CN209046728U - Driving assembly and camera module and its electronic equipment - Google Patents

Abstract

Driving assembly and camera module and its electronic equipment, wherein the driving component includes a magnetic element, a coil；An and camera lens carrier；Wherein, the camera lens carrier is for carrying an optical lens in the inner, wherein, the magnetic element and the camera lens carrier are integrally formed, the coil and the magnetic element are separately and corresponding to the magnetic element, so that the coil and the magnetic element interact to drive the camera lens carrier to carry the optical lens movement when the coil is switched on.In this way, making the driving component that there is more miniature size.

Description

Driving assembly and camera module and its electronic equipment

Technical field

The utility model relates to an optical field more particularly to a driving assemblies and camera module and its electronic equipment.

Background technique

It is increasingly sent out with advances in technology towards high-performance, lightening trend with development, electronic equipment, smart machine Exhibition, the camera module of one of core configuration as electronic product, smart machine are necessarily required to adaptedly in performance and size side Face, which is made, correspondingly to be adjusted.Correspondingly, during this takes turns technological innovation, each component of camera module require in performance and Corresponding variation is made in terms of size.

It is as shown in Figure 1 the existing camera module with driver comprising optical lens a 10P, a driver 20P With a circuit board assemblies 30P, wherein optical lens 10P is held in the one of circuit board assemblies 30P by driver 20P On the photosensitive path of sensitive chip 32P.Driver 20P can drive optical lens 10P mobile, to realize the camera module Auto-focusing and the functions such as optical anti-vibration.Existing driver 20P is assembled in circuit board usually as an individual attachment On one microscope base 33P of component, and then one group of pin of driver 20P is electrically connected to the electricity by electric connection modes such as welding 31P is on one wiring board of road board group part to be connected circuit board assemblies 30P and the driver 20P, so as to by the circuit Electric energy needed for board group part 30P provides work for driver 20P.However, existing driver 20P exists in practical applications Many defects.

Firstly, driver 20P is installed on the top surface of the microscope base 33P of circuit board assemblies 30P, and it is used to install Therefore optical lens 10P in order to ensure the cooperation precision of the optical lens and the circuit board assemblies, need to guarantee driver 20P With the cooperation precision of circuit board assemblies 30P.In other words, if during assembling driver 20P, driver 20P There is inclination or offset, this fractional error with circuit board assemblies 30P will be transferred to optical lens 10P and the circuit board To influence image quality between the photosensitive element 32P of component 30P.

Secondly, the pin of the driver 20 is usually connected to the route of circuit board assemblies 30P by welding Plate 31P, to provide energy and control signal by wiring board 31P for the driver.Correspondingly, in the mistake for applying welding procedure Cheng Zhong, on the one hand, other electronic components for being assembled in circuit board assemblies 30P need to be prevented to be soldered material and polluted, especially It is the photosensitive element 32P of circuit board assemblies 30P, that is, welding procedure difficulty is high.Even so, even if welding procedure is complete Beauty is implemented, however, during the work time, welding material, which will be switched on, to be produced since the welding material itself has biggish resistance Raw a large amount of heat, undoubtedly to the heat dissipation of the wiring board, more stringent requirements are proposed for this.

It is noted that the stability in order to guarantee welding, it will usually which the appropriate area for increasing welding region, this is undoubtedly Will affect the overall aesthetics of the structure of circuit board assemblies 30P: welding material is applied to wiring board 31P as a patch.And And in subsequent use process, the pin of driver 20P may be due to shaking, and the factors such as vibration take off with wiring board 31P phase From, and cause open circuit fault.It further, should during the pin of driver 20P is welded in wiring board 31P Driver 20P is moved even slightly.Simultaneously as the welding material of each pin is uneven, each pin of driver 20P and the line are caused Stress between the plate 31P of road is different, leads to the presence of the fit tolerances such as inclination and offset between driver 20P and microscope base 33P, To influence the cooperation precision between subsequent optical lens 10P and photosensitive element 31P.In other words, existing Welder Skill is difficult to meet the package requirements of camera module.

Further, driver 20P is operated by the law of electromagnetic induction comprising a coil 211P, one is magnetic An element 212P and camera lens carrier 213P.In general, coil 211P is wrapped in the outer of camera lens carrier 213P using the mode of coiling Side, and after powered up with magnetic element 212P interact to form a driving force, drive the optical lens 10P movement from And change the relative positional relationship of itself and sensitive chip 32P, to realize the functions such as auto-focusing and optical anti-vibration.However, existing There are many defect in structure and performance by some driver 20P

Specifically, the coil 211P of existing driver 20P is formed in the camera lens usually using the mode of coiling The side of carrier 213P, while in order to ensure stable magnetic field can be formed upon power-up, coil wire body 211P be tightened up and Tightly it is bound by the side of camera lens carrier 213P.It needs to have enough in this way, not requiring nothing more than camera lens carrier 213P itself Intensity, and coil wire body 211P itself is required to be also required to the intensity for having certain.In other words, when coil 211P is using winding Mode be formed in the side of camera lens carrier 213P, need to suitably increase the thickness of camera lens carrier 213P and increase coil 211P The diameter of wire body, to guarantee that the camera lens carrier 213P will not deform and the line during coil 211P is in winding Circle 211P is not broken.

It is well known that the magnetic field strength that coil generates is influenced by the number of turns of coil, and, the circle of same volume lower coil It is several, it is limited to the diameter of wire body.However, being limited to coil 211P line in the coil 211P of existing driver 20P The diameter needs of requirement of the body itself to intensity, coil 211P wire body are correspondingly increased, and are caused in same volume lower coil Relative turns can reduce.For example, by taking the coil 211P of conventional audio motor driver 20P as an example, wherein coil 211P Wire body line width be 40-50 μm, line-spacing (assuming that be closely wound, and the thickness of insulating layer for being 2 times) encloses number model at 10 μm to 20 It encloses and encloses (4-8 layers of axis parallel direction, vertical direction is 5-12 layers unilateral) for 50-70.

Further, during coil 211P coiling, coil wire body 211P is closely wound in camera lens carrier 213P Side and every two circles coil between gap need to reduce as much as possible.In this way, utilizing electromagnetism after coil 211P energization Induction be formed by magnetic field just can it is uniform and controllably.However, in actual winding process, since coil wire body 211P is usual Be elongated round and itself there is certain diameter, can not be bonded completely between every two circles coil 211P cause coil 211P it Between can have a degree of gap, and with the increase of coil 211P the number of turns, the gap between coil wire body 211P is tired out The final feature for influencing magnetic field of meter.

In addition, in the assembling process of existing driver 20P, it need to be reserved fixed for the subsequent installation of magnetic element 212P Bit architecture and safe space, while for the ease of the calibration and adjustment in later period, it also needs to preset centainly for magnetic element 212P Location tolerance, these Structural Design Requirements all can cause the size of driver 20P to be correspondingly increased.

Utility model content

One of the utility model is designed to provide a driving assembly and camera module and its electronic equipment, wherein described Driving assembly includes a pedestal and a camera lens carrier module, and the camera lens carrier module is movably assembled in the pedestal, In, when the camera lens carrier module is triggered, the optical lens movement for being installed on the camera lens carrier module can be driven, To realize the functions such as auto-focusing and/or optical anti-vibration.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein at this In one embodiment of utility model, the camera lens carrier module includes a coil and a camera lens carrier, the coil and the mirror Head carrier is integrally formed (for example, passing through moulding technology) to reduce the size of the camera lens carrier module.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein by It is shaped in the camera lens carrier in the coil, so that on the one hand the camera lens carrier can be reinforced by the coil Structural strength, on the other hand, the coil reduce the intensity requirement of the camera lens carrier, so as to reduce the camera lens carrier Thickness, with meet miniaturization size requirements.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein at this In one embodiment of utility model, the coil is Wiring board type coil comprising a substrate and a coil body, wherein described Coil body is shaped in the substrate, and is spirally arranged in the substrate, and works as the Wiring board type coil quilt When conducting, the coil body can generate stable magnetic field.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described The diameter of the coil wire body of Wiring board type coil can be much smaller than normal operable diameter, to pass through compared to traditional The Wiring board type coil that canoe is formed, the Wiring board type coil for forming identical the number of turns have relatively small size, Conducive to the size for further reducing the driving component.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, compared to existing The coil that some is formed by canoe, under same volume, the number of turns of the Wiring board type coil can be significantly increased, thus Magnetic field strength needed for obtaining identical driving force opposite can be reduced, i.e., the volume energy of the corresponding magnetic element of described coil is further Ground reduces, in favor of further compressing the overall dimensions of the driving component.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein due to The Wiring board type coil has relatively large number of the number of turns, so that the electric current of the Wiring board type coil, which is connected, suitably to be reduced, To in size, power consumption, Wiring board type coil described in many aspects such as material cost is all had great advantages.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Wiring board type coil is formed in the substrate by wiring board etching process, and is spirally arranged in the substrate, leads to Such mode is crossed, after the Wiring board type coil is switched on, according to electromagnetic induction mechanism, the Wiring board type coil can be produced A raw stabilizing magnetic field.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Wiring board type coil takes shape in the substrate by circuit board plating process, and is arranged in a manner of intimate form concentric spirals line In the substrate, in this way, after the Wiring board type coil is switched on, according to electromagnetic induction mechanism, the line Circuit plate coil can produce a stabilizing magnetic field.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Wiring board type coil takes shape in the substrate by wiring board depositing process, and is arranged in a manner of intimate form concentric spirals line In the substrate, in this way, after the Wiring board type coil is switched on, according to electromagnetic induction mechanism, the line Circuit plate coil can produce a stabilizing magnetic field.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Wiring board type coil takes shape in the substrate by photoetching, and is arranged in a manner of intimate form concentric spirals line in the base Plate, in this way, after the Wiring board type coil is switched on, according to electromagnetic induction mechanism, the Wiring board type line Circle can produce a stabilizing magnetic field.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described The coil body of Wiring board type coil is in same plane, to effectively reduce occupied by the Wiring board type coil Space, in favor of being further reduced the overall dimensions of the camera module and the driving component.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described The substrate of route board coil has multilayered structure, and every layer of substrate is and different at least provided with a coil body The coil body mutual conduction of layer is simultaneously superimposed, and is passed through caused by the Wiring board type coil with effectively enhancing or controlling Magnetic field strength.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Magnetic element is positioned apart from the outside of the camera lens carrier, and physics does not occur with the camera lens carrier and the coil Contact, thus after the coil is switched on, according to electromagnetic induction principle it is found that can produce a magnetic by the hot-wire coil , and then magnetic field interaction provided by the magnetic field and magnetic element, to realize auto-focusing, the optics of the camera module The functions such as zoom function or optical anti-vibration.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Magnetic element passes through a magnetic element carrier compartment of terrain and is symmetrically distributed in the outside of the camera lens carrier module, the camera lens Carrier module is movably nested in the magnetic element carrier, between the camera lens carrier module and the magnetic element carrier Mutually may occur from by moving, thus when the camera lens carrier module the coil be switched on after and with the magnetic element Interaction, to drive the optical lens mobile, by means of the auto-focusing and/or stabilization function for being achieved in the camera module Etc. functions.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Pedestal is additionally provided with a control coil and one drive circuit plate, and the control coil is implemented as Wiring board type coil and integrated molding In the drive circuit board, wherein the control coil is arranged to that the magnetic element carrier levels or inclination is driven to move It is dynamic, so that the camera lens carrier and the camera lens are synchronously moved, to realize the optical anti-vibration function of the camera module.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described The drive circuit board of pedestal and the wiring board of the circuit board assemblies are connected with each other simultaneously mutual conduction by a soft board, Compared to existing driver, existing driver connection pin and welded structure design and step can be omitted, thus effectively Ground avoids brought adverse effect in the welding process.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described The drive circuit board of pedestal is connected with the wiring board of the circuit board assemblies by a soft board, so that the driving Connection between circuit board and the circuit board of the camera module with communicate more stable, from the point of view of deeper level, lead to Such mode is crossed, driver circuit plate and camera module circuit board industry can be integrated, to realize all wiring boards of camera module Between modularization and integrated, be conducive to reinforce the cooperation between each industrial chain of camera module, promote camera module industry Integration and development.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Pedestal can further be shaped in the circuit board assemblies, so that the camera module and the driving component have more For compact and more small and exquisite integral structure.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein at this In one embodiment of utility model, the camera lens carrier module includes a camera lens carrier and one group of magnetic element, wherein the magnetic Property element is shaped in the camera lens carrier, such as by moulding technology etc., to reduce the thickness of the camera lens carrier module Size.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein in institute It states in the integrally formed technical process of camera lens carrier module, the magnetic element is arranged at close to the interior of the camera lens carrier Side, so that the thickness of the camera lens carrier module is ultimately reduced, and the magnetic element can effectively add The intensity of the strong camera lens carrier.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Camera lens carrier module further includes a coil, wherein the coil is Wiring board type coil, and is symmetrically disposed on the driving group The peripheral part of the pedestal of part, and when the camera lens carrier is assembled in the pedestal, the coil is correspondingly located at The outside of the magnetic element, with the structure of formation " interior magnetic outside line ", when the coil is switched on, the coil and the magnetic Property element interaction it is mobile to drive the camera lens carrier to carry the optical lens, to realize the camera module The functions such as auto-focusing or optical anti-vibration.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Wiring board type coil is further advanced by a soft board and the drive circuit board of the pedestal is connected with each other simultaneously mutual conduction, from And further by the circuit board of the camera module, the drive circuit board and the wiring board of the driving component Formula coil is integrated into one structure.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Wiring board type coil is shaped in the peripheral part of the Base body by moulding technology, further to make the driving Component has more compact and small and exquisite dimensional structure.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Camera lens carrier module further includes a coil, wherein the coil is Wiring board type coil, and is shaped in the pedestal The drive circuit board, when the camera lens carrier is assembled in the pedestal, the coil is correspondingly located at the magnetic member The lower section of part, with the structure of formation " magnetic opposite ", thus when the coil is switched on, the coil and the magnetic element Interaction is to drive the camera lens carrier to carry the optical lens movement, to realize the automatic right of the camera module The functions such as burnt or optical anti-vibration.

The another object of the utility model is to provide a driving assembly and camera module and its electronic equipment, wherein described Camera lens carrier module further includes a coil, wherein the coil is implemented as Wiring board type coil, wherein the Wiring board type line Circle is set to simultaneously on the peripheral part of the pedestal and the drive circuit board of the pedestal, thus when the coil is led When logical, the coil and the magnetic element interact to drive the camera lens carrier to carry the optical lens movement, To realize the functions such as auto-focusing or the optical anti-vibration of the camera module.

To achieve the above object, the utility model provides a driving assembly comprising:

One magnetic element；

One coil；And

One camera lens carrier；Wherein, the camera lens carrier is for carrying an optical lens in the inner, wherein the magnetic member Part and the camera lens carrier are integrally formed, and the coil separately and corresponds to the magnetic element with the magnetic element, with So that the coil interacts with the magnetic element to drive the camera lens carrier to carry when the coil is switched on The optical lens is mobile.

In an embodiment of the utility model, the coil is Wiring board type coil, wherein the Wiring board type coil Including a substrate and a coil body, the coil body is shaped in the substrate and is arranged in the base in the shape of a spiral Plate, so as to can produce a magnetic field by the Wiring board type coil after coil body is switched on.

In an embodiment of the utility model, the substrate have it is planar, the coil body is formed in the shape of a spiral In the surface of the substrate.

In an embodiment of the utility model, the Wiring board type coil is stacked with so that the coil is with more Layer structure, wherein every layer of Wiring board type coil mutual conduction.

In an embodiment of the utility model, each layer Wiring board type coil have one into electric end and with it is described into The opposite current output terminal in electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction, be located at The current output terminal that the Wiring board type coil positioned at lower layer is electrically connected into electric end of the Wiring board type coil on upper layer, so that Obtain the electric current flow direction having the same of the Wiring board type coil positioned at different layers.

In an embodiment of the utility model, the Wiring board type coil at intervals and is arranged in correspondence in the magnetic The outside of property element.

In an embodiment of the utility model, the camera lens carrier is embedded in the magnetic element, and adjacent to described The inside of camera lens carrier.

In an embodiment of the utility model, one drive circuit plate is gone back, it is soft that the Wiring board type coil passes through one respectively Plate is electrically connected to the drive circuit board.

It further include one drive circuit plate and a Base body, wherein the route in an embodiment of the utility model Board-like coil is integrally formed in the surface of the drive circuit board and corresponds respectively to the bottom side of the magnetic element.

It further include one drive circuit plate in an embodiment of the utility model, wherein the part Wiring board type coil It at intervals and is arranged in correspondence in the outside of the magnetic element, wherein Wiring board type coil described in another part is integrally It is formed in the surface of the drive circuit board, so that Wiring board type coil described in described another part is at intervals and right respectively The bottom side of magnetic element described in Ying Yu.

In an embodiment of the utility model, at intervals and it is arranged in correspondence in the portion in the outside of the magnetic element Divide the Wiring board type coil to pass through a soft board respectively and is electrically connected to the drive circuit board.

It further include a Base body, the Base body is for installing the drive in an embodiment of the utility model Dynamic circuit board, to form the pedestal of the driving component.

Another aspect according to the present utility model, the utility model also provide a camera module comprising:

One optical lens；

Driving assembly as described above；With

One circuit board assemblies, wherein the circuit board assemblies include a wiring board, a photosensitive element and a microscope base, described Photosensitive element is electrically connected to the wiring board, and the microscope base is supported in the wiring board and is arranged to install the driving group Part is thereon, wherein the optical lens is installed on the driving component, to be held in the photosensitive road of the photosensitive element Diameter.

In an embodiment of the utility model, the soft board extend the drive circuit board and the wiring board it Between, to be electrically connected the driving component to the wiring board.

In an embodiment of the utility model, the microscope bases of the circuit board assemblies and the driving component it is described Pedestal is integrally formed.

In an embodiment of the utility model, the microscope bases of the circuit board assemblies and the driving component it is described Pedestal is shaped in the wiring board of the circuit board assemblies.

Another aspect according to the present utility model, the utility model also provide an electronic equipment comprising:

Camera module as described above；With

One electronic equipment ontology, wherein the camera module is assembled in the electronic equipment ontology.

By the understanding to subsequent description and attached drawing, the further purpose of the utility model and advantage will be able to abundant body It is existing.

The these and other objects of the utility model, feature and advantage, by following detailed descriptions, attached drawing and right are wanted It acquires to fully demonstrate.

Detailed description of the invention

Fig. 1 is the exploded perspective schematic diagram of a driver in the prior art.

Fig. 2A is the schematic diagram according to a camera module shown in one preferred embodiment of the utility model.

Fig. 2 B and Fig. 2 C are the coil and the magnetic element of the driving component according to above preferred embodiment Relative position distribution schematic diagram.

Fig. 3 A is a deformation implementation of the camera module according to the utility model above preferred embodiment.

Fig. 3 B and Fig. 3 C are the coil and institute of the driving component of the deformation implementation according to above preferred embodiment State magnetic element relative position distribution schematic diagram.

Fig. 4 A is the schematic diagram of a camera module according to another preferred embodiment of the utility model.

Fig. 4 B and Fig. 4 C be the driving assembly according to above-mentioned another preferred embodiment the coil and the magnetism Element relative position distribution schematic diagram.

Fig. 5 A is the schematic diagram according to the Wiring board type coil of above-mentioned another preferred implementation.

Fig. 5 B is another schematic diagram according to the Wiring board type coil of above-mentioned another preferred implementation.

Fig. 5 C is the wiring board according to another preferable example, the drive circuit board and the Wiring board type coil Assembling schematic diagram.

Fig. 6 A is a variant embodiment schematic diagram of the camera module according to shown in above-mentioned another preferred embodiment.

Fig. 6 B and Fig. 6 C are the coil and the magnetic of the driving component of the camera module according to Fig. 6 A Property element relative position distribution schematic diagram.

Fig. 7 A is another variant embodiment schematic diagram of the camera module according to shown in above-mentioned another preferred embodiment.

Fig. 7 B and Fig. 7 C are the coil and the magnetic of the driving component of the camera module according to Fig. 7 A Property element relative position distribution schematic diagram.

Fig. 8 is the stereoscopic schematic diagram according to an electronic equipment provided by the utility model.

Specific embodiment

It is described below for disclosing the utility model so that those skilled in the art can be realized the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs The other technologies scheme of case and the spirit and scope without departing from the utility model.

It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, without It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore on Stating term should not be understood as limiting the present invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " is no It can be interpreted as the limitation to quantity.

It, can if Fig. 2A is to the camera module 1 for being as shown in fig. 2 c a preferred embodiment according to the present utility model Being applied to various electronic equipments 80, illustrating but being not limited to smart phone, wearable device, computer equipment, television set, traffic Tool, camera, monitoring device etc., the camera module 1 cooperate the electronic equipment 80 to realize the image to target object Acquisition and representational role.

More specifically, the camera module 1 includes an at least optical lens 10, a driving assembly 20 and a circuit board group Part 30.The driving component 20 is installed on the top side of the circuit board assemblies 30, and more particularly, the driving component 20 is installed In a microscope base 33 of the circuit board assemblies 30.The optical lens 10 is assembled by the driving component 20 and is held in institute State the photosensitive path of a photosensitive element 32 of circuit board assemblies 30.The driving component 20 is arranged to drive the optical frames First 10 is mobile, with functions such as auto-focusing and/or the optical anti-vibrations of realizing the camera module 1.Those skilled in the art answers Know, in the utility model other embodiment, the quantity of the optical lens 10 of the camera module 1 can be more than one, Each optical lens 10 is respectively correspondingly assembled in the driving component 20, that is to say, that the camera module 1 can quilt It is embodied as array camera module.Here, in this application only with an optical lens 10 for for example bright camera module 1, it will be appreciated that, the quantity of the optical lens 10 has no effect on the interest field of the utility model.

As shown in Figure 2 A, the driving component 20 includes a camera lens carrier module 21 and a pedestal 22, wherein the pedestal 22 are supported at the top side of the microscope base 33 of the circuit board assemblies 30, and the camera lens carrier module 21 is operationally assembled in The pedestal 22, wherein when the camera lens carrier module 21 is in running order, the camera lens carrier module 21 can be carried The optical lens 10 it is mobile, to change the pass of the relative position between the optical lens 10 and the circuit board assemblies 30 System, to realize the functions such as auto-focusing and/or the optical anti-vibration of the camera module 1, with improve the camera module 1 at As quality.Preferably, in the preferred embodiment of the utility model, the pedestal 22 of the driving component 20 integrally prolongs The microscope base 33 of the circuit board assemblies 30 is stretched in, so that the pedestal 22 and the microscope base 33 have integral structure. Certainly, those skilled in the art it would be appreciated that, in the utility model other embodiment, the driving component 20 can be Split type driving assembly, that is, the driving component 20 is individual component, is mounted on the mirror of the circuit board assemblies 30 Seat 33.

Those skilled in the art will be appreciated that the driving component 20 is based on electromagnetic induction principle and is operated.Such as Fig. 2A Shown, the camera lens carrier module 21 includes a camera lens carrier 213, a coil 211 and one group of magnetic element 212.The camera lens For carrier 213 for accommodating the optical lens 10 in the inner, the coil 211 is set to the camera lens carrier 213, the magnetism Element 212 is arranged in correspondence in the outside of the coil 211, so that can pass through the coil 211 and the magnetic element 212 Electromagnetic induction power drive described in the mobile institute to change the optical lens 10 and the circuit board assemblies 30 of camera lens carrier 213 The relative position between photosensitive element 32 is stated, to realize the functions such as automatic focusing and/or optical anti-vibration.

Particularly, in the preferred embodiment of the utility model, the coil 211 is shaped in the camera lens carrier 213, so that the camera lens carrier module 21 has integral structure.Here, it is formed compared to existing by winding mode Coil 211, the coil 211 is shaped in the camera lens carrier 213, and in other words, the coil 211 constitutes the camera lens A part of carrier 213, thus, effectively reduce the thickness of the camera lens carrier module 21.Simultaneously as the line Circle 211 and the camera lens carrier module 21 are integrally formed, and are not lain between the coil 211 and the camera lens carrier 213 mutually Active force, to can further be reduced to the intensity requirement of the camera lens carrier 213.It is noted that just because of described Camera lens carrier 213 and the coil 211 have an integral structure, the coil 211 camera lens carrier 213 described in reinforcement instead, from And it can further reduce the thickness of the camera lens carrier 213.Further, since the coil 211 and the camera lens carrier Special configuration mode between 213, the coil 211 are not necessarily to be formed in the outer of the camera lens carrier 213 by way of coiling Peripheral wall, can be relatively low hence for the intensity requirement of coil wire body.That is, if still using existing wire body formula coil, line The diameter of astragal body can reduce, in favor of meeting the number of turns and size requirements of coil.

Particularly, in the preferred embodiment of the utility model, the coil 211 is implemented as a Wiring board type coil 2111, the Wiring board type coil 2111 is set to the camera lens carrier 213, so that working as 2111 quilt of Wiring board type coil When excitation with 212 phase separation of magnetic element, to drive the camera lens carrier 213 mobile to change the optical lens 10 With the relative positional relationship between the circuit board assemblies 30, the automatic focusing and/or optical anti-vibration of the camera module 1 are realized Etc. functions.

More specifically, as shown in Figure 2 B, the Wiring board type coil 2111 includes a substrate 21111 and a coil body 21110, wherein the coil body 21110 is shaped in the substrate 21111, and spirally it is arranged in the substrate 21111.The technology of this field can generate magnetic field by energization spiral shell conducting wire it will be appreciated that based on galvanomagnetic-effect, correspondingly, at this In the preferred embodiment of utility model, after the Wiring board type coil 2111 is switched on, by the coil body 21110 can generate stable magnetic field.Particularly, it is noted that in the preferred embodiment of the utility model, the substrate 21111 be plane, and the coil body 21110 is formed in the surface of the substrate in the shape of a spiral, and such mode is fully run The coil that existing Wound-rotor type is formed is covered, to bring many technical advantages.

More specifically, in specific implementation, the Wiring board type coil 2111 can pass through wiring board etching process, wiring board Electroplating technology, wiring board depositing process, wiring board photoetching process are prepared, and the substrate 21111 can be hardboard, soft board, PCB Plate, Rigid Flex etc., the coil body 21110 are formed in the corresponding position of the substrate 21111 by related process, and It arranges in the shape of a spiral.Here, since the coil body 21110 is shaped in the substrate 21111 without being tightened up, because This, the diameter of the wire body of the coil body 21110 can substantially reduce.Correspondingly, under same volume, the Wiring board type The number of turns possessed by coil 2111 can relative increase compared to existing wire-wound coils.Particularly, in specific implementation, described Coil body 21110 can be implemented as the ultra-fine wire body wrapped up by insulating layer, to be formed by by the ultra-fine wire body described Coil can meet the needs of size and the number of turns simultaneously.

Those skilled in the art should be appreciated that magnetic field caused by hot-wire coil is influenced by its number of turns, and same volume The number of turns of lower coil then depends on the diameter of coil wire body.Correspondingly, the Wiring board type coil of offer described in the utility model 2111 are formed by superfine wire body, and compared to existing wire-wound coils, the Wiring board type coil 2111 can phase under same volume It is laid with more the number of turns over the ground.Those skilled in the art will be appreciated that magnetic field force caused by the driving component 20 depends on The influence of magnetic field strength caused by magnetic field strength caused by the coil 211 and the magnetic element 212, thus in order to Under the premise of increasing coil turn, the conducting electric current for controlling the Wiring board type coil 2111 can significantly decline.In this way, can have Effect ground reduces the power consumption of the driving component 20 and the requirement to heat dissipation

On the other hand, there are relatively more the number of turns since the Wiring board type coil 2111 is configurable, that is, correspondingly, The size of the magnetic element 212 opposite with the Wiring board type coil 2111 can be reduced, in favor of further reducing The overall dimensions of the driving component 20.

Further, as shown in Figure 2 B, in the preferred embodiment of the utility model, the Wiring board type coil 2111 It is integrally formed with the camera lens carrier 213, so that the camera lens carrier module 21 has integral structure.In specific implementation, The camera lens carrier 213 can be integrally formed by moulding technology or Shooting Technique and the Wiring board type coil 2111.For example, In the preferred embodiment of the utility model, the camera lens carrier 213 is formed in the Wiring board type coil by moulding technology 2111 central region, wherein after formation, the coil body 21110 of the Wiring board type coil 2111 is along institute It states the outside of camera lens carrier 213 and is gradually distributed outward at spiral form.Meanwhile in order to give the optical lens 10 reserved installation Hole also has a through-hole at 2111 middle part of Wiring board type coil, so that carrying forming the camera lens by moulding technology After body, the installation passage to install the optical lens 10 is formed in the through hole of the Wiring board type coil 2111. In this way, stabilizing magnetic field can be generated by the Wiring board type coil 2111 after the Wiring board type coil 2111 is switched on, And interact with the magnetic element 212, with drive the camera lens carrier 213 carry the optical lens 10 it is mobile to Realize the functions such as auto-focusing and/or the optical anti-vibration of the camera module 1.

Particularly, in the preferred embodiment of the utility model, the Wiring board type coil 2111 is configured with more Layer structure, wherein the Wiring board type coil 2111 of different layers is overlapped mutually and mutual conduction is to strengthen the Wiring board type The functional characteristic of coil 2111.In order to preferably illustrate skill that how the board-like coil 2111 of multilayer line is superimposed and how to be connected Art details, first the technical characteristic of Wiring board type coil 2111 described in single layer is specifically described.

As shown in Figure 2 B, single layer Wiring board type coil 2111 has laminated structure, wherein the coil body 21,110 1 It is body formed in the substrate 21111, to form the Wiring board type coil 2111.Particularly, the coil body 21110 is with spiral shell The mode of rotation shape is arranged in the substrate 21111 so that after the Wiring board type coil 2111 is switched on, electric current along One end of the spiral helicine coil body 21110 is conducted to the other end of coil body 21110, to be imitated according to electromagnetic induction Stabilizing magnetic field should be formed.It is noted that the paving mode of the coil body 21110 of the Wiring board type coil 2111 Other types can also be implemented as, for example side is linear, and concentric circles is linear with one heart etc..

More specifically, each layer Wiring board type coil 2111 includes at least two energization ends, the energization end is used to Obtain extraneous electric energy.Preferably, every layer of Wiring board type coil 2111 respectively has two energization ends, and one into electric end 21112 With a current output terminal 21113.Particularly, as shown in Figure 2 B, described to be arranged at the coil body 21110 most into electric end 21112 The starting point of inside, the current output terminal 21113 are arranged at the outermost end of the coil body 21110, thus when described When Wiring board type coil 2111 is switched on, electric current can be flowed into from described into electric end 21112, and be flowed from the current output terminal 21113 Out, and stable magnetic field is generated.Those skilled in the art answers it will be appreciated that described into electric end 21112 and the current output terminal 21113 be relative concept, does not determine the flow direction of electric current, that is to say, that electric current also can be from the Wiring board type coil 2111 Outermost flows to the most inner side of Wiring board type coil 2111, i.e. electric current flows to described into electric end from the current output terminal 21113 21112。

Further, when the Wiring board type coil 2111 has multilayered structure, on every layer of substrate 21111 respectively Ground forms at least one coil body 21110, and every layer of 2111 mutual conduction of Wiring board type coil is simultaneously overlapped mutually, with phase Increase overall the number of turns of the Wiring board type coil 2111 over the ground.Specifically, every layer of Wiring board type coil 2111 is distinguished Ground has two energization end, is connected with each other between the energization end of the Wiring board type coil 2111 between different layers, so that Obtaining the electric current flowed through in the Wiring board type coil 2111 of different layers has orientation consistency, thus the line of different layers The magnetic direction formed between circuit plate coil 2111 is consistent and mutually reinforces.

More specifically, when the coil body 21110 of the Wiring board type coil 2111 of different layers is with identical Arrangement mode when, such as different layers the Wiring board type coil 2111 simultaneously in counter-clockwise helical shape arrange, in this feelings Under condition, positioned at the route of the Wiring board type coil 2111 on upper layer being electrically connected into electric end 21112 positioned at lower layer The current output terminal 21113 of board-like coil 2111, so that the electric current for flowing through the Wiring board type coil 2111 positioned at upper layer With the electric current flow direction having the same for flowing through the Wiring board type coil 2111 positioned at lower layer, to pass through the line on upper layer Circuit plate coil 2111 is formed by magnetic direction and is formed by magnetic field side with by the Wiring board type coil 2111 of lower layer To with uniformity.Analogize according to this rule, forms Wiring board type coil 2111 with multi-layer structure.

On the contrary, when the wire body of the Wiring board type coil 2111 of different layers has different arrangement modes, Such as the Wiring board type coil 2111 positioned at upper layer is arranged in counter-clockwise helical shape, and it is located at the Wiring board type of lower layer Coil 2111 layers of clockwise spiral arrangement, at this point, be located at the Wiring board type coil 2111 on upper layer into electric 21112 quilt of end The current output terminal 21113 for being connected to the Wiring board type coil 2111 positioned at lower layer is set, so that again such that described flow through position In the Wiring board type coil 2111 on upper layer electric current and flow through the electric current of the Wiring board type coil 2111 positioned at lower layer Flow direction having the same, therefore, the Wiring board type coil 2111 positioned at upper layer are formed by magnetic field and are located at the institute of lower layer It states Wiring board type coil 2111 and is formed by between magnetic field and mutually reinforce.

It is as shown in Figure 3A to 3C a variant embodiment of Wiring board type coil 2111 described in multilayer, wherein in the deformation In embodiment, every layer of substrate 21111 is respectively formed at least one coil body 21110, every layer of wiring board Formula coil 2111 is mutually nested and mutual conduction, to strengthen the functional characteristic of the Wiring board type coil 2111.Analogously, it is Wiring board type coil 2111 described in multilayer is preferably specifically described in the equivalent embodiment how to be connected and how nested folded The technical detail added, the technical characteristic of the Wiring board type coil 2111 when being first single layer substrate 21111 to the substrate 21111 More specifically described.

As shown in Figure 3B, the single layer Wiring board type coil 2111 has oblong structure, wherein the coil body 21110 are shaped in the substrate 21111, wherein 211 wire body of the coil is with intimate form concentric spirals wire type along vertical side To spirally arranging.After the Wiring board type coil 2111 is switched on, electric current is along the spiral helicine coil body 21110 One end conduct to the other end of 2111 wire body of Wiring board type coil, thus utilize electromagnetic induction effect generate a stabilizing magnetic field.

Consistently, every layer of Wiring board type coil 2111 respectively has one into electric end 21112 and a current output terminal 21113, wherein the coil body of the most top side for being arranged at the Wiring board type coil 2111 into electric end 21112 21110 starting point, the current output terminal 21113 are arranged at the coil 211 of the most bottom side of Wiring board type coil 2111 The destination terminal of wire body, so that electric current is flowed into from described into electric end 21112 after the Wiring board type coil 2111 is switched on, And flowed out from the current output terminal 21113, to generate stable magnetic field by electromagnetic induction principle.Those skilled in the art should Understand, described into electric end 21112 and the current output terminal 21113 is relative concept, does not determine the flow direction of electric current, that is to say, that Electric current also can from the most top side of the Wiring board type coil 2111 flow into Wiring board type coil most bottom side, i.e., electric current from it is described go out electricity End 21113 flow to described into electric end 21112.

When the Wiring board type coil 2111 has multilayered structure, wherein in the variant embodiment of the utility model In, every layer of Wiring board type coil 2111 be mutually nested and mutual conduction, equally to increase the Wiring board type coil 2111 overall the number of turns.Specifically, every layer of Wiring board type coil 2111 respectively has two energization end, different layers The Wiring board type coil 2111 energization end between connection it is correct so that flowing through the Wiring board type coil of different layers Electric current in 2111 has consistent direction, thus the magnetic field that the Wiring board type coil 2111 of different layers is formed, direction one It causes and mutually reinforces.

More specifically, when 2111 arrangement mode having the same of Wiring board type coil of different layers, such as not The Wiring board type coil 2111 of same layer is arranged in helical form counterclockwise simultaneously, in this case, positioned at the institute of internal layer It states being set into electric end 21112 for Wiring board type coil 2111 and is connected to going out for the Wiring board type coil 2111 positioned at outer layer Electric end 21113, so that the electric current for flowing through the Wiring board type coil 2111 positioned at internal layer and flowing through positioned at outer layer The electric current flow direction having the same of the Wiring board type coil 2111, to pass through 2111 institute of the Wiring board type coil of internal layer The magnetic direction of formation with to be formed by magnetic direction by the Wiring board type coil 2111 of outer layer with uniformity.

Correspondingly, when the Wiring board type coil 2111 of different layers has opposite arrangement mode, such as positioned at interior The Wiring board type coil 2111 of layer is arranged in counter-clockwise helical shape, and the Wiring board type coil 2111 for being located at outer layer is in Clockwise spiral arrangement.Wherein, it is connected to positioned at being set into electric end 21112 for the Wiring board type coil 2111 of internal layer Positioned at the current output terminal 21113 of the Wiring board type coil 2111 of outer layer, so that the route flowed through positioned at internal layer The electric current of board-like coil 2111 and the electric current flow direction having the same for flowing through the Wiring board type coil 2111 positioned at outer layer, from And magnetic direction is formed by by the Wiring board type coil 2111 of internal layer and passes through the Wiring board type coil of outer layer 2111 to be formed by magnetic direction with uniformity.

It to sum up can be seen that, the Wiring board type coil 2111 with multi-layer structure can be formed by way of upper push-down stack Or the mode of inside and outside nesting is formed.The Wiring board type coil 2111 formed multilayered structure after, further, and with it is described Camera lens carrier 213 is integrally formed.More specifically, the camera lens carrier 213 and the Wiring board type coil 2111 can pass through molding Technique is integrally formed, in specific moulding technology, the middle section of the substrate 21111 of the Wiring board type coil 2111 For a groove and it is isolated, so that after molded material is cured molding, in the middle section of the substrate 21111 The camera lens carrier 213 is formed, while the Wiring board type coil 2111 is integrally solidificated in the camera lens carrier 213, so that Obtaining the camera lens carrier module 21 has integrated compact structure.It is noted that the camera lens carrier 213 can be implemented as Individual component is fitted together with the Wiring board type coil with multi-layer structure, and then passes through moulding technology for two Person is joined integrally.Comparison, is not limited to by the utility model.

Further, in order to drive the camera lens carrier 213 to carry, the optical lens 10 is mobile, and more electromagnetism is fixed Rule, the camera lens carrier module 21 further includes one group of magnetic element 212, wherein the magnetic element 212 is constant for providing one Magnetic field.Wherein, when the Wiring board type coil 2111 is switched on to generate a magnetic field, the magnetic field and the magnetic element 212 Provided magnetic field interaction, it is mobile to generate Wiring board type coil 2111 described in a drive force.Here, due to described Camera lens carrier 213 and the Wiring board type coil 2111 are integrally formed, therefore when the Wiring board type coil 2111 is by movement, institute It states camera lens carrier 213 and is carried synchronizing moving with the optical lens 10 for being installed on the camera lens carrier 213, it is automatic right to realize The functions such as burnt or optical anti-vibration.

More specifically, as shown in figures 2 b and 3b, the magnetic element 212 is positioned apart from the camera lens carrier 213 outside, and be not physically contacted with the camera lens carrier 213 and the coil 211, so that the coil 211 It can be relative to 212 free movement of magnetic element.According to electromagnetic induction principle it is found that after the coil 211 is switched on, institute It states hot-wire coil 211 and generates a magnetic field, and then magnetic field interaction provided by the magnetic field and magnetic element 212, to realize State the functions such as automatic focusing function and/or the optical anti-vibration of camera module 1.

It is more specific, as shown in figures 2 b and 3b, according to Ampere's law it is found that being produced by the Wiring board type coil 2111 Raw magnetic direction is parallel to the direction of optical axis Z, while being symmetrically disposed on the magnetic in 2111 outside of Wiring board type coil Magnetic field caused by property element 212 perpendicular to the optical axis Z, thus the magnetic element 212 can make the coil 211 by The power of vertical power and the horizontal direction cancelled out each other is carried with driving the Wiring board type coil 2111 to carry the camera lens Body 213 and the optical lens 10 are mobile, to realize the automatic focusing function of the camera module 1.

It is noted that the pedestal 22 for being installed on the driving component 20 may be selected in the magnetic element 212, from And when the camera lens carrier module 21 is assembled in the pedestal 22, the magnetic element 212 is arranged in the camera lens vehicle group The outside of part 21 drives the optical lens 10 to move along optical axis direction to generate driving force with the coil 211 interaction It moves to realize automatic focusing function.Here, in other embodiments of the utility model, the magnetic element 212 is composable In on the inner sidewall of an outer housing of the driving component 20, for example, the magnetic element 212 is symmetrically distributed in the shell On the inner sidewall of body, to provide the magnetic field perpendicular to optical axis Z for the coil 211, with drive the camera lens carrier 213 along The direction for being parallel to optical axis Z is mobile, to change the distance between the optical lens 10 and described photosensitive element 32, to realize The automatic focusing function of the camera module 1.

Particularly, as shown in figures 2 b and 3b, in the present invention, the magnetic element 212 is carried by a magnetic element 2121 compartment of terrain of body and the outside for being symmetrically disposed on the Wiring board type coil 2111, to provide one for the coil 211 Symmetrically and perpendicular to the magnetic field of the optical axis Z, and the camera lens carrier 213 is driven to move along the direction for being parallel to optical axis Z, To realize automatic focusing function.Here, the camera lens carrier module 21 is movably nested in the magnetic element carrier 2121, That is, can move freely between each other between the camera lens carrier 213 and the magnetic element carrier 2121.Correspondingly, when described When magnetic element carrier 2121 is by horizontal or inclination movement, the camera lens carrier module 21 can be by the magnetic element carrier 2121 drive and synchronously do and horizontally or diagonally move, with so that realize the optical anti-vibration function of the camera module 1.Ability The technical staff in domain will be appreciated that, caused by magnetic field provided by the Wiring board type coil 2111 and the magnetic element 212 Magnetic field is perpendicular, therefore, it is impossible to make the magnetic element carrier by magnetic field provided by the Wiring board type coil 2111 2121 horizontally or diagonally move.Particularly, in the present invention, the magnetic element carrier 2121 is driven horizontally or diagonally The magnetic field of movement is provided by the coil for the pedestal 22 for being formed in the driving component 20.About this partial content, meeting It is specifically described in the next detailed description about the pedestal 22 of the driving component 20.

Such as Fig. 2A or as shown in Figure 3A, the pedestal 22 includes a Base body 221 and one drive circuit plate 222.Especially Ground, in the present invention, (the camera shooting of the wiring board 31 of the drive circuit board 222 and the circuit board assemblies 30 The wiring board 31 of mould group) it is connected with each other and is connected by an interconnecting piece 223.Particularly, the interconnecting piece 223 is implemented as One soft board 2230, to connect and be connected the institute of the drive circuit board 222 and the camera module 1 by the soft board 2230 State wiring board 31.From the point of view of plainly, to be electrically connected the driving component 20 and the circuit board assemblies by the soft board 2230 30 replace the modes of pins welding electrical connection, may make connection between the drive circuit board 222 and the wiring board 31 with It communicates more stable.From the point of view of deeper, be conducive to 31 industry of wiring board for integrating driver circuit plate and camera module, described in realizing Modularization between all wiring boards of camera module and integrated, reinforces between each industry of camera module to be more advantageous to It works in concert, promotes the integration and development of camera module industry.

Further, as shown in Fig. 2 C or 3C, in the preferred embodiment of the utility model, the pedestal 22 is additionally provided with One control coil 2112, the control coil 2112 are shaped in the drive circuit board, and the magnetic element that is at one's beck and call carries The work of body 2121 horizontally or diagonally moves, to realize the function of optical anti-vibration.Consistently, in the preferable reality of the utility model It applies in example, the control coil 2112 can equally be implemented as Wiring board type coil, and correspond to (corresponding up and down) and be installed on institute The magnetic element of magnetic element carrier is stated, thus, the control coil 2112 can be used for driving the magnetic element carrier 2121 horizontally or diagonally move, so that the camera lens carrier 213 and the camera lens are synchronously moved, to take the photograph described in realizing As the optical anti-vibration function of mould group 1.

Such as Fig. 2 B and 2C or as shown in figs. 3 b and 3 c, after the control coil 2112 is switched on, imitated by electromagnetic induction It answers, generates the magnetic field for corresponding to the magnetic element 212 and being parallel to optical axis Z.As previously mentioned, being produced by magnetic element 212 Raw magnetic field is perpendicular to the optical axis Z, so that magnetic field caused by the magnetic element 212 is produced with the control coil 2112 Raw magnetic field is mutually perpendicular to drive the magnetic element carrier 2121 to carry the camera lens carrier 213 translation or obliquely Movement, to realize the optical anti-vibration function of the camera module 1.Combine and sees, the relatively described magnetism of camera lens carrier 213 Component carrier 2121 does the movement in vertical direction, and the relatively described control coil 2112 of the magnetic element carrier 2121 does level Or the movement on inclined direction, with functions such as auto-focusing and the optical anti-vibrations of realizing the camera module 1 jointly.

Further, the driving component 20 further includes a limit element 40, and the limit element 40 is arranged at described Between camera lens carrier module 21 and the pedestal 22, accurately to limit the camera lens carrier module by the limit element 40 21 movement.More specifically, when the Wiring board type coil 2111 of the camera lens carrier module 21 is switched on to generate and drive When kinetic moment, the limit element 40 arranges in pairs or groups the Wiring board type coil 2111 and the magnetic element 212 pushes the camera lens Carrier 213 is mobile, with functions such as auto-focusing and the optical anti-vibrations of realizing the camera module 1.Those skilled in the art should Know, the limit element 40 can be implemented as an elastic slice component, to limit the camera lens carrier by the elastic slice component The moving condition of component 21 is precisely controlled the camera module to realize.

It is noted that in the preferred embodiment of the utility model, the pedestal 22 and the camera module 1 Integrated degree between circuit board assemblies 30 can gradually extend, to form the integral structure of different levels.

The driver circuit plate 31 and the Base body 221 are only integrally formed by the first level by moulding technology, into And the driving component 20 being completed is installed on to the microscope base 33 of the circuit board assemblies 30.

The driver circuit plate 31 and the Base body 221 are integrally formed by the second level by moulding technology.It is described Base body 221 further can longitudinally extend, to be assembled integrally formula driving assembly 20 and be mounted on the circuit board group After the wiring board 31 of part 30, the pedestal 22 of the driving component 20 forms the microscope base of the circuit board assemblies 30 33.In other words, the Base body 221 has integral structure with the microscope base 33.It is noted that in such case Under, the pedestal 22 in the driving component 20 can be assembled in the optical filter of the camera module 1, described to advanced optimize The overall structure and size of camera module 1.

Third level, by the drive circuit board 222 of the pedestal 22 of driving assembly 20 and the circuit board assemblies 30 wiring board 31 is integrally formed by moulding technology, on the wiring board 31 prior to the circuit board assemblies 30 one The pedestal 22 of body formed the driving component 20, and the camera lens carrier module 21 is assembled in the pedestal 22 to be formed Integral type the driving component 20.In other words, in the level, moulding bodies is formed by by moulding technology and are shaped in institute State wiring board, and the drive circuit board 222 joined integrally and the wiring board 31.

It, can be by once molding or secondary molding is by 22 one of pedestal it is noted that in third level Take shape in the wiring board 31 of the circuit board assemblies 30.

Specifically, if using primary molding, in moulding technology, by the drive circuit board 222 and the camera shooting The wiring board 31 of mould group 1 is set in molding die according to certain position, after the molding of molded material solidification, in Corresponding position forms the pedestal 22 of the driving component 20, wherein the pedestal 22 is shaped in the circuit board assemblies 30 wiring board 31, to function simultaneously as described in the microscope base 33 and the driving component 20 of the circuit board assemblies 30 Pedestal 22.

If using secondary molding, in moulding technology, first to the circuit board assemblies 30 carry out first time molding, with The pedestal with certain height is integrally formed on the wiring board 31 of the circuit board assemblies 30, and then by the pedestal 22 The drive circuit board 222 be set to the top of the pedestal, and carry out second and mold, to form the pedestal 22, Described in pedestal 22 function simultaneously as the microscope base 33 of the circuit board assemblies 30 and the pedestal 22 of the driving component 20.

In addition, in order to further increase the compactedness of the camera module, it can be by the optical lens 10 and the camera lens Carrier 213 is combined as a whole.More specifically, the camera lens carrier 213 includes an accommodating space 2130, the optical lens 10 are accordingly contained in the accommodating space 2130, to be combined as a whole structure with the camera lens carrier 213.Correspondingly, Those skilled in the art should be appreciated that the camera lens carrier 213 has one group when the camera module is array camera module The accommodating space 2130, each optical lens 10 are respectively correspondingly contained in each accommodating space 2130, with It is integrally formed with the camera lens carrier 213.

As Fig. 4 A to it is as shown in Figure 4 C be another preferred embodiment according to the present utility model a camera module, In, the camera module 1 includes an at least optical lens 10, a driving assembly 20 and a circuit board assemblies 30.The driving group Part 20 is installed on a microscope base 33 of the circuit board assemblies 30.The optical lens 10 is assembled simultaneously by the driving component 20 It is held in the photosensitive path of a photosensitive element 32 of the circuit board assemblies 30.The driving component 20 is arranged to driving institute It is mobile to state optical lens 10, with functions such as auto-focusing and/or the optical anti-vibrations of realizing the camera module 1.

As shown in Figure 4 A, the driving component 20 includes a camera lens carrier module 21 and a pedestal 22, wherein the pedestal 22 are supported at the top side of the microscope base 33 of the circuit board assemblies 30, and the camera lens carrier module 21 is operationally assembled in The pedestal 22, wherein when the camera lens carrier module 21 is in running order, the camera lens carrier module 21 can be carried The optical lens 10 it is mobile, to change the pass of the relative position between the optical lens 10 and the circuit board assemblies 30 System, to realize the functions such as auto-focusing and/or the optical anti-vibration of the camera module 1, with improve the camera module 1 at As quality.Preferably, in the preferred embodiment of the utility model, the pedestal 22 of the driving component 20 integrally prolongs The microscope base 33 of the circuit board assemblies 30 is stretched in, so that the pedestal 22 and the microscope base 33 have integral structure. Certainly, those skilled in the art it would be appreciated that, in the utility model other embodiment, the driving component 20 can be Split type driving assembly, that is, the driving component 20 is individual component, is mounted on the mirror of the circuit board assemblies 30 Seat 33.

As shown in Figure 4 A, the camera lens carrier module 21 includes a camera lens carrier 213, a magnetic element 212 and a coil 211, wherein the camera lens carrier 213 is for accommodating the optical lens 10 in the inner, the magnetic element 212 is arranged at institute Camera lens carrier 213 is stated, the coil 211 is arranged in correspondence in the outside of the magnetic element 212, so that can pass through the magnetic Property element 212 and the coil 211 between electromagnetic induction power drive described in camera lens carrier 213 it is mobile, to change the optics Relative positional relationship between camera lens 10 and the photosensitive element 32, to realize the functions such as automatic focusing and/or optical anti-vibration.

Particularly, in the preferred embodiment of the utility model, the magnetic element 212 is shaped in the camera lens Carrier 213, so that the camera lens carrier module 21 has integral structure.That is, the magnetic element 212 is described in interior be embedded in In camera lens carrier 213, in this way, on the one hand reinforce the knot of the camera lens carrier 213 by the magnetic element 212 On the other hand structure intensity may make the size of the camera lens carrier 213 to reduce.

Preferably, the magnetic element 212 is in and is symmetrically set to the camera lens about the camera lens carrier 213 to carry Body 213.Specifically, the magnetic element 212 includes 4 magnet units in the preferred embodiment of the utility model 2120, the magnet unit 2120 is symmetrically distributed in the inside portion of the camera lens carrier 213 about camera lens carrier 213 2131.It is highly preferred that the thickness of the camera lens carrier 213 is almost equal to the thickness of the magnet unit 2120, i.e., from the mirror The distance of head 213 inside portion 2131 of carrier to 213 outside portion 2132 of camera lens carrier is almost equal to the magnet unit 2120 Thickness, thus when the magnet unit 2120 is shaped in the camera lens carrier 213, the magnet unit 2120 it is interior Side is located at the inside portion 2131 of the camera lens carrier 213, and the other side of the magnet unit 2120 is carried adjacent to the camera lens The outside portion 2132 of body 213, on the one hand to ensure the thickness of the camera lens carrier module 21, on the other hand, so that described Magnetic field caused by magnet unit 2120 can sufficiently with the coil 211 interact, with realize the camera module 1 from The functions such as dynamic focusing or optical anti-vibration.

Certainly, those skilled in the art will be appreciated that, in the utility model other embodiment, the magnet unit 2120 be located at the camera lens carrier 213 in positions can change, for example, the magnet unit 2120 can partial denudation in institute State the outside portion of camera lens carrier 213.In this regard, not limited to by the utility model.

As shown in Figure 4 A, in the preferred embodiment of the utility model, the coil 211 is arranged in the driving component 20 pedestal 22, and when the camera lens carrier 213 is assembled in the pedestal 22, the coil 211 is accordingly set It is placed in the outside of the magnetic element 212, with the structure of formation " interior magnetic outside line ".When the coil 211 is switched on, the line Circle 211 is interacted with the magnetic element 212 to drive the camera lens carrier 213 to carry the movement of optical lens 10, To realize the functions such as auto-focusing or the optical anti-vibration of the camera module 1.

More specifically, as shown in Figure 4 B and 4C, the coil 211 is arranged at the peripheral part of the pedestal 22, thus When the camera lens carrier 213 is installed on the top side of the pedestal 22, the coil 211 is arranged in correspondence in the magnetic element The outside of 212 each magnet unit 2120, the cramped construction of " interior magnetic outside line " described in realizing.

In the preferred embodiment of the utility model, it is Wiring board type coil that the coil 211, which is equally carried out example, 2111, wherein as shown in Figure 5A, the Wiring board type coil 2111 includes a substrate 21111 and a coil body 21110, Described in coil body 21110 be shaped in the substrate 21111, and be spirally arranged in the substrate 21111.Ability The technology in domain can generate magnetic field by energization spiral shell conducting wire, correspondingly, in the utility model it will be appreciated that based on galvanomagnetic-effect In the preferred embodiment, after the Wiring board type coil 2111 is switched on, it can be generated surely by the coil body 21110 Fixed magnetic field.

More specifically, in specific implementation, the Wiring board type coil 2111 can pass through wiring board etching process, wiring board Electroplating technology, wiring board depositing process, wiring board photoetching process are prepared, and the substrate 21111 can be hardboard, soft board, PCB Plate, Rigid Flex etc., the coil body 21110 are formed in the corresponding position of the substrate 21111 by related process, and It arranges in the shape of a spiral.Compared to traditional coil formed by canoe, those skilled in the art are readily apparent that, the line The coil wire body of circuit plate coil 2111 is with narrower line width and has smaller line-spacing, these technical characteristics impart 20 many advantages of the driving component.

Consistently, in the preferred embodiment of the utility model, the Wiring board type coil 2111 can equally be matched It sets with multilayered structure, wherein the Wiring board type coil 2111 of different layers is overlapped mutually and mutual conduction is described to strengthen The functional characteristic of Wiring board type coil 2111.In order to preferably illustrate the board-like coil 2111 of multilayer line how to be superimposed and how The technical detail of conducting, first the technical characteristic of Wiring board type coil 2111 described in single layer is specifically described.

As shown in Figure 5A, single layer Wiring board type coil 2111 has laminated structure, wherein the coil body 21,110 1 It is body formed in the substrate 21111, to form the Wiring board type coil 2111.Particularly, the coil body 21110 is with spiral shell The mode of rotation shape is arranged in the substrate 21111 so that after the Wiring board type coil 2111 is switched on, electric current along One end of the spiral helicine coil body 21110 is conducted to the other end of coil body 21110, to be imitated according to electromagnetic induction Stabilizing magnetic field should be formed.It is noted that the paving mode of the coil body 21110 of the Wiring board type coil 2111 Other types can also be implemented as, for example side is linear, and concentric circles is linear with one heart etc..

More specifically, each layer Wiring board type coil 2111 includes at least two energization ends, the energization end is used to Obtain extraneous electric energy.Preferably, every layer of Wiring board type coil 2111 respectively has two energization ends, and one into electric end 21112 With a current output terminal 21113.Particularly, as shown in Figure 2 B, described to be arranged at the coil body 21110 most into electric end 21112 The starting point of inside, the current output terminal 21113 are arranged at the outermost end of the coil body 21110, thus when described When Wiring board type coil 2111 is switched on, electric current can be flowed into from described into electric end 21112, and be flowed from the current output terminal 21113 Out, and stable magnetic field is generated.Those skilled in the art answers it will be appreciated that described into electric end 21112 and the current output terminal 21113 be relative concept, does not determine the flow direction of electric current, that is to say, that electric current also can be from the Wiring board type coil 2111 Outermost flows to the most inner side of Wiring board type coil 2111, i.e. electric current flows to described into electric end from the current output terminal 21113 21112。

Further, when the Wiring board type coil 2111 has multilayered structure, on every layer of substrate 21111 respectively Ground forms at least one coil body 21110, and every layer of 2111 mutual conduction of Wiring board type coil is simultaneously overlapped mutually, with phase Increase overall the number of turns of the Wiring board type coil 2111 over the ground.Specifically, every layer of Wiring board type coil 2111 is distinguished Ground has two energization end, is connected with each other between the energization end of the Wiring board type coil 2111 between different layers, so that Obtaining the electric current flowed through in the Wiring board type coil 2111 of different layers has orientation consistency, thus the line of different layers The magnetic direction formed between circuit plate coil 2111 is consistent and mutually reinforces.

More specifically, when the coil body 21110 of the Wiring board type coil 2111 of different layers is with identical Arrangement mode when, such as different layers the Wiring board type coil 2111 simultaneously in counter-clockwise helical shape arrange, in this feelings Under condition, positioned at the route of the Wiring board type coil 2111 on upper layer being electrically connected into electric end 21112 positioned at lower layer The current output terminal 21113 of board-like coil 2111, so that the electric current for flowing through the Wiring board type coil 2111 positioned at upper layer With the electric current flow direction having the same for flowing through the Wiring board type coil 2111 positioned at lower layer, to pass through the line on upper layer Circuit plate coil 2111 is formed by magnetic direction and is formed by magnetic field side with by the Wiring board type coil 2111 of lower layer To with uniformity.Analogize according to this rule, forms Wiring board type coil 2111 with multi-layer structure.

On the contrary, as shown in Figure 5 B, when different layers the Wiring board type coil 2111 the wire body have it is different The Wiring board type coil 2111 when arrangement mode, such as positioned at upper layer is arranged in counter-clockwise helical shape, and is located at lower layer 2111 layers of clockwise spiral arrangement of the Wiring board type coil, at this point, be located at the Wiring board type coil 2111 on upper layer The current output terminal 21113 for being connected to the Wiring board type coil 2111 positioned at lower layer is set into electric end 21112, to equally make It obtains the electric current for flowing through the Wiring board type coil 2111 positioned at upper layer and flows through the Wiring board type line positioned at lower layer Circle 2111 electric current flow direction having the same, therefore, the Wiring board type coil 2111 positioned at upper layer be formed by magnetic field with It is formed by between magnetic field positioned at the Wiring board type coil 2111 of lower layer and mutually reinforces.

Particularly, in the preferred embodiment of the utility model, the coil 211 includes 4 Wiring board type lines Circle 2111, the every Wiring board type coil 2111 have multilayered structure.Here, it will be appreciated that the Wiring board type coil 2111 quantity corresponds to the quantity of the magnet unit 2120, wherein when the camera lens carrier 213 is assembled in the pedestal 22 When, each Wiring board type coil 2111 corresponds to each magnet unit 2120 of the magnetic element 212, to work as After 31 coil 211 of wiring board is switched on, by between the Wiring board type coil 2111 and the magnetic element 212 Interaction can drive the camera lens carrier 213 to carry the movement of optical lens 10, to realize the camera module 1 The functions such as auto-focusing and/or optical anti-vibration.

More specifically, passing through electromagnetic induction machine after the Wiring board type coil 2111 is by with identical current lead-through Reason, the Wiring board type coil 2111 respectively generate the magnetic field with same size, so that being located at the Wiring board type line The power that the magnetic element 212 of 2111 inside of circle is cancelled out each other by the power and horizontal direction of vertical direction, described in driving Camera lens carrier 213 is moved along vertical direction, to realize the automatic focusing function of the camera module 1.

When the Wiring board type coil 211 is selectively turned on, for example, only Wiring board type coil 2111 described in two panels Be switched on so that be located at the magnetic element 212 of 2111 inside of the Wiring board type coil by the power of vertical direction and The power of horizontal direction cannot cancel out each other, so as to drive the camera lens carrier 213 to move along dampening or inclined direction, with reality The optical anti-vibration function of the existing camera module 1.

Equally, when the conducting electric current of the board-like coil 2111 of the coil has differences, according to electromagnetic induction mechanism, lead to The magnetic field size or direction for crossing the generation of Wiring board type coil 2111 also accordingly have differences.In this way, equally may make described The power that magnetic element 212 is subject in the horizontal direction cannot cancel out each other, so as to similarly drive from 213 edge of camera lens carrier Horizontal or inclined direction it is mobile, to realize the optical anti-vibration function of the camera module 1.Here, conducting electric current exists Difference characterizes that size of current has differences or current direction has differences.

To sum up, based on described " interior magnetic outside line " structure, providing more selection variables, (size of conducting electric current, direction are led The quantity of logical Wiring board type coil 2111) with control the camera lens carrier module 21 different movements is done, described in realizing The functions such as the auto-focusing of camera module 1 and optical anti-vibration.

It is noted that in the preferred embodiment of the utility model, the Wiring board type coil 2111 with it is described Pedestal 22 can be integrally formed, so that the Wiring board type coil 2111 can be combined more steadily with the pedestal 22.About The integral forming process of the Wiring board type coil 2111, can be in the subsequent pedestal 22 about the driving component 20 In detailed description, further explain.

As described in Fig. 4 A, the pedestal 22 includes a Base body 221 and one drive circuit plate 222.Particularly, in this reality In novel, the wiring boards 31 of the drive circuit board 222 and the circuit board assemblies 30 (camera module it is described Wiring board 31) it is connected with each other and is connected by an interconnecting piece 223.Particularly, the interconnecting piece 223 is implemented as a soft board 2230, to connect and be connected the route of the drive circuit board 222 and the camera module 1 by the soft board 2230 Plate 31.From the point of view of plainly, to be electrically connected the driving component 20 and the substitution of the circuit board assemblies 30 by the soft board 2230 The mode of pin welding electrical connection, may make connection between the drive circuit board 222 and the wiring board 31 with communicate more Add stabilization.From the point of view of deeper, be conducive to 31 industry of wiring board for integrating driver circuit plate and camera module, to realize the camera shooting mould Modularization and integrated between all wiring boards of group is closed to be more advantageous to the concerted effort reinforced between each industry of camera module Make, promotes the integration and development of camera module industry.

It is noted that the Wiring board type coil 2111 equally may be used in the preferred embodiment of the utility model It is connected by the soft board 2230 and the drive circuit board 222, in this way, further by the camera shooting The wiring board 31 of mould group 1, the drive circuit board 222 of the driving component 20 and the Wiring board type coil 2111 are integrated into the wiring board chain group with integral structure, just as shown in Figure 5 C.

Further, the driving component 20 further includes a limit element 40, and the limit element 40 is arranged at described Between camera lens carrier module 21 and the pedestal 22, accurately to limit the camera lens carrier module by the limit element 40 21 movement.More specifically, when the Wiring board type coil 2111 of the camera lens carrier module 21 is switched on to generate and drive When kinetic moment, the limit element 40 arranges in pairs or groups the Wiring board type coil 2111 and the magnetic element 212 pushes the camera lens Carrier 213 is mobile, with functions such as auto-focusing and the optical anti-vibrations of realizing the camera module 1.Those skilled in the art should Know, the limit element 40 can be implemented as a sliding slot perhaps ball assembly etc. with by the sliding slot or the ball Component limits the moving condition of the camera lens carrier module 21, to realize being precisely controlled to the camera module 1.

It is noted that in the preferred embodiment of the utility model, the pedestal 22 and the camera module 1 Integrated degree between circuit board assemblies 30 can gradually extend, to form the integral structure of different levels.

The driver circuit plate 31 and the Base body 221 are only integrally formed by the first level by moulding technology, into And the institute that the Wiring board type coil 2111 is symmetrically mounted on to the peripheral part of the Base body 221, and will be completed State the microscope base 33 that driving assembly 20 is installed on the circuit board assemblies 30.

The driver circuit plate 31 and the Base body 221 are integrally formed by moulding technology, and led to by the second level Second of moulding technology is crossed, the Wiring board type coil 2111 is shaped in the peripheral part of the pedestal 22, and then by group The driving component 20 installed is installed on the microscope base 33 of the circuit board assemblies 30.It is equally possible, it can will be described Drive circuit board 222, the Base body 221 and the Wiring board type coil 2111 only by moulding technology one at Type, and the driving component 20 being completed is installed on to the microscope base 33 of the circuit board assemblies 30 in turn.

Third level, by moulding technology by the driver circuit plate 31, the Base body 221 and the Wiring board type Coil 2111 is integrally formed, wherein the Base body 221 continues to extend downwards, to be assembled integrally formula driving assembly 20 simultaneously After being mounted on the wiring board 31 of the circuit board assemblies 30, the pedestal 22 of the driving component 20 serves as the circuit The microscope base 33 of board group part 30.It is noted that in this case, the optical filter of the camera module 1, can be assembled in The pedestal 22 of the driving component 20, to advanced optimize the overall structure and size of the camera module 1.

The pedestal 22 of the driving component 20 is molded to the circuit board by moulding technology by the 4th level The wiring board 31 of component 30 so that the pedestal 22 and the wiring board 31 have integral structure, and serves as described The microscope base 33 of circuit board assemblies 30.In other words, in the level, molding body by integral forming is formed by by moulding technology In the wiring board 31, and the drive circuit board 222 joined integrally and the wiring board 31.

In the 4th level, in specific moulding technology, an optional moulding technology, secondary moulding technology, or Moulding technology is integrally formed the pedestal 22 on the wiring board 31 three times.

Specifically, in a moulding technology, by the drive circuit board 222 of the driving component 20, the electricity The wiring board 31 of road board group part 30, the Wiring board type coil 2111 are fixed on molded mold according to certain position In, after the molding of molded material solidification, the pedestal 22 of the driving component 20 is formed in corresponding position, wherein institute State the wiring board 31 that pedestal 22 is shaped in the circuit board assemblies 30, while 2111 one of the Wiring board type coil Take shape in the peripheral part of the pedestal 22.

In secondary moulding technology, first by the drive circuit board 222 of the driving component 20 and the circuit board group The wiring board 31 of part 30, is fixed in molded mold according to certain position, after moulding material curing molding, Corresponding position forms the pedestal 22 of the driving component 20, wherein the pedestal 22 is formed in the circuit board assemblies 30 The wiring board 31, and serve as pedestal 22 described in the circuit board assemblies 30.It then, will be described by second of moulding technology Wiring board type coil 2111 is integrally molded into the peripheral part of the pedestal 22.

In moulding technology three times, will first first time molding be carried out to the circuit board assemblies 30, in the circuit board The pedestal with certain height is integrally formed on the wiring board 31 of component 30, and then will be described in the driving component 20 Drive circuit board 222 is set to the top of the pedestal, and carries out second and mold, to be integrally formed the pedestal 22, then The Wiring board type coil 2111 is set to the peripheral part of the pedestal 22, third time molding is carried out, by the Wiring board type Coil 2111 is integrally molded into the peripheral part of the pedestal 22.It is noted that comparing more primary moulding technology and secondary mould Modeling technique can be effectively reduced the positioning difficulty between component each in moulding process by moulding technology three times, to reduce The Unitarily molded difficulty of camera module 1.

In addition, in order to further increase the compactedness of the camera module, it can be by the optical lens 10 and the camera lens Carrier 213 is combined as a whole.More specifically, the camera lens carrier 213 includes an accommodating space 2130, the optical lens 10 are accordingly contained in the accommodating space 2130, to be combined as a whole structure with the camera lens carrier 213.Correspondingly, Those skilled in the art should be appreciated that the camera lens carrier 213 has one group when the camera module is array camera module The accommodating space 2130, each optical lens 10 are respectively correspondingly contained in each accommodating space 2130, with It is integrally formed with the camera lens carrier 213.

It is a deformation implementation of the preferred embodiment of the utility model as shown in Figure 6A, wherein in the variant embodiment In, the camera lens carrier module 21 includes a camera lens carrier 213, a coil 211 and a magnetic element 212.The camera lens carrier 213 to accommodate the optical lens 10 in the inner, and the magnetic element 212 is shaped in the camera lens carrier 213, described Coil 211 corresponds to the magnetic element 212, is controlled with interaction by the coil 211 and the magnetic element 212 The moving condition of the camera lens carrier 213 is made, to change the sense of the optical lens 10 and the circuit board assemblies 30 Relative positional relationship between optical element 32, with functions such as auto-focusing and/or the optical anti-vibrations of realizing the camera module 1.

As shown in Figure 6B, in the variant embodiment of the utility model, the coil 211 is formed in the driving component 20 pedestal 22, and when the camera lens carrier 213 is assembled in the pedestal 22, the coil 211 is arranged in correspondence with In the lower section of the magnetic element 212, with the structure of formation " magnet-wire is opposite ", wherein after the coil 211 is switched on, it is described Coil 211 and the magnetic element 212 interact to drive the camera lens carrier 213 to carry the optical lens 10 and move It is dynamic, with functions such as auto-focusing or the optical anti-vibrations of realizing the camera module 1.

Consistently, as shown in Figure 6 C, it is Wiring board type coil 2112 that the coil 211, which is carried out example, wherein the line Circuit plate coil 2112 is shaped in the drive circuit board 222 of the pedestal 22., it will be appreciated that here, can pass through Control the conducting feelings of the Wiring board type coil 2112 with the corresponding situation of the magnetic element 212 and the Wiring board type coil Condition, to control the moving condition of the optical lens 10.

More specifically, when the magnetic field that the Wiring board type coil 2112 generates to be located at the Wiring board type coil When the power that the magnetic element 212 of 2112 tops is cancelled out each other by the power and horizontal direction of vertical direction, mirror described here Head carrier 213 is moved along vertical direction, to realize the automatic focusing function of the camera module 1.In addition, working as the route Magnetic field caused by board-like coil 2112 to be located at the magnetic element 212 of 2112 top of the Wiring board type coil by The power of vertical direction and when the power of horizontal direction cannot cancel out each other, at this time the camera lens carrier 213 by drives edge dampening or Inclined direction is mobile, to realize the optical anti-vibration function of the camera module 1.

Preferably, in the preferred embodiment of the utility model, the Wiring board type coil 2112 is in about the drive Dynamic 222 central symmetry of circuit board distribution, and each Wiring board type coil 2112 corresponds respectively to the magnetic element 212 Each magnet unit 2120, so as to pass through the size of current and direction that control the Wiring board type coil 2112 or described The conducting quantity of Wiring board type coil 2112, to realize the automatic focusing function and/or optical anti-vibration function of the camera module 1 Energy.

Further, the driving component 20 further includes a limit element 40, and the limit element 40 is arranged at described Between camera lens carrier module 21 and the pedestal 22, accurately to limit the camera lens carrier module by the limit element 40 21 movement.More specifically, when the Wiring board type coil 2111 of the camera lens carrier module 21 is switched on to generate and drive When kinetic moment, the limit element 40 arranges in pairs or groups the Wiring board type coil 2111 and the magnetic element 212 pushes the camera lens Carrier 213 is mobile, with functions such as auto-focusing and the optical anti-vibrations of realizing the camera module 1.Those skilled in the art should Know, the limit element 40 can be implemented as an elastic slice component, to limit the camera lens carrier by the elastic slice component The moving condition of component 21 is precisely controlled the camera module to realize.

It is noted that the Wiring board type coil 2112 can be integrated in the preferred embodiment of the utility model Take shape in the drive circuit board 222 of the pedestal 22.Wherein about the pedestal 22, the drive circuit board 222 and institute Stating the relationship between Wiring board type coil 2112 can further illustrate in subsequent detailed description.

As shown in Figure 6A, the pedestal 22 includes a Base body 221 and one drive circuit plate 222.Particularly, in this reality In novel, the wiring boards 31 of the drive circuit board 222 and the circuit board assemblies 30 (camera module it is described Wiring board 31) it is connected with each other and is connected by an interconnecting piece 223.Particularly, the interconnecting piece 223 is implemented as a soft board 2230, to connect and be connected the route of the drive circuit board 222 and the camera module 1 by the soft board 2230 Plate 31.From the point of view of plainly, to be electrically connected the driving component 20 and the substitution of the circuit board assemblies 30 by the soft board 2230 The mode of pin welding electrical connection, may make connection between the drive circuit board 222 and the wiring board 31 with communicate more Add stabilization.From the point of view of deeper, be conducive to 31 industry of wiring board for integrating driver circuit plate and camera module, to realize the camera shooting mould Modularization and integrated between all wiring boards of group is closed to be more advantageous to the concerted effort reinforced between each industry of camera module Make, promotes the integration and development of camera module industry.

Particularly, in the variant embodiment of the utility model, the Wiring board type coil 2112 is shaped in institute Drive circuit board 222 is stated, in this way, further by the circuit board of the camera module 1, the driving component 20 The drive circuit board 222 and the Wiring board type coil 2112 be integrated into one structure.

More specifically, in the preferred embodiment of the utility model, the electricity of the pedestal 22 and the camera module 1 Integrated degree between road board group part 30 can gradually extend, to form the integral structure of different levels.

The driver circuit plate 31 and the Base body 221 are only integrally formed by the first level by moulding technology, Described in Wiring board type coil 2112 drive circuit board 222 is shaped in by the rotten depositing process of wiring board 31, and then will The driving component 20 being completed is installed on the microscope base 33 of the circuit board assemblies 30.

The driver circuit plate 31 and the Base body 221 are integrally formed by the second level by moulding technology, wherein The Base body 221 continues to extend downwards, to be assembled integrally formula driving assembly 20 and be mounted on the circuit board assemblies After 30 wiring board 31, the pedestal 22 of the driving component 20 serves as the microscope base of the circuit board assemblies 30 33.It is noted that in this case, the institute in the driving component 20 can be assembled in the optical filter of the camera module 1 Pedestal 22 is stated, to advanced optimize the overall structure and size of the camera module 1.

Third level passes through the pedestal 22 of driving assembly 20 and the wiring board 31 of the circuit board assemblies 30 Moulding technology is integrally formed, so that being integrally formed the driving group on the wiring board 31 prior to the circuit board assemblies 30 The pedestal 22 of part 20, and the camera lens carrier module 21 is assembled in the pedestal 22 to form driving group described in integral type Part 20.It, can be by once molding or the pedestal 22 is integrally molded by secondary molding it is noted that in this case The circuit board of the circuit board assemblies 30.

Specifically, in a moulding technology, by the wiring board 31 of the driver circuit plate 31 and the camera module 1 It is fixed in the molding die with certain position, after the molding of molded material solidification, is formed in corresponding position described The pedestal 22 of driving assembly 20, wherein the pedestal 22 is shaped in the wiring board of the circuit board assemblies 30 31, to function simultaneously as the microscope base 33 of the circuit board assemblies 30 and the pedestal 22 of the driving component 20.

In secondary moulding technology, will first first time molding be carried out to the circuit board assemblies 30, in the circuit board The pedestal with certain height is integrally formed on the wiring board 31 of component 30, and then will be described in the driving component 20 Drive circuit board 222 is set to the top of the pedestal, and carries out second and mold, to be integrally formed the pedestal 22, wherein The pedestal 22 functions simultaneously as the microscope base 33 of the circuit board assemblies 30 and the pedestal 22 of the driving component 20.

In the preferred embodiment of the utility model, the circuit board assemblies 30 of the pedestal 22 and the camera module 1 Between integrated degree can gradually extend, to form the integral structure of different levels.

It is another deformation implementation according to the above-mentioned preferred embodiment of the utility model as shown in Figure 7 A, wherein in the deformation In embodiment, the camera lens carrier module 21 includes a camera lens carrier 213, a coil 211 and a magnetic element 212.The mirror For head carrier 213 to accommodate the optical lens 10 in the inner, the magnetic element 212 is shaped in the camera lens carrier 213, the coil 211 corresponds to the magnetic element 212, to pass through the mutual of the coil 211 and the magnetic element 212 Effect is to control the moving condition of the camera lens carrier 213, to change the optical lens 10 and the circuit board assemblies 30 The photosensitive element 32 between relative positional relationship, to realize the auto-focusing and/or optical anti-vibration of the camera module 1 Etc. functions.As shown in Figure 7 A, the coil 211 is set to simultaneously described in the peripheral part and the pedestal 22 of the pedestal 22 Drive circuit board 222, so that the coil 211 interacts with the magnetic element 212 when the coil 211 is switched on It is mobile to drive the camera lens carrier 213 to carry the optical lens 10.

As shown in figures 7 b and 7 c, the coil 211 is implemented as Wiring board type coil 2111, wherein is mounted on described The Wiring board type coil 2111 of the peripheral part of pedestal 22 and an at least magnet unit 2120 for the magnetic element 212 are opposite It answers, is set to the Wiring board type coil 2112 of the drive circuit board 222, is correspondingly located at the magnetic element 212 The lower section of the magnet unit 2120.Correspondingly, it is mounted on 2111 quilt of Wiring board type coil of 22 peripheral part of pedestal To control vertically moving for the optical lens 10, to realize the automatic focusing function of the camera module 1.In addition, setting It is used to control the optical lens 10 horizontally or diagonally in the Wiring board type coil 2112 of the drive circuit board 222 Movement, to realize the optical anti-vibration function of the camera module 1.

It is noted that the Wiring board type coil 2111 can be integrally formed at the pedestal 22, that is, be set to described The Wiring board type coil 2111 of 22 peripheral part of pedestal is shaped in the peripheral part of the pedestal 22, at the same time, setting The drive circuit board 222 is shaped in the Wiring board type coil 2112 of the drive circuit board 222.About described The relationship of pedestal 22, the drive circuit board 222 and the Wiring board type coil 2111 can be detailed subsequently with respect to the pedestal 22 Thin description further illustrates.

As shown in Figure 7 A, the pedestal 22 includes a Base body 221 and one drive circuit plate 222.Particularly, in this reality In novel, the wiring boards 31 of the drive circuit board 222 and the circuit board assemblies 30 (camera module it is described Wiring board 31) it is connected with each other and is connected by an interconnecting piece 223.Particularly, the interconnecting piece 223 is implemented as a soft board 2230, to connect and be connected the route of the drive circuit board 222 and the camera module 1 by the soft board 2230 Plate 31.From the point of view of plainly, to be electrically connected the driving component 20 and the substitution of the circuit board assemblies 30 by the soft board 2230 The mode of pin welding electrical connection, may make connection between the drive circuit board 222 and the wiring board 31 with communicate more Add stabilization.From the point of view of deeper, be conducive to 31 industry of wiring board for integrating driver circuit plate and camera module, to realize the camera shooting mould Modularization and integrated between all wiring boards of group is closed to be more advantageous to the concerted effort reinforced between each industry of camera module Make, promotes the integration and development of camera module industry.

It is noted that the Wiring board type coil 2112 for being set to the drive circuit board 222 passes through electricity Plate erosion depositing process in road is shaped in the drive circuit board 222.The line of the peripheral part for being set to the pedestal 22 Circuit plate coil 2111 can be attached by the soft board 2230 with the drive circuit board 222 and mutual conduction, passes through this The mode of sample, further by the wiring board 31 of the camera module 1, the drive circuit board of the driving component 20 222 and the Wiring board type coil 2111 be integrated into one structure.

In the preferred embodiment of the utility model, the circuit board assemblies 30 of the pedestal 22 and the camera module 1 Between integrated degree can gradually extend, to form the integral structure of different levels.

The driver circuit plate 31 and the Base body 221 are only integrally formed by the first level by moulding technology, Described in be set to the Wiring board type coil 2112 of the drive circuit board 222 by wiring board 31 lose depositing process one at Type is mounted in the drive circuit board 222, and then by the Wiring board type coil 2111 for being set to 22 peripheral part of pedestal The circuit board assemblies 30 are installed in the peripheral part of the Base body 221, and by the driving component 20 being completed The microscope base 33.

The driver circuit plate 31 and the Base body 221 are integrally formed by moulding technology, and led to by the second level Secondary moulding technology is crossed, the Wiring board type coil 2111 is shaped in the peripheral part of the pedestal 22, and then will assembling The driving component 20 of completion is installed on the microscope base 33 of the circuit board assemblies 30.It equally, can be by the driving line Road plate 31, the Base body 221 and the Wiring board type coil 2111 are integrally formed by a moulding technology, and in turn will The driving component 20 being completed is installed on the microscope base 33 of the circuit board assemblies 30.

Third level, by moulding technology by the driver circuit plate 31, the Base body 221 and the Wiring board type Coil 2111 is integrally formed, wherein the Base body 221 continues to extend downwards, to be assembled integrally formula driving assembly 20 simultaneously After being mounted on the wiring board 31 of the circuit board assemblies 30, the pedestal 22 of the driving component 20 serves as the circuit The microscope base 33 of board group part 30.It is noted that in this case, the optical filter of the camera module 1, can be assembled in The pedestal 22 of the driving component 20, to advanced optimize the overall structure and size of the camera module 1.

The pedestal 22 of the driving component 20 is molded to the camera shooting mould by moulding technology by the 4th level The wiring board 31 of group 1, so that the pedestal 22 and the wiring board 31 have integral structure, and the pedestal 22 Serve as the microscope base 33 of the circuit board assemblies 30, in this case, the pedestal of the driving component 20 22 first from It is integrally formed, and is then assembled in the camera lens carrier module 21 described on the wiring board 31 of the circuit board assemblies 30 Pedestal 22 is to form integral type the driving component 20.It is noted that may be selected in the integrated process of the 4th level By once molding, secondary molding molds three times.

Specifically, in a moulding technology, by the drive circuit board 222 of the driving component 20, the electricity The wiring board 31 of road board group part 30, the Wiring board type coil 2111 are fixed on molded mold according to certain position In, after the molding of molded material solidification, the pedestal 22 of the driving component 20 is formed in corresponding position, wherein institute State the wiring board 31 that pedestal 22 is shaped in the circuit board assemblies 30, while 2111 one of the Wiring board type coil Take shape in the peripheral part of the pedestal 22.

In secondary moulding technology, first by the drive circuit board 222 of the driving component 20 and the circuit board group The wiring board 31 of part 30, is fixed in molded mold according to certain position, after moulding material curing molding, Corresponding position forms the pedestal 22 of the driving component 20, wherein the pedestal 22 is formed in the circuit board assemblies 30 The wiring board 31, and serve as pedestal 22 described in the circuit board assemblies 30.It then, will be described by second of moulding technology Wiring board type coil 2111 is integrally molded into the peripheral part of the pedestal 22.

In moulding technology three times, will first first time molding be carried out to the circuit board assemblies 30, in the circuit board The pedestal with certain height is integrally formed on the wiring board 31 of component 30, and then will be described in the driving component 20 Drive circuit board 222 is set to the top of the pedestal, and carries out second and mold, to be integrally formed the pedestal 22, then The Wiring board type coil 2111 is set to the peripheral part of the pedestal 22, third time molding is carried out, by the Wiring board type Coil 2111 is integrally molded into the peripheral part of the pedestal 22.It is noted that comparing more primary moulding technology and secondary mould Modeling technique can be effectively reduced the positioning difficulty between component each in moulding process by moulding technology three times, to reduce The Unitarily molded difficulty of camera module 1.

As shown in figure 8, the utility model additionally provides an electronic equipment 80, wherein the electronic equipment 80 includes an electronics Apparatus body 81 and the camera module 1 provided by the utility model, wherein the camera module 1 is the electronic equipment sheet Body 81 acquires and provides image information.It is noted that camera module 1 provided by the utility model is dynamic burnt camera module 1, there is smaller, more compact construction, so that the camera module 1 is applied in the electronic equipment 80 of wider scope, To better adapt to the inexorable trend of electronic equipment 80 " lightening " instantly.

It should be understood by those skilled in the art that foregoing description and the embodiments of the present invention shown in the drawings are only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The function of the utility model Energy and structural principle sufficiently show and illustrate in embodiment, under without departing from the principle, the implementation of the utility model Mode can have any type of deformation or modification.

Claims (127)

1. a driving assembly characterized by comprising

One magnetic element；

One coil；

One camera lens carrier；With

One pedestal, wherein for carrying an optical lens in the inner, the camera lens carrier is moveably mounted the camera lens carrier In the pedestal, wherein the magnetic element and the camera lens carrier are integrally formed, and the coil is at intervals accordingly in institute Magnetic element is stated, so that the coil and magnetic element interaction are described to drive when the coil is switched on It is mobile that camera lens carrier carries the optical lens.

2. driving assembly as described in claim 1, wherein the coil is Wiring board type coil, wherein the Wiring board type Coil includes a substrate and a coil body, and the coil body is shaped in the substrate and is arranged in the shape of a spiral described Substrate, so as to can produce a magnetic field by the Wiring board type coil after coil body is switched on.

3. driving assembly as claimed in claim 2, wherein the substrate have it is planar, the coil body is in the shape of a spiral It is formed in the surface of the substrate.

4. driving assembly as claimed in claim 2, wherein the Wiring board type coil is stacked with so that the coil has There is multilayered structure, wherein every layer of Wiring board type coil mutual conduction.

5. driving assembly as claimed in claim 3, wherein the Wiring board type coil is stacked with so that the coil has There is multilayered structure, wherein every layer of Wiring board type coil mutual conduction.

6. driving assembly as claimed in claim 4, wherein each layer Wiring board type coil have one into electric end and with institute State a current output terminal opposite into electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction, Positioned at the current output terminal for being electrically connected to the Wiring board type coil positioned at lower layer into electric end of the Wiring board type coil on upper layer, So that being located at the electric current flow direction having the same of the Wiring board type coil of different layers.

7. driving assembly as claimed in claim 5, wherein each layer Wiring board type coil have one into electric end and with institute State a current output terminal opposite into electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction, Positioned at the current output terminal for being electrically connected to the Wiring board type coil positioned at lower layer into electric end of the Wiring board type coil on upper layer, So that being located at the electric current flow direction having the same of the Wiring board type coil of different layers.

8. driving assembly as claimed in claim 2, wherein the Wiring board type coil is fixed on the pedestal, so that institute It states Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

9. driving assembly as claimed in claim 3, wherein the Wiring board type coil is fixed on the pedestal, so that institute It states Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

10. driving assembly as claimed in claim 4, wherein the Wiring board type coil is fixed on the pedestal, so that institute It states Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

11. driving assembly as claimed in claim 5, wherein the Wiring board type coil is fixed on the pedestal, so that institute It states Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

12. driving assembly as claimed in claim 6, wherein the Wiring board type coil is fixed on the pedestal, so that institute It states Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

13. driving assembly as claimed in claim 7, wherein the Wiring board type coil is fixed on the pedestal, so that institute It states Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

14. driving assembly as described in claim 1, wherein it is embedded in the camera lens carrier in the magnetic element, and adjacent to The inside portion of the camera lens carrier.

15. driving assembly as claimed in claim 8, wherein the pedestal further includes one drive circuit plate and a Base body, The drive circuit board is installed on the Base body, wherein the Wiring board type coil passes through a soft board respectively and is electrically connected to The drive circuit board.

16. driving assembly as claimed in claim 9, wherein the pedestal further includes one drive circuit plate and a Base body, The drive circuit board is installed on the Base body, wherein the Wiring board type coil passes through a soft board respectively and is electrically connected to The drive circuit board.

17. driving assembly as claimed in claim 10, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

18. driving assembly as claimed in claim 11, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

19. driving assembly as claimed in claim 12, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

20. driving assembly as claimed in claim 13, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

21. driving assembly as claimed in claim 8, wherein the pedestal further includes one drive circuit plate and a Base body, The drive circuit board is installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving electricity The surface of road plate and correspond respectively to the magnetic element.

22. driving assembly as claimed in claim 9, wherein the pedestal further includes one drive circuit plate and a Base body, The drive circuit board is installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving electricity The surface of road plate and correspond respectively to the magnetic element.

23. driving assembly as claimed in claim 10, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

24. driving assembly as claimed in claim 11, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

25. driving assembly as claimed in claim 12, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

26. driving assembly as claimed in claim 13, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

27. driving assembly as claimed in claim 8, wherein the pedestal further includes one drive circuit plate and a Base body, The drive circuit board is installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, so that The part Wiring board type coil is obtained at intervals and to be arranged in correspondence in the outside of the magnetic element respectively, wherein Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that described another part institute It states Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

28. driving assembly as claimed in claim 9, wherein the pedestal further includes one drive circuit plate and a Base body, The drive circuit board is installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, so that The part Wiring board type coil is obtained at intervals and to be arranged in correspondence in the outside of the magnetic element respectively, wherein Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that described another part institute It states Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

29. driving assembly as claimed in claim 10, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

30. driving assembly as claimed in claim 11, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

31. driving assembly as claimed in claim 12, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

32. driving assembly as claimed in claim 13, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

33. driving assembly as claimed in claim 27, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

34. driving assembly as claimed in claim 28, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

35. driving assembly as claimed in claim 29, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

36. driving assembly as claimed in claim 30, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

37. driving assembly as claimed in claim 31, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

38. driving assembly as claimed in claim 32, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

39. a camera module characterized by comprising

One optical lens；

One driving assembly；

One circuit board assemblies, wherein the circuit board assemblies include a wiring board, a photosensitive element and a microscope base, described photosensitive Element is electrically connected to the wiring board, the microscope base be supported in the wiring board and be arranged to installation the driving component in Thereon, wherein the optical lens is installed on the driving component, to be held in the photosensitive path of the photosensitive element, In, the driving component includes:

One magnetic element；

One coil；

One camera lens carrier；And

One pedestal, wherein for carrying an optical lens in the inner, the camera lens carrier is moveably mounted the camera lens carrier In the pedestal, wherein the magnetic element and the camera lens carrier are integrally formed, and the coil is at intervals accordingly in institute Magnetic element is stated, so that the coil and magnetic element interaction are described to drive when the coil is switched on It is mobile that camera lens carrier carries the optical lens.

40. camera module as claimed in claim 39, wherein the coil is Wiring board type coil, wherein the wiring board Formula coil includes a substrate and a coil body, and the coil body is shaped in the substrate and is arranged in institute in the shape of a spiral Substrate is stated, so as to can produce a magnetic field by the Wiring board type coil after coil body is switched on.

41. camera module as claimed in claim 40, wherein the substrate have it is planar, the coil body is helically Shape is formed in the surface of the substrate.

42. camera module as claimed in claim 40, wherein the Wiring board type coil is stacked with so that the coil With multilayered structure, wherein every layer of Wiring board type coil mutual conduction.

43. camera module as claimed in claim 41, wherein the Wiring board type coil is stacked with so that the coil With multilayered structure, wherein every layer of Wiring board type coil mutual conduction.

44. camera module as claimed in claim 42, wherein each layer Wiring board type coil have one into electric end and with A current output terminal opposite into electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction When, positioned at the electricity out for the Wiring board type coil of the Wiring board type coil on upper layer being electrically connected into electric end positioned at lower layer End, so that being located at the electric current flow direction having the same of the Wiring board type coil of different layers.

45. camera module as claimed in claim 43, wherein each layer Wiring board type coil have one into electric end and with A current output terminal opposite into electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction When, positioned at the electricity out for the Wiring board type coil of the Wiring board type coil on upper layer being electrically connected into electric end positioned at lower layer End, so that being located at the electric current flow direction having the same of the Wiring board type coil of different layers.

46. camera module as claimed in claim 40, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

47. camera module as claimed in claim 41, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

48. camera module as claimed in claim 42, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

49. camera module as claimed in claim 43, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

50. camera module as claimed in claim 44, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

51. camera module as claimed in claim 45, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

52. camera module as claimed in claim 39, wherein be embedded in the camera lens carrier in the magnetic element, and neighbouring In the inside portion of the camera lens carrier.

53. camera module as claimed in claim 46, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

54. camera module as claimed in claim 47, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

55. camera module as claimed in claim 48, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

56. camera module as claimed in claim 49, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

57. camera module as claimed in claim 50, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

58. camera module as claimed in claim 51, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

59. camera module as claimed in claim 46, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

60. camera module as claimed in claim 47, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

61. camera module as claimed in claim 48, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

62. camera module as claimed in claim 49, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

63. camera module as claimed in claim 50, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

64. camera module as claimed in claim 51, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

65. camera module as claimed in claim 46, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

66. camera module as claimed in claim 47, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

67. camera module as claimed in claim 48, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

68. camera module as claimed in claim 49, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

69. camera module as claimed in claim 50, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

70. camera module as claimed in claim 51, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

71. the camera module as described in claim 65, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

72. the camera module as described in claim 66, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

73. the camera module as described in claim 67, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

74. camera module as recited in claim 68, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

75. the camera module as described in claim 69, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

76. the camera module as described in claim 70, wherein be fixed on the part Wiring board type line of the pedestal Circle is electrically connected to the drive circuit board by a soft board respectively.

77. the camera module as described in claim 53 to 76 is any, further includes a soft board, the soft board extends the driving Between circuit board and the wiring board, to be electrically connected the driving component to the wiring board.

78. the camera module as described in claim 39 to 76 is any, wherein the microscope base of the circuit board assemblies and described The pedestal of driving assembly is integrally formed.

79. the camera module as described in claim 77, wherein the microscope base and the driving component of the circuit board assemblies The pedestal be integrally formed.

80. the camera module as described in claim 78, wherein the microscope base and the driving component of the circuit board assemblies The pedestal be shaped in the wiring boards of the circuit board assemblies.

81. the camera module as described in claim 79, wherein the microscope base and the driving component of the circuit board assemblies The pedestal be shaped in the wiring boards of the circuit board assemblies.

82. an electronic equipment characterized by comprising

One camera module；

One electronic equipment ontology, wherein the camera module is assembled in the electronic equipment ontology, wherein the camera shooting mould Group includes:

One optical lens；

One driving assembly；

One circuit board assemblies, wherein the circuit board assemblies include a wiring board, a photosensitive element and a microscope base, described photosensitive Element is electrically connected to the wiring board, and the microscope base is supported in the wiring board and is arranged to one driving assembly of installation in it On, wherein the optical lens is installed on the driving component, to be held in the photosensitive path of the photosensitive element, wherein The driving component includes:

One magnetic element；

One coil；

One camera lens carrier；And

One pedestal, wherein for carrying an optical lens in the inner, the camera lens carrier is moveably mounted the camera lens carrier In the pedestal, wherein the magnetic element and the camera lens carrier are integrally formed, and the coil is at intervals accordingly in institute Magnetic element is stated, so that the coil and magnetic element interaction are described to drive when the coil is switched on It is mobile that camera lens carrier carries the optical lens.

83. the electronic equipment as described in claim 82, wherein the coil is Wiring board type coil, wherein the wiring board Formula coil includes a substrate and a coil body, and the coil body is shaped in the substrate and is arranged in institute in the shape of a spiral Substrate is stated, so as to can produce a magnetic field by the Wiring board type coil after coil body is switched on.

84. the electronic equipment as described in claim 83, wherein the substrate have it is planar, the coil body is helically Shape is formed in the surface of the substrate.

85. the electronic equipment as described in claim 83, wherein the Wiring board type coil is stacked with so that the coil With multilayered structure, wherein every layer of Wiring board type coil mutual conduction.

86. the electronic equipment as described in claim 84, wherein the Wiring board type coil is stacked with so that the coil With multilayered structure, wherein every layer of Wiring board type coil mutual conduction.

87. the electronic equipment as described in claim 85, wherein each layer Wiring board type coil have one into electric end and with A current output terminal opposite into electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction When, positioned at the electricity out for the Wiring board type coil of the Wiring board type coil on upper layer being electrically connected into electric end positioned at lower layer End, so that being located at the electric current flow direction having the same of the Wiring board type coil of different layers.

88. the electronic equipment as described in claim 86, wherein each layer Wiring board type coil have one into electric end and with A current output terminal opposite into electric end, wherein when the Wiring board type coil of different layers has the helical form of the same direction When, positioned at the electricity out for the Wiring board type coil of the Wiring board type coil on upper layer being electrically connected into electric end positioned at lower layer End, so that being located at the electric current flow direction having the same of the Wiring board type coil of different layers.

89. the electronic equipment as described in claim 83, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

90. the electronic equipment as described in claim 84, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

91. the electronic equipment as described in claim 85, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

92. the electronic equipment as described in claim 86, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

93. the electronic equipment as described in claim 87, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

94. the electronic equipment as described in claim 88, wherein the Wiring board type coil is fixed on the pedestal, so that The Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element.

95. the electronic equipment as described in claim 82, wherein be embedded in the camera lens carrier in the magnetic element, and neighbouring In the inside portion of the camera lens carrier.

96. the electronic equipment as described in claim 89, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

97. the electronic equipment as described in claim 90, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

98. the electronic equipment as described in claim 91, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

99. the electronic equipment as described in claim 92, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

100. the electronic equipment as described in claim 93, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

101. the electronic equipment as described in claim 94, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil passes through soft board electrical connection respectively In the drive circuit board.

102. the electronic equipment as described in claim 89, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

103. the electronic equipment as described in claim 90, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

104. the electronic equipment as described in claim 91, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

105. the electronic equipment as described in claim 92, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

106. the electronic equipment as described in claim 93, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

107. the electronic equipment as described in claim 94, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein the Wiring board type coil is integrally formed in the driving The surface of circuit board and correspond respectively to the magnetic element.

108. the electronic equipment as described in claim 89, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

109. the electronic equipment as described in claim 90, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

110. the electronic equipment as described in claim 91, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

111. the electronic equipment as described in claim 92, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

112. the electronic equipment as described in claim 93, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

113. the electronic equipment as described in claim 94, wherein the pedestal further includes one drive circuit plate and a pedestal master Body, the drive circuit board are installed on the Base body, wherein and the part Wiring board type coil is fixed on the pedestal, So that the part Wiring board type coil at intervals and is arranged in correspondence in the outside of the magnetic element respectively, In, Wiring board type coil described in another part is integrally formed in the surface of the drive circuit board, so that another portion Divide the Wiring board type coil difference at intervals and corresponds to the bottom side of the magnetic element.

114. the electronic equipment as described in claim 108, wherein be fixed on the part Wiring board type of the pedestal Coil passes through a soft board respectively and is electrically connected to the drive circuit board.

115. the electronic equipment as described in claim 109, wherein be fixed on the part Wiring board type of the pedestal Coil passes through a soft board respectively and is electrically connected to the drive circuit board.

116. the electronic equipment as described in claim 110, wherein be fixed on the part Wiring board type of the pedestal Coil passes through a soft board respectively and is electrically connected to the drive circuit board.

117. the electronic equipment as described in claim 111, wherein be fixed on the part Wiring board type of the pedestal Coil passes through a soft board respectively and is electrically connected to the drive circuit board.

118. the electronic equipment as described in claim 112, wherein be fixed on the part Wiring board type of the pedestal Coil passes through a soft board respectively and is electrically connected to the drive circuit board.

119. the electronic equipment as described in claim 113, wherein be fixed on the part Wiring board type of the pedestal Coil passes through a soft board respectively and is electrically connected to the drive circuit board.

120. the electronic equipment as described in claim 82 to 95 is any, wherein the pedestal further include one drive circuit plate and One Base body, the drive circuit board are installed on the Base body, wherein the electronic equipment further includes a soft board, it is described Soft board extends between the drive circuit board and the wiring board, to be electrically connected the driving component to the wiring board.

121. the electronic equipment as described in claim 96 to 119 is any, further includes a soft board, the soft board extends the drive Between dynamic circuit board and the wiring board, to be electrically connected the driving component to the wiring board.

122. the electronic equipment as described in claim 82 to 119 is any, wherein the microscope base of the circuit board assemblies and institute The pedestal for stating driving assembly is integrally formed.

123. the electronic equipment as described in claim 120, wherein the microscope base of the circuit board assemblies and the driving group The pedestal of part is integrally formed.

124. the electronic equipment as described in claim 121, wherein the microscope base of the circuit board assemblies and the driving group The pedestal of part is integrally formed.

125. the electronic equipment as described in claim 122, wherein the microscope base of the circuit board assemblies and the driving group The pedestal of part is shaped in the wiring board of the circuit board assemblies.

126. the electronic equipment as described in claim 123, wherein the microscope base of the circuit board assemblies and the driving group The pedestal of part is shaped in the wiring board of the circuit board assemblies.

127. the electronic equipment as described in claim 124, wherein the microscope base of the circuit board assemblies and the driving group The pedestal of part is shaped in the wiring board of the circuit board assemblies.