CN108989629B

CN108989629B - Driving assembly, camera module and electronic equipment thereof

Info

Publication number: CN108989629B
Application number: CN201810552442.5A
Authority: CN
Inventors: 王明珠; 姚立锋; 张建龙; 方银丽; 陈振宇; 郭楠; 陈飞帆; 吴业
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-06-02
Filing date: 2018-05-31
Publication date: 2023-06-30
Anticipated expiration: 2038-05-31
Also published as: WO2018219324A1; CN209046728U; CN208581284U; CN108989630A; CN110692232A; CN108989629A

Abstract

The camera comprises a driving assembly, a camera module and electronic equipment thereof, wherein the driving assembly comprises a magnetic element and a coil; a lens carrier; the lens carrier is used for bearing an optical lens therein, wherein the magnetic element and the lens carrier are integrally formed, and the coil is spaced from and corresponds to the magnetic element, so that when the coil is conducted, the coil interacts with the magnetic element to drive the lens carrier to bear the optical lens for movement. In this way, the drive assembly is made to be of a more compact size.

Description

Driving assembly, camera module and electronic equipment thereof

Technical Field

The present invention relates to the field of optics, and more particularly, to a driving assembly, a camera module and an electronic device thereof.

Background

With the progress and development of technology, electronic devices and intelligent devices are increasingly moving toward high performance and light and thin, and camera modules, which are one of core configurations of electronic products and intelligent devices, are necessarily required to be adaptively adjusted in terms of performance and size. Accordingly, in the process of the technological innovation, each component of the camera module needs to make corresponding changes in performance and size.

As shown in fig. 1, the conventional camera module with a driver includes an optical lens 10P, a driver 20P and a circuit board assembly 30P, wherein the optical lens 10P is held on a photosensitive path of a photosensitive chip 32P of the circuit board assembly 30P by the driver 20P. The driver 20P can drive the optical lens 10P to move, so as to achieve the functions of auto-focusing and optical anti-shake of the camera module. The conventional driver 20P is usually assembled as a separate accessory on a lens holder 33P of the circuit board assembly, and then a set of pins of the driver 20P are electrically connected to a circuit board 31P of the circuit board assembly by soldering or the like to conduct the circuit board assembly 30P and the driver 20P, so that the circuit board assembly 30P can provide the driver 20P with the electric energy required for operation. However, the existing driver 20P has many drawbacks in practical applications.

First, the driver 20P is mounted on the top surface of the lens holder 33P of the circuit board assembly 30P and is used for mounting the optical lens 10P, so that in order to ensure the precision of the fitting of the optical lens and the circuit board assembly, the precision of the fitting of the driver 20P and the circuit board assembly 30P needs to be ensured. In other words, if there is a tilt or offset of the driver 20P and the circuit board assembly 30P during the assembly of the driver 20P, this error will be transferred between the optical lens 10P and the photosensitive element 32P of the circuit board assembly 30P to affect the imaging quality.

Next, the pins of the driver 20 are typically connected to the circuit board 31P of the circuit board assembly 30P by soldering to provide power and control signals to the driver through the circuit board 31P. Accordingly, during the soldering process, on one hand, other electronic components assembled on the circuit board assembly 30P should be prevented from being contaminated by soldering materials, especially the photosensitive element 32P of the circuit board assembly 30P, i.e. the soldering process is difficult. In a further step, even if the soldering process is perfectly carried out, however, since the soldering material itself has a large resistance, the soldering material is conducted to generate a large amount of heat during operation, which clearly puts higher demands on the heat dissipation of the circuit board.

It should be noted that, to ensure the stability of the soldering, the area of the soldering area is generally increased appropriately, which certainly affects the overall aesthetic appearance of the structure of the circuit board assembly 30P: solder material is applied to the circuit board 31P like a patch. In addition, during the subsequent use, the pins of the driver 20P may be separated from the circuit board 31P due to vibration, shock, etc., so as to cause an open circuit fault. Further, the driver 20P is slightly moved in the process of soldering the pins of the driver 20P to the wiring board 31P. Meanwhile, due to the uneven welding materials of the pins, the stress between the pins of the driver 20P and the circuit board 31P is different, so that there are matching tolerances such as inclination and offset between the driver 20P and the lens base 33P, thereby affecting the matching precision between the optical lens 10P and the photosensitive element 31P. In other words, the existing soldering process is difficult to meet the packaging requirement of the camera module.

Further, the actuator 20P operates by law of electromagnetic induction, and includes a coil 211P, a magnetic element 212P and a lens carrier 213P. Generally, the coil 211P is wound on the outer side of the lens carrier 213P by a winding manner, and interacts with the magnetic element 212P to form a driving force after being electrified, so as to drive the optical lens 10P to move, thereby changing the relative position relationship between the optical lens and the photosensitive chip 32P, so as to realize functions of auto-focusing, optical anti-shake, and the like. However, the existing driver 20P has a number of drawbacks in terms of structure and performance.

Specifically, the coil 211P of the conventional driver 20P is generally formed at the side of the lens carrier 213P using a wire winding manner, and the coil body 211P is fastened and tightly bound to the side of the lens carrier 213P in order to ensure that a stable magnetic field can be formed after power is applied. Thus, not only the lens carrier 213P itself needs to have a sufficient strength, but also the coil wire body 211P itself needs to have a certain strength. In other words, when the coil 211P is formed on the side of the lens carrier 213P in a winding manner, it is necessary to appropriately increase the thickness of the lens carrier 213P and the diameter of the wire body of the coil 211P to ensure that the lens carrier 213P is not deformed and the coil 211P is not broken during the winding process of the coil 211P.

It is well known that the strength of the magnetic field produced by a coil is affected by the number of turns of the coil, and that the number of turns of the coil at the same volume is limited by the diameter of the wire body. However, in the coil 211P of the existing driver 20P, the diameter of the coil 211P wire body needs to be increased accordingly, resulting in a decrease in the relative number of turns of the coil at the same volume, due to the requirement of the coil 211P wire body itself for strength. For example, taking the coil 211P of the conventional sound motor driver 20P as an example, the coil 211P has a line width of 40-50 μm, a line pitch (assuming a tight winding and a 2-fold insulation layer thickness) of 10 μm to 20, and a number of turns ranging from 50-70 (axis parallel direction 4-8 layers, vertical direction single side 5-12 layers).

Further, during the winding process of the coil 211P, the coil body 211P is tightly wound around the side of the lens carrier 213P, and the gap between every two turns of the coil is reduced as much as possible. Thus, the magnetic field generated by electromagnetic induction after the coil 211P is energized is uniform and controllable. However, in the actual winding process, since the coil wire body 211P is generally elongated and circular and has a certain diameter, the coil 211P cannot be completely bonded between every two turns, so that a certain gap exists between the coils 211P, and as the number of turns of the coil 211P increases, the gap between the coil wire bodies 211P is accumulated to ultimately affect the characteristics of the magnetic field.

In addition, during the assembly process of the existing driver 20P, a positioning structure and a safety space need to be reserved for the subsequent installation of the magnetic element 212P, and a certain installation tolerance needs to be preset for the magnetic element 212P in order to facilitate the later calibration and adjustment, and these structural design requirements will result in a corresponding increase in the size of the driver 20P.

Disclosure of Invention

An object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the driving assembly includes a base and a lens carrier assembly movably assembled on the base, and when the lens carrier assembly is triggered, the lens carrier assembly can drive an optical lens mounted on the lens carrier assembly to move so as to achieve functions of auto-focusing and/or optical anti-shake.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein in an embodiment of the present invention, the lens carrier assembly includes a coil and a lens carrier, and the coil is integrally formed with the lens carrier (e.g. by a molding process) to reduce the size of the lens carrier assembly.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic device thereof, in which, since the coil is integrally formed on the lens carrier, on one hand, the structural strength of the lens carrier can be enhanced by the coil, and on the other hand, the strength requirement of the coil on the lens carrier is reduced, so that the thickness dimension of the lens carrier can be reduced, and the requirement of miniaturization dimension can be met.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein in one embodiment of the present invention, the coil is a circuit board type coil, and includes a substrate and a coil body, wherein the coil body is integrally formed on the substrate and is spirally arranged on the substrate, and the coil body can generate a stable magnetic field when the circuit board type coil is turned on.

Another object of the present invention is to provide a driving assembly, an image pickup module, and an electronic device thereof, in which the coil wire body of the circuit board type coil can have a diameter substantially smaller than a normal operable diameter, so that the circuit board type coil having the same number of turns has a relatively smaller size than the conventional circuit board type coil formed by winding, which is advantageous for further downsizing the driving assembly.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic device thereof, in which the number of turns of the circuit board type coil can be greatly increased under the same volume compared with the existing coil formed by winding, so that the magnetic field strength required for obtaining the same driving force can be relatively reduced, that is, the volume of the magnetic element corresponding to the coil can be further reduced, which is beneficial to further compressing the overall size of the driving assembly.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic device thereof, wherein the circuit board type coil has relatively more turns, so that the current conducted to the circuit board type coil can be properly reduced, and the circuit board type coil has great advantages in aspects of size, power consumption, material cost, and the like.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by a circuit board etching process and is disposed on the substrate in a spiral arrangement.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by a circuit board electroplating process and is arranged on the substrate in a nearly concentric spiral manner, in such a manner that the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism after the circuit board type coil is conducted.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by a circuit board plating process and is arranged on the substrate in a nearly concentric spiral manner, in this way, when the circuit board type coil is conducted, the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the circuit board type coil is formed on the substrate by photolithography and is arranged on the substrate in a nearly concentric spiral manner, in such a way, when the circuit board type coil is conducted, the circuit board type coil can generate a stable magnetic field according to an electromagnetic induction mechanism.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the coil bodies of the circuit board type coils are in the same plane, so that the space occupied by the circuit board type coils is effectively reduced, and the overall size of the image capturing module and the driving assembly is further reduced.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the substrate of the circuit board coil has a multi-layer structure, each layer of the substrate is provided with at least one coil body, and the coil bodies of different layers are mutually conducted and overlapped, so as to effectively enhance or control the intensity of the magnetic field generated by the circuit board coil.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic device thereof, in which the magnetic element is disposed at an outer side of the lens carrier at intervals and does not physically contact the lens carrier and the coil, so that after the coil is conducted, according to an electromagnetic induction principle, a magnetic field can be generated by the energized coil, and the magnetic field interacts with a magnetic field provided by the magnetic element, so as to achieve functions of auto focusing, optical zooming, or optical anti-shake of the image capturing module.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the magnetic elements are distributed on the outer side of the lens carrier assembly at intervals and symmetrically through a magnetic element carrier, the lens carrier assembly is movably nested in the magnetic element carrier, and the lens carrier assembly and the magnetic element carrier can freely move relative to each other, so that when the coil of the lens carrier assembly is conducted and interacts with the magnetic element, the optical lens is driven to move, thereby realizing functions such as auto focusing and/or anti-shake functions of the image capturing module.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the base is further provided with a control coil and a driving circuit board, the control coil is implemented as a circuit board type coil and integrally formed on the driving circuit board, and the control coil is configured to drive the magnetic element carrier to move horizontally or obliquely, so that the lens carrier and the lens are synchronously moved to realize the optical anti-shake function of the image capturing module.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic device thereof, wherein the driving circuit board of the base and the circuit board of the circuit board assembly are connected and conducted with each other through a flexible board, and compared with the existing driver, the structure design and steps of the existing driver connection pins and soldering can be omitted, thereby effectively avoiding adverse effects caused in the soldering process.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the driving circuit board of the base and the circuit board of the circuit board assembly are connected by a flexible board, so that connection and communication between the driving circuit board and the circuit board of the camera module are more stable, and from a deeper aspect, the driving circuit board and the camera module circuit board industry can be integrated in such a way, so as to realize modularization and integration between all circuit boards of the camera module, thereby being beneficial to enhancing cooperation between industry chains of the camera module and promoting integration and development of the camera module industry.

Another object of the present invention is to provide a driving assembly, a camera module and an electronic device thereof, wherein the base can be further integrally formed with the circuit board assembly, so that the camera module and the driving assembly have a more compact and smaller integrated structure.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein in an embodiment of the present invention, the lens carrier assembly includes a lens carrier and a set of magnetic elements, wherein the magnetic elements are integrally formed on the lens carrier, for example, by a molding process, so as to reduce the thickness of the lens carrier assembly.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic apparatus thereof, wherein the magnetic element is disposed near an inner side portion of the lens carrier during an integral molding process of the lens carrier assembly, such that a thickness dimension of the lens carrier assembly is reduced to a limited extent, and the magnetic element can effectively strengthen a strength of the lens carrier.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the lens carrier assembly further includes a coil, wherein the coil is a circuit board type coil and is symmetrically disposed at an outer peripheral portion of the base of the driving assembly, and when the lens carrier is assembled to the base, the coil is correspondingly located at an outer side of the magnetic element to form an "inner magnetic and outer line" structure, and when the coil is turned on, the coil interacts with the magnetic element to drive the lens carrier to carry the optical lens to move, thereby achieving the functions of auto focusing or optical anti-shake of the image capturing module.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the circuit board type coil is further connected to and conducted with the driving circuit board of the base through a flexible board, so as to further integrate the circuit board of the image capturing module, the driving circuit board of the driving assembly, and the circuit board type coil into an integrated structure.

Another object of the present invention is to provide a driving assembly, an image capturing module, and an electronic apparatus thereof, in which the circuit board type coil is integrally formed on the outer circumference of the base body through a molding process, so that the driving assembly further has a more compact and small size structure.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the lens carrier assembly further includes a coil, the coil is a circuit board type coil and is integrally formed on the driving circuit board of the base, and when the lens carrier is assembled on the base, the coil is correspondingly located below the magnetic element to form a "magnetically opposite" structure, so that when the coil is conducted, the coil interacts with the magnetic element to drive the lens carrier to carry the optical lens to move, thereby achieving the functions of auto focusing or optical anti-shake of the image capturing module.

Another object of the present invention is to provide a driving assembly, an image capturing module and an electronic device thereof, wherein the lens carrier assembly further includes a coil, wherein the coil is implemented as a circuit board type coil, wherein the circuit board type coil is disposed on the outer peripheral portion of the base and the driving circuit board of the base at the same time, so that when the coil is turned on, the coil interacts with the magnetic element to drive the lens carrier to carry the optical lens to move, thereby achieving the functions of auto focusing or optical anti-shake of the image capturing module.

To achieve the above object, the present invention provides a driving assembly comprising:

a magnetic element;

a coil; and

a lens carrier; the lens carrier is used for bearing an optical lens therein, wherein the magnetic element and the lens carrier are integrally formed, and the coil is spaced from and corresponds to the magnetic element, so that when the coil is conducted, the coil interacts with the magnetic element to drive the lens carrier to bear the optical lens for movement.

In an embodiment of the invention, the coil is a circuit board type coil, wherein the circuit board type coil includes a substrate and a coil body, and the coil body is integrally formed on the substrate and spirally arranged on the substrate, so that a magnetic field can be generated by the circuit board type coil after the coil body is conducted.

In an embodiment of the present invention, the substrate has a planar shape, and the coil body is formed on a surface of the substrate in a spiral shape.

In an embodiment of the invention, the circuit board-type coils are stacked on each other such that the coils have a multi-layer structure in which each layer of the circuit board-type coils are conducted to each other.

In an embodiment of the present invention, each layer of the circuit board type coils has an electrical inlet end and an electrical outlet end opposite to the electrical inlet end, wherein when the circuit board type coils of different layers have a spiral shape with the same direction, the electrical inlet ends of the circuit board type coils of the upper layer are electrically connected to the electrical outlet ends of the circuit board type coils of the lower layer, so that the currents of the circuit board type coils of different layers have the same flow direction.

In an embodiment of the invention, the circuit board type coils are disposed at intervals and correspondingly outside the magnetic element.

In an embodiment of the invention, the magnetic element is embedded in the lens carrier and is adjacent to the inner side of the lens carrier.

In an embodiment of the invention, the circuit board type coil is further electrically connected to the driving circuit board through a flexible board.

In an embodiment of the invention, the circuit board coil further comprises a driving circuit board and a base body, wherein the circuit board type coil is integrally formed on the surface of the driving circuit board and corresponds to the bottom sides of the magnetic elements respectively.

In an embodiment of the invention, the circuit board further includes a driving circuit board, wherein a part of the circuit board coils are disposed at intervals and correspondingly outside the magnetic element, and another part of the circuit board coils are integrally formed on the surface of the driving circuit board, so that the other part of the circuit board coils are respectively spaced and correspond to the bottom side of the magnetic element.

In an embodiment of the invention, the circuit board coils are respectively and electrically connected to the driving circuit board through a flexible board.

In an embodiment of the present invention, the driving module further includes a base body for mounting the driving circuit board, so as to form a base of the driving module.

According to another aspect of the present invention, there is provided an image capturing module, including:

an optical lens;

a drive assembly as described above; and

The circuit board assembly comprises a circuit board, a photosensitive element and a lens seat, wherein the photosensitive element is electrically connected to the circuit board, the lens seat is supported on the circuit board and is used for installing the driving assembly on the circuit board, and the optical lens is installed on the driving assembly so as to be kept on a photosensitive path of the photosensitive element.

In an embodiment of the invention, the flexible board extends between the driving circuit board and the circuit board to electrically connect the driving assembly to the circuit board.

In an embodiment of the present invention, the lens base of the circuit board assembly and the base of the driving assembly are integrally formed.

In an embodiment of the invention, the lens base of the circuit board assembly and the base of the driving assembly are integrally formed with the circuit board of the circuit board assembly.

According to another aspect of the present invention, there is also provided an electronic apparatus, including:

a camera module as described above; and

the camera module is assembled on the electronic equipment body.

Further objects and advantages of the present invention will become fully apparent from the following description and the accompanying drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

Fig. 1 is a perspective exploded view of a prior art actuator.

Fig. 2A is a schematic diagram of an image capturing module according to a preferred embodiment of the invention.

Fig. 2B and 2C are schematic diagrams showing relative position distribution of the coil and the magnetic element of the driving assembly according to the above preferred embodiment.

Fig. 3A is a modified implementation of the camera module according to the above preferred embodiment of the present invention.

Fig. 3B and 3C are schematic diagrams of relative position distribution of the coil and the magnetic element of the drive assembly implemented according to variations of the preferred embodiments described above.

Fig. 4A is a schematic diagram of an image capturing module according to another preferred embodiment of the present invention.

Fig. 4B and 4C are schematic diagrams of relative position distribution of the coil and the magnetic element of the driving assembly according to another preferred embodiment.

Fig. 5A is a schematic view of the wiring board type coil according to another preferred embodiment described above.

Fig. 5B is another schematic view of the wiring board type coil according to another preferred embodiment described above.

Fig. 5C is an assembly schematic diagram of the driving circuit board and the board-type coil according to another preferred example.

Fig. 6A is a schematic view of a variant embodiment of the camera module according to another preferred embodiment.

Fig. 6B and 6C are schematic diagrams of relative position distribution of the coils and the magnetic elements of the drive assembly of the camera module according to the embodiment of fig. 6A.

Fig. 7A is a schematic view of still another variant of the camera module according to the above another preferred embodiment.

Fig. 7B and 7C are schematic diagrams of relative position distribution of the coil and the magnetic element of the driving assembly of the camera module according to the embodiment shown in fig. 7A.

Fig. 8 is a schematic perspective view of an electronic device according to the present invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

As shown in fig. 2A to 2C, an image capturing module 1 according to a preferred embodiment of the present invention may be applied to various electronic devices 80, such as, but not limited to, smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, etc., and the image capturing module 1 cooperates with the electronic devices 80 to implement image capturing and reproducing functions of a target object.

More specifically, the camera module 1 includes at least one optical lens 10, a driving assembly 20 and a circuit board assembly 30. The drive assembly 20 is mounted to the top side of the circuit board assembly 30, more specifically, the drive assembly 20 is mounted to a lens mount 33 of the circuit board assembly 30. The optical lens 10 is assembled and held on a photosensitive path of a photosensitive element 32 of the circuit board assembly 30 by the driving assembly 20. The driving component 20 is configured to drive the optical lens 10 to move, so as to achieve the functions of auto-focusing and/or optical anti-shake of the camera module 1. It should be understood by those skilled in the art that, in other embodiments of the present invention, the number of the optical lenses 10 of the camera module 1 may be more than one, and each of the optical lenses 10 is correspondingly assembled to the driving component 20, that is, the camera module 1 may be implemented as an array camera module. Here, the image capturing module 1 is illustrated by taking only one optical lens 10 as an example in the present application, and it should be appreciated that the number of optical lenses 10 does not affect the scope of the present invention.

As shown in fig. 2A, the driving assembly 20 includes a lens carrier assembly 21 and a base 22, wherein the base 22 is supported on a top side of the lens holder 33 of the circuit board assembly 30, and the lens carrier assembly 21 is operatively assembled to the base 22, wherein when the lens carrier assembly 21 is in an operating state, the lens carrier assembly 21 can carry the optical lens 10 to move so as to change a relative positional relationship between the optical lens 10 and the circuit board assembly 30, thereby implementing functions such as auto-focusing and/or optical anti-shake of the camera module 1, so as to improve an imaging quality of the camera module 1. Preferably, in the preferred embodiment of the present invention, the base 22 of the driving assembly 20 is integrally extended to the lens holder 33 of the circuit board assembly 30, such that the base 22 and the lens holder 33 have a unitary structure. Of course, those skilled in the art will appreciate that in other embodiments of the present invention, the drive assembly 20 may be a split drive assembly, i.e., the drive assembly 20 is a separate component that is attached to the lens mount 33 of the circuit board assembly 30.

Those skilled in the art will appreciate that the drive assembly 20 operates based on electromagnetic induction principles. As shown in fig. 2A, the lens carrier assembly 21 includes a lens carrier 213, a coil 211, and a set of magnetic elements 212. The lens carrier 213 is configured to house the optical lens 10 therein, the coil 211 is disposed on the lens carrier 213, and the magnetic element 212 is correspondingly disposed on the outer side of the coil 211, so that the lens carrier 213 can be driven to move by electromagnetic induction force of the coil 211 and the magnetic element 212 to change a relative position between the optical lens 10 and the photosensitive element 32 of the circuit board assembly 30, thereby achieving functions such as auto-focusing and/or optical anti-shake.

In particular, in the preferred embodiment of the present invention, the coil 211 is integrally formed with the lens carrier 213, so that the lens carrier assembly 21 has a unitary structure. Here, the coil 211 is integrally formed with the lens carrier 213, in other words, the coil 211 forms a part of the lens carrier 213, compared to the conventional coil 211 formed by a wire winding method, thereby effectively reducing the thickness dimension of the lens carrier assembly 21. Meanwhile, since the coil 211 and the lens carrier assembly 21 are integrally formed, there is no interaction force between the coil 211 and the lens carrier 213, so that the strength requirement of the lens carrier 213 can be further reduced. It should be noted that, just as the lens carrier 213 and the coil 211 have an integral structure, the coil 211 instead reinforces the lens carrier 213, so that the thickness dimension of the lens carrier 213 can be further reduced. In addition, due to the special arrangement between the coil 211 and the lens carrier 213, the coil 211 does not need to be formed on the outer peripheral wall of the lens carrier 213 by winding, so that the strength requirement for the coil body can be relatively low. That is, if the existing wire-type coil is still employed, the diameter of the coil wire can be reduced to facilitate satisfying the number of turns and the size requirement of the coil.

In particular, in the preferred embodiment of the present invention, the coil 211 is implemented as a circuit board-like coil 2111, and the circuit board-like coil 2111 is disposed on the lens carrier 213 so as to interact with the magnetic element 212 when the circuit board-like coil 2111 is excited, thereby driving the lens carrier 213 to move to change the relative positional relationship between the optical lens 10 and the circuit board assembly 30, and realizing the functions of auto-focusing and/or optical anti-shake of the image pickup module 1.

More specifically, as shown in fig. 2B, the track plate coil 2111 includes a base plate 21111 and a coil body 21110, wherein the coil body 21110 is integrally formed on the base plate 21111 and is arranged in a spiral shape on the base plate 21111. It will be appreciated by those skilled in the art that based on the electromagnetic effect, a magnetic field can be generated by energizing the screw, and accordingly, in the preferred embodiment of the present invention, a stable magnetic field can be generated by the coil body 21110 after the track board coil 2111 is turned on. In particular, it should be noted that in the preferred embodiment of the present invention, the base plate 21111 is planar, and the coil body 21110 is formed on the surface of the base plate in a spiral shape, in such a way as to completely subvert the existing coil formed by winding, thereby providing technical advantages.

More specifically, in an implementation, the circuit board type coil 2111 may be manufactured by a circuit board etching process, a circuit board electroplating process, a circuit board chemical plating process, and a circuit board photolithography process, the substrate 21111 may be a hard board, a soft board, a PCB board, a soft and hard board, and the like, and the coil body 21110 is formed at a corresponding position of the substrate 21111 by a related process and is arranged in a spiral shape. Here, since the coil body 21110 is integrally formed to the base plate 21111 without being tensioned, the diameter of the wire body of the coil body 21110 can be greatly reduced. Accordingly, the board-like coil 2111 has a relatively increased number of turns compared to the existing wire-wound coil at the same volume. In particular, in implementations, the coil body 21110 may be implemented as an ultra-fine wire body surrounded by an insulating layer, so that the coil formed by the ultra-fine wire body can satisfy both size and number of turns.

It will be appreciated by those skilled in the art that the magnetic field produced by an energized coil is affected by its number of turns, which in the same volume depends on the diameter of the coil wire body. Accordingly, the circuit board coil 2111 provided by the invention is formed by an ultrafine wire body, and compared with the existing wire winding coil, the circuit board coil 2111 with the same volume can be paved with more turns relatively. Those skilled in the art will appreciate that the magnetic field force generated by the driving assembly 20 depends on the magnetic field strength generated by the coil 211 and the magnetic field strength generated by the magnetic element 212, so that the on-current of the board-like coil 2111 can be significantly reduced in order to control the number of turns of the coil. In this way, the power consumption and heat dissipation requirements of the drive assembly 20 can be effectively reduced

On the other hand, since the wiring board-like coil 2111 can be configured with a relatively larger number of turns, that is, accordingly, the size of the magnetic element 212 opposite to the wiring board-like coil 2111 can be reduced, to facilitate further downsizing of the entire drive assembly 20.

Further, as shown in fig. 2B, in the preferred embodiment of the present invention, the wiring board type coil 2111 is integrally formed with the lens carrier 213 so that the lens carrier assembly 21 has an integral structure. In a specific implementation, the lens carrier 213 may be integrally formed with the circuit board coil 2111 through a molding process or an injection molding process. For example, in the preferred embodiment of the present invention, the lens carrier 213 is formed in the middle region of the wiring board type coil 2111 by a molding process, wherein the coil body 21110 of the wiring board type coil 2111 is distributed spirally along the outside of the lens carrier 213 and gradually outwardly after molding. Meanwhile, in order to reserve a mounting hole for the optical lens 10, a through hole is further provided in the middle of the wiring board-like coil 2111 so that a mounting passage for mounting the optical lens 10 is formed at the through hole of the wiring board-like coil 2111 after the lens carrier is formed by a molding process. Thus, after the circuit board coil 2111 is turned on, a stable magnetic field can be generated by the circuit board coil 2111 and interact with the magnetic element 212 to drive the lens carrier 213 to carry the optical lens 10 to move, so as to realize functions of auto-focusing and/or optical anti-shake of the camera module 1.

In particular, in the preferred embodiment of the present invention, the wiring board coil 2111 is configured to have a multi-layer structure in which the wiring board coils 2111 of different layers are overlapped with each other and conducted with each other to enhance the functional characteristics of the wiring board coil 2111. In order to better describe the technical details of how the multi-layer wiring board coils 2111 are stacked and conducted, the technical features of the single-layer wiring board coils 2111 will be specifically described.

As shown in fig. 2B, the single-layer wiring board type coil 2111 has a sheet structure, wherein the coil body 21110 is integrally formed with the base plate 21111 to form the wiring board type coil 2111. In particular, the coil body 21110 is arranged in a spiral manner at the substrate 21111 such that after the wiring board coil 2111 is turned on, a current is conducted along one end of the spiral coil body 21110 to the other end of the coil body 21110 to form a stable magnetic field according to an electromagnetic induction effect. It should be noted that the laying manner of the coil body 21110 of the circuit board coil 2111 may also be implemented as other types, such as concentric Fang Xianxing, concentric circle line shape, etc.

More specifically, each layer of the track-board coil 2111 includes at least two energized terminals that are used to draw external electrical energy. Preferably, each layer of the board-like coil 2111 has two electrical terminals, an electrical input terminal 21112 and an electrical output terminal 21113. In particular, as shown in fig. 2B, the power-in end 21112 is provided at the innermost start end of the coil body 21110, and the power-out end 21113 is provided at the outermost end of the coil body 21110, so that when the board-like coil 2111 is turned on, current can flow in from the power-in end 21112 and out from the power-out end 21113, and a stable magnetic field is generated. Those skilled in the art will appreciate that the power in end 21112 and the power out end 21113 are relative concepts and do not determine the current flow direction, that is, current can also flow from the outermost side of the track plate coil 2111 to the innermost side of the track plate coil 2111, that is, current flows from the power out end 21113 to the power in end 21112.

Further, when the wiring board-like coil 2111 has a multi-layer structure, at least one coil body 21110 is formed on each layer of the substrate 21111, respectively, and each layer of the wiring board-like coil 2111 is conducted to each other and overlapped with each other to relatively increase the number of turns of the wiring board-like coil 2111 as a whole. Specifically, each layer of the board-like coils 2111 has the two energizing ends, respectively, and the energizing ends of the board-like coils 2111 between different layers are connected to each other so that currents flowing in the board-like coils 2111 of different layers have directional uniformity, whereby the directions of magnetic fields formed between the board-like coils 2111 of different layers are uniform and mutually reinforced.

More specifically, when the coil bodies 21110 of the wiring board coils 2111 of different layers have the same arrangement, for example, the wiring board coils 2111 of different layers are simultaneously arranged in a counterclockwise spiral, in which case the power feeding end 21112 of the wiring board coil 2111 of the upper layer is electrically connected to the power discharging end 21113 of the wiring board coil 2111 of the lower layer so that the current flowing through the wiring board coil 2111 of the upper layer and the current flowing through the wiring board coil 2111 of the lower layer have the same flow direction, and thus the magnetic field direction formed by the wiring board coil 2111 of the upper layer and the magnetic field direction formed by the wiring board coil 2111 of the lower layer are identical. By analogy with this rule, the wiring board coil 2111 having a multilayer structure is formed.

In contrast, when the wire bodies of the wiring board coils 2111 of different layers have different arrangements, for example, the wiring board coils 2111 of an upper layer are arranged in a counterclockwise spiral, and the wiring board coils 2111 of a lower layer are arranged in a clockwise spiral, at this time, the power-in end 21112 of the wiring board coils 2111 of the upper layer is connected to the power-out end 21113 of the wiring board coils 2111 of the lower layer, so that the current flowing through the wiring board coils 2111 of the upper layer and the current flowing through the wiring board coils 2111 of the lower layer have the same flow direction, and therefore, the magnetic field formed by the wiring board coils 2111 of the upper layer and the magnetic field formed by the wiring board coils 2111 of the lower layer are mutually reinforced.

Fig. 3A to 3C show a modified embodiment of the multi-layered wiring board coil 2111, wherein in the modified embodiment, at least one coil body 21110 is formed on each layer of the substrate 21111, and each layer of the wiring board coil 2111 is nested and conducted with each other, so as to enhance the functional characteristics of the wiring board coil 2111. Similarly, in order to better specifically describe the technical details of how the multiple layers of the circuit board coils 2111 are conducted and nested and stacked in this equivalent embodiment, the technical features of the circuit board coils 2111 when the substrate 21111 is a single-layer substrate 21111 will be described in more detail.

As shown in fig. 3B, the single-layer board-like coil 2111 has an oblong structure, wherein the coil body 21110 is integrally formed with the base plate 21111, and wherein the coil 211 wire bodies are spirally arranged in a vertical direction in a nearly concentric spiral. When the plate coil 2111 is turned on, current is conducted along one end of the spiral coil body 21110 to the other end of the wire body of the plate coil 2111, thereby generating a stable magnetic field by using electromagnetic induction effect.

In accordance with the above, each layer of the circuit board coil 2111 has an in-current end 21112 and an out-current end 21113, respectively, wherein the in-current end 21112 is disposed at the start end of the coil body 21110 at the topmost side of the circuit board coil 2111, and the out-current end 21113 is disposed at the end of the coil body 211 at the bottommost side of the circuit board coil 2111, so that when the circuit board coil 2111 is turned on, current flows in from the in-current end 21112 and flows out from the out-current end 21113 to generate a stable magnetic field by the principle of electromagnetic induction. Those skilled in the art will appreciate that the power in end 21112 and the power out end 21113 are relative concepts and do not determine the flow direction of current, that is, current can also flow from the top most side of the track plate coil 2111 to the bottom most side of the track plate coil, i.e., current flows from the power out end 21113 to the power in end 21112.

When the wiring board-like coil 2111 has a multilayer structure in which, in this modified embodiment of the invention, each layer of the wiring board-like coil 2111 is nested and conducted with each other to equivalently increase the number of turns of the wiring board-like coil 2111 as a whole. Specifically, each layer of the circuit board coils 2111 has the two energizing ends, respectively, and the energizing ends of the circuit board coils 2111 of different layers are properly connected to each other, so that the currents flowing through the circuit board coils 2111 of different layers have uniform directions, and the magnetic fields formed by the circuit board coils 2111 of different layers have uniform directions and mutually reinforce each other.

More specifically, when the wiring board coils 2111 of different layers have the same arrangement, for example, the wiring board coils 2111 of different layers are simultaneously arranged in a counterclockwise spiral, in which case the power-in end 21112 of the wiring board coil 2111 of the inner layer is provided to be connected to the power-out end 21113 of the wiring board coil 2111 of the outer layer so that the current flowing through the wiring board coil 2111 of the inner layer and the current flowing through the wiring board coil 2111 of the outer layer have the same flow direction, and thus the direction of the magnetic field formed by the wiring board coil 2111 of the inner layer and the direction of the magnetic field formed by the wiring board coil 2111 of the outer layer are identical.

Accordingly, when the wiring board coils 2111 of different layers have opposite arrangement, for example, the wiring board coils 2111 of an inner layer are arranged in a counterclockwise spiral, and the wiring board coils 2111 of an outer layer are arranged in a clockwise spiral. Wherein the power-in end 21112 of the circuit board coil 2111 located at the inner layer is connected to the power-out end 21113 of the circuit board coil 2111 located at the outer layer so that the current flowing through the circuit board coil 2111 located at the inner layer and the current flowing through the circuit board coil 2111 located at the outer layer have the same flow direction, and thus the direction of the magnetic field formed by the circuit board coil 2111 located at the inner layer and the direction of the magnetic field formed by the circuit board coil 2111 located at the outer layer are consistent.

In summary, it can be seen that the wiring board coil 2111 having a multi-layer structure can be formed by stacking one above the other or by nesting one inside the other. After the wiring board-like coil 2111 is formed into a multilayer structure, further, and integrally formed with the lens carrier 213. More specifically, the lens carrier 213 and the wiring board coil 2111 may be integrally formed through a molding process, in which a central region of the substrate 21111 of the wiring board coil 2111 is a groove and is isolated such that the lens carrier 213 is formed at the central region of the substrate 21111 after the molding material is cured and formed, while the wiring board coil 2111 is integrally cured at the lens carrier 213 such that the lens carrier assembly 21 has an integrally compact structure. It should be noted that the lens carrier 213 may be implemented as a separate component assembled with the wiring board type coil having a multi-layer structure, and then integrally combined with each other through a molding process. In contrast, the invention is not limited thereto.

Further, in order to drive the lens carrier 213 to move carrying the optical lens 10, and further having the law of electromagnetism, the lens carrier assembly 21 further comprises a set of magnetic elements 212, wherein the magnetic elements 212 are used for providing a constant magnetic field. When the track-board coil 2111 is turned on to generate a magnetic field, the magnetic field interacts with the magnetic field provided by the magnetic element 212 to generate a driving force to drive the track-board coil 2111 to move. Here, since the lens carrier 213 and the wiring board coil 2111 are integrally formed, when the wiring board coil 2111 is moved, the lens carrier 213 and the optical lens 10 mounted to the lens carrier 213 are carried to move synchronously to realize functions of auto focus or optical anti-shake, etc.

More specifically, as shown in fig. 2B and 3B, the magnetic element 212 is disposed at a distance outside the lens carrier 213 and does not make physical contact with the lens carrier 213 and the coil 211 so that the coil 211 can freely move with respect to the magnetic element 212. According to the electromagnetic induction principle, after the coil 211 is turned on, the energizing coil 211 generates a magnetic field, and the magnetic field interacts with the magnetic field provided by the magnetic element 212 to realize the auto-focusing function and/or the optical anti-shake function of the camera module 1.

More specifically, as shown in fig. 2B and 3B, according to the ampere rule, the direction of the magnetic field generated by the circuit board coil 2111 is parallel to the direction of the optical axis Z, and the magnetic field generated by the magnetic element 212 symmetrically disposed outside the circuit board coil 2111 is perpendicular to the optical axis Z, so that the magnetic element 212 can make the coil 211 receive a vertical force and a horizontal force that are offset from each other, so as to drive the circuit board coil 2111 to carry the lens carrier 213 and the optical lens 10 to move, thereby implementing the auto-focusing function of the camera module 1.

It should be noted that the magnetic element 212 may be selectively mounted on the base 22 of the driving component 20, so that when the lens carrier component 21 is assembled on the base 22, the magnetic element 212 is disposed on the outer side of the lens carrier component 21, so as to interact with the coil 211 to generate a driving force to drive the optical lens 10 to move along the optical axis direction to realize an auto-focusing function. Here, in other embodiments of the present invention, the magnetic element 212 may be assembled on an inner sidewall of an outer housing of the driving assembly 20, for example, the magnetic element 212 is symmetrically distributed on the inner sidewall of the outer housing, so as to provide a magnetic field perpendicular to the optical axis Z for the coil 211, so as to drive the lens carrier 213 to move along a direction parallel to the optical axis Z, thereby changing a distance between the optical lens 10 and the photosensitive element 32, so as to implement an auto-focusing function of the camera module 1.

In particular, as shown in fig. 2B and 3B, in the present invention, the magnetic elements 212 are disposed at intervals and symmetrically outside the circuit board type coil 2111 by a magnetic element carrier 2121, so as to provide a symmetrical magnetic field perpendicular to the optical axis Z for the coil 211, and drive the lens carrier 213 to move along a direction parallel to the optical axis Z, so as to implement an auto focusing function. Here, the lens carrier assembly 21 is movably nested in the magnetic element carrier 2121, i.e. the lens carrier 213 and the magnetic element carrier 2121 are freely movable with respect to each other. Accordingly, when the magnetic element carrier 2121 is moved horizontally or obliquely, the lens carrier assembly 21 is driven by the magnetic element carrier 2121 and synchronously moves horizontally or obliquely, so as to further realize the optical anti-shake function of the camera module 1. Those skilled in the art will appreciate that the magnetic field provided by the track-board coil 2111 is perpendicular to the magnetic field generated by the magnetic element 212, and thus the magnetic element carrier 2121 cannot be moved horizontally or obliquely by the magnetic field provided by the track-board coil 2111. In particular, in the present invention, the magnetic field driving the horizontal or tilting movement of the magnetic element carrier 2121 is provided by a coil formed at the base 22 of the driving assembly 20. This will be described in more detail below with respect to the base 22 of the drive assembly 20.

As shown in fig. 2A or fig. 3A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected to each other and conducted by a connection portion 223. In particular, the connection portion 223 is implemented as a flexible board 2230 to connect and conduct the driving circuit board 222 and the wiring board 31 of the camera module 1 through the flexible board 2230. The connection and communication between the driving circuit board 222 and the circuit board 31 can be made more stable by electrically connecting the driving module 20 and the circuit board module 30 through the flexible board 2230 instead of the pin soldering electrical connection. In a deeper view, the circuit board 31 industry of integrating the driving circuit board and the camera module is facilitated, so that modularization and integration among all circuit boards of the camera module are realized, the powerful cooperation among the industries of the camera module is enhanced, and the integration and development of the camera module industry are promoted.

Further, as shown in fig. 2C or 3C, in the preferred embodiment of the present invention, the base 22 is further provided with a control coil 2112, and the control coil 2112 is integrally formed on the driving circuit board for driving the magnetic element carrier 2121 to move horizontally or obliquely, so as to implement an optical anti-shake function. In accordance with the preferred embodiment of the present invention, the control coil 2112 may also be implemented as a track-board type coil and corresponds (up-down corresponds) to the magnetic element mounted to the magnetic element carrier, so that the control coil 2112 may be used to drive the magnetic element carrier 2121 to move horizontally or obliquely so that the lens carrier 213 and the lens are moved synchronously, thereby realizing the optical anti-shake function of the camera module 1.

As shown in fig. 2B and 2C or fig. 3B and 3C, when the control coil 2112 is turned on, a magnetic field corresponding to the magnetic element 212 and parallel to the optical axis Z is generated by an electromagnetic induction effect. As described above, the magnetic field generated by the magnetic element 212 is perpendicular to the optical axis Z, so that the magnetic field generated by the magnetic element 212 and the magnetic field generated by the control coil 2112 are perpendicular to each other to drive the magnetic element carrier 2121 to carry the lens carrier 213 to move horizontally or obliquely, so as to implement the optical anti-shake function of the camera module 1. In combination, the lens carrier 213 moves vertically relative to the magnetic element carrier 2121, and the magnetic element carrier 2121 moves horizontally or obliquely relative to the control coil 2112, so as to jointly implement the functions of auto-focusing, optical anti-shake, and the like of the camera module 1.

Further, the driving assembly 20 further includes a limiting element 40, and the limiting element 40 is disposed between the lens carrier assembly 21 and the base 22, so as to precisely limit the movement of the lens carrier assembly 21 by the limiting element 40. More specifically, when the circuit board coil 2111 of the lens carrier assembly 21 is turned on to generate a driving torque, the limiting element 40 cooperates with the circuit board coil 2111 and the magnetic element 212 to push the lens carrier 213 to move, so as to achieve the functions of auto-focusing and optical anti-shake of the camera module 1. It should be appreciated by those skilled in the art that the limiting element 40 may be implemented as a spring assembly, so as to limit the movement state of the lens carrier assembly 21 by using the spring assembly, thereby realizing precise control of the camera module.

It should be noted that, in the preferred embodiment of the present invention, the degree of integration between the base 22 and the circuit board assembly 30 of the camera module 1 can be gradually expanded to form different levels of integrated structures.

In the first stage, only the driving circuit board 31 and the base body 221 are integrally formed by a molding process, and the assembled driving assembly 20 is mounted on the lens holder 33 of the circuit board assembly 30.

The second level, the driving circuit board 31 and the base body 221 are integrally formed through a molding process. The base body 221 may further extend longitudinally to form the lens seat 33 of the circuit board assembly 30 after being assembled into an integrated driving assembly 20 and attached to the circuit board 31 of the circuit board assembly 30, the base 22 of the driving assembly 20. In other words, the base body 221 and the lens holder 33 have a unitary structure. It should be noted that, in this case, the optical filter of the camera module 1 may be assembled to the base 22 of the driving assembly 20, so as to further optimize the overall structure and size of the camera module 1.

In the third level, the driving circuit board 222 of the base 22 of the driving component 20 and the circuit board 31 of the circuit board component 30 are integrally formed through a molding process, so that the base 22 of the driving component 20 is integrally formed on the circuit board 31 of the circuit board component 30 before the lens carrier component 21 is assembled on the base 22 to form the integrated driving component 20. In other words, in this level, the molded body formed by the molding process is integrally formed to the wiring board, and integrally bonds the driving circuit board 222 and the wiring board 31.

It should be noted that, in the third level, the base 22 may be integrally formed with the circuit board 31 of the circuit board assembly 30 by one molding or two molding.

Specifically, if one molding is adopted, in the molding process, the driving circuit board 222 and the circuit board 31 of the camera module 1 are set in a molding die at a certain position, and after the molding material is cured and molded, the base 22 of the driving assembly 20 is formed at a corresponding position, wherein the base 22 is integrally molded with the circuit board 31 of the circuit board assembly 30 to serve as both the lens holder 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20.

If the secondary molding is adopted, in the molding process, the circuit board assembly 30 is first molded for the first time to integrally form a base having a certain height on the circuit board 31 of the circuit board assembly 30, and then the driving circuit board 222 of the base 22 is disposed on top of the base, and is molded for the second time to form the base 22, wherein the base 22 serves as both the mirror base 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20.

In addition, in order to further improve the compactness of the image pickup module, the optical lens 10 may be integrated with the lens carrier 213. More specifically, the lens carrier 213 includes an accommodating space 2130, and the optical lens 10 is correspondingly accommodated in the accommodating space 2130 to be combined with the lens carrier 213 into a unitary structure. Accordingly, it should be understood by those skilled in the art that when the image capturing module is an array image capturing module, the lens carrier 213 has a set of accommodating spaces 2130, and each of the optical lenses 10 is correspondingly accommodated in each of the accommodating spaces 2130 to be integrally formed with the lens carrier 213.

As shown in fig. 4A to 4C, an image capturing module 1 according to another preferred embodiment of the present invention includes at least one optical lens 10, a driving assembly 20 and a circuit board assembly 30. The driving assembly 20 is mounted on a lens holder 33 of the circuit board assembly 30. The optical lens 10 is assembled and held on a photosensitive path of a photosensitive element 32 of the circuit board assembly 30 by the driving assembly 20. The driving component 20 is configured to drive the optical lens 10 to move, so as to achieve the functions of auto-focusing and/or optical anti-shake of the camera module 1.

As shown in fig. 4A, the driving assembly 20 includes a lens carrier assembly 21 and a base 22, wherein the base 22 is supported on a top side of the lens holder 33 of the circuit board assembly 30, and the lens carrier assembly 21 is operatively assembled to the base 22, wherein when the lens carrier assembly 21 is in an operating state, the lens carrier assembly 21 can carry the optical lens 10 to move so as to change a relative positional relationship between the optical lens 10 and the circuit board assembly 30, thereby implementing functions such as auto-focusing and/or optical anti-shake of the camera module 1, so as to improve an imaging quality of the camera module 1. Preferably, in the preferred embodiment of the present invention, the base 22 of the driving assembly 20 is integrally extended to the lens holder 33 of the circuit board assembly 30, such that the base 22 and the lens holder 33 have a unitary structure. Of course, those skilled in the art will appreciate that in other embodiments of the present invention, the drive assembly 20 may be a split drive assembly, i.e., the drive assembly 20 is a separate component that is attached to the lens mount 33 of the circuit board assembly 30.

As shown in fig. 4A, the lens carrier assembly 21 includes a lens carrier 213, a magnetic element 212 and a coil 211, wherein the lens carrier 213 is configured to accommodate the optical lens 10 therein, the magnetic element 212 is disposed on the lens carrier 213, and the coil 211 is correspondingly disposed on the outer side of the magnetic element 212, so that the lens carrier 213 can be driven to move by electromagnetic induction force between the magnetic element 212 and the coil 211, so as to change the relative positional relationship between the optical lens 10 and the photosensitive element 32, thereby realizing functions such as auto focusing and/or optical anti-shake.

In particular, in the preferred embodiment of the present invention, the magnetic element 212 is integrally formed with the lens carrier 213, such that the lens carrier assembly 21 has a unitary structure. That is, the magnetic element 212 is embedded in the lens carrier 213, in such a way that the structural strength of the lens carrier 213 is reinforced by the magnetic element 212 on the one hand, and the size of the lens carrier 213 can be reduced on the other hand.

Preferably, the magnetic element 212 is disposed on the lens carrier 213 symmetrically with respect to the center of the lens carrier 213. Specifically, in the preferred embodiment of the present invention, the magnetic element 212 includes 4 magnetic units 2120, and the magnetic units 2120 are symmetrically distributed about the center of the lens carrier 213 at the inner side 2131 of the lens carrier 213. More preferably, the thickness of the lens carrier 213 is approximately equal to the thickness of the magnetic unit 2120, that is, the distance from the inner side 2131 of the lens carrier 213 to the outer side 2132 of the lens carrier 213 is approximately equal to the thickness of the magnetic unit 2120, so that when the magnetic unit 2120 is integrally formed with the lens carrier 213, the inner side of the magnetic unit 2120 is located at the inner side 2131 of the lens carrier 213, and the other side of the magnetic unit 2120 is adjacent to the outer side 2132 of the lens carrier 213, so that the thickness of the lens carrier assembly 21 is ensured, and the magnetic field generated by the magnetic unit 2120 is sufficiently interacted with the coil 211 to perform functions such as auto-focusing or optical anti-shake of the camera module 1.

Of course, those skilled in the art will appreciate that in other embodiments of the present invention, the location of the magnetic unit 2120 within the lens carrier 213 may be changed, for example, the magnetic unit 2120 may be partially exposed to the outside of the lens carrier 213. This is not a limitation of the present invention.

As shown in fig. 4A, in the preferred embodiment of the present invention, the coil 211 is disposed at the base 22 of the driving assembly 20, and when the lens carrier 213 is assembled to the base 22, the coil 211 is correspondingly disposed at the outer side of the magnetic element 212 to form an "inner magnetic outer" structure. When the coil 211 is turned on, the coil 211 interacts with the magnetic element 212 to drive the lens carrier 213 to carry the optical lens 10 to move, so as to realize functions of auto-focusing or optical anti-shake of the camera module 1.

More specifically, as shown in fig. 4B and 4C, the coil 211 is provided at the outer peripheral portion of the base 22, so that when the lens carrier 213 is mounted at the top side of the base 22, the coil 211 is correspondingly provided at the outer side of each magnetic unit 2120 of the magnetic element 212 to achieve a compact structure of the "inner magnetic outer line".

In the preferred embodiment of the present invention, the coil 211 is also embodied as a wiring board type coil 2111, wherein, as shown in fig. 5A, the wiring board type coil 2111 includes a base plate 21111 and a coil body 21110, wherein the coil body 21110 is integrally formed on the base plate 21111 and is arranged in a spiral shape on the base plate 21111. It will be appreciated by those skilled in the art that based on the electromagnetic effect, a magnetic field can be generated by energizing the screw, and accordingly, in the preferred embodiment of the present invention, a stable magnetic field can be generated by the coil body 21110 after the track board coil 2111 is turned on.

More specifically, in an implementation, the circuit board type coil 2111 may be manufactured by a circuit board etching process, a circuit board electroplating process, a circuit board chemical plating process, and a circuit board photolithography process, the substrate 21111 may be a hard board, a soft board, a PCB board, a soft and hard board, and the like, and the coil body 21110 is formed at a corresponding position of the substrate 21111 by a related process and is arranged in a spiral shape. These technical features confer a number of advantages to the drive assembly 20 in comparison to conventional coils formed by winding, as will be readily appreciated by those skilled in the art, the coil wire body of the wiring board coil 2111 having a narrower line width and having a smaller line spacing.

In accordance with this preferred embodiment of the present invention, the wiring board coils 2111 may also be configured to have a multi-layered structure in which the wiring board coils 2111 of different layers are overlapped with each other and conducted with each other to enhance the functional characteristics of the wiring board coils 2111. In order to better describe the technical details of how the multi-layer wiring board coils 2111 are stacked and conducted, the technical features of the single-layer wiring board coils 2111 will be specifically described.

As shown in fig. 5A, the single-layer wiring board type coil 2111 has a sheet structure, wherein the coil body 21110 is integrally formed with the base plate 21111 to form the wiring board type coil 2111. In particular, the coil body 21110 is arranged in a spiral manner at the substrate 21111 such that after the wiring board coil 2111 is turned on, a current is conducted along one end of the spiral coil body 21110 to the other end of the coil body 21110 to form a stable magnetic field according to an electromagnetic induction effect. It should be noted that the laying manner of the coil body 21110 of the circuit board coil 2111 may also be implemented as other types, such as concentric Fang Xianxing, concentric circle line shape, etc.

In contrast, as shown in fig. 5B, when the wire bodies of the wiring board coils 2111 of different layers have different arrangements, for example, the wiring board coils 2111 of the upper layer are arranged in a counterclockwise spiral, and the wiring board coils 2111 of the lower layer are arranged in a clockwise spiral, at this time, the power-in end 21112 of the wiring board coils 2111 of the upper layer is connected to the power-out end 21113 of the wiring board coils 2111 of the lower layer, so that the current flowing through the wiring board coils 2111 of the upper layer and the current flowing through the wiring board coils 2111 of the lower layer have the same flow direction, and therefore, the magnetic field formed by the wiring board coils 2111 of the upper layer and the magnetic field formed by the wiring board coils 2111 of the lower layer are mutually reinforced.

In particular, in the preferred embodiment of the present invention, the coil 211 includes 4 pieces of the wiring board type coil 2111, and each piece of the wiring board type coil 2111 has a multilayer structure. It should be appreciated that the number of the circuit board coils 2111 corresponds to the number of the magnetic units 2120, wherein each of the circuit board coils 2111 corresponds to each of the magnetic units 2120 of the magnetic element 212 when the lens carrier 213 is assembled to the base 22, so that the lens carrier 213 can be driven to move with the optical lens 10 through interaction between the circuit board coils 2111 and the magnetic element 212 after the circuit board 31 coil 211 is turned on, so as to achieve functions such as auto-focusing and/or optical anti-shake of the camera module 1.

More specifically, after the wiring board coils 2111 are turned on with the same current, the wiring board coils 2111 respectively generate magnetic fields having the same magnitude by an electromagnetic induction mechanism, so that the magnetic elements 212 located inside the wiring board coils 2111 receive forces in the vertical direction and forces in the horizontal direction that cancel each other to drive the lens carrier 213 to move in the vertical direction, thereby realizing the auto-focusing function of the image pickup module 1.

When the circuit board coils 211 are selectively turned on, for example, only two circuit board coils 2111 are turned on, so that the magnetic elements 212 located inside the circuit board coils 2111 receive forces in the vertical direction and the forces in the horizontal direction cannot cancel each other, the lens carrier 213 can be driven to move along the water or the oblique direction, so as to implement the optical anti-shake function of the camera module 1.

Equivalently, when there is a difference in the on-current of the coil plate coil 2111, there is a corresponding difference in the magnitude or direction of the magnetic field generated by the board coil 2111 according to the electromagnetic induction mechanism. In this way, the forces applied by the magnetic element 212 in the horizontal direction cannot cancel each other, so that the movement from the lens carrier 213 in the horizontal or oblique direction can be driven in the same way, thereby realizing the optical anti-shake function of the camera module 1. Here, the difference in on-current means that there is a difference in current magnitude or a difference in current direction.

In summary, based on the "inner magnetic and outer line" structure, more selection variables (the magnitude, direction, and number of the on-state circuit board coils 2111) are provided to control the lens carrier assembly 21 to move differently, so as to realize the functions of auto-focusing and optical anti-shake of the camera module 1.

It should be noted that, in the preferred embodiment of the present invention, the wiring board coil 2111 and the base 22 may be integrally formed, so that the wiring board coil 2111 and the base 22 may be more stably combined. The process of integrally forming the track-board coil 2111 is further described in the detailed description of the base 22 of the drive assembly 20 that follows.

As shown in fig. 4A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected to each other and conducted by a connection portion 223. In particular, the connection portion 223 is implemented as a flexible board 2230 to connect and conduct the driving circuit board 222 and the wiring board 31 of the camera module 1 through the flexible board 2230. The connection and communication between the driving circuit board 222 and the circuit board 31 can be made more stable by electrically connecting the driving module 20 and the circuit board module 30 through the flexible board 2230 instead of the pin soldering electrical connection. In a deeper view, the circuit board 31 industry of integrating the driving circuit board and the camera module is facilitated, so that modularization and integration among all circuit boards of the camera module are realized, the powerful cooperation among the industries of the camera module is enhanced, and the integration and development of the camera module industry are promoted.

It should be noted that, in the preferred embodiment of the present invention, the circuit board-type coil 2111 can be also conducted with the driving circuit board 222 through the flexible board 2230, in such a way that the circuit board 31 of the camera module 1, the driving circuit board 222 of the driving assembly 20, and the circuit board-type coil 2111 are further integrated into a circuit board chain set having an integral structure, as shown in fig. 5C.

Further, the driving assembly 20 further includes a limiting element 40, and the limiting element 40 is disposed between the lens carrier assembly 21 and the base 22, so as to precisely limit the movement of the lens carrier assembly 21 by the limiting element 40. More specifically, when the circuit board coil 2111 of the lens carrier assembly 21 is turned on to generate a driving torque, the limiting element 40 cooperates with the circuit board coil 2111 and the magnetic element 212 to push the lens carrier 213 to move, so as to achieve the functions of auto-focusing and optical anti-shake of the camera module 1. It should be appreciated by those skilled in the art that the limiting element 40 may be implemented as a chute or a ball assembly, etc. to limit the movement state of the lens carrier assembly 21 by the chute or the ball assembly, so as to achieve precise control of the camera module 1.

In the first stage, only the driving circuit board 31 and the base body 221 are integrally molded by a molding process, and then the circuit board type coil 2111 is symmetrically attached to the outer peripheral portion of the base body 221, and the assembled driving unit 20 is mounted to the mirror base 33 of the circuit board unit 30.

The second stage is to integrally mold the driving circuit board 31 and the base body 221 by a molding process, and integrally mold the circuit board-like coil 2111 to the outer peripheral portion of the base 22 by a second molding process, and then to mount the assembled driving unit 20 to the mirror base 33 of the circuit board unit 30. It is also possible to integrally mold the base body 221 and the board-type coil 2111 by only one molding process, and thus mount the assembled driving assembly 20 to the mirror mount 33 of the circuit board assembly 30.

Third, the driving circuit board 31, the base body 221 and the circuit board coil 2111 are integrally formed by a molding process, wherein the base body 221 continues to extend downward, so that the base 22 of the driving assembly 20 serves as the mirror base 33 of the circuit board assembly 30 after being assembled into an integrated driving assembly 20 and attached to the circuit board 31 of the circuit board assembly 30. It should be noted that, in this case, the optical filter of the camera module 1 may be assembled to the base 22 of the driving assembly 20, so as to further optimize the overall structure and size of the camera module 1.

Fourth, the base 22 of the driving assembly 20 is molded to the circuit board 31 of the circuit board assembly 30 through a molding process, so that the base 22 and the circuit board 31 have an integral structure and serve as the lens holder 33 of the circuit board assembly 30. In other words, in this level, a molded body formed by a molding process is integrally formed to the wiring board 31, and integrally bonds the driving circuit board 222 and the wiring board 31.

In the fourth level, in a specific molding process, the base 22 may be integrally formed on the circuit board 31 by a single molding process, a double molding process, or a triple molding process.

Specifically, in a one-shot molding process, the driving circuit board 222 of the driving assembly 20, the circuit board 31 of the circuit board assembly 30, the circuit board-type coil 2111 is fixed in a molding die at a certain position, and after the molding material is cured, the base 22 of the driving assembly 20 is formed at a corresponding position, wherein the base 22 is integrally molded to the circuit board 31 of the circuit board assembly 30, and the circuit board-type coil 2111 is integrally molded to the outer peripheral portion of the base 22.

In the secondary molding process, the driving circuit board 222 of the driving assembly 20 and the circuit board 31 of the circuit board assembly 30 are fixed in a molding mold according to a certain position, and after the molding material is cured and molded, the base 22 of the driving assembly 20 is formed at a corresponding position, wherein the base 22 is molded on the circuit board 31 of the circuit board assembly 30 and serves as the base 22 of the circuit board assembly 30. Then, the board-like coil 2111 is integrally molded to the outer peripheral portion of the base 22 by a second molding process.

In the third molding process, the circuit board assembly 30 is first molded to integrally mold a base having a certain height on the circuit board 31 of the circuit board assembly 30, then the driving circuit board 222 of the driving assembly 20 is disposed on top of the base, and is molded to integrally mold the base 22, then the circuit board-type coil 2111 is disposed on the outer periphery of the base 22, and is molded to integrally mold the circuit board-type coil 2111 on the outer periphery of the base 22. It should be noted that, compared with the primary molding process and the secondary molding process, the positioning difficulty between the parts in the molding process can be effectively reduced through the tertiary molding process, so that the overall molding difficulty of the camera module 1 is reduced.

A variant of this preferred embodiment of the invention is shown in fig. 6A, in which the lens-carrier assembly 21 comprises a lens carrier 213, a coil 211 and a magnetic element 212. The lens carrier 213 is configured to house the optical lens 10 therein, the magnetic element 212 is integrally formed on the lens carrier 213, the coil 211 corresponds to the magnetic element 212, so as to control a moving state of the lens carrier 213 through interaction of the coil 211 and the magnetic element 212, thereby changing a relative positional relationship between the optical lens 10 and the photosensitive element 32 of the circuit board assembly 30, so as to achieve functions of auto-focusing and/or optical anti-shake of the image capturing module 1.

As shown in fig. 6B, in this variant embodiment of the present invention, the coil 211 is formed on the base 22 of the driving assembly 20, and when the lens carrier 213 is assembled on the base 22, the coil 211 is correspondingly disposed below the magnetic element 212 to form a structure of "magnetic wire opposition", wherein when the coil 211 is turned on, the coil 211 interacts with the magnetic element 212 to drive the lens carrier 213 to move with the optical lens 10, so as to implement functions such as auto-focusing or optical anti-shake of the camera module 1.

In accordance with the embodiment, as shown in fig. 6C, the coil 211 is implemented as a circuit board type coil 2112, wherein the circuit board type coil 2112 is integrally formed with the driving circuit board 222 of the base 22. It should be appreciated that here, the moving state of the optical lens 10 may be controlled by controlling the corresponding condition of the wiring board coil 2112 and the magnetic element 212 and the conduction condition of the wiring board coil.

More specifically, when the magnetic field generated by the board-like coil 2112 causes the magnetic element 212 located above the board-like coil 2112 to receive a force in the vertical direction and a force in the horizontal direction that cancel each other, the lens carrier 213 is moved in the vertical direction to realize the auto-focusing function of the camera module 1. In addition, when the magnetic field generated by the circuit board coil 2112 causes the magnetic element 212 located above the circuit board coil 2112 to receive a force in a vertical direction and the forces in a horizontal direction cannot cancel each other, the lens carrier 213 is driven to move in a water or tilt direction at this time to realize an optical anti-shake function of the camera module 1.

Preferably, in the preferred embodiment of the present invention, the circuit board coils 2112 are distributed symmetrically about the center of the driving circuit board 222, and each of the circuit board coils 2112 corresponds to each of the magnetic units 2120 of the magnetic element 212, so that the auto-focusing function and/or the optical anti-shake function of the camera module 1 can be achieved by controlling the current magnitude and direction of the circuit board coils 2112 or the number of conductive circuit board coils 2112.

It should be noted that, in the preferred embodiment of the present invention, the circuit board-type coil 2112 may be integrally formed with the driving circuit board 222 of the base 22. Wherein the relationship between the drive circuit board 222 and the wiring board coil 2112 will be further elaborated upon in the following detailed description with respect to the base 22.

As shown in fig. 6A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected to each other and conducted by a connection portion 223. In particular, the connection portion 223 is implemented as a flexible board 2230 to connect and conduct the driving circuit board 222 and the wiring board 31 of the camera module 1 through the flexible board 2230. The connection and communication between the driving circuit board 222 and the circuit board 31 can be made more stable by electrically connecting the driving module 20 and the circuit board module 30 through the flexible board 2230 instead of the pin soldering electrical connection. In a deeper view, the circuit board 31 industry of integrating the driving circuit board and the camera module is facilitated, so that modularization and integration among all circuit boards of the camera module are realized, the powerful cooperation among the industries of the camera module is enhanced, and the integration and development of the camera module industry are promoted.

In particular, in this modified embodiment of the present invention, the circuit board-type coil 2112 is integrally formed with the driving circuit board 222, in such a way that the circuit board of the camera module 1, the driving circuit board 222 of the driving assembly 20, and the circuit board-type coil 2112 are further integrated into an integral structure.

More specifically, in the preferred embodiment of the present invention, the degree of integration between the base 22 and the circuit board assembly 30 of the camera module 1 may be gradually expanded to form different levels of integrated structures.

At the first level, only the driving circuit board 31 and the base main body 221 are integrally formed by a molding process, wherein the circuit board type coil 2112 is integrally formed on the driving circuit board 222 by a plating process of the circuit board 31, and then the assembled driving assembly 20 is mounted on the mirror base 33 of the circuit board assembly 30.

The second level, the driving circuit board 31 and the base main body 221 are integrally formed by a molding process, wherein the base main body 221 continues to extend downward, so that the base 22 of the driving assembly 20 serves as the lens seat 33 of the circuit board assembly 30 after being assembled into an integrated driving assembly 20 and attached to the circuit board 31 of the circuit board assembly 30. It should be noted that, in this case, the optical filter of the camera module 1 may be assembled to the base 22 of the driving assembly 20, so as to further optimize the overall structure and size of the camera module 1.

In the third level, the base 22 of the driving component 20 and the circuit board 31 of the circuit board component 30 are integrally formed through a molding process, so that the base 22 of the driving component 20 is integrally formed on the circuit board 31 prior to the circuit board component 30, and the lens carrier component 21 is assembled on the base 22 to form the integrated driving component 20. It should be noted that in this case, the base 22 may be integrally molded to the circuit board of the circuit board assembly 30 by one molding or two molding.

Specifically, in a one-shot molding process, the driving circuit board 31 and the circuit board 31 of the camera module 1 are fixed in the molding die at a certain position, and after the molding material is cured and molded, the base 22 of the driving assembly 20 is formed at a corresponding position, wherein the base 22 is integrally molded to the circuit board 31 of the circuit board assembly 30 to serve as both the lens holder 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20.

In the secondary molding process, the circuit board assembly 30 is first molded to integrally form a base having a certain height on the circuit board 31 of the circuit board assembly 30, and then the driving circuit board 222 of the driving assembly 20 is disposed on top of the base, and is molded to integrally form the base 22, wherein the base 22 serves as both the lens holder 33 of the circuit board assembly 30 and the base 22 of the driving assembly 20.

In the preferred embodiment of the present invention, the degree of integration between the base 22 and the circuit board assembly 30 of the camera module 1 may be gradually expanded to form different levels of integrated structures.

Another variant of the above preferred embodiment according to the invention is shown in fig. 7A, wherein in this variant the lens-carrier assembly 21 comprises a lens-carrier 213, a coil 211 and a magnetic element 212. The lens carrier 213 is configured to house the optical lens 10 therein, the magnetic element 212 is integrally formed on the lens carrier 213, the coil 211 corresponds to the magnetic element 212, so as to control a moving state of the lens carrier 213 through interaction of the coil 211 and the magnetic element 212, thereby changing a relative positional relationship between the optical lens 10 and the photosensitive element 32 of the circuit board assembly 30, so as to achieve functions of auto-focusing and/or optical anti-shake of the image capturing module 1. As shown in fig. 7A, the coil 211 is provided at both the outer peripheral portion of the base 22 and the driving circuit board 222 of the base 22, so that when the coil 211 is turned on, the coil 211 interacts with the magnetic element 212 to drive the lens carrier 213 to move carrying the optical lens 10.

As shown in fig. 7B and 7C, the coil 211 is implemented as a board-like coil 2111, wherein the board-like coil 2111 attached to the outer peripheral portion of the base 22 corresponds to at least one magnetic unit 2120 of the magnetic element 212, and the board-like coil 2112 provided on the driving circuit board 222 is correspondingly located under the magnetic unit 2120 of the magnetic element 212. Accordingly, the wiring board-like coil 2111 attached to the outer peripheral portion of the base 22 is used to control the vertical movement of the optical lens 10 to realize the auto-focusing function of the camera module 1. In addition, the circuit board type coil 2112 provided on the driving circuit board 222 is used to control the horizontal or tilting movement of the optical lens 10 to realize the optical anti-shake function of the camera module 1.

It should be noted that the circuit board type coil 2111 may be integrally formed with the base 22, that is, the circuit board type coil 2111 disposed at the outer periphery of the base 22 may be integrally formed with the outer periphery of the base 22, and at the same time, the circuit board type coil 2112 disposed at the driving circuit board 222 may be integrally formed with the driving circuit board 222. The relationship of the drive circuit board 222 and the wiring board coil 2111 with respect to the base 22 will be further elucidated with respect to the base 22 later in detail.

As shown in fig. 7A, the base 22 includes a base body 221 and a driving circuit board 222. In particular, in the present invention, the driving circuit board 222 and the circuit board 31 of the circuit board assembly 30 (the circuit board 31 of the camera module) are connected to each other and conducted by a connection portion 223. In particular, the connection portion 223 is implemented as a flexible board 2230 to connect and conduct the driving circuit board 222 and the wiring board 31 of the camera module 1 through the flexible board 2230. The connection and communication between the driving circuit board 222 and the circuit board 31 can be made more stable by electrically connecting the driving module 20 and the circuit board module 30 through the flexible board 2230 instead of the pin soldering electrical connection. In a deeper view, the circuit board 31 industry of integrating the driving circuit board and the camera module is facilitated, so that modularization and integration among all circuit boards of the camera module are realized, the powerful cooperation among the industries of the camera module is enhanced, and the integration and development of the camera module industry are promoted.

It should be noted that the circuit board-type coil 2112 disposed on the driving circuit board 222 is integrally formed on the driving circuit board 222 through a circuit board etching process. The circuit board-type coil 2111 provided on the outer peripheral portion of the base 22 may be connected to and electrically connected to the driving circuit board 222 via the flexible board 2230, and in this way, the circuit board 31 of the camera module 1, the driving circuit board 222 of the driving unit 20, and the circuit board-type coil 2111 may be further integrated into a unitary structure.

In the first stage, only the driving circuit board 31 and the base main body 221 are integrally formed by a molding process, wherein the circuit board-type coil 2112 provided on the driving circuit board 222 is integrally formed on the driving circuit board 222 by a circuit board 31 plating process, and further the circuit board-type coil 2111 provided on the outer peripheral portion of the base 22 is attached to the outer peripheral portion of the base main body 221, and the assembled driving assembly 20 is mounted on the mirror base 33 of the circuit board assembly 30.

In the second stage, the driving circuit board 31 and the base body 221 are integrally molded by a molding process, and the circuit board-like coil 2111 is integrally molded on the outer periphery of the base 22 by a secondary molding process, so that the assembled driving unit 20 is mounted on the mirror base 33 of the circuit board unit 30. Equivalently, the driving circuit board 31, the base body 221 and the circuit board coil 2111 may be integrally formed through a one-time molding process, and thus the assembled driving assembly 20 may be mounted to the mirror mount 33 of the circuit board assembly 30.

Fourth, the base 22 of the driving assembly 20 is molded to the circuit board 31 of the camera module 1 through a molding process, so that the base 22 and the circuit board 31 have an integrated structure, and the base 22 serves as the lens holder 33 of the circuit board assembly 30, in which case the base 22 of the driving assembly 20 is first integrally molded from the circuit board 31 of the circuit board assembly 30, and then the lens carrier assembly 21 is assembled to the base 22 to form the integrated driving assembly 20. It should be noted that in the fourth level integration process, one molding, two molding and three molding may be selected.

As shown in fig. 8, the present invention further provides an electronic device 80, where the electronic device 80 includes an electronic device body 81 and the camera module 1 provided by the present invention, and the camera module 1 collects and provides image information for the electronic device body 81. It should be noted that the image capturing module 1 provided by the present invention is a moving focus image capturing module 1, and has a smaller and more compact structure, so that the image capturing module 1 is advantageously applied to a wider range of electronic devices 80, so as to better adapt to the necessary trend of "thinning" of the current electronic devices 80.

Those skilled in the art will appreciate that the embodiments of the invention described above and shown in the drawings are by way of example only and not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been fully shown and described in the examples, and the embodiments of the invention may be modified or adapted in any manner without departing from such principles.

Claims

1. A drive assembly, comprising:

a magnetic element;

a coil; and

a lens carrier; the lens carrier is used for bearing an optical lens therein, wherein the magnetic element and the lens carrier are integrally formed, the magnetic element is embedded in the lens carrier, the outer side surface of the magnetic element is adjacent to the outer side part of the lens carrier, and the coil is spaced from the magnetic element and corresponds to the magnetic element, so that when the coil is conducted, the coil interacts with the magnetic element to drive the lens carrier to bear the optical lens to move.

2. The drive assembly of claim 1, wherein the coil is a track-board coil, wherein the track-board coil comprises a substrate and a coil body integrally formed with the substrate and spirally disposed on the substrate, such that a magnetic field is generated by the track-board coil after the coil body is turned on.

3. The drive assembly of claim 2, wherein the substrate has a planar shape, and the coil body is formed in a spiral shape on a surface of the substrate.

4. The drive assembly of claim 2, wherein the wiring board-type coils are stacked on each other such that the coils have a multi-layer structure in which each layer of the wiring board-type coils are conducted with each other.

5. A drive assembly according to claim 3, wherein the wiring board-like coils are stacked on each other such that the coils have a multi-layer structure in which each layer of the wiring board-like coils are in communication with each other.

6. The drive assembly of claim 4, wherein each layer of the circuit board type coils has an input end and an output end opposite to the input end, wherein when the circuit board type coils of different layers have spiral shapes with the same direction, the input ends of the circuit board type coils of the upper layer are electrically connected to the output ends of the circuit board type coils of the lower layer so that currents of the circuit board type coils of different layers have the same flow direction.

7. The drive assembly of claim 5, wherein each layer of the circuit board type coils has an input end and an output end opposite to the input end, wherein when the circuit board type coils of different layers have spiral shapes with the same direction, the input ends of the circuit board type coils of the upper layer are electrically connected to the output ends of the circuit board type coils of the lower layer so that currents of the circuit board type coils of different layers have the same flow direction.

8. The drive assembly according to any one of claims 2 to 7, wherein the track-board coils are disposed at a distance from and correspondingly outside the magnetic element.

9. The drive assembly of claim 1, wherein the magnetic element is adjacent to an inner side of the lens carrier.

10. The drive assembly of claim 8, further comprising a drive circuit board, the track board coils being electrically connected to the drive circuit board by a flexible board, respectively.

11. The drive assembly of any one of claims 2 to 7, further comprising a drive circuit board and a base body, wherein the track board type coils are integrally formed on the surface of the drive circuit board and correspond to the bottom sides of the magnetic elements, respectively.

12. The drive assembly of any one of claims 2 to 7, further comprising a drive circuit board, wherein a portion of the circuit board-type coils are disposed at intervals and correspondingly outside the magnetic element, and wherein another portion of the circuit board-type coils are integrally formed on the surface of the drive circuit board, such that the other portion of the circuit board-type coils are respectively spaced and correspond to the bottom side of the magnetic element.

13. The driving assembly as claimed in claim 12, wherein portions of the circuit board type coils disposed at intervals and correspondingly outside the magnetic element are electrically connected to the driving circuit board through a flexible board, respectively.

14. The drive assembly of claim 10, further comprising a base body for mounting the drive circuit board to form a base of the drive assembly.

15. The drive assembly of claim 11, further comprising a base body for mounting the drive circuit board to form a base of the drive assembly.

16. The drive assembly of claim 12, further comprising a base body for mounting the drive circuit board to form a base of the drive assembly.

17. The drive assembly of claim 13, further comprising a base body for mounting the drive circuit board to form a base of the drive assembly.

18. A camera module, its characterized in that includes:

an optical lens;

the drive assembly of claim 1; and

19. The camera module of claim 18, wherein the coil is a circuit board type coil, wherein the circuit board type coil comprises a substrate and a coil body, and the coil body is integrally formed on the substrate and is spirally arranged on the substrate, so that a magnetic field can be generated by the circuit board type coil after the coil body is conducted.

20. The camera module of claim 19, wherein the substrate has a planar shape, and the coil body is formed in a spiral shape on a surface of the substrate.

21. The camera module of claim 19, wherein the circuit board coils are stacked on top of each other such that the coils have a multi-layer structure in which each layer of the circuit board coils are conductive to each other.

22. The camera module of claim 20, wherein the circuit board-type coils are stacked on top of each other such that the coils have a multi-layer structure in which each layer of the circuit board-type coils are conductive to each other.

23. The camera module of claim 21, wherein each layer of the circuit board type coils has an input end and an output end opposite to the input end, wherein when the circuit board type coils of different layers have spiral shapes with the same direction, the input ends of the circuit board type coils of the upper layer are electrically connected to the output ends of the circuit board type coils of the lower layer, so that currents of the circuit board type coils of different layers have the same flow direction.

24. The camera module of claim 22, wherein each layer of the circuit board type coils has an input end and an output end opposite to the input end, wherein when the circuit board type coils of different layers have spiral shapes with the same direction, the input ends of the circuit board type coils of the upper layer are electrically connected to the output ends of the circuit board type coils of the lower layer, so that currents of the circuit board type coils of different layers have the same flow direction.

25. The camera module of any of claims 19 to 24, wherein the track board coils are disposed on an outer side of the magnetic element at intervals and correspondingly.

26. The camera module of claim 18, wherein the magnetic element is adjacent to an inner side of the lens carrier.

27. The camera module of claim 25, further comprising a drive circuit board, the circuit board type coils being electrically connected to the drive circuit board through a flexible board, respectively.

28. The camera module of any of claims 19 to 24, further comprising a drive circuit board and a base body, wherein the track board type coils are integrally formed on a surface of the drive circuit board and correspond to bottom sides of the magnetic elements, respectively.

29. The camera module of any of claims 19 to 24, further comprising a driving circuit board, wherein a portion of the circuit board coils are disposed at intervals and correspondingly outside the magnetic element, and wherein another portion of the circuit board coils are integrally formed on the surface of the driving circuit board, such that the other portion of the circuit board coils are respectively spaced and correspond to the bottom side of the magnetic element.

30. The camera module of claim 29, wherein the circuit board coils are electrically connected to the driving circuit board through a flexible board, respectively, at intervals and corresponding to the portions of the circuit board coils disposed outside the magnetic element.

31. The camera module of claim 27, further comprising a base body for mounting the drive circuit board to form a base for the drive assembly.

32. The camera module of claim 28, further comprising a base body for mounting the drive circuit board to form a base for the drive assembly.

33. The camera module of claim 31, further comprising a flexible board extending between the drive circuit board and the circuit board to electrically connect the drive assembly to the circuit board.

34. The camera module of claim 33, wherein the lens mount of the circuit board assembly and the base of the drive assembly are integrally formed.

35. The camera module of claim 34, wherein the lens mount of the circuit board assembly and the base of the drive assembly are integrally formed with the circuit board of the circuit board assembly.

36. An electronic device, comprising:

a camera module according to any one of claims 18 to 35; and

the camera module is assembled on the electronic equipment body.