly includes a base and a lens carrier assembly movably assembled to the base, wherein when the lens carrier assembly is triggered, the lens carrier assembly can drive an optical lens mounted on the lens carrier assembly to move, so as to implement auto-focusing and/or optical anti-shake functions.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein in an embodiment of the present invention, the lens carrier assembly includes a coil and a lens carrier, and the coil and the lens carrier are integrally formed (for example, by a molding process) to reduce the size of the lens carrier assembly.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the coil is integrally formed on the lens carrier, so that the structural strength of the lens carrier can be enhanced by the coil, and the strength requirement of the coil on the lens carrier is reduced, thereby reducing the thickness of the lens carrier and meeting the size requirement of miniaturization.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein in an embodiment of the present invention, the coil is a circuit board type coil, which includes a substrate and a coil body, wherein the coil body is integrally formed on the substrate and spirally arranged on the substrate, and when the circuit board type coil is turned on, the coil body can generate a stable magnetic field.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the diameter of the coil wire body of the circuit board type coil can be much smaller than the normal operable diameter, so that compared with the conventional circuit board type coil formed by winding, the circuit board type coil formed with the same number of turns has a relatively smaller size, which is beneficial to further reducing the size of the driving assembly.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein compared with the conventional coil formed by winding, the number of turns of the circuit board type coil can be greatly increased under the same volume, so that the magnetic field strength required for obtaining the same driving force can be relatively reduced, that is, the volume of the magnetic element corresponding to the coil can be further reduced, thereby facilitating further compression of the overall size of the driving assembly.

Another object of the present invention is to provide a driving device, a camera module and an electronic apparatus thereof, wherein the circuit board type coil has a relatively large number of turns, so that the current for conducting the circuit board type coil can be reduced properly, and the circuit board type coil has great advantages in various aspects such as size, power consumption and material cost.

Another object of the present invention is to provide a driving module, a camera module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by a circuit board etching process and is disposed on the substrate in a spiral arrangement, in such a manner that when the circuit board type coil is turned on, the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by a circuit board electroplating process and is arranged on the substrate in a substantially concentric spiral manner, such that when the circuit board type coil is turned on, the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by a circuit board plating process and is arranged on the substrate in a substantially concentric spiral manner, such that when the circuit board type coil is conducted, the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by photolithography and is arranged on the substrate in a substantially concentric spiral manner, so that when the circuit board type coil is turned on, the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the coil bodies of the circuit board type coils are located on the same plane, so as to effectively reduce the space occupied by the circuit board type coils, and further reduce the overall size of the camera module and the driving assembly.

Another objective of the present invention is to provide a driving module, a camera module and an electronic device thereof, wherein the substrate of the circuit board coil has a multi-layer structure, each layer of the substrate is provided with at least one coil body, and the coil bodies of different layers are mutually conducted and stacked to effectively enhance or control the magnetic field intensity generated by the circuit board coil.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the magnetic element is disposed at an interval outside the lens carrier and does not physically contact with the lens carrier and the coil, so that when the coil is turned on, a magnetic field is generated by the coil, and the magnetic field interacts with a magnetic field provided by the magnetic element to realize auto-focusing, optical zooming or optical anti-shake functions of the camera module according to the electromagnetic induction principle.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the magnetic elements are distributed at intervals and symmetrically outside the lens carrier assembly through a magnetic element carrier, the lens carrier assembly is movably nested in the magnetic element carrier, and the lens carrier assembly and the magnetic element carrier can freely move relative to each other, so that when the coil of the lens carrier assembly is conducted and interacts with the magnetic element to drive the optical lens to move, thereby implementing functions of auto-focusing and/or anti-shake of the camera module.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the base is further provided with a control coil and a driving circuit board, the control coil is implemented as a circuit board type coil and is integrally formed on the driving circuit board, wherein the control coil is configured to drive the magnetic element carrier to move horizontally or obliquely, so that the lens carrier and the lens are moved synchronously to achieve an optical anti-shake function of the camera module.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the driving circuit board of the base and the circuit board of the circuit board assembly are connected and conducted with each other through a flexible board, and compared with the conventional driver, the structural design and steps of connecting pins and soldering of the conventional driver can be omitted, thereby effectively avoiding adverse effects caused during soldering.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the driving circuit board of the base and the circuit board of the circuit board assembly are connected by a flexible board, so that the connection and communication between the driving circuit board and the circuit board of the camera module are more stable, and from a deeper perspective, in such a manner, the driving circuit board and camera module circuit board industries can be integrated, so as to implement modularization and integration between all circuit boards of the camera module, which is beneficial to enhance the cooperation between each industry chain of the camera module, and promote the integration and development of the camera module industries.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the base is further integrally formed on the circuit board assembly, so that the camera module and the driving assembly have a more compact and more compact integrated structure.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein in an embodiment of the present invention, the lens carrier assembly includes a lens carrier and a set of magnetic elements, wherein the magnetic elements are integrally formed on the lens carrier, for example, by a molding process, so as to reduce the thickness dimension of the lens carrier assembly.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the magnetic element is disposed near an inner side of the lens carrier during the process of integrally molding the lens carrier assembly, so that the thickness dimension of the lens carrier assembly is reduced to the utmost, and the magnetic element can effectively reinforce the strength of the lens carrier.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the lens carrier assembly further includes a coil, the coil is a circuit board type coil and symmetrically disposed on an outer periphery of the base of the driving assembly, and when the lens carrier is assembled on the base, the coil is correspondingly disposed on an outer side of the magnetic element to form an "inner magnetic outer line" structure, and when the coil is turned on, the coil and the magnetic element interact to drive the lens carrier to carry the optical lens to move, thereby implementing functions of auto-focusing or optical anti-shake of the camera module.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the circuit board type coil is further connected to and electrically connected to the driving circuit board of the base through a flexible board, so that the circuit board of the camera module, the driving circuit board of the driving assembly, and the circuit board type coil are integrated into an integrated structure.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the circuit board type coil is integrally formed on the outer periphery of the base body by a molding process, so as to further make the driving assembly have a more compact and compact size structure.

Another objective of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the lens carrier assembly further includes a coil, wherein the coil is a circuit board type coil and is integrally formed on the driving circuit board of the base, when the lens carrier is assembled on the base, the coil is correspondingly located below the magnetic element to form a "magnetic-opposed" structure, so that when the coil is turned on, the coil and the magnetic element interact to drive the lens carrier to carry the optical lens to move, thereby implementing functions of auto-focusing or optical anti-shake of the camera module.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the lens carrier assembly further includes a coil, wherein the coil is implemented as a circuit board type coil, and the circuit board type coil is disposed on the outer periphery of the base and the driving circuit board of the base, so that when the coil is turned on, the coil interacts with the magnetic element to drive the lens carrier to carry the optical lens to move, thereby implementing functions of auto-focusing or optical anti-shake of the camera module.

To achieve the above object, the present invention provides a driving assembly, wherein the driving assembly includes:

a magnetic element;

a coil; and

the lens carrier is used for carrying an optical lens therein, the coil and the lens carrier are integrally formed, and the magnetic elements are arranged on the outer side of the coil at intervals and correspondingly, so that when the coil is conducted, the coil and the magnetic elements interact with each other to drive the lens carrier to carry the optical lens to move.

In an embodiment of the invention, the coil is a circuit board type coil, wherein the circuit board type coil includes a substrate and a coil body, and the coil body is integrally formed on the substrate and spirally disposed on the substrate, so that when the coil body is turned on, a magnetic field can be generated by the circuit board type coil.

In an embodiment of the invention, the substrate has a planar shape, and the coil body is spirally formed on a surface of the substrate.

In an embodiment of the present invention, the circuit board type coils are stacked on each other such that the coils have a multi-layer structure in which each layer of the circuit board type coils is in conduction with each other.

In an embodiment of the invention, each layer of the circuit board type coils has a power input end and a power output end opposite to the power input end, wherein when the circuit board type coils of different layers have spiral shapes in the same direction, the power input end of the circuit board type coil located at the upper layer is electrically connected to the power output end of the circuit board type coil located at the lower layer, so that currents of the circuit board type coils located at different layers have the same flow direction.

In an embodiment of the invention, each layer of the circuit board type coils has an electric input end and an electric output end opposite to the electric input end, wherein when the circuit board type coils of different layers have spiral shapes in opposite directions, the electric input end of the circuit board type coil located at the upper layer is electrically connected to the near point end of the circuit board type coil located at the lower layer, so that the current of the circuit board type coils located at different layers has the same flow direction.

In an embodiment of the invention, the lens module further includes a magnetic element carrier movably nested outside the lens carrier, wherein the magnetic element is mounted on the magnetic element carrier, so that the magnetic elements are disposed outside the coil at intervals and correspondingly.

In an embodiment of the invention, the optical lens driving device further includes a driving circuit board electrically connected to the circuit board, wherein the driving circuit board further includes a control coil, the control coil is a circuit board type coil and is integrally formed on a surface of the driving circuit board, and the control coil corresponds to a bottom side of the magnetic element and is used for interacting with the magnetic element to drive the magnetic element carrier, so that the lens carrier is driven by the magnetic element carrier to carry the optical lens to move.

In an embodiment of the invention, the electronic device further includes a base main body, and the base main body is used for mounting the driving circuit board to form a base of the driving assembly.

According to another aspect of the present invention, there is also provided a driving assembly, comprising:

a magnetic element;

a coil; and

a lens carrier; the lens carrier is used for carrying an optical lens therein, wherein the magnetic element and the lens carrier are integrally formed, and the coil is spaced from the magnetic element and corresponds to the magnetic element, so that when the coil is conducted, the coil and the magnetic element interact with each other to drive the lens carrier to carry the optical lens to move.

In an embodiment of the invention, the circuit board type coils are disposed at intervals and correspondingly outside the magnetic element.

In an embodiment of the invention, the magnetic element is embedded in the lens carrier and is adjacent to an inner side of the lens carrier.

In an embodiment of the invention, the circuit board type coil is further electrically connected to the driving circuit board through a flexible board.

In an embodiment of the invention, the magnetic element further includes a driving circuit board and a base body, wherein the circuit board type coils are integrally formed on a surface of the driving circuit board and respectively correspond to bottom sides of the magnetic elements.

In an embodiment of the invention, the magnetic element further includes a driving circuit board, wherein a portion of the circuit board type coils are disposed at intervals and correspondingly outside the magnetic element, and another portion of the circuit board type coils are integrally formed on a surface of the driving circuit board, so that the another portion of the circuit board type coils are respectively at intervals and correspond to a bottom side of the magnetic element.

In an embodiment of the invention, a portion of the circuit board type coil that is disposed at an interval and correspondingly outside the magnetic element is electrically connected to the driving circuit board through a flexible board.

According to another aspect of the present invention, the present invention further provides a camera module, which includes:

an optical lens;

the drive assembly as described above; and

a circuit board assembly, wherein the circuit board assembly includes a circuit board, a photosensitive element and a lens holder, the photosensitive element is electrically connected to the circuit board, the lens holder is supported by the circuit board and configured to mount the driving assembly thereon, wherein the optical lens is mounted to the driving assembly so as to be held in a photosensitive path of the photosensitive element.

In an embodiment of the invention, the electronic device further includes a flexible board extending between the driving circuit board and the circuit board to electrically connect the driving component to the circuit board.

In an embodiment of the invention, the mirror base of the circuit board assembly and the base of the driving assembly are integrally formed.

In an embodiment of the invention, the mirror base of the circuit board assembly and the base of the driving assembly are integrally formed on the circuit board of the circuit board assembly.

According to another aspect of the present invention, the present invention also provides an electronic device, comprising:

the camera module group is described above; and

the camera module is assembled on the electronic equipment body.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1 is a perspective exploded view of a prior art actuator.

Fig. 2A is a schematic diagram of a camera module according to a preferred embodiment of the invention.

Fig. 2B and 2C are schematic diagrams of the relative position distribution of the coils and the magnetic elements of the driving assembly according to the preferred embodiment.

Fig. 3A is a modified implementation of the camera module according to the above preferred embodiment of the invention.

Fig. 3B and 3C are schematic diagrams of the relative position distributions of the coils and the magnetic elements of the driving assembly implemented according to the variation of the preferred embodiment described above.

Fig. 4A is a schematic diagram of a camera module according to another preferred embodiment of the invention.

Fig. 4B and 4C are schematic diagrams of relative position distributions of the coils and the magnetic elements of the driving assembly according to another preferred embodiment described above.

Fig. 5A is a schematic view of the circuit board type coil according to another preferred embodiment described above.

Fig. 5B is another schematic view of the circuit board coil according to another preferred embodiment described above.

Fig. 5C is an assembly diagram of the wiring board, the driving circuit board, and the wiring board type coil according to another preferred example.

Fig. 6A is a schematic view of a modified embodiment of the camera module according to another preferred embodiment.

Fig. 6B and 6C are schematic diagrams of relative position distributions of the coils and the magnetic elements of the drive assembly according to the camera module of fig. 6A.

Fig. 7A is a schematic view of still another modified embodiment of the camera module according to the above-described another preferred embodiment.

Fig. 7B and 7C are schematic diagrams of relative position distributions of the coils and the magnetic elements of the drive assembly according to the camera module of fig. 7A.

Fig. 8 is a perspective view of an electronic device according to the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Fig. 2A to 2C show a camera module 1 according to a preferred embodiment of the present invention, which can be applied to various electronic devices 80, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, etc., wherein the camera module 1 cooperates with the electronic devices 80 to achieve the image capturing and reproducing functions for the target object.

More specifically, the camera module 1 includes at least an optical lens 10, a driving assembly 20 and a circuit board assembly 30. The driving assembly 20 is mounted on the top side of the circuit board assembly 30, and more specifically, the driving assembly 20 is mounted on a mirror base 33 of the circuit board assembly 30. The optical lens 10 is assembled and held in a photosensitive path of a photosensitive element 32 of the circuit board assembly 30 by the driving assembly 20. The driving assembly 20 is configured to drive the optical lens 10 to move, so as to implement auto-focusing and/or optical anti-shake functions of the camera module 1. It should be understood by those skilled in the art that in other embodiments of the present invention, the number of the optical lenses 10 of the camera module 1 may be more than one, and each of the optical lenses 10 is correspondingly assembled to the driving assembly 20, that is, the camera module 1 may be implemented as an array camera module. Here, the camera module 1 is described by taking only one optical lens 10 as an example in the present application, and it should be appreciated that the number of the optical lenses 10 does not affect the scope of the present invention.

As shown in fig. 2A, the driving assembly 20 includes a lens carrier assembly 21 and a base 22, wherein the base 22 is supported on the top side of the lens seat 33 of the circuit board assembly 30, the lens carrier assembly 21 is operably assembled to the base 22, wherein when the lens carrier assembly 21 is in an operating state, the lens carrier assembly 21 can move along with the optical lens 10 to change the relative position relationship between the optical lens 10 and the circuit board assembly 30, so as to achieve the functions of auto-focusing and/or optical anti-shake of the camera module 1, and improve the imaging quality of the camera module 1. Preferably, in the preferred embodiment of the present invention, the base 22 of the driving assembly 20 integrally extends to the mirror base 33 of the circuit board assembly 30, so that the base 22 and the mirror base 33 have an integral structure. Of course, it should be understood by those skilled in the art that in other embodiments of the present invention, the driving assembly 20 may be a split driving assembly, i.e., the driving assembly 20 is a separate component that is attached to the mirror base 33 of the circuit board assembly 30.

Those skilled in the art will appreciate that the drive assembly 20 operates based on the principles of electromagnetic induction. As shown in fig. 2A, the lens carrier assembly 21 includes a lens carrier 213, a coil 211 and a set of magnetic elements 212. The lens carrier 213 is used for accommodating the optical lens 10 therein, the coil 211 is disposed on the lens carrier 213, and the magnetic element 212 is correspondingly disposed on the outer side of the coil 211, so that the lens carrier 213 can be driven by the electromagnetic induction force of the coil 211 and the magnetic element 212 to move to change the relative position between the optical lens 10 and the photosensitive element 32 of the circuit board assembly 30, thereby achieving the functions of auto-focusing and/or optical anti-shake.

In particular, in the preferred embodiment of the present invention, the coil 211 is integrally formed with the lens carrier 213, so that the lens carrier assembly 21 has an integral structure. Here, compared to the conventional coil 211 formed by winding, the coil 211 is integrally formed with the lens carrier 213, in other words, the coil 211 constitutes a part of the lens carrier 213, thereby effectively reducing the thickness dimension of the lens carrier assembly 21. Meanwhile, since the coil 211 and the lens carrier assembly 21 are integrally formed, there is no interaction between the coil 211 and the lens carrier 213, so that the strength requirement of the lens carrier 213 can be further reduced. It should be noted that, just as the lens carrier 213 and the coil 211 have an integrated structure, the coil 211 reinforces the lens carrier 213 instead, so that the thickness dimension of the lens carrier 213 can be further reduced. In addition, due to the special configuration between the coil 211 and the lens carrier 213, the coil 211 does not need to be formed on the outer circumferential wall of the lens carrier 213 by winding, so that the requirement for the strength of the coil body can be relatively low. That is, if the existing coil body is still used, the diameter of the coil body can be reduced, so as to meet the requirements of the number of turns and the size of the coil.

In particular, in the preferred embodiment of the present invention, the coil 211 is implemented as a line plate coil 2111, and the line plate coil 2111 is disposed on the lens carrier 213, so that when the line plate coil 2111 is excited, it interacts with the magnetic element 212, thereby driving the lens carrier 213 to move to change the relative position relationship between the optical lens 10 and the circuit board assembly 30, and implementing the functions of auto-focusing and/or optical anti-shake of the camera module 1.

More specifically, as shown in fig. 2B, the circuit board type coil 2111 includes a substrate 21111 and a coil body 21110, wherein the coil body 21110 is integrally formed on the substrate 21111 and spirally arranged on the substrate 21111. It will be appreciated by those skilled in the art that the magnetic field can be generated by energizing the solenoid based on the electromagnetic effect, and accordingly, in the preferred embodiment of the present invention, when the circuit board coil 2111 is turned on, a stable magnetic field can be generated by the coil body 21110. In particular, it should be noted that in the preferred embodiment of the present invention, the base plate 21111 is planar and the coil body 21110 is spirally formed on the surface of the base plate, in such a way as to completely subvert the existing coil formed by winding, which brings technical advantages.

More specifically, in a specific implementation, the circuit board type coil 2111 may be prepared through a circuit board corrosion process, a circuit board electroplating process, a circuit board chemical plating process, and a circuit board photolithography process, the substrate 21111 may be a hard board, a soft board, a PCB board, a rigid-flex board, or the like, and the coil body 21110 is formed at a corresponding position of the substrate 21111 through a related process and arranged in a spiral shape. Here, since the coil body 21110 is integrally formed with the base plate 21111 without being tightened, the wire body of the coil body 21110 can be greatly reduced in diameter. Accordingly, the coil 2111 has a relatively increased number of turns compared to the conventional wound coil in the same volume. In particular, in an implementation, the coil body 21110 may be implemented as an ultra-fine wire body wrapped by an insulating layer, so that the coil formed by the ultra-fine wire body can satisfy the requirements of size and number of turns at the same time.

It will be appreciated by those skilled in the art that the magnetic field generated by an energized coil is influenced by the number of turns in the coil, and that the number of turns in the coil for the same volume depends on the diameter of the wire body of the coil. Accordingly, the circuit board type coil 2111 provided by the invention is formed by an ultra-fine wire body, and compared with the existing winding type coil, the circuit board type coil 2111 can be relatively laid with more turns under the same volume. Those skilled in the art will appreciate that the magnetic force generated by the driving assembly 20 depends on the magnetic field strength generated by the coil 211 and the magnetic field strength generated by the magnetic element 212, so that the on-current of the circuit board type coil 2111 can be significantly reduced in order to control the condition of increasing the number of turns of the coil. In this way, the power consumption of the drive assembly 20 and the requirement for heat dissipation can be effectively reduced

On the other hand, since the circuit board type coil 2111 can be configured to have a relatively larger number of turns, that is, accordingly, the size of the magnetic element 212 opposite to the circuit board type coil 2111 can be reduced, which is advantageous for further reducing the overall size of the driving assembly 20.

Further, as shown in fig. 2B, in the preferred embodiment of the present invention, the line plate type coil 2111 is integrally formed with the lens carrier 213, so that the lens carrier assembly 21 has an integral structure. In a specific implementation, the lens carrier 213 may be integrally formed with the circuit board type coil 2111 through a molding process or an injection molding process. For example, in the preferred embodiment of the present invention, the lens carrier 213 is formed in the middle region of the circuit board type coil 2111 by a molding process, wherein after molding, the coil body 21110 of the circuit board type coil 2111 is spirally distributed along the outer side of the lens carrier 213 and gradually outward. Meanwhile, in order to reserve a mounting hole for the optical lens 10, a through hole is further formed in the middle of the board coil 2111, so that a mounting passage for mounting the optical lens 10 is formed at the through hole of the board coil 2111 after the lens carrier is formed by a molding process. Thus, when the circuit board type coil 2111 is turned on, a stable magnetic field can be generated by the circuit board type coil 2111 and interacts with the magnetic element 212 to drive the lens carrier 213 to carry the optical lens 10 to move, thereby realizing the functions of auto-focusing and/or optical anti-shake of the camera module 1.

In particular, in this preferred embodiment of the present invention, the line plate type coil 2111 is configured to have a multilayer structure in which the line plate type coils 2111 of different layers are superimposed on each other and conducted to each other to reinforce the functional characteristics of the line plate type coil 2111. In order to better illustrate the technical details of how the multilayer wired board coil 2111 is stacked and conducted, the technical features of the single-layer wired board coil 2111 will be described in detail.

As shown in fig. 2B, the single-layer wire-type coil 2111 has a sheet-like structure, in which the coil body 21110 is integrally formed on the substrate 21111 to form the wire-type coil 2111. Specifically, the coil body 21110 is arranged on the substrate 21111 in a spiral manner so that, after the board coil 2111 is turned on, a current is conducted to the other end of the coil body 21110 along one end of the spiral coil body 21110 to form a stable magnetic field according to the electromagnetic induction effect. It should be noted that the coil body 21110 of the wire board coil 2111 may be laid in other types, such as a concentric square line shape, a concentric circular line shape, and the like.

More specifically, each layer of the wired circuit board coil 2111 includes at least two power-on terminals, and the power-on terminals are used for obtaining external power. Preferably, each layer of the line card coil 2111 has two power-on ends, a power-in end 21112 and a power-out end 21113. Specifically, as shown in fig. 2B, the power input end 21112 is disposed at the start end of the innermost side of the coil body 21110, and the power output end 21113 is disposed at the end of the outermost side of the coil body 21110, so that when the line card coil 2111 is turned on, current can flow in from the power input end 21112 and flow out from the power output end 21113, and a stable magnetic field is generated. It should be understood by those skilled in the art that the power input end 21112 and the power output end 21113 are relative concepts, and the flowing direction of the current is not determined, that is, the current can also flow from the outermost side of the circuit board type coil 2111 to the innermost side of the circuit board type coil 2111, that is, the current flows from the power output end 21113 to the power input end 21112.

Further, when the circuit board type coil 2111 has a multilayer structure, at least one coil body 21110 is formed on each layer of the substrate 21111, and the circuit board type coils 2111 of each layer are conducted to each other and stacked to relatively increase the total number of turns of the circuit board type coil 2111. Specifically, each layer of the line plate type coils 2111 has the two power-on ends, and the power-on ends of the line plate type coils 2111 in different layers are connected with each other, so that currents flowing in the line plate type coils 2111 in different layers have direction consistency, and magnetic fields formed between the line plate type coils 2111 in different layers are consistent in direction and mutually strengthened.

More specifically, when the coil bodies 21110 of the line plate coils 2111 of different layers have the same arrangement, for example, the line plate coils 2111 of different layers are simultaneously arranged in a counterclockwise spiral manner, in this case, the power input end 21112 of the line plate coil 2111 of the upper layer is electrically connected to the power output end 21113 of the line plate coil 2111 of the lower layer, so that the current flowing through the line plate coil 2111 of the upper layer and the current flowing through the line plate coil 2111 of the lower layer have the same flow direction, and the direction of the magnetic field formed by the line plate coil 2111 of the upper layer and the direction of the magnetic field formed by the line plate coil 2111 of the lower layer have the same direction. By analogy with this rule, the wiring board type coil 2111 having a multilayer structure is formed.

On the contrary, when the wire bodies of the line plate coils 2111 in different layers have different arrangement modes, for example, the line plate coils 2111 in the upper layer are spirally arranged counterclockwise, and the line plate coils 2111 in the lower layer are spirally arranged clockwise, at this time, the power input end 21112 of the line plate coil 2111 in the upper layer is connected to the power output end 21113 of the line plate coil 2111 in the lower layer, so that the current flowing through the line plate coil 2111 in the upper layer and the current flowing through the line plate coil 2111 in the lower layer also have the same flow direction, and therefore, the magnetic field formed by the line plate coil 2111 in the upper layer and the magnetic field formed by the line plate coil 2111 in the lower layer are mutually strengthened.

As shown in fig. 3A to 3C, a modified embodiment of the multilayer printed circuit board coil 2111 is shown, wherein in the modified embodiment, at least one coil body 21110 is formed on each substrate 21111, and the printed circuit board coils 2111 of each layer are nested and conducted with each other to enhance the functional characteristics of the printed circuit board coils 2111. Similarly, in order to better and specifically explain the technical details of how the multi-layer wired circuit board coil 2111 is conducted and how the multi-layer wired circuit board coil 2111 is nested and stacked in this equivalent embodiment, the technical features of the wired circuit board coil 2111 when the substrate 21111 is a single-layer substrate 21111 will be described in more detail.

As shown in fig. 3B, the single-layer-wiring plate-type coil 2111 has an oblong circular structure in which the coil body 21110 is integrally formed with the base plate 21111, wherein the coil 211 wire bodies are spirally arranged in a vertical direction in an approximately concentric spiral. When the pcb 2111 is turned on, current is conducted to the other end of the pcb 2111 along one end of the spiral coil 21110, thereby generating a stable magnetic field by electromagnetic induction.

Correspondingly, each layer of the circuit board type coil 2111 has an electric input end 21112 and an electric output end 21113, wherein the electric input end 21112 is disposed at the initial end of the coil body 21110 at the top side of the circuit board type coil 2111, and the electric output end 21113 is disposed at the terminal end of the coil body 211 at the bottom side of the circuit board type coil 2111, so that when the circuit board type coil 2111 is turned on, current flows in from the electric input end 21112 and flows out from the electric output end 21113, so as to generate a stable magnetic field through the electromagnetic induction principle. It should be understood by those skilled in the art that the power input end 21112 and the power output end 21113 are relative concepts, and do not determine the current flowing direction, that is, the current can flow into the bottom side of the printed circuit board coil from the top side of the printed circuit board coil 2111, that is, the current flows from the power output end 21113 to the power input end 21112.

When the wiring board type coil 2111 has a multilayer structure in which, in this modified embodiment of the present invention, the wiring board type coils 2111 of each layer are nested and conducted to each other to equivalently increase the total number of turns of the wiring board type coil 2111. Specifically, each layer of the line plate type coils 2111 respectively has the two power-on ends, and the power-on ends of the line plate type coils 2111 in different layers are correctly connected, so that the currents flowing through the line plate type coils 2111 in different layers have the same direction, and the magnetic fields formed by the line plate type coils 2111 in different layers are in the same direction and mutually strengthen.

More specifically, when the line card type coils 2111 of different layers have the same arrangement, for example, the line card type coils 2111 of different layers are simultaneously arranged in a spiral shape counterclockwise, in this case, the power input end 21112 of the line card type coil 2111 located in an inner layer is connected to the power output end 21113 of the line card type coil 2111 located in an outer layer, so that the current flowing through the line card type coil 2111 located in the inner layer and the current flowing through the line card type coil 2111 located in the outer layer have the same flow direction, and thus the direction of the magnetic field formed by the line card type coil 2111 located in the inner layer and the direction of the magnetic field formed by the line card type coil 2111 located in the outer layer have the same direction.

Accordingly, when the circuit board coils 2111 of different layers have opposite arrangement, for example, the circuit board coils 2111 at the inner layer are spirally arranged counterclockwise, and the circuit board coils 2111 at the outer layer are spirally arranged clockwise. The power input end 21112 of the circuit plate coil 2111 positioned at the inner layer is connected to the power output end 21113 of the circuit plate coil 2111 positioned at the outer layer, so that the current flowing through the circuit plate coil 2111 positioned at the inner layer and the current flowing through the circuit plate coil 2111 positioned at the outer layer have the same flow direction, and the direction of the magnetic field formed by the circuit plate coil 2111 positioned at the inner layer and the direction of the magnetic field formed by the circuit plate coil 2111 positioned at the outer layer have the same consistency.

In summary, the line plate type coil 2111 having a multilayer structure may be formed in a stacked manner or in a nested manner. After the wiring board type coil 2111 is formed into a multilayer structure, it is further integrally molded with the lens carrier 213. More specifically, the lens carrier 213 and the circuit board type coil 2111 may be integrally formed through a molding process, in which a central region of the substrate 21111 of the circuit board type coil 2111 is a groove and isolated, so that after a molding material is cured and formed, the lens carrier 213 is formed in the central region of the substrate 21111, and at the same time, the circuit board type coil 2111 is integrally cured on the lens carrier 213, so that the lens carrier assembly 21 has an integrated compact structure. It is noted that the lens carrier 213 may be implemented as a separate part which is assembled with the circuit board type coil having a multi-layered structure, and thus, the two are integrally combined through a molding process. By contrast, the present invention is not limited thereto.

Further, in order to drive the lens carrier 213 to move along with the optical lens 10, and further according to the law of electromagnetism, the lens carrier assembly 21 further includes a set of magnetic elements 212, wherein the magnetic elements 212 are used for providing a constant magnetic field. When the circuit board type coil 2111 is turned on to generate a magnetic field, the magnetic field interacts with the magnetic field provided by the magnetic element 212 to generate a driving force to drive the circuit board type coil 2111 to move. Here, since the lens carrier 213 and the line plate coil 2111 are integrally formed, when the line plate coil 2111 is moved, the lens carrier 213 and the optical lens 10 mounted on the lens carrier 213 are carried to move synchronously to realize functions such as auto-focusing or optical anti-shake.

More specifically, as shown in fig. 2B and 3B, the magnetic element 212 is disposed at an interval outside the lens carrier 213, and does not come into physical contact with the lens carrier 213 and the coil 211, so that the coil 211 can freely move with respect to the magnetic element 212. According to the electromagnetic induction principle, after the coil 211 is turned on, the coil 211 generates a magnetic field, and the magnetic field interacts with the magnetic field provided by the magnetic element 212, so as to realize the auto-focusing function and/or the optical anti-shake function of the camera module 1.

More specifically, as shown in fig. 2B and 3B, according to the ampere's rule, the direction of the magnetic field generated by the circuit board type coil 2111 is parallel to the direction of the optical axis Z, and the magnetic field generated by the magnetic element 212 symmetrically disposed outside the circuit board type coil 2111 is perpendicular to the optical axis Z, so that the magnetic element 212 can make the coil 211 receive a vertical force and a horizontal force which cancel each other out, so as to drive the circuit board type coil 2111 to move with the lens carrier 213 and the optical lens 10, thereby implementing the auto-focusing function of the camera module 1.

It should be noted that the magnetic element 212 can be selectively mounted on the base 22 of the driving assembly 20, so that when the lens carrier assembly 21 is assembled on the base 22, the magnetic element 212 is disposed outside the lens carrier assembly 21 to interact with the coil 211 to generate a driving force to drive the optical lens 10 to move along the optical axis direction to realize the auto-focusing function. Here, in other embodiments of the present invention, the magnetic elements 212 may be assembled on an inner sidewall of an outer casing of the driving assembly 20, for example, the magnetic elements 212 are symmetrically distributed on the inner sidewall of the outer casing, so as to provide a magnetic field perpendicular to the optical axis Z for the coil 211 to drive the lens carrier 213 to move along a direction parallel to the optical axis Z, so as to change a distance between the optical lens 10 and the photosensitive element 32, so as to implement an auto-focusing function of the camera module 1.

In particular, as shown in fig. 2B and 3B, in the present invention, the magnetic element 212 is disposed outside the circuit board coil 2111 at intervals and symmetrically by a magnetic element carrier 2121, so as to provide a magnetic field symmetrical and perpendicular to the optical axis Z for the coil 211, and drive the lens carrier 213 to move along a direction parallel to the optical axis Z, so as to implement an auto-focusing function. Here, the lens carrier assembly 21 is movably nested in the magnetic element carrier 2121, i.e., the lens carrier 213 and the magnetic element carrier 2121 are freely movable relative to each other. Accordingly, when the magnetic element carrier 2121 is moved horizontally or obliquely, the lens carrier assembly 21 is driven by the magnetic element carrier 2121 to perform a horizontal or oblique movement synchronously, so as to further implement the optical anti-shake function of the camera module 1. Those skilled in the art will appreciate that the magnetic field provided by the patch coil 2111 is perpendicular to the magnetic field generated by the magnetic element 212, and thus the magnetic element carrier 2121 cannot be moved horizontally or obliquely by the magnetic field provided by the patch coil 2111. In particular, in the present invention, the magnetic field for driving the horizontal or tilting motion of the magnetic element holder 2121 is provided by a coil formed at the base 22 of the driving assembly 20. This is set forth in more detail in the following detailed description of the base 22 of the drive assembly 20.

As shown in fig. 2A or fig. 3A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected and conducted to each other through a connecting portion 223. Specifically, the connecting portion 223 is implemented as a flexible board 2230, so as to connect and conduct the driving circuit board 222 and the circuit board 31 of the camera module 1 through the flexible board 2230. It should be noted that, instead of the pin soldering electrical connection, the electrical connection between the driving circuit board 222 and the circuit board 31 is made by the flexible board 2230 to electrically connect the driving component 20 and the circuit board component 30. And furthermore, the integration of the drive circuit board and the circuit board 31 industry of the camera module is facilitated, so that the modularization and the integration of all circuit boards of the camera module are realized, the universal cooperation among all industries of the camera module is further facilitated, and the integration and the development of the camera module industry are promoted.

Further, as shown in fig. 2C or 3C, in the preferred embodiment of the present invention, the base 22 is further provided with a control coil 2112, and the control coil 2112 is integrally formed on the driving circuit board for driving the magnetic element carrier 2121 to move horizontally or obliquely, so as to implement the optical anti-shake function. In this preferred embodiment of the present invention, the control coil 2112 may also be implemented as a circuit board type coil and corresponds to (vertically corresponding to) the magnetic element mounted on the magnetic element carrier, so that the control coil 2112 can be used to drive the magnetic element carrier 2121 to move horizontally or obliquely, so that the lens carrier 213 and the lens are moved synchronously, thereby implementing the optical anti-shake function of the camera module 1.

As shown in fig. 2B and 2C or fig. 3B and 3C, when the control coil 2112 is turned on, a magnetic field corresponding to the magnetic element 212 and parallel to the optical axis Z is generated by an electromagnetic induction effect. As mentioned above, the magnetic field generated by the magnetic element 212 is perpendicular to the optical axis Z, so that the magnetic field generated by the magnetic element 212 and the magnetic field generated by the control coil 2112 are perpendicular to each other to drive the magnetic element holder 2121 to move in a translational or tilting manner with the lens holder 213, thereby implementing the optical anti-shake function of the camera module 1. In combination, the lens carrier 213 moves vertically relative to the magnetic element carrier 2121, and the magnetic element carrier 2121 moves horizontally or obliquely relative to the control coil 2112, so as to achieve the functions of auto-focusing and optical anti-shake of the camera module 1.

Further, the driving assembly 20 further includes a limiting element 40, and the limiting element 40 is disposed between the lens carrier assembly 21 and the base 22, so as to precisely limit the movement of the lens carrier assembly 21 by the limiting element 40. More specifically, when the board coil 2111 of the lens carrier assembly 21 is turned on to generate a driving torque, the position limiting element 40 cooperates with the board coil 2111 and the magnetic element 212 to push the lens carrier 213 to move, so as to achieve the functions of auto-focusing and optical anti-shake of the camera module 1. It should be understood by those skilled in the art that the position limiting element 40 can be implemented as a spring assembly to limit the moving state of the lens carrier assembly 21 through the spring assembly, so as to achieve precise control of the camera module.

It should be noted that in the preferred embodiment of the present invention, the integration degree between the base 22 and the circuit board assembly 30 of the camera module 1 can be gradually expanded to form an integrated structure with different levels.

In the first stage, only the driving circuit board 31 and the base body 221 are integrally molded by a molding process, and the assembled driving component 20 is mounted on the mirror base 33 of the circuit board component 30.

A second stage of integrally molding the driving wiring board 31 and the base body 221 through a molding process. The base body 221 may further extend longitudinally so that the base 22 of the driver assembly 20 forms the mirror base 33 of the circuit board assembly 30 after the integrated driver assembly 20 is assembled and attached to the circuit board 31 of the circuit board assembly 30. In other words, the base body 221 and the mirror base 33 have an integral structure. It is worth mentioning that in this case, the filter of the camera module 1 can be assembled to the base 22 of the driving assembly 20 to further optimize the overall structure and size of the camera module 1.

At a third level, the driving circuit board 222 of the base 22 of the driving component 20 and the circuit board 31 of the circuit board component 30 are integrally formed by a molding process, so as to integrally form the base 22 of the driving component 20 on the circuit board 31 of the circuit board component 30, and the lens carrier component 21 is assembled to the base 22 to form the integrated driving component 20. In other words, in this level, a molded body formed by a molding process is integrally formed with the wiring board, and the drive circuit board 222 and the wiring board 31 are integrally bonded.

It is worth mentioning that, in the third level, the base 22 can be integrally formed on the circuit board 31 of the circuit board assembly 30 by one-time molding or two-time molding.

Specifically, if one-time molding is adopted, in the molding process, the driving circuit board 222 and the circuit board 31 of the camera module 1 are arranged in a molding die at certain positions, and after the molding material is cured and molded, the base 22 of the driving assembly 20 is formed at the corresponding position, wherein the base 22 is integrally molded with the circuit board 31 of the circuit board assembly 30 to simultaneously serve as the mirror base 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20.

If the secondary molding is adopted, in the molding process, the circuit board assembly 30 is molded for the first time to integrally form a base with a certain height on the circuit board 31 of the circuit board assembly 30, and then the driving circuit board 222 of the base 22 is disposed on the top of the base, and the secondary molding is performed to form the base 22, wherein the base 22 serves as the mirror seat 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20 at the same time.

In addition, in order to further improve the compactness of the camera module, the optical lens 10 may be integrated with the lens carrier 213. More specifically, the lens carrier 213 includes a receiving space 2130, and the optical lens 10 is correspondingly received in the receiving space 2130 to be integrated with the lens carrier 213 into a unitary structure. Accordingly, it should be understood by those skilled in the art that when the camera module is an array camera module, the lens carrier 213 has a set of the receiving spaces 2130, and each of the optical lenses 10 is correspondingly received in each of the receiving spaces 2130, respectively, so as to be integrally formed with the lens carrier 213.

Fig. 4A to 4C show a camera module according to another preferred embodiment of the present invention, wherein the camera module 1 includes at least an optical lens 10, a driving assembly 20 and a circuit board assembly 30. The driving assembly 20 is mounted to a mirror base 33 of the circuit board assembly 30. The optical lens 10 is assembled and held in a photosensitive path of a photosensitive element 32 of the circuit board assembly 30 by the driving assembly 20. The driving assembly 20 is configured to drive the optical lens 10 to move, so as to implement auto-focusing and/or optical anti-shake functions of the camera module 1.

As shown in fig. 4A, the driving assembly 20 includes a lens carrier assembly 21 and a base 22, wherein the base 22 is supported on the top side of the lens seat 33 of the circuit board assembly 30, the lens carrier assembly 21 is operably assembled to the base 22, wherein when the lens carrier assembly 21 is in an operating state, the lens carrier assembly 21 can move along with the optical lens 10 to change the relative position relationship between the optical lens 10 and the circuit board assembly 30, so as to achieve the functions of auto-focusing and/or optical anti-shake of the camera module 1, and improve the imaging quality of the camera module 1. Preferably, in the preferred embodiment of the present invention, the base 22 of the driving assembly 20 integrally extends to the mirror base 33 of the circuit board assembly 30, so that the base 22 and the mirror base 33 have an integral structure. Of course, it should be understood by those skilled in the art that in other embodiments of the present invention, the driving assembly 20 may be a split driving assembly, i.e., the driving assembly 20 is a separate component that is attached to the mirror base 33 of the circuit board assembly 30.

As shown in fig. 4A, the lens carrier assembly 21 includes a lens carrier 213, a magnetic element 212 and a coil 211, wherein the lens carrier 213 is used for accommodating the optical lens 10 therein, the magnetic element 212 is disposed on the lens carrier 213, and the coil 211 is correspondingly disposed on the outer side of the magnetic element 212, so that the lens carrier 213 can be driven to move by an electromagnetic induction force between the magnetic element 212 and the coil 211 to change a relative position relationship between the optical lens 10 and the photosensitive element 32, thereby implementing functions such as auto-focusing and/or optical anti-shake.

In particular, in the preferred embodiment of the present invention, the magnetic element 212 is integrally formed with the lens carrier 213, so that the lens carrier assembly 21 has an integral structure. That is, the magnetic element 212 is embedded in the lens carrier 213, so that the structural strength of the lens carrier 213 is enhanced by the magnetic element 212, and the size of the lens carrier 213 can be reduced.

Preferably, the magnetic element 212 is disposed on the lens carrier 213 in a manner of being centrosymmetric with respect to the lens carrier 213. Specifically, in the preferred embodiment of the present invention, the magnetic element 212 includes 4 magnetic units 2120, and the magnetic units 2120 are distributed on the inner side portion 2131 of the lens carrier 213 symmetrically with respect to the center of the lens carrier 213. More preferably, the thickness of the lens carrier 213 is approximately equal to the thickness of the magnetic unit 2120, i.e. the distance from the inner part 2131 of the lens carrier 213 to the outer part 2132 of the lens carrier 213 is approximately equal to the thickness of the magnetic unit 2120, so that when the magnetic unit 2120 is integrally formed on the lens carrier 213, the inner side of the magnetic unit 2120 is located at the inner part 2131 of the lens carrier 213, and the other side of the magnetic unit 2120 is adjacent to the outer part 2132 of the lens carrier 213, so as to ensure the thickness dimension of the lens carrier assembly 21 on the one hand, and on the other hand, the magnetic field generated by the magnetic unit 2120 can sufficiently interact with the coil 211 to realize the functions of auto-focusing or optical anti-shake of the camera module 1.

Of course, those skilled in the art will appreciate that in other embodiments of the present invention, the positions of the magnetic units 2120 in the lens carrier 213 may be changed, for example, the magnetic units 2120 may be partially exposed on the outer side of the lens carrier 213. And are not intended to limit the scope of the present invention.

As shown in fig. 4A, in the preferred embodiment of the present invention, the coil 211 is disposed on the base 22 of the driving assembly 20, and when the lens carrier 213 is assembled on the base 22, the coil 211 is correspondingly disposed on the outer side of the magnetic element 212 to form an "inner and outer magnetic line" structure. When the coil 211 is turned on, the coil 211 interacts with the magnetic element 212 to drive the lens carrier 213 to move along with the optical lens 10, so as to achieve functions of auto-focusing or optical anti-shake of the camera module 1.

More specifically, as shown in fig. 4B and 4C, the coil 211 is disposed at the outer circumferential portion of the base 22, so that when the lens carrier 213 is mounted at the top side of the base 22, the coil 211 is correspondingly disposed at the outer side of each magnet unit 2120 of the magnet element 212 to achieve a compact structure of the "inner and outer magnets".

In the preferred embodiment of the present invention, the coil 211 is also implemented as a circuit board type coil 2111, wherein, as shown in fig. 5A, the circuit board type coil 2111 includes a substrate 21111 and a coil body 21110, wherein the coil body 21110 is integrally formed on the substrate 21111 and is spirally arranged on the substrate 21111. It will be appreciated by those skilled in the art that the magnetic field can be generated by energizing the solenoid based on the electromagnetic effect, and accordingly, in the preferred embodiment of the present invention, when the circuit board coil 2111 is turned on, a stable magnetic field can be generated by the coil body 21110.

More specifically, in a specific implementation, the circuit board type coil 2111 may be prepared through a circuit board corrosion process, a circuit board electroplating process, a circuit board chemical plating process, and a circuit board photolithography process, the substrate 21111 may be a hard board, a soft board, a PCB board, a rigid-flex board, or the like, and the coil body 21110 is formed at a corresponding position of the substrate 21111 through a related process and arranged in a spiral shape. As compared with the conventional coil formed by winding, it is easy for those skilled in the art to think that the coil wire body of the line plate type coil 2111 has a narrower line width and a smaller line pitch, and these technical features give the driving assembly 20 many advantages.

In this preferred embodiment of the present invention, the circuit board type coil 2111 may also be configured to have a multilayer structure in which the circuit board type coils 2111 of different layers are superimposed on each other and conducted to each other to enhance the functional characteristics of the circuit board type coil 2111. In order to better illustrate the technical details of how the multilayer wired board coil 2111 is stacked and conducted, the technical features of the single-layer wired board coil 2111 will be described in detail.

As shown in fig. 5A, the single-layer wire-type coil 2111 has a sheet-like structure, in which the coil body 21110 is integrally formed on the substrate 21111 to form the wire-type coil 2111. Specifically, the coil body 21110 is arranged on the substrate 21111 in a spiral manner so that, after the board coil 2111 is turned on, a current is conducted to the other end of the coil body 21110 along one end of the spiral coil body 21110 to form a stable magnetic field according to the electromagnetic induction effect. It should be noted that the coil body 21110 of the wire board coil 2111 may be laid in other types, such as a concentric square line shape, a concentric circular line shape, and the like.

On the contrary, as shown in fig. 5B, when the line bodies of the line plate type coils 2111 in different layers have different arrangement manners, for example, the line plate type coils 2111 in an upper layer are spirally arranged counterclockwise, and the line plate type coils 2111 in a lower layer are spirally arranged clockwise, at this time, the power input end 21112 of the line plate type coil 2111 in the upper layer is connected to the power output end 21113 of the line plate type coil 2111 in the lower layer, so that the current flowing through the line plate type coil 2111 in the upper layer and the current flowing through the line plate type coil 2111 in the lower layer have the same flow direction, and therefore, the magnetic field formed by the line plate type coil 2111 in the upper layer and the magnetic field formed by the line plate type coil 2111 in the lower layer are mutually strengthened.

In particular, in the preferred embodiment of the present invention, the coil 211 includes 4 pieces of the line plate type coil 2111, and each piece of the line plate type coil 2111 has a multi-layer structure. It should be appreciated that the number of the circuit board coils 2111 corresponds to the number of the magnetic units 2120, wherein when the lens carrier 213 is assembled to the base 22, each of the circuit board coils 2111 corresponds to each of the magnetic units 2120 of the magnetic element 212, so that after the coil 211 of the circuit board 31 is turned on, the lens carrier 213 can be driven to move with the optical lens 10 by the interaction between the circuit board coils 2111 and the magnetic element 212, so as to realize the functions of auto-focusing and/or optical anti-shake of the camera module 1.

More specifically, after the circuit board coils 2111 are conducted by the same current, the circuit board coils 2111 respectively generate magnetic fields with the same magnitude through an electromagnetic induction mechanism, so that the magnetic elements 212 located inside the circuit board coils 2111 are subjected to a vertical force and a horizontal force which are mutually offset, so as to drive the lens carrier 213 to move along the vertical direction, thereby realizing the auto-focusing function of the camera module 1.

When the circuit board coils 211 are selectively turned on, for example, only two pieces of the circuit board coils 2111 are turned on, so that the magnetic elements 212 inside the circuit board coils 2111 are subjected to a vertical force and a horizontal force cannot be cancelled, and the lens carrier 213 can be driven to move along water or an inclined direction, thereby implementing an optical anti-shake function of the camera module 1.

Equivalently, when there is a difference in the conduction current of the coil plate type coil 2111, there is a corresponding difference in the magnitude or direction of the magnetic field generated by the circuit plate type coil 2111 according to the electromagnetic induction mechanism. In this way, the forces applied to the magnetic element 212 in the horizontal direction can also be prevented from canceling each other, so that the lens carrier 213 can be driven to move in the horizontal or inclined direction, thereby implementing the optical anti-shake function of the camera module 1. Here, the difference in the on-currents indicates that there is a difference in the magnitude of the current or a difference in the direction of the current.

In summary, based on the "internal and external magnetic" structure, more selection variables (the magnitude and direction of the conducting current, and the number of the conducting circuit board coils 2111) are provided to control the lens carrier assembly 21 to move differently, so as to realize the functions of auto-focusing and optical anti-shake of the camera module 1.

It should be noted that, in the preferred embodiment of the present invention, the circuit plate coil 2111 and the base 22 may be integrally formed, so that the circuit plate coil 2111 and the base 22 can be more stably combined. The process of integrally molding the circuit board type coil 2111 will be further described in the following detailed description of the base 22 of the driving assembly 20.

As shown in fig. 4A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected and conducted to each other through a connecting portion 223. Specifically, the connecting portion 223 is implemented as a flexible board 2230, so as to connect and conduct the driving circuit board 222 and the circuit board 31 of the camera module 1 through the flexible board 2230. It should be noted that, by electrically connecting the driving component 20 and the circuit board component 30 via the flexible board 2230 instead of the pin-bonding electrical connection, the connection and communication between the driving circuit board 222 and the circuit board 31 can be more stable. And furthermore, the integration of the drive circuit board and the circuit board 31 industry of the camera module is facilitated, so that the modularization and the integration of all circuit boards of the camera module are realized, the universal cooperation among all industries of the camera module is further facilitated, and the integration and the development of the camera module industry are promoted.

It should be noted that, in the preferred embodiment of the present invention, the circuit board type coil 2111 can also be conducted to the driving circuit board 222 through the flexible board 2230, so as to further integrate the circuit board 31 of the camera module 1, the driving circuit board 222 of the driving assembly 20, and the circuit board type coil 2111 into a circuit board chain set having an integrated structure, as shown in fig. 5C.

Further, the driving assembly 20 further includes a limiting element 40, and the limiting element 40 is disposed between the lens carrier assembly 21 and the base 22, so as to precisely limit the movement of the lens carrier assembly 21 by the limiting element 40. More specifically, when the board coil 2111 of the lens carrier assembly 21 is turned on to generate a driving torque, the position limiting element 40 cooperates with the board coil 2111 and the magnetic element 212 to push the lens carrier 213 to move, so as to achieve the functions of auto-focusing and optical anti-shake of the camera module 1. It should be understood by those skilled in the art that the position-limiting element 40 can be implemented as a sliding slot or a ball assembly, etc. to limit the moving state of the lens carrier assembly 21 through the sliding slot or the ball assembly, so as to achieve precise control of the camera module 1.

In the first level, only the driving circuit board 31 and the base body 221 are integrally formed by a molding process, so that the circuit board type coils 2111 are symmetrically attached to the outer periphery of the base body 221, and the assembled driving assembly 20 is mounted on the mirror base 33 of the circuit board assembly 30.

In the second stage, the driving circuit board 31 and the base body 221 are integrally formed by a molding process, and the circuit board type coil 2111 is integrally formed on the outer periphery of the base 22 by a second molding process, so that the assembled driving assembly 20 is mounted on the mirror base 33 of the circuit board assembly 30. It is also feasible to integrally form the driving circuit board 222, the base body 221 and the circuit board type coil 2111 by only one-time molding process, and then mount the assembled driving assembly 20 to the mirror base 33 of the circuit board assembly 30.

In a third level, the driving circuit board 31, the base body 221 and the circuit board coil 2111 are integrally formed by a molding process, wherein the base body 221 continues to extend downward, so that the base 22 of the driving assembly 20 serves as the mirror base 33 of the circuit board assembly 30 after the integrated driving assembly 20 is assembled and attached to the circuit board 31 of the circuit board assembly 30. It is worth mentioning that in this case, the filter of the camera module 1 can be assembled to the base 22 of the driving assembly 20 to further optimize the overall structure and size of the camera module 1.

At a fourth level, the base 22 of the driving component 20 is molded to the circuit board 31 of the circuit board component 30 by a molding process, so that the base 22 and the circuit board 31 have an integral structure and serve as the mirror seat 33 of the circuit board component 30. In other words, at this level, a molded body formed by a molding process is integrally formed with the wiring board 31, and the driver circuit board 222 and the wiring board 31 are integrally bonded.

In the fourth level, in a specific molding process, a single molding process, a two-shot molding process, or a three-shot molding process may be selected to integrally form the base 22 on the circuit board 31.

Specifically, in a one-step molding process, the driving circuit board 222 of the driving assembly 20, the circuit board 31 of the circuit board assembly 30, and the circuit board type coil 2111 are fixed in a mold according to a certain position, and after the mold material is cured, the base 22 of the driving assembly 20 is formed at the corresponding position, wherein the base 22 is integrally formed on the circuit board 31 of the circuit board assembly 30, and the circuit board type coil 2111 is integrally formed on the outer peripheral portion of the base 22.

In the secondary molding process, the driving circuit board 222 of the driving assembly 20 and the circuit board 31 of the circuit board assembly 30 are fixed in a molding mold according to a certain position, and after the molding material is cured and molded, the base 22 of the driving assembly 20 is formed at the corresponding position, wherein the base 22 is molded on the circuit board 31 of the circuit board assembly 30 and serves as the base 22 of the circuit board assembly 30. Then, the wiring board type coil 2111 is integrally molded to the outer peripheral portion of the base 22 by a second molding process.

In the third molding process, the circuit board assembly 30 is first molded to integrally form a base with a certain height on the circuit board 31 of the circuit board assembly 30, the driving circuit board 222 of the driving assembly 20 is disposed on the top of the base, and the second molding is performed to integrally form the base 22, and the circuit board type coil 2111 is disposed on the outer periphery of the base 22, and the third molding is performed to integrally mold the circuit board type coil 2111 on the outer periphery of the base 22. It should be noted that, compared with the primary molding process and the secondary molding process, the positioning difficulty between the parts in the molding process can be effectively reduced by the three-time molding process, so that the overall molding difficulty of the camera module 1 is reduced.

Fig. 6A shows a modified embodiment of the preferred embodiment of the present invention, wherein, in the modified embodiment, the lens carrier assembly 21 includes a lens carrier 213, a coil 211 and a magnetic element 212. The lens carrier 213 is used for accommodating the optical lens 10 therein, the magnetic element 212 is integrally formed on the lens carrier 213, and the coil 211 corresponds to the magnetic element 212, so as to control the moving state of the lens carrier 213 through the interaction between the coil 211 and the magnetic element 212, thereby changing the relative position relationship between the optical lens 10 and the photosensitive element 32 of the circuit board assembly 30, and realizing the functions of auto-focusing and/or optical anti-shake of the camera module 1.

As shown in fig. 6B, in the modified embodiment of the present invention, the coil 211 is formed on the base 22 of the driving assembly 20, and when the lens carrier 213 is assembled on the base 22, the coil 211 is correspondingly disposed below the magnetic element 212 to form a structure of "magnetic lines facing each other", wherein when the coil 211 is turned on, the coil 211 and the magnetic element 212 interact to drive the lens carrier 213 to move with the optical lens 10, so as to implement auto-focusing or optical anti-shake functions of the camera module 1.

In accordance with the embodiment shown in fig. 6C, the coil 211 is a circuit board type coil 2112, wherein the circuit board type coil 2112 is integrally formed on the driving circuit board 222 of the base 22. It should be appreciated that, here, the moving state of the optical lens 10 can be controlled by controlling the correspondence between the circuit board type coil 2112 and the magnetic element 212 and the conduction of the circuit board type coil.

More specifically, when the magnetic field generated by the board coil 2112 causes the magnetic element 212 above the board coil 2112 to receive a force in the vertical direction and a force in the horizontal direction which cancel each other out, the lens carrier 213 here moves in the vertical direction to realize the auto-focus function of the camera module 1. In addition, when the magnetic field generated by the wired circuit board coil 2112 causes the magnetic element 212 above the wired circuit board coil 2112 to receive a vertical force and the horizontal forces cannot cancel each other out, the lens carrier 213 is driven to move along the water or the inclined direction, so as to realize the optical anti-shake function of the camera module 1.

Preferably, in the preferred embodiment of the present invention, the circuit board coils 2112 are distributed in a central symmetry manner with respect to the driving circuit board 222, and each circuit board coil 2112 corresponds to each magnetic unit 2120 of the magnetic element 212, so that the auto-focusing function and/or the optical anti-shake function of the camera module 1 can be realized by controlling the current magnitude and direction of the circuit board coils 2112 or the conducting number of the circuit board coils 2112.

It should be noted that, in the preferred embodiment of the present invention, the circuit board type coil 2112 can be integrally formed on the driving circuit board 222 of the base 22. Wherein the relationship between the driver circuit board 222 and the circuit board coil 2112 with respect to the base 22 is further explained in the following detailed description.

As shown in fig. 6A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected and conducted to each other through a connecting portion 223. Specifically, the connecting portion 223 is implemented as a flexible board 2230, so as to connect and conduct the driving circuit board 222 and the circuit board 31 of the camera module 1 through the flexible board 2230. It should be noted that, instead of the pin soldering electrical connection, the electrical connection between the driving circuit board 222 and the circuit board 31 is made by the flexible board 2230 to electrically connect the driving component 20 and the circuit board component 30. And furthermore, the integration of the drive circuit board and the circuit board 31 industry of the camera module is facilitated, so that the modularization and the integration of all circuit boards of the camera module are realized, the universal cooperation among all industries of the camera module is further facilitated, and the integration and the development of the camera module industry are promoted.

In particular, in this modified embodiment of the present invention, the circuit board type coil 2112 is integrally formed on the driving circuit board 222, and in this way, the circuit board of the camera module 1, the driving circuit board 222 of the driving assembly 20, and the circuit board type coil 2112 are further integrated into an integral structure.

More specifically, in the preferred embodiment of the present invention, the degree of integration between the base 22 and the circuit board assembly 30 of the camera module 1 can be gradually expanded to form an integrated structure of different levels.

In the first stage, only the driving circuit board 31 and the base body 221 are integrally formed by a molding process, wherein the circuit board type coil 2112 is integrally formed on the driving circuit board 222 by a circuit board 31 etching process, so as to mount the assembled driving assembly 20 on the lens holder 33 of the circuit board assembly 30.

In a second level, the driving circuit board 31 and the base body 221 are integrally formed by a molding process, wherein the base body 221 continues to extend downward, so that the base 22 of the driving assembly 20 serves as the mirror base 33 of the circuit board assembly 30 after the integrated driving assembly 20 is assembled and attached to the circuit board 31 of the circuit board assembly 30. It is worth mentioning that in this case, the filter of the camera module 1 can be assembled to the base 22 of the driving assembly 20 to further optimize the overall structure and size of the camera module 1.

In the third stage, the base 22 of the driving component 20 and the circuit board 31 of the circuit board component 30 are integrally formed by a molding process, so that the base 22 of the driving component 20 is integrally formed on the circuit board 31 of the circuit board component 30, and the lens carrier component 21 is assembled to the base 22 to form the integrated driving component 20. It is worth mentioning that, in this case, the base 22 may be integrally molded to the circuit board of the circuit board assembly 30 by one-time molding or two-time molding.

Specifically, in a one-time molding process, the driving circuit board 31 and the circuit board 31 of the camera module 1 are fixed in position in the molding die, and after the molding material is cured and molded, the base 22 of the driving assembly 20 is formed in the corresponding position, wherein the base 22 is integrally formed with the circuit board 31 of the circuit board assembly 30 to serve as the mirror base 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20 at the same time.

In the secondary molding process, the circuit board assembly 30 is first molded to form a base with a certain height integrally on the circuit board 31 of the circuit board assembly 30, and then the driving circuit board 222 of the driving assembly 20 is disposed on the top of the base, and the base 22 is molded for the second time, wherein the base 22 serves as both the mirror base 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20.

In the preferred embodiment of the present invention, the degree of integration between the base 22 and the circuit board assembly 30 of the camera module 1 can be gradually expanded to form an integrated structure of different levels.

Fig. 7A shows another variant of the above preferred embodiment of the present invention, wherein, in this variant, the lens carrier assembly 21 includes a lens carrier 213, a coil 211 and a magnetic element 212. The lens carrier 213 is used for accommodating the optical lens 10 therein, the magnetic element 212 is integrally formed on the lens carrier 213, and the coil 211 corresponds to the magnetic element 212, so as to control the moving state of the lens carrier 213 through the interaction between the coil 211 and the magnetic element 212, thereby changing the relative position relationship between the optical lens 10 and the photosensitive element 32 of the circuit board assembly 30, and realizing the functions of auto-focusing and/or optical anti-shake of the camera module 1. As shown in fig. 7A, the coil 211 is disposed on the outer periphery of the base 22 and the driving circuit board 222 of the base 22, so that when the coil 211 is turned on, the coil 211 interacts with the magnetic element 212 to drive the lens carrier 213 to move along with the optical lens 10.

As shown in fig. 7B and 7C, the coil 211 is implemented as a board coil 2111, wherein the board coil 2111 attached to the outer peripheral portion of the base 22 corresponds to at least one magnetic unit 2120 of the magnetic element 212, and the board coil 2112 provided on the driving circuit board 222 is correspondingly located below the magnetic unit 2120 of the magnetic element 212. Accordingly, the circuit board type coil 2111 attached to the outer peripheral portion of the base 22 is used to control the vertical movement of the optical lens 10, so as to realize the auto-focusing function of the camera module 1. In addition, the circuit board type coil 2112 disposed on the driving circuit board 222 is used to control the horizontal or tilting motion of the optical lens 10, so as to realize the optical anti-shake function of the camera module 1.

It should be noted that the circuit board type coil 2111 may be integrally formed on the base 22, that is, the circuit board type coil 2111 disposed on the outer periphery of the base 22 is integrally formed on the outer periphery of the base 22, and meanwhile, the circuit board type coil 2112 disposed on the driving circuit board 222 is integrally formed on the driving circuit board 222. The relationship between the driver circuit board 222 and the circuit board coil 2111 with respect to the base 22 will be further explained in detail later with respect to the base 22.

As shown in fig. 7A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected and conducted to each other through a connecting portion 223. Specifically, the connecting portion 223 is implemented as a flexible board 2230, so as to connect and conduct the driving circuit board 222 and the circuit board 31 of the camera module 1 through the flexible board 2230. It should be noted that, instead of the pin soldering electrical connection, the electrical connection between the driving circuit board 222 and the circuit board 31 is made by the flexible board 2230 to electrically connect the driving component 20 and the circuit board component 30. And furthermore, the integration of the drive circuit board and the circuit board 31 industry of the camera module is facilitated, so that the modularization and the integration of all circuit boards of the camera module are realized, the universal cooperation among all industries of the camera module is further facilitated, and the integration and the development of the camera module industry are promoted.

It should be noted that the circuit board type coil 2112 disposed on the driving circuit board 222 is integrally formed on the driving circuit board 222 through a circuit board etching process. The circuit board type coil 2111 disposed on the outer periphery of the base 22 may be connected to the driving circuit board 222 through the flexible board 2230 and electrically connected to each other, so that the circuit board 31 of the camera module 1, the driving circuit board 222 of the driving module 20, and the circuit board type coil 2111 are integrated into an integrated structure.

In the first level, only the driving circuit board 31 and the base body 221 are integrally formed by a molding process, wherein the circuit board type coil 2112 disposed on the driving circuit board 222 is integrally formed on the driving circuit board 222 by an etching process of the circuit board 31, the circuit board type coil 2111 disposed on the outer periphery of the base 22 is attached to the outer periphery of the base body 221, and the assembled driving assembly 20 is mounted on the lens holder 33 of the circuit board assembly 30.

In the second stage, the driving circuit board 31 and the base body 221 are integrally formed by a molding process, and the circuit board type coil 2111 is integrally formed on the outer periphery of the base 22 by a secondary molding process, so that the assembled driving assembly 20 is mounted on the lens holder 33 of the circuit board assembly 30. Equivalently, the driving circuit board 31, the base body 221 and the circuit board type coil 2111 may be integrally formed by a one-time molding process, and the assembled driving assembly 20 may be further mounted to the mirror base 33 of the circuit board assembly 30.

At a fourth level, the base 22 of the driving component 20 is molded on the circuit board 31 of the camera module 1 by a molding process, so that the base 22 and the circuit board 31 have an integral structure, and the base 22 serves as the lens holder 33 of the circuit board component 30, in this case, the base 22 of the driving component 20 is integrally molded on the circuit board 31 of the circuit board component 30, and then the lens carrier component 21 is assembled to the base 22 to form the integral driving component 20. It is worth mentioning that in the integration process of the fourth level, one-time molding, two-time molding and three-time molding can be selected.

As shown in fig. 8, the present invention further provides an electronic device 80, wherein the electronic device 80 includes an electronic device body 81 and the camera module 1 provided by the present invention, and the camera module 1 collects and provides image information for the electronic device body 81. It should be noted that the camera module 1 provided by the present invention is a moving-focus camera module 1, and has a smaller and more compact structure, so that the camera module 1 can be applied to a wider range of electronic devices 80, and better adapt to the inevitable trend of "thinning" of the electronic devices 80.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been fully shown and described in the examples, and the embodiments of the present invention may be modified or adapted in any manner without departing from such principles.

Claims

A drive assembly, comprising:

a magnetic element;

a coil; and

the lens carrier is used for carrying an optical lens therein, the coil and the lens carrier are integrally formed, and the magnetic elements are arranged on the outer side of the coil at intervals and correspondingly, so that when the coil is conducted, the coil and the magnetic elements interact with each other to drive the lens carrier to carry the optical lens to move.
The drive assembly of claim 1, wherein the coil is a circuit board coil, wherein the circuit board coil comprises a substrate and a coil body integrally formed on the substrate and spirally disposed on the substrate such that a magnetic field is generated by the circuit board coil when the coil body is turned on.
The driving assembly of claim 2, wherein the substrate has a planar shape, and the coil body is spirally formed on a surface of the substrate.
A drive assembly according to claim 2 or 3, wherein the plate coils are stacked on top of each other such that the coils have a multi-layer structure in which each layer of the plate coils is in conduction with each other.
The driving assembly as claimed in claim 4, wherein each layer of the land coil has an incoming end and an outgoing end opposite to the incoming end, wherein when the land coils of different layers have spiral shapes with the same direction, the incoming end of the land coil of an upper layer is electrically connected to the outgoing end of the land coil of a lower layer, so that the current of the land coils of different layers has the same flow direction.
The driving assembly as claimed in claim 4, wherein each layer of the plate coils has an incoming end and an outgoing end opposite to the incoming end, wherein when the plate coils of different layers have opposite spiral shapes, the incoming end of the plate coil of the circuit board located at the upper layer is electrically connected to the proximal end of the plate coil of the circuit board located at the lower layer, so that the current of the plate coils of the circuit board located at different layers has the same flow direction.
The driving assembly according to any one of claims 1 to 6, further comprising a magnetic element carrier movably nested outside the lens carrier, wherein the magnetic element is mounted to the magnetic element carrier such that the magnetic element is disposed outside the coil in a spaced and corresponding manner.
The driving assembly according to claim 7, further comprising a driving circuit board electrically connected to the circuit board, wherein the driving circuit board further comprises a control coil, the control coil is a circuit board type coil and is integrally formed on a surface of the driving circuit board, wherein the control coil corresponds to a bottom side of the magnetic element and is configured to interact with the magnetic element to drive the magnetic element carrier, so that the lens carrier is driven by the magnetic element carrier to move while carrying the optical lens.
The drive assembly of claim 8, further comprising a base body for mounting the drive circuit board to form a base for the drive assembly.
A drive assembly, comprising:

a magnetic element;

a coil; and

a lens carrier; the lens carrier is used for carrying an optical lens therein, wherein the magnetic element and the lens carrier are integrally formed, and the coil is spaced from the magnetic element and corresponds to the magnetic element, so that when the coil is conducted, the coil and the magnetic element interact with each other to drive the lens carrier to carry the optical lens to move.
The drive assembly of claim 10, wherein the coil is a circuit board coil, wherein the circuit board coil comprises a substrate and a coil body integrally formed on the substrate and spirally disposed on the substrate such that a magnetic field is generated by the circuit board coil when the coil body is turned on.
The driving assembly of claim 11, wherein the substrate has a planar shape, and the coil body is spirally formed on a surface of the substrate.
The drive assembly of claim 11 or 12, wherein the plate-type coils are stacked on each other such that the coils have a multi-layered structure in which each layer of the plate-type coils is in conduction with each other.
The driving assembly as claimed in claim 13, wherein each layer of the land coil has an incoming end and an outgoing end opposite to the incoming end, wherein when the land coils of different layers have spiral shapes with the same direction, the incoming end of the land coil of an upper layer is electrically connected to the outgoing end of the land coil of a lower layer, so that the current of the land coils of different layers has the same flow direction.
The driving assembly according to any one of claims 11 to 14, wherein the circuit board coils are disposed at intervals and correspondingly outside the magnetic element.
The drive assembly of claim 10, wherein the magnetic element is embedded in the lens carrier adjacent to an inner side of the lens carrier.
The driving assembly as claimed in claim 10, further comprising a driving circuit board, wherein the circuit board type coils are electrically connected to the driving circuit board through a flexible board, respectively.
The driving assembly as claimed in any one of claims 11 to 14, further comprising a driving circuit board and a base body, wherein the line plate type coils are integrally formed on a surface of the driving circuit board and respectively correspond to bottom sides of the magnetic elements.
The driving assembly according to any one of claims 11 to 14, further comprising a driving circuit board, wherein a portion of the plate-type coils are disposed at intervals and correspondingly outside the magnetic element, and another portion of the plate-type coils are integrally formed on a surface of the driving circuit board, so that the another portion of the plate-type coils are respectively at intervals and correspondingly correspond to a bottom side of the magnetic element.
The driving assembly as claimed in claim 19, wherein the circuit board type coils disposed at intervals and correspondingly outside the magnetic element are electrically connected to the driving circuit board through a flexible board.
The drive assembly of any of claims 17 to 20, further comprising a base body for mounting the drive circuit board to form a base for the drive assembly.
A camera module, comprising:

an optical lens;

the drive assembly of any one of claims 1 to 21; and

a circuit board assembly, wherein the circuit board assembly includes a circuit board, a photosensitive element and a lens holder, the photosensitive element is electrically connected to the circuit board, the lens holder is supported by the circuit board and configured to mount the driving assembly thereon, wherein the optical lens is mounted to the driving assembly so as to be held in a photosensitive path of the photosensitive element.
The camera module of claim 22, further comprising a flexible board extending between the driver circuit board and the circuit board for electrically connecting the driver assembly to the circuit board.
The camera module of claim 22 or 23, wherein the lens mount of the circuit board assembly and the base of the drive assembly are integrally formed.
The camera module of claim 15, wherein the lens mount of the circuit board assembly and the base of the driver assembly are integrally formed with the circuit board of the circuit board assembly.
An electronic device, comprising:

a camera module according to any one of claims 22 to 25; and

the camera module is assembled on the electronic equipment body.