CN114257726A

CN114257726A - Camera module and electronic equipment

Info

Publication number: CN114257726A
Application number: CN202111565675.7A
Authority: CN
Inventors: 马忠科; 陈小凤
Original assignee: Jiangxi Jinghao Optical Co Ltd
Current assignee: Jiangxi Jinghao Optical Co Ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2022-03-29
Anticipated expiration: 2041-12-20
Also published as: CN114257726B

Abstract

The invention discloses a camera module and electronic equipment, wherein the camera module comprises a lens component, an elastic supporting structure, a chip component and a power component, the chip component is arranged on a movable plate of the elastic supporting structure, the power component comprises a first support, a connecting support, a first elastic component and a first power component, the first support is connected to a bearing plate of the elastic supporting structure, the connecting support is connected to the chip component, two ends of the first elastic component are respectively connected to the first support and the connecting support, the first elastic component extends towards a first direction in a bending mode, the first direction is the direction from the connecting position of the first elastic component and the first support to the connecting position of the first elastic component and the connecting support, and the first power component is connected to the first support and the connecting support and used for enabling the chip component to move along the direction of an optical axis to perform automatic focusing. By adopting the embodiment, the miniaturization design of the camera module can be realized, the resistance of the chip assembly when the chip assembly moves along the optical axis direction is reduced, and the response speed of automatic focusing is improved.

Description

Camera module and electronic equipment

Technical Field

The invention relates to the technical field of imaging devices, in particular to a camera module and electronic equipment.

Background

The camera module is often provided with among the electronic equipment such as camera, smart mobile phone, intelligent wrist-watch of correlation technique, and in order to improve the shooting quality when shooing, the module of making a video recording of the overwhelming majority can include driving motor to realize auto focus through driving motor drive camera lens motion, in order to improve the shooting quality of the module of making a video recording. Along with the rising of sensitization chip pixel grade, the overall dimension of chip increases thereupon, and in step, the size and the weight of camera lens also increase thereupon, and the requirement to the bearing of driving motor and area power is higher and higher, and the bearing performance that needs driving motor is higher and higher, and area power is bigger and bigger, leads to driving motor's overall dimension to lead to making a video recording the increase of module, be unfavorable for the miniaturized design of the module of making a video recording.

Disclosure of Invention

The embodiment of the invention discloses a camera module and electronic equipment, which can reduce the resistance of a chip assembly when moving along the optical axis direction while realizing the miniaturization design of the camera module, thereby being beneficial to improving the response speed of automatic focusing and facilitating the automatic focusing.

In order to achieve the above object, in a first aspect, the present invention discloses a camera module, including:

a lens assembly;

the elastic support structure is arranged on the image side of the lens assembly and comprises a bearing plate and a movable plate electrically connected with the bearing plate;

the chip component is arranged on the movable plate and is positioned between the movable plate and the lens component; and

the power assembly is positioned on the image side of the lens assembly and comprises a first support, a connecting support, a first elastic component and a first power component, the first support is connected to the bearing plate, the connecting support is connected to the chip assembly, two ends of the first elastic component are respectively connected to the first support and the connecting support, the first elastic component is bent towards a first direction to form at least one first bent part, the first power component is respectively connected to the first support and the connecting support, and the first power component is used for enabling the connecting support to move along the optical axis direction of the lens assembly so as to enable the chip assembly to move along the optical axis direction and realize automatic focusing of the camera module;

wherein the first direction is a direction from a connection of the first elastic member and the first bracket to a connection of the first elastic member and the connection bracket.

In the camera module provided by the application, the power assembly is arranged to drive the chip assembly to move along the optical axis direction so as to realize the automatic focusing of the camera module, although the overall dimensions and the weight of the chip assembly and the lens assembly are increased along with the increase of the pixel level of the chip assembly, the increased chip assembly is generally lighter than the lens assembly, compared with the mode that the lens assembly is driven by the power assembly to move along the optical axis direction so as to realize the automatic focusing, the power assembly drives the chip assembly to move along the optical axis direction so as to carry out the automatic focusing of the camera module, the requirements on the bearing and the driving force of the power assembly are lower, so that the power assembly with smaller overall dimension can be adopted to drive the chip assembly to move along the optical axis direction so as to realize the automatic focusing function of the camera module, thereby being beneficial to reducing the overall dimension of the camera module, the miniaturized design of the camera module is realized.

In addition, the first support and the connecting support in the application are connected through the first elastic component, the connecting support is driven by the first power component to move along the optical axis direction, so that when the chip assembly moves along the optical axis direction for automatic focusing, the first elastic component is subjected to the action of the connecting support, single-arm swinging and deformation occur by taking the joint of the first elastic component and the first support as a fulcrum, the first elastic component is limited to bend along the first direction to form at least one first bending part, so that the first elastic component has a longer swing arm, the first elastic component can bend and deform only by overcoming smaller material stress during automatic focusing, the dragging force from the first elastic component when the connecting support moves along the optical axis direction is reduced, the resistance on the chip assembly during focusing is smaller, and the automatic focusing response speed of the chip assembly is improved, the automatic focusing is convenient to carry out.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the power assembly is located between the elastic support structure and the lens assembly, or the power assembly is located on a side of the elastic support structure facing away from the lens assembly, and as a result, the location of the power assembly is not limited to one location, and the power assembly may be located at different locations according to actual needs, and the application range is wider. Moreover, when the power component is arranged on the side of the elastic supporting structure, which is opposite to the chip component, compared with the mode that the power component is arranged between the elastic supporting structure and the lens component, the distance from the lens component to the chip component can be shortened, namely, the image distance of the camera module can be reduced, and the camera module can be made into a short back focus camera module; meanwhile, the overall thickness of the camera module in the optical axis direction can be reduced, and the miniaturization design of the camera module is facilitated.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the first elastic component includes a plurality of first elastic portions, the plurality of first elastic portions are sequentially connected, and two adjacent first elastic portions are connected at an angle to form the first bending portion, of the plurality of first elastic portions, the first elastic portion located at the head portion is connected to the first bracket, the first elastic portion located at the tail portion is connected to the connecting bracket, and the extending directions of the first elastic portion located at the head portion and the first elastic portion located at the tail portion are both parallel to the first direction. The first elastic member is structured such that the first elastic member has a small reaction force in the optical axis direction and a large reaction force in a direction perpendicular to the optical axis. The first elastic component has a smaller reaction force in the optical axis direction, so that the reaction force from the first elastic component when the connecting bracket moves in the optical axis direction is smaller, and meanwhile, the first elastic component has a larger reaction force in the direction perpendicular to the optical axis, so that the reaction force from the first elastic component when the connecting bracket moves in the direction perpendicular to the optical axis is larger.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the power assembly further includes a second bracket, a second elastic component, and a second power component, the second bracket is connected to the lens assembly, two ends of the second elastic component are respectively connected to the second bracket and the first bracket, the second elastic component is bent along a second direction to form at least one second bent portion, the second direction is a direction from a connection point of the second elastic component and the second bracket to a connection point of the second elastic component and the first bracket, the second power component is connected to the second bracket and the first bracket, and the second power component is configured to drive the first bracket to move relative to the second bracket, so that the chip assembly moves to perform optical anti-shake. According to the camera module, the first power component of the power component can be utilized to enable the chip component to move along the optical axis direction so as to carry out automatic focusing, and meanwhile, the second power component of the power component can be utilized to enable the chip component to move along the direction perpendicular to the optical axis direction and rotate around the optical axis so as to carry out optical anti-shake, namely, the power component can drive the chip component to move along the optical axis direction so as to realize the automatic focusing function of the camera module; simultaneously, the chip component can be driven to move along the direction perpendicular to the optical axis and rotate around the optical axis, so that the optical anti-shake function of the camera module is realized, and the camera module is favorable for improving the shooting quality.

In addition, the second support and the first support in the application are connected through the second elastic component, the second power component drives the first support to move along the direction perpendicular to the optical axis, so that when the chip assembly moves along the direction perpendicular to the optical axis to perform optical anti-shake, the second elastic component is acted by the first support, and the joint of the second elastic component and the second support is taken as a fulcrum to swing by a single arm and deform, the second elastic component is limited to bend along the second direction to form at least one second bent part, so that the second elastic component has a longer swing arm, the second elastic component can bend and deform only by overcoming smaller material stress during automatic focusing, the pulling force from the second elastic component during movement of the first support is reduced, the resistance of the chip assembly during optical anti-shake is smaller, and the optical anti-shake response speed of the chip assembly is further improved, optical anti-shake is convenient to carry out.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the second elastic component includes a plurality of second elastic portions, the plurality of second elastic portions are sequentially connected, and two adjacent second elastic portions are connected at an angle to form the second bending portion, of the plurality of second elastic portions, the second elastic portion located at the head portion is connected to the second bracket, the second elastic portion located at the tail portion is connected to the first bracket, and the extending directions of the second elastic portion located at the head portion and the second elastic portion located at the tail portion are both parallel to the second direction. The second elastic member is structured such that the second elastic member has a smaller reaction force in a direction perpendicular to the optical axis and a larger reaction force in the optical axis direction. The second elastic component has a smaller reaction force in the direction perpendicular to the optical axis, so that the reaction force from the second elastic component received by the first bracket when the first bracket moves in the direction perpendicular to the optical axis is smaller, and meanwhile, the second elastic component has a larger reaction force in the direction of the optical axis, so that the reaction force from the second elastic component received by the first bracket when the first bracket moves in the direction of the optical axis is larger.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the chip assembly and/or the movable plate are provided with a spacer, and the chip assembly and the movable plate are connected through the spacer. This is mainly considered: if directly pile up the chip subassembly and establish on the fly leaf, the chip subassembly can contact with the flexible connection area, move along the optical axis direction at the chip subassembly, specifically when moving (being downstream) along the direction of the lens subassembly dorsad, the first link end of flexible connection area being connected with the loading board can butt in the chip subassembly, lead to interfering and hinder the downstream of chip subassembly, consequently, through cushion between chip subassembly and fly leaf, make and to have the clearance between chip subassembly and the flexible connection area, this is equivalent to giving a decurrent free space of chip subassembly, thereby avoid the condition that the chip subassembly moved is influenced with first link end touching when the chip subassembly moves downwards, provide probably for the removal of chip subassembly.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the supporting plate is a hollowed-out substrate, the supporting plate includes a plurality of hollowed-out portions, and the plurality of movable plates are disposed at intervals and located in the hollowed-out portions;

the elastic supporting structure also comprises a connecting part and a plurality of spiral flexible connecting belts, the connecting part is positioned in the hollow part, the flexible connecting belts are arranged at intervals and positioned in the hollow part, the flexible connecting belts are all fixed and are electrically connected with the connecting part, and each of the flexible connecting bands spirally extends in the same direction around the connecting part, wherein among the flexible connecting bands, one end of one part of the flexible connecting belt far away from the connecting part is provided with a first connecting end, the other end of the other part of the flexible connecting belt far away from the connecting part is provided with a second connecting end, the first connecting ends are electrically connected with the bearing plate, the movable plates are respectively arranged at the corresponding second connecting ends and are electrically connected with the corresponding second connecting ends, and the chip assemblies are arranged on the movable plates and are electrically connected with the movable plates.

It can be known that, when the chip assembly moves along the optical axis direction for automatic focusing, the movable plate moves along the optical axis direction along with the chip assembly, so that the flexible connecting band deforms, therefore, by arranging a plurality of flexible connecting bands, the electric connection between the movable plate and the bearing plate is realized, under the condition of ensuring that the wiring amount is not changed, namely under the condition of not influencing the power connection conduction of the chip assembly, the flexible connecting band is in a belt shape, and can be bent and deformed only by overcoming smaller material stress when stressed, so that the resistance of the chip assembly when moving is smaller; and, flexible connection area is the spiral and extends, and for linear bar structure, it has certain redundancy, only need overcome less material stress alright bending, deformation when carrying out the chip subassembly motion to the resistance that need overcome when being favorable to reducing flexible connection area deformation, the resistance that makes the chip subassembly receive when moving along the optical axis direction is littleer. In other words, when the automatic focusing is performed, the resistance received by the photosensitive chip when the photosensitive chip moves along the optical axis direction can be reduced, so that the response speed of the automatic focusing is favorably improved, and the automatic focusing is facilitated.

Or the elastic supporting structure further comprises a plurality of spiral flexible connecting strips, the flexible connecting strips are independently arranged and located in the hollow-out portion, each flexible connecting strip is provided with a first connecting end and a second connecting end, the first connecting end is electrically connected with the bearing plate, each movable plate is arranged at the corresponding second connecting end and is electrically connected with the corresponding second connecting end, and the chip assembly is arranged on each movable plate and is electrically connected with each movable plate.

Through making many flexonics areas relatively independent setting, each flexonics area breaks off the interval setting each other promptly, thus, in the deformation in-process of each flexonics area atress by tensile, can reduce the control effect between each flexonics area, in order to avoid taking place mutual interference when warping, make each flexonics area more easily stretched take place deformation, in order to further reduce the resistance that the chip subassembly received when removing along the optical axis direction, thereby can further improve autofocus's response speed, more conveniently carry out autofocus.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the elastic support structure further includes an upright flexible board, the upright flexible board includes a cantilever portion, a first connecting arm and a second connecting arm, the cantilever portion surrounds the loading board, the first connecting arm is connected to the cantilever portion, and is bent from the cantilever portion to the direction of the loading board and electrically connected to the loading board, and the second connecting arm is connected to the cantilever portion, and is bent from the cantilever portion to the direction of the loading board and electrically connected to an external circuit.

Adopt the upright type soft board to realize the electricity between chip subassembly and the external circuit and be connected, move and rotate around the optical axis along the perpendicular to optical axis direction at the chip subassembly, when in order to carry out optics anti-shake, can use the junction of second linking arm and external circuit as the fulcrum, take place the swing for the cantilever with first linking arm and cantilever portion, can make the upright type soft board have longer swing arm like this, thereby when carrying out optics anti-shake, can reduce the resistance of chip subassembly motion, thereby be favorable to improving the response speed of optics anti-shake, be convenient for carry out optics anti-shake.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the cantilever portion is a bending plate, the cantilever portion includes a plurality of cantilever portions, the plurality of cantilever portions are connected in sequence, and two adjacent cantilever portions are disposed at an angle to form an enclosed space, at least one of the cantilever portions is bent toward the carrier plate to form the first connecting arm, at least another one of the cantilever portions is bent away from the carrier plate to form the second connecting arm, and at least one fourth of the carrier plate is located in the enclosed space, that is, the cantilever portion can perform one-fourth enclosure, one-half enclosure, three-fourth enclosure, or substantially full enclosure on the carrier plate to ensure that the cantilever portion has a longer length to ensure that the upright soft plate has a longer swing arm, thereby further reducing resistance to movement of the chip assembly when performing optical anti-shake, therefore, the optical anti-shake response speed is improved, and the optical anti-shake is facilitated.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, when the power component is located between the elastic supporting structure and the lens component, the second support has a first accommodating space with an opening facing away from the lens component, the elastic supporting structure, the chip component, the first support, the connecting support, the first elastic component, the first power component, the second elastic component, and the second power component are all located in the first accommodating space, the camera module further includes a base, the base covers the opening of the first accommodating space, and the base has an avoiding groove communicated with the first accommodating space, and the avoiding groove is used for avoiding the chip component and the movable plate when the chip component moves along the optical axis direction.

The first accommodating space is formed in the second support, so that parts such as the elastic supporting structure, the chip assembly, the first support, the connecting support, the first elastic part, the first power part, the second elastic part and the second power part are arranged in the first accommodating space, and the parts occupy the inner space of the second support, so that the structure of the power assembly is more compact, the size is smaller, the integral size of the camera module is smaller, and the miniaturization design of the camera module is facilitated; moreover, the setting of first accommodation space for the quality of second support is lighter, is favorable to making the whole quality of the module of making a video recording lighter, thereby is favorable to making a video recording the lightweight design of module.

The opening is formed in the first accommodating space, so that the elastic supporting structure, the chip assembly, the first support, the connecting support, the first elastic component, the first power component, the second elastic component, the second power component and other parts can be conveniently assembled in the first accommodating space, and the camera module can be conveniently assembled; still set up the opening of base with the first accommodation space of closing cap simultaneously to make the module of making a video recording form into a confined structure, can not only avoid external light to get into the camera lens subassembly from the opening of first accommodation space and influence the formation of image effect of camera lens subassembly, can also play parts such as the elastic support structure to the encapsulation in inside, the chip subassembly, first support, linking bridge, first elastomeric element, first power component, second elastomeric element and second power component with external isolated guard action. Moreover, because when carrying out automatic focusing, chip subassembly and fly leaf can take place to remove along the optical axis direction, in order to avoid having the interference between chip subassembly and fly leaf and the base, the base is equipped with the opening towards the groove of dodging of fly leaf, thereby dodge the groove and can be used to dodge chip subassembly and fly leaf when chip subassembly takes place to remove along the optical axis direction, provide probably for the removal of chip subassembly and fly leaf.

Or, the power component is located elastic support structure's dorsad when one side of lens subassembly, the second support has the opening orientation the first accommodation space of lens subassembly, the image side of lens subassembly has the opening orientation the second accommodation space of second support, the lens subassembly with the second leg joint, just the second accommodation space with first accommodation space intercommunication, elastic support structure first support the linking bridge, first elastic component, first power component second elastic component with second power component all is located in first accommodation space, the chip subassembly is located in the second accommodation space.

The first accommodating space is formed in the second support, so that the elastic supporting structure, the first support, the connecting support, the first elastic part, the first power part, the second elastic part, the second power part and other parts are arranged in the first accommodating space, and the internal space of the second support is occupied, so that the structure of the power assembly is more compact, the size is smaller, the integral size of the camera module is smaller, and the miniaturization design of the camera module is facilitated; moreover, the setting of first accommodation space for the quality of second support is lighter, is favorable to making the whole quality of the module of making a video recording lighter, thereby is favorable to making a video recording the lightweight design of module.

The opening is formed in the first accommodating space, so that the elastic supporting structure, the first support, the connecting support, the first elastic part, the first power part, the second elastic part, the second power part and other parts can be conveniently assembled in the first accommodating space, and the camera module can be conveniently assembled; simultaneously, a second accommodating space with an opening facing the second support is formed in the image side of the lens assembly, the lens assembly is connected with the second support, and the opening of the first accommodating space and the opening of the second accommodating space are mutually sealed, so that the camera module is formed into a closed structure without additionally arranging a cover plate, parts are fewer, the overall structure of the camera module is more compact, the size is smaller, and the miniaturization design of the camera module is facilitated.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the camera module further includes a filter, the filter is disposed on a side of the chip assembly facing the lens assembly, and the chip assembly is connected to the power assembly through the filter, or the filter is disposed on a side of the lens assembly facing the chip assembly and corresponding to the chip assembly, or the filter is disposed on the connecting bracket and corresponding to the chip assembly when the power assembly is located between the elastic supporting structure and the lens assembly.

By arranging the filter plate, such as an infrared filter plate, light rays of other wave bands such as visible light can be filtered, and only infrared light passes through the filter plate, so that the infrared filter plate is selected, the infrared light is filtered, the imaging quality is improved, and the imaging more conforms to the visual experience of human eyes; and the module of making a video recording can regard as infrared module of making a video recording to use, promptly, the module of making a video recording can also form images and can obtain better image effect under dim environment and other special application scenes.

And when locating the filter plate in the one side of lens subassembly towards the chip subassembly, perhaps locate the linking bridge with the filter plate, compare in with the filter plate directly set up on the chip subassembly, and the linking bridge is connected with the chip subassembly and encircles the mode in the periphery of filter plate, need not to reserve the attached position of filter plate in the one side of the perpendicular optical axis direction of chip subassembly, make linking bridge can corresponding the reduction in the ascending size in perpendicular optical axis direction, thereby be favorable to reducing the overall dimension of power component in perpendicular optical axis direction, accord with miniaturized design.

In a second aspect, the invention discloses an electronic device having the camera module according to the first aspect. The electronic equipment with the camera module reduces resistance of the chip assembly when moving along the direction of the optical axis while realizing the miniaturization design of the camera module, thereby being beneficial to improving the response speed of automatic focusing and being convenient for automatic focusing.

Compared with the prior art, the invention has the beneficial effects that:

(1) can realize the miniaturized design of the module of making a video recording. The camera module and the electronic equipment provided by the embodiment of the invention realize the automatic focusing of the camera module by arranging the power component to drive the chip component to move along the optical axis direction, although the overall dimensions and the weight of the chip component and the lens component are increased along with the increase of the pixel level of the chip component, the increased weight of the chip component is still much lighter than that of the lens component, compared with the mode of driving the lens component to move along the optical axis direction to realize the automatic focusing by the power component, the camera module is automatically focused by driving the chip component to move along the optical axis direction by the power component, the requirements on the bearing and the driving force of the power component are lower, so that the power component with smaller overall dimension can be adopted to drive the chip component to move along the optical axis direction to realize the automatic focusing function of the camera module, thereby being beneficial to reducing the overall dimension of the camera module, the miniaturized design of the camera module is realized.

(2) The response speed of automatic focusing can be improved, and the focusing effect is ensured. The power assembly comprises a first support, a connecting support, a first elastic component and a first power component, wherein the first support is connected with the connecting support through the first elastic component, the connecting support is driven by the first power component to move along the optical axis direction, so that when the chip assembly moves along the optical axis direction for automatic focusing, the first elastic component can swing by a single arm and deform under the action of the connecting support by taking the joint of the first elastic component and the first support as a fulcrum, the first elastic component is limited to bend along the first direction to form at least one bending part, so that the first elastic component has a longer swing arm, the first elastic component can bend and deform only by overcoming smaller material stress during automatic focusing, the dragging force from the first elastic component when the connecting support moves along the optical axis direction is reduced, and the resistance of the chip assembly during focusing is smaller, and then help improving the response speed of auto focus of the chip assembly, facilitate carrying on the auto focus.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a camera module disclosed in the embodiment of the present invention;

fig. 2 is an exploded schematic view of a camera module according to an embodiment of the present invention;

fig. 3 is a top view of the camera module disclosed in the embodiment of the present invention;

FIG. 4 is a first cross-sectional view of the camera module of FIG. 3 taken along the line A-A;

FIG. 5 is a schematic view of a first bracket, a connecting bracket and a first resilient member according to an embodiment of the present invention;

FIG. 6 is a schematic view of a first bracket, a second bracket and a second resilient member according to an embodiment of the present disclosure;

FIG. 7 is a second cross-sectional view of the camera module of FIG. 3 taken along the line A-A;

FIG. 8 is a third cross-sectional view of the camera module of FIG. 3 taken along the line A-A;

FIG. 9 is a fourth cross-sectional view of the camera module of FIG. 3 taken along the line A-A;

FIG. 10 is a schematic view of a first embodiment of a flexible support structure according to the present disclosure;

FIG. 11 is a schematic view of a second embodiment of the disclosed flexible support structure;

FIG. 12 is a schematic view of a third embodiment of the disclosed flexible support structure;

FIG. 13 is an enlarged view of a portion of FIG. 12 at M;

fig. 14 is a schematic structural diagram of an electronic device disclosed in the embodiment of the present invention.

Icon: 100. a camera module; 1. a lens assembly; 11. a second accommodating space; 2. an elastic support structure; 21. a carrier plate; 211. a hollow-out section; 22. a movable plate; 23. a connecting portion; 24. a flexible connecting band; 24a, sub flexible connecting bands; 241. a first connection end; 242. a second connection end; 25. a vertical soft board; 251. a cantilever portion; 2511. a cantilever portion; 252. a first connecting arm; 253. a second connecting arm; 3. a chip assembly; 31. a circuit board; 32. a photosensitive chip; 4. a power assembly; 41. a first bracket; 42. connecting a bracket; 43. a first elastic member; 431. a first elastic portion; 44. a first power component; 441. a coil; 442. a magnetic part; 45. a second bracket; 451. a first accommodating space; 452. a recessed portion; 46. a second elastic member; 461. a second elastic portion; 47. a second power component; 5. a base; 51. an avoidance groove; 6. a filter plate; 7. cushion blocks; 200. an electronic device; 201. a housing.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.

Referring to fig. 1 to 4, an embodiment of the invention discloses a camera module, which can be applied to electronic devices such as mobile phones and tablet computers, and the camera module 100 can include a lens assembly 1, an elastic support structure 2, a chip assembly 3, and a power assembly 4, wherein the elastic support structure 2 is disposed on an image side of the lens assembly 1, the elastic support structure 2 includes a supporting plate 21 and a movable plate 22 electrically connected to the supporting plate 21, the supporting plate 21 can be electrically connected to a main board of the electronic device through a gold finger, a plate-to-plate connector, and the like, the chip assembly 3 is disposed on the movable plate 22 and located between the movable plate 22 and the lens assembly 1, and the chip assembly 3 is further electrically connected to the movable plate 22, so that the chip assembly 3 can be electrically connected to the electronic devices through the elastic support structure 2. The power assembly 4 is located on the image side of the lens assembly 1, the power assembly 4 may include a first bracket 41, a connecting bracket 42, a first elastic component 43 and a first power component 44, the first bracket 41 is connected to the loading plate 21, the connecting bracket 42 is connected to the chip assembly 3, two ends of the first elastic component 43 are respectively connected to the first bracket 41 and the connecting bracket 42, the first elastic component 43 is bent in a first direction to form at least one first bent portion, the first power component 44 is respectively connected to the first bracket 41 and the connecting bracket 42, and the first power component 44 is configured to move the connecting bracket 42 along the optical axis direction of the lens assembly 1, so that the chip assembly 3 moves along the optical axis direction, and auto-focusing of the camera module 100 is achieved.

As shown in fig. 4 and 5, the first direction is a direction from a connection point of the first elastic member 43 and the first bracket 41 to a connection point of the first elastic member 43 and the connection bracket 42, such as a direction a in fig. 5. The first elastic member 43 is bent in the first direction: the first elastic member 43 is bent to form a structure in which the entire longitudinal direction (the extending direction of the first elastic member 43) coincides with the first direction. Illustratively, the first elastic member 43 may be disposed in a spiral shape, a zigzag shape, or a corrugated shape, and the spiral, zigzag and corrugated structures are simple to implement, and have low process requirements, so as to facilitate reducing the processing difficulty of the first elastic member 43.

Illustratively, the chip assembly 3 in the present embodiment may include a circuit board 31 and a photosensitive chip 32 provided on the circuit board 31. The elastic support structure 2 in this embodiment may be a plate-like structure that can be deformed and electrically conductive, such as a flexible circuit board, so that the electrical connection between the chip assembly 3 and an external circuit can be realized, and the deformation can be caused when the force is applied. The first bracket 41 and the connecting bracket 42 in this embodiment may both be hollow cylindrical structures, the first bracket 41 surrounds the periphery of the connecting bracket 42, and the hollow portion of the connecting bracket 42 is disposed corresponding to the lens of the lens assembly 1 and the photosensitive chip 32 of the chip assembly 3, so that the incident light entering through the lens assembly 1 can enter the chip assembly 3 through the hollow portion of the connecting bracket 42 and can form an image on the photosensitive surface of the photosensitive chip 32 of the chip assembly 3.

In the camera module 100 provided by the present application, the power assembly 4 is arranged to drive the chip assembly 3 to move along the optical axis direction, so as to realize the auto-focusing of the camera module 100, although the overall dimensions and the weight of the chip assembly 3 and the lens assembly 1 are increased along with the increase of the pixel level of the chip assembly 3, the increased weight of the chip assembly 3 is usually much lighter than that of the lens assembly 1, compared with the method of driving the lens assembly 1 to move along the optical axis direction by the power assembly 4 so as to realize the auto-focusing, the method of driving the chip assembly 3 to move along the optical axis direction by the power assembly 4 to perform the auto-focusing of the camera module 100, has lower requirements on the bearing and the driving force of the power assembly 4, so that the power assembly 4 with smaller overall dimension can be used to drive the chip assembly 3 to move along the optical axis direction, so as to realize the auto-focusing function of the camera module 100, this is advantageous in reducing the overall size of the camera module 100 to achieve a compact design of the camera module 100.

It can be known that, in the present application, the first support 41 and the connecting support 42 are connected by the first elastic component 43, when the first power component 44 drives the connecting support 42 to move along the optical axis direction, so that the chip assembly 3 moves along the optical axis direction for auto-focusing, the first elastic component 43 under the action of the connecting support 42 will swing and deform with the joint of the first elastic component 43 and the first support 41 as a pivot, and by limiting the first elastic component 43 to bend and extend along the first direction, the first elastic component 43 has a longer swing arm, so that the first elastic component 43 can bend and deform only by overcoming a smaller material stress when performing auto-focusing, and the pulling force from the first elastic component 43 when the connecting support 42 moves along the optical axis direction is reduced, so that the resistance of the chip assembly 3 when performing focusing is smaller, thereby being beneficial to improving the automatic focusing response speed of the chip assembly 3 and facilitating automatic focusing.

In some embodiments, as shown in fig. 5, the first elastic member 43 may include a plurality of first elastic parts 431, the plurality of first elastic parts 431 are connected in sequence, and two adjacent first elastic parts 431 are connected at an angle to form the aforementioned first bent portion, among the plurality of first elastic parts 431, the first elastic part 431 located at the head portion is connected to the first bracket 41, the first elastic part 431 located at the tail portion is connected to the connecting bracket 42, and the extending directions of the first elastic part 431 located at the head portion and the first elastic part 431 located at the tail portion are both parallel to the first direction. The first elastic member 43 adopts a structure such that the first elastic member 43 has a small reaction force in the optical axis direction and a large reaction force in the direction perpendicular to the optical axis. It is also because the first elastic component 43 has a smaller reaction force in the optical axis direction, so that the reaction force from the first elastic component 43 received by the connecting bracket 42 when moving in the optical axis direction is smaller, and at the same time, because the first elastic component 43 has a larger reaction force in the direction perpendicular to the optical axis, so that the reaction force from the first elastic component 43 received by the connecting bracket 42 when moving in the direction perpendicular to the optical axis is larger, therefore, the first elastic component 43 adopts the above structure, which is beneficial for the chip assembly 3 to move in the optical axis direction, and is not beneficial for the chip assembly 3 to move in the direction perpendicular to the optical axis, so that the first power component 44 drives the chip assembly 3 to move in the optical axis direction, so as to perform auto-focusing.

As shown in fig. 4, the first power component 44 of the present application may be an Auto Focus Motor (AF Motor), the first power component 44 may include a coil 441 and a magnetic portion 442, the coil 441 and the magnetic portion 442 are disposed at an interval in a direction perpendicular to the optical axis O, the coil 441 may be disposed on the first bracket 41, the magnetic portion 442 may be disposed on the connecting bracket 42, such that when the coil 441 is powered on, the coil 441 generates a thrust force on the magnetic portion 442, such that the magnetic portion 442 drives the connecting bracket 42 to move along the optical axis, such that the chip assembly 3 moves along the optical axis to perform Auto Focus, and simultaneously, the first elastic component 43 swings and deforms with a single arm using a connection position of the first elastic component 43 and the first bracket 41 as a fulcrum, and then when the coil 441 is powered off, the first elastic component 43 returns to deform, such that the connecting bracket 42 is pulled back, thereby pulling the chip assembly 3 back into place. The magnetic portion 442 may be a magnet or a magnet. It is understood that in other embodiments, the first power component 44 may also be a piezoelectric focus motor.

In some embodiments, as shown in fig. 4, the power assembly 4 is located between the elastic support structure 2 and the lens assembly 1, i.e., the first bracket 41, the connecting bracket 42, the first elastic member 43 and the first power member 44 are located on a side of the elastic support structure 2 facing the lens assembly 1; or, as shown in fig. 7, the power assembly 4 is located on the side of the elastic support structure 2 facing away from the lens assembly 1, that is, the first bracket 41, the connecting bracket 42, the first elastic component 43 and the first power component 44 are located on the side of the elastic support structure 2 facing away from the lens assembly 1, it can be seen that the location of the power assembly 4 is not limited to one location, and the power assembly 4 can be located at different locations according to actual requirements, which is applicable to a wider range. Moreover, when the power assembly 4 is disposed on the side of the elastic supporting structure 2 opposite to the chip assembly 3, compared with the manner in which the power assembly 4 is disposed between the elastic supporting structure 2 and the lens assembly 1, the distance from the lens assembly 1 to the chip assembly 3 can be shortened, which is equivalent to reducing the image distance of the camera module 100, and the camera module 100 can be made into a short back focus camera module 100; meanwhile, the overall thickness of the camera module 100 in the optical axis direction can be reduced, and the miniaturization design of the camera module 100 is facilitated.

In some embodiments, as shown in fig. 4, 6 and 7, the power assembly 4 may further include a second bracket 45, a second elastic component 46 and a second power component 47, the second bracket 45 is connected to the lens assembly 1, two ends of the second elastic component 46 are respectively connected to the second bracket 45 and the first bracket 41, the second elastic component 46 is bent along a second direction to form at least one second bent portion, the second direction is a direction from a connection point of the second elastic component 46 and the second bracket 45 to a connection point of the second elastic component 46 and the first bracket 41, the second power component 47 is connected to the second bracket 45 and the first bracket 41, and the second power component 47 is configured to drive the first bracket 41 to move relative to the second bracket 45, so as to optically prevent the movement of the lens assembly 3, that is, the second power component 47 can drive the first bracket 41, the second power component 47, The whole of the connecting bracket 42, the first elastic member 43, the first power member 44, the elastic support structure 2 and the chip assembly 3 is moved in a direction perpendicular to the optical axis and rotated about the optical axis O for optical anti-shake.

As can be seen from the foregoing description, the present application can utilize the first power component 44 of the power assembly 4 to move the chip assembly 3 along the optical axis direction for automatic focusing, in the process, the connecting bracket 42, the chip assembly 3 and the movable plate 22 of the elastic supporting structure 2 are moved together along the optical axis direction by the first power component 44, and the first elastic component 43 is deformed, and the present application can also utilize the second power component 47 of the power assembly 4 to move the chip assembly 3 along the direction perpendicular to the optical axis and rotate around the optical axis O for optical anti-shake, in the process, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the chip assembly 3 and the carrying plate 21 and the movable plate 22 of the elastic supporting structure 2 are moved together along the direction perpendicular to the optical axis by the second power component 47, while the second elastic member 46 is deformed. Therefore, the power assembly 4 in the present application can drive the chip assembly 3 to move in the optical axis direction, so as to realize the automatic focusing function of the camera module 100; meanwhile, the chip component 3 can be driven to move along the direction perpendicular to the optical axis O and rotate around the optical axis O, so that the optical anti-shake function of the camera module 100 is realized, and the shooting quality of the camera module 100 is improved.

It is understood that, in other embodiments, both ends of the first elastic component 43 can be respectively connected to the first bracket 41 and the second bracket 45, and the first power component 44 is respectively connected to the first bracket 41 and the second bracket 45, so as to move the chip assembly 3 along the optical axis direction for auto-focusing, in this process, the first bracket 41, the connecting bracket 42, the second elastic component 46, the second power component 47, the chip assembly 3, and the supporting plate 21 and the movable plate 22 of the elastic supporting structure 2 move together along the optical axis direction for auto-focusing under the action of the first power component 44, and the first elastic component 43 is deformed. The two ends of the second elastic component 46 can be respectively connected to the connecting bracket 42 and the first bracket 41, the second power component 47 is connected to the connecting bracket 42 and the first bracket 41, and is used for driving the connecting bracket 42 to move relative to the first bracket 41, so that the chip assembly 3 moves to perform optical anti-shake, in this process, the connecting bracket 42, the chip assembly 3 and the movable plate 22 of the elastic supporting structure 2 move together along the direction perpendicular to the optical axis under the action of the second power component 47 to perform optical anti-shake, and the second elastic component 46 can deform.

As shown in fig. 4, 6 and 7, the second direction is a direction from a connection point of the second elastic member 46 and the second bracket 45 to a connection point of the second elastic member 46 and the first bracket 41, which is a direction b in fig. 6. The second elastic member 46 is bent in the second direction: the second elastic member 46 is bent to form a structure in which the entire longitudinal direction (the extending direction of the second elastic member 46) coincides with the second direction. For example, the second elastic member 46 may be disposed in a spiral shape, a zigzag shape, or a corrugated shape, and the spiral, zigzag, and corrugated structures are simple to implement, and have low process requirements, so as to reduce the processing difficulty of the second elastic member 46.

It can be known that, in the present application, the second support 45 is connected to the first support 41 through the second elastic component 46, when the second power component 47 drives the first support 41 to move along the direction perpendicular to the optical axis, so that the chip assembly 3 moves along the direction perpendicular to the optical axis for optical anti-shake, the second elastic component 46 under the action of the first support 41 will swing and deform with the joint of the second elastic component 46 and the second support 45 as a pivot, and by limiting the second elastic component 46 to bend and extend along the second direction, the second elastic component 46 has a longer swing arm, so that the second elastic component 46 can bend and deform only by overcoming a smaller material stress when performing auto-focusing, and the pulling force from the second elastic component 46 when the first support 41 moves is reduced, so that the resistance of the chip assembly 3 during optical anti-shake is smaller, and then be favorable to improving the optics anti-shake response speed of chip subassembly 3, be convenient for carry out optics anti-shake.

It should be noted that the camera module 100 provided in the embodiment of the present application has an internal coordinate system (also referred to as an internal reference coordinate system), please refer to fig. 1 and fig. 2, the internal coordinate system is a stereo coordinate system, which uses the center of the chip assembly 3 as an origin, and the internal coordinate system includes: a z-axis parallel to the optical axis direction of the lens assembly 1, an x-axis perpendicular to the z-axis and parallel to the length direction of the lens assembly 1, and a y-axis perpendicular to the z-axis and perpendicular to the length direction of the lens assembly 1. Wherein rotation about the z-axis is referred to as rotation (roll), also known as providing roll compensation. To show this coordinate system more clearly, the origin of the internal coordinate system shown in fig. 1 and 2 is shifted with respect to the actual coordinate system origin, but does not represent the actual position of the coordinate system.

In the camera module 100 provided by the present application, the first power component 44 can drive the chip assembly 3 to move along the z direction for auto-focusing, and the second power component 47 can drive the chip assembly 3 to move along the x direction (i.e. providing x direction compensation), move along the y direction (i.e. providing y direction compensation), and rotate around the z axis (i.e. providing roll compensation), so as to perform optical anti-shake, thereby improving the imaging quality of the camera module 100.

In some embodiments, as shown in fig. 6, the second elastic member 46 may include a plurality of second elastic portions 461, the plurality of second elastic portions 461 are connected in sequence, and two adjacent second elastic portions 461 are connected at an angle to form the aforementioned second bending portion, in the plurality of second elastic portions 461, the second elastic portion 461 located at the head portion is connected to the second bracket 45, the second elastic portion 461 located at the tail portion is connected to the first bracket 41, and the extending directions of the second elastic portion 461 located at the head portion and the second elastic portion 461 located at the tail portion are both parallel to the second direction. The second elastic member 46 adopts a structure such that the second elastic member 46 has a small reaction force in the direction perpendicular to the optical axis and a large reaction force in the optical axis direction. It is also because the second elastic component 46 has a smaller reaction force in the direction perpendicular to the optical axis, so that the reaction force from the second elastic component 46 when the first support 41 moves in the direction perpendicular to the optical axis is smaller, and at the same time, because the second elastic component 46 has a larger reaction force in the optical axis direction, the reaction force from the second elastic component 46 when the first support 41 moves in the optical axis direction is larger, therefore, the second elastic component 46 adopts the above structure, which is beneficial for the chip assembly 3 to move in the direction perpendicular to the optical axis, and is not beneficial for the chip assembly 3 to move in the optical axis direction, and is convenient for the second power component 47 to drive the chip assembly 3 to move in the direction perpendicular to the optical axis, so as to perform optical anti-shake.

As shown in fig. 4 to 7, the second power component 47 of the present application is an ois (optical Image stabilization) motor, for example, the second power component 47 may be a suspension structure anti-shake motor, and specifically, the second bracket 45 and the first bracket 41 may be connected by a Shape Memory Alloy (SMA) suspension wire, and the SMA suspension wire contracts when heated and stretches when dissipating heat, so as to drive the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, and the chip assembly 3 to move in a direction perpendicular to the optical axis (x and y directions) and rotate around the optical axis O (roll axis) to optically prevent shake by utilizing the contraction and stretching of the SMA suspension wire. It is understood that in other embodiments, the second power component 47 may also be an anti-shake motor such as a magneto-structure anti-shake motor or a piezoelectric-structure anti-shake motor.

As an alternative embodiment, as shown in fig. 4, when the power assembly 4 is located between the elastic support structure 2 and the lens assembly 1, the second bracket 45 may have a first accommodating space 451 with an opening facing away from the lens assembly 1, and the elastic support structure 2, the chip assembly 3, the first bracket 41, the connecting bracket 42, the first elastic member 43, the first power member 44, the second elastic member 46 and the second power member 47 may all be located in the first accommodating space 451. The camera module 100 further comprises a base 5, the base 5 covers the opening of the first accommodating space 451, the base 5 is provided with an avoiding groove 51 communicated with the first accommodating space 451, the avoiding groove 51 can be used for avoiding the chip component 3 and the movable plate 22 when the chip component 3 moves along the optical axis direction, and possibility is provided for movement of the chip component 3 and the movable plate 22.

By arranging the first accommodating space 451 in the second bracket 45, the elastic support structure 2, the chip assembly 3, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and other parts are arranged in the first accommodating space 451, and the parts occupy the inner space of the second bracket 45, so that the structure of the power assembly 4 is more compact, the volume is smaller, the overall volume of the camera module 100 is smaller, and the miniaturization design of the camera module 100 is facilitated; moreover, the arrangement of the first accommodating space 451 makes the mass of the second bracket 45 lighter, which is beneficial to making the whole mass of the camera module 100 lighter, and is beneficial to the light-weight design of the camera module 100.

In addition, the first accommodating space 451 is provided with an opening, so that the elastic support structure 2, the chip assembly 3, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and other components can be conveniently assembled in the first accommodating space 451, and the camera module 100 can be conveniently assembled; meanwhile, the base 5 is further arranged to cover the opening of the first accommodating space 451, so that the camera module 100 is formed into a closed structure, external light can be prevented from entering the lens assembly 1 from the opening of the first accommodating space 451 to influence the imaging effect of the lens assembly 1, and the elastic support structure 2, the chip assembly 3, the first support 41, the connecting support 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and other components packaged inside can be protected from the outside. Moreover, since the chip module 3 and the movable plate 22 move along the optical axis direction during auto-focusing, in order to avoid interference between the chip module 3 and the movable plate 22 and the base 5, the base 5 is provided with an avoiding groove 51 with an opening facing the movable plate 22, so that the avoiding groove 51 can be used for avoiding the chip module 3 and the movable plate 22 when the chip module 3 moves along the optical axis direction, thereby providing possibility for movement of the chip module 3 and the movable plate 22.

In the embodiment shown in fig. 4, a side surface of the second support 45 facing away from the base 5 is recessed inwards to form a recessed portion 452, a light-passing hole is formed in the bottom of the recessed portion 452, the light-passing hole is communicated with the hollow portion of the connecting support 42, the lens assembly 1 is disposed in the recessed portion 452, and a lens of the lens assembly 1 corresponds to the light-passing hole, so that incident light entering through the lens assembly 1 can sequentially pass through the light-passing hole and the hollow portion of the connecting support 42 to enter the chip assembly 3 and can form an image on the photosensitive surface of the photosensitive chip 32 of the chip assembly 3. Set up depressed part 452 through the side that faces away from base 5 at second support 45 to hold lens subassembly 1, what make lens subassembly 1 occupy is the inner space of second support 45, thereby be favorable to reducing the whole thickness of module 100 in the optical axis direction of making a video recording, and then be favorable to realizing the miniaturized design of module 100 of making a video recording.

As another alternative, as shown in fig. 7, when the power assembly 4 is located on a side of the elastic support structure 2 opposite to the lens assembly 1, the second bracket 45 may have a first accommodating space 451 opening toward the lens assembly 1, and the image side of the lens assembly 1 may have a second accommodating space 11 opening toward the second bracket 45, the lens assembly 1 is connected to the second bracket 45, and the second accommodating space 11 is communicated with the first accommodating space 451, the elastic support structure 2, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46 and the second power component 47 may all be located in the first accommodating space 451, and the chip assembly 3 is located in the second accommodating space 11.

By arranging the first accommodating space 451 in the second bracket 45, the elastic support structure 2, the first bracket 41, the connecting bracket 42, the first elastic part 43, the first power part 44, the second elastic part 46, the second power part 47 and other parts are arranged in the first accommodating space 451, and the parts occupy the inner space of the second bracket 45, so that the structure of the power assembly 4 is more compact, the volume is smaller, the overall volume of the camera module 100 is smaller, and the miniaturization design of the camera module 100 is facilitated; moreover, the arrangement of the first accommodating space 451 makes the mass of the second bracket 45 lighter, which is beneficial to making the whole mass of the camera module 100 lighter, and is beneficial to the light-weight design of the camera module 100.

In addition, the opening is formed in the first accommodating space 451, so that the elastic support structure 2, the first bracket 41, the connecting bracket 42, the first elastic component 43, the first power component 44, the second elastic component 46, the second power component 47 and other components can be conveniently assembled in the first accommodating space 451, and the assembly of the camera module 100 is facilitated; simultaneously set up the second accommodation space 11 of opening orientation second support 45 on the image side of lens subassembly 1, lens subassembly 1 is connected with second support 45 to utilize the opening of first accommodation space 451 of closing cap and the opening of second accommodation space 11 each other, so that module 100 forms into a confined structure of making a video recording, need not additionally to set up the apron, spare part is less, be favorable to making module 100's overall structure compacter, the volume is littleer, thereby be favorable to making a video recording the miniaturized design of module 100.

As shown in fig. 4, 7, 8 and 9, the camera module 100 in the present application can further utilize the second power component 47 to suspend the first support 41, the connecting support 42, the first elastic component 43, the first power component 44, the chip assembly 3, and the supporting plate 21 and the movable plate 22 of the elastic supporting structure 2, so as to avoid friction generated by the contact between the supporting plate 21 and the movable plate 22 of the elastic supporting structure 2 and the base 5, or friction generated by the contact between the first support 41 and the second support 45 when the second power component 47 drives the chip assembly 3 to move along the direction perpendicular to the optical axis, so as to reduce the resistance of the chip assembly 3 moving along the direction perpendicular to the optical axis, and facilitate optical anti-shake.

In some embodiments, as shown in fig. 7 to 9, the camera module 100 may further include a filter 6, and the filter 6 is disposed between the lens assembly 1 and the chip assembly 3. By arranging the filter 6, for example, an infrared filter, light rays of other wave bands such as visible light can be filtered, and only infrared light passes through the filter, so that the infrared filter is selected, the infrared light is filtered, the imaging quality is improved, and the imaging more conforms to the visual experience of human eyes; and the module 100 of making a video recording can regard as infrared module 100 of making a video recording to use, promptly, the module 100 of making a video recording can also form images and can obtain better image effect under dim environment and other special application scenes.

As a first alternative, as shown in fig. 4 and 7, the filter 6 may be disposed on a side of the chip component 3 facing the lens component 1, so as to filter out light rays in other bands, such as visible light, and only allow infrared light to pass through, so as to improve the imaging quality, and make the imaging better conform to the visual experience of human eyes. In this embodiment, the chip assembly 3 may be connected to the power assembly 4 through a filter 6. For example, in the embodiment shown in fig. 4, specifically, the fixing bracket may be disposed on a side of the chip assembly 3 facing the lens assembly 1, one end of the first bracket 41 of the power assembly 4 is connected to the lens assembly 1 through the first elastic component 43, and the other end of the first bracket is connected to the supporting plate 21 of the elastic supporting structure 2, the connecting bracket 42 of the power assembly 4 may be connected to the circuit board 31 of the chip assembly 3 through the fixing bracket, and when performing auto-focusing, the first power component 44 may drive the connecting bracket 42 to move along the optical axis direction relative to the first bracket 41, so as to drive the chip assembly 3 to move along the optical axis direction, thereby implementing the auto-focusing function of the camera module 100.

As a second alternative embodiment, as shown in fig. 8, when the power assembly 4 is located between the elastic supporting structure 2 and the lens assembly 1, the filter 6 may be disposed on the connecting bracket 42 and disposed corresponding to the chip assembly 3, specifically, a first receiving groove is disposed on a side surface of the connecting bracket 42 of the power assembly 4 facing the lens assembly 1, and the filter 6 is disposed in the first receiving groove. Adopt such design, compare in directly setting up filter plate 6 on chip subassembly 3, and linking bridge 42 is connected with chip subassembly 3 and encircles the mode in filter plate 6's periphery, need not to reserve filter plate 6's attached position in the one side of chip subassembly 3's perpendicular optical axis direction, make linking bridge 42 can corresponding reduction in the ascending size of perpendicular optical axis direction, thereby be favorable to reducing the whole size of power component 4 on perpendicular optical axis direction, accord with miniaturized design.

As a third alternative embodiment, as shown in fig. 9, the filter 6 may be disposed on a side of the lens assembly 1 facing the chip assembly 3 and disposed corresponding to the chip assembly 3, specifically, a second receiving groove is disposed on a side of the lens assembly 1 facing the chip assembly 3, and the filter 6 is disposed in the second receiving groove. Similarly, adopt such design, compare in directly setting up filter plate 6 on chip subassembly 3, and linking bridge 42 is connected with chip subassembly 3 and encircles the mode in filter plate 6's periphery, need not to reserve filter plate 6's attached position on the one side of chip subassembly 3's perpendicular optical axis direction, make linking bridge 42 can corresponding reduction in the ascending size of perpendicular optical axis direction, thereby be favorable to reducing the whole size of power component 4 on perpendicular optical axis direction, accord with miniaturized design.

As an alternative embodiment, as shown in fig. 10, the supporting plate 21 is a hollow substrate, that is, the supporting plate 21 may include a hollow portion 211, a plurality of movable plates 22 may be provided, and the plurality of movable plates 22 are disposed at intervals and located in the hollow portion 211; the elastic support structure 2 may further include a connection portion 23 and a plurality of flexible connection bands 24 in a spiral shape, the connection portion 23 is located in the hollow portion 211, the plurality of flexible connection bands 24 are disposed at intervals and located in the hollow portion 211, the plurality of flexible connection bands 24 are all fixed and electrically connected to the connection portion 23, and each flexible connection band 24 extends spirally around the connection portion 23 in the same direction, in the plurality of flexible connection bands 24, one end of one portion of the flexible connection band 24 away from the connection portion 23 has a first connection end 241, one end of the other portion of the flexible connection band 24 away from the connection portion 23 has a second connection end 242, the first connection end 241 is electrically connected to the support plate 21, each movable plate 22 is disposed at a corresponding second connection end 242 and electrically connected to a corresponding second connection end 242, and the chip assembly 3 is disposed at each movable plate 22 and electrically connected to each movable plate 22. For example, in the embodiment shown in fig. 10, there may be two movable plates 22, and the number of the flexible connection tapes 24 may be 4, where one end of two flexible connection tapes 24 away from the connection portion 23 has a first connection end 241, two first connection ends 241 are both electrically connected to the carrier plate 21, one end of the other two flexible connection tapes 24 away from the connection portion 23 has a second connection end 242, two movable plates 22 are respectively disposed at the corresponding second connection ends 242 and electrically connected to the corresponding second connection ends 242, and the chip assembly 3 is disposed at two movable plates 22 and electrically connected to two movable plates 22.

It can be known that, when the chip assembly 3 moves along the optical axis direction for auto-focusing, each movable plate 22 moves along the optical axis direction along with the chip assembly 3, so that the flexible connection belt 24 deforms, therefore, by providing the plurality of flexible connection belts 24, electrical connection between the plurality of movable plates 22 and the bearing plate 21 is realized, the flexible connection belts 24 are in a belt shape under the condition of ensuring that the wire-routing amount is unchanged, i.e. under the condition of not influencing the power-on conduction of the chip assembly 3, and the flexible connection belts can be bent and deformed only by overcoming small material stress when stressed, so that the resistance to the chip assembly 3 when moving is small; moreover, the flexible connecting band 24 extends spirally, and has a certain redundancy relative to a linear strip structure, so that the chip assembly 3 can be bent and deformed only by overcoming small material stress when moving, and resistance required to be overcome when the flexible connecting band 24 deforms is reduced, so that the resistance of the chip assembly 3 when moving along the optical axis direction is smaller. In other words, when performing auto-focusing, the resistance of the photosensitive chip 32 when moving in the optical axis direction can be reduced, which is beneficial to improving the response speed of auto-focusing and facilitating auto-focusing.

As another alternative embodiment, as shown in fig. 11, the supporting plate 21 is a hollow substrate, that is, the supporting plate 21 may include a hollow portion 211, a plurality of movable plates 22 may be provided, and the plurality of movable plates 22 are disposed at intervals and located in the hollow portion 211; the elastic support structure 2 may further include a plurality of flexible connection strips 24 in a spiral shape, the plurality of flexible connection strips 24 are independently disposed and located in the hollow portion 211, each flexible connection strip 24 has a first connection end 241 and a second connection end 242, the first connection end 241 is electrically connected to the supporting plate 21, each movable plate 22 is disposed on the corresponding second connection end 242 and electrically connected to the corresponding second connection end 242, and the chip assembly 3 is disposed on each movable plate 22 and electrically connected to each movable plate 22. For example, in the embodiment shown in fig. 11, two movable plates 22 may be provided, two flexible connection tapes 24 may be provided, each of the two flexible connection tapes 24 has a first connection end 241 and a second connection end 242, each of the two first connection ends 241 is electrically connected to the carrier plate 21, the two movable plates 22 are respectively disposed at the corresponding second connection end 242 and electrically connected to the corresponding second connection end 242, and the chip assembly 3 is disposed at the two movable plates 22 and electrically connected to the two movable plates 22.

Through making many flexible connection bands 24 relatively independent setting, each flexible connection band 24 breaks off the interval setting each other promptly, like this, in each flexible connection band 24 atress by tensile deformation in-process, can reduce the control effect that leads between each flexible connection band 24, in order to avoid taking place mutual interference when warping, make each flexible connection band 24 more stretched the emergence deformation, in order to further reduce the resistance that chip subassembly 3 received when removing along the optical axis direction, thereby can further improve autofocus's response speed, more conveniently carry out autofocus.

In some embodiments, as shown in fig. 12 and 13, the at least one flexible connecting band 24 comprises a plurality of sub flexible connecting bands 24a, and in the embodiment shown in fig. 12 and 13, each flexible connecting band 24 comprises a plurality of sub flexible connecting bands 24a, and the plurality of sub flexible connecting bands 24a are arranged at intervals in a direction perpendicular to the optical axis O. This is equivalent to decomposing a single wide flexible connection tape 24 into a plurality of thinner sub-flexible connection tapes 24a, so that the elastic modulus of the flexible connection tape 24 can be reduced under the condition of ensuring that the amount of wiring is not changed, the flexibility of the flexible connection tape 24 can be improved, and the deformation resistance can be reduced, so that the flexible connection tape 24 is more easily stretched to deform, and the resistance received when the chip assembly 3 moves in the optical axis direction can be reduced, thereby improving the response speed of automatic focusing and ensuring the focusing effect.

In some embodiments, as shown in fig. 8 and 9, the chip assembly 3 and/or the movable plate 22 are provided with spacers 7, and the chip assembly 3 and the movable plate 22 are connected by the spacers 7. That is, when the pad 7 is disposed on the side of the circuit board 31 of the chip assembly 3 facing the movable plate 22, the pad 7 is connected to the movable plate 22; when the pad 7 is disposed on the side of the movable plate 22 facing the chip assembly 3, the pad 7 is connected to the circuit board 31 of the chip assembly 3; when the side of the circuit board 31 of the chip assembly 3 facing the movable plate 22 is provided with the spacer 7, and the side of the movable plate 22 facing the chip assembly 3 is provided with the spacer 7, the spacer 7 on the circuit board 31 is connected with the spacer 7 on the movable plate 22.

This is mainly considered: if the chip component 3 is directly stacked on the movable plate 22, the chip component 3 will contact with the flexible connecting band 24, when the chip component 3 moves along the optical axis direction, specifically, moves along the direction away from the lens component 1 (i.e. moves downwards), the first connecting end 241 of the flexible connecting band 24 connected with the loading plate 21 will abut against the chip component 3, resulting in interference to hinder the downward movement of the chip component 3, therefore, a gap can exist between the chip component 3 and the flexible connecting band 24 through the cushion block 7 between the chip component 3 and the movable plate 22, which is equivalent to a downward moving space for the chip component 3, thereby avoiding the situation that the chip component 3 touches the first connecting end 241 when the chip component 3 moves downwards to affect the movement of the chip component 3, and providing possibility for the movement of the chip component 3.

In some embodiments, as shown in fig. 10 to 12, the elastic support structure 2 may further include an upright flexible board 25, the upright flexible board 25 may include a cantilever portion 251, a first connection arm 252 and a second connection arm 253, the cantilever portion 251 surrounds the carrier plate 21, the first connection arm 252 is connected to the cantilever portion 251, and is bent from the cantilever portion 251 toward the carrier plate 21 and electrically connected to the carrier plate 21, the second connection arm 253 is connected to the cantilever portion 251, and is bent from the cantilever portion 251 away from the carrier plate 21 and used for electrically connecting to an external circuit (e.g., the aforementioned motherboard of the electronic device), that is, the carrier plate 21 may be electrically connected to the motherboard of the electronic device through the upright flexible board 25.

Through adopting the soft board 25 of vertical type to realize the electricity between chip module 3 and the external circuit and be connected, move and rotate around optical axis O along perpendicular to optical axis direction at chip module 3, when carrying out optics anti-shake, can use the junction of second linking arm 253 and external circuit as the fulcrum, use first linking arm 252 and cantilever portion 251 to take place the swing for the cantilever, can make vertical type soft board 25 have longer swing arm like this, thereby when carrying out optics anti-shake, can reduce the resistance of chip module 3 motion, thereby be favorable to improving the response speed of optics anti-shake, be convenient for carry out optics anti-shake.

Further, as shown in fig. 10 to 12, the cantilever portion 251 may be a vertical bending plate, the cantilever portion 251 includes a plurality of cantilever portions 2511, the plurality of cantilever portions 2511 are connected in sequence, and two adjacent cantilever portions 2511 are disposed at an angle to form an enclosed space, at least one cantilever portion 2511 is bent towards the carrier 21 to form the first connecting arm 252, at least another cantilever portion 2511 is bent away from the carrier 21 to form the second connecting arm 253, at least one fourth of the carrier 21 is located in the enclosed space, that is, the cantilever portion 251 can perform a quarter-surrounding (as shown in fig. 10), a half-surrounding (as shown in fig. 11), a three-quarter-surrounding or a substantially full-surrounding (as shown in fig. 12) on the carrier 21 to ensure that the cantilever portion 251 has a longer length to ensure that the soft board 25 has a longer swing arm, so that the resistance to the movement of the chip assembly 3 can be further reduced when performing optical anti-shake, therefore, the optical anti-shake response speed is improved, and the optical anti-shake is facilitated.

Referring to fig. 13, an electronic device 200 having the camera module 100 according to the foregoing embodiment is disclosed. Specifically, as shown in fig. 13, the electronic device 200 may include a housing 201 and the aforementioned camera module 100, wherein a main board is disposed in the housing 201, and the camera module 100 is disposed in the housing 201 and electrically connected to the main board in the housing 201, so that the electronic device 200 has a photographing function. The electronic device 200 may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a monitor, and the like. It can be understood that the electronic device 200 having the camera module 100 according to the foregoing embodiment also has all the technical effects of the camera module 100 according to the foregoing embodiment. That is, the electronic device 200 having the camera module 100 realizes the auto-focusing of the camera module 100 by arranging the power assembly to drive the chip assembly to move along the optical axis direction, although the overall dimensions and the weight of the chip assembly and the lens assembly increase with the increase of the pixel level of the chip assembly, the increased weight of the chip assembly is still much lighter than that of the lens assembly, compared with the method of driving the lens assembly to move along the optical axis direction to realize the auto-focusing by the power assembly, the auto-focusing of the camera module 100 is carried out by driving the chip assembly to move along the optical axis direction by the power assembly, the requirements for the bearing and the driving force of the power assembly are lower, so that the power assembly with smaller overall dimension can be used to drive the chip assembly to move along the optical axis direction to realize the auto-focusing function of the camera module 100, which is beneficial to reducing the overall dimension of the camera module 100, to achieve a compact design of the camera module 100.

In addition, the power assembly in the application comprises a first support, a connecting support, a first elastic component and a first power component, wherein the first support and the connecting support are connected through the first elastic component, the connecting support is driven by the first power component to move along the optical axis direction, so that when the chip assembly moves along the optical axis direction for automatic focusing, the first elastic component can swing and deform by taking the joint of the first elastic component and the first support as a fulcrum under the action of the connecting support, and the first elastic component is bent and extended along the first direction by limiting the first elastic component, so that the first elastic component has a longer swing arm, the first elastic component can be bent and deformed only by overcoming small material stress during automatic focusing, the dragging force from the first elastic component when the connecting support moves along the optical axis direction is reduced, and the resistance of the chip assembly during focusing is smaller, and then help improving the response speed of auto focus of the chip assembly, facilitate carrying on the auto focus.

The above detailed description is made on the camera module and the electronic device disclosed in the embodiments of the present invention, and the principle and the implementation of the present invention are explained in the present document by applying specific examples, and the description of the above embodiments is only used to help understanding the camera module and the electronic device of the present invention and the core ideas thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. The utility model provides a module of making a video recording which characterized in that includes:

a lens assembly;

a chip assembly disposed on the movable plate of the elastic support structure and between the movable plate and the lens assembly; and

the power assembly is positioned on the image side of the lens assembly and comprises a first support, a connecting support, a first elastic component and a first power component, the first support is connected to the bearing plate, the connecting support is connected to the chip assembly, two ends of the first elastic component are respectively connected to the first support and the connecting support, the first elastic component is bent towards a first direction to form at least one first bent part, the first power component is respectively connected to the first support and the connecting support, and the first power component is used for enabling the connecting support to move along the optical axis direction of the lens assembly so as to enable the chip assembly to move along the optical axis direction and achieve automatic focusing of the camera module;

2. The camera module of claim 1, wherein the power assembly is located between the resilient support structure and the lens assembly, or wherein the power assembly is located on a side of the resilient support structure facing away from the lens assembly.

3. The camera module according to claim 1, wherein the first elastic member includes a plurality of first elastic portions, the plurality of first elastic portions are sequentially connected, two adjacent first elastic portions are connected at an angle to form the first bending portion, of the plurality of first elastic portions, the first elastic portion located at the head is connected to the first bracket, the first elastic portion located at the tail is connected to the connecting bracket, and the extending directions of the first elastic portion located at the head and the first elastic portion located at the tail are both parallel to the first direction.

4. The camera module according to claim 1, wherein the power assembly further comprises a second bracket, a second elastic member, and a second power member, the second bracket is connected to the lens assembly, two ends of the second elastic member are respectively connected to the second bracket and the first bracket, the second elastic member is bent in a second direction to form at least one second bent portion, the second power member is connected to the second bracket and the first bracket, and the second power member is configured to drive the first bracket to move relative to the second bracket, so that the movement of the chip assembly is optically anti-shake;

wherein the second direction is a direction from a connection of the second elastic member and the second bracket to a connection of the second elastic member and the first bracket.

5. The camera module according to claim 4, wherein the second elastic member includes a plurality of second elastic portions, the plurality of second elastic portions are sequentially connected, two adjacent second elastic portions are connected at an angle to form the second bending portion, of the plurality of second elastic portions, the second elastic portion located at the head is connected to the second bracket, the second elastic portion located at the tail is connected to the first bracket, and the extending directions of the second elastic portion located at the head and the second elastic portion located at the tail are both parallel to the second direction.

6. The camera module according to claim 4, wherein the supporting plate is a hollow substrate, the supporting plate includes a plurality of hollow portions, and the plurality of movable plates are spaced apart from each other and located in the hollow portions;

the elastic supporting structure also comprises a connecting part and a plurality of spiral flexible connecting belts, the connecting part is positioned in the hollow part, the flexible connecting belts are arranged at intervals and positioned in the hollow part, the flexible connecting belts are all fixed and are electrically connected with the connecting part, and each of the flexible connecting bands spirally extends in the same direction around the connecting part, wherein among the flexible connecting bands, one end of one part of the flexible connecting belt far away from the connecting part is provided with a first connecting end, the other end of the other part of the flexible connecting belt far away from the connecting part is provided with a second connecting end, the first connecting ends are electrically connected with the bearing plate, the movable plates are respectively arranged at the corresponding second connecting ends and are electrically connected with the corresponding second connecting ends, and the chip assemblies are arranged on the movable plates and are electrically connected with the movable plates; or

The elastic supporting structure further comprises a plurality of spiral flexible connecting strips, the flexible connecting strips are independently arranged and located in the hollow-out portion, each flexible connecting strip is provided with a first connecting end and a second connecting end, the first connecting end is electrically connected with the bearing plate, each movable plate is arranged at the corresponding second connecting end and is electrically connected with the corresponding second connecting end, and the chip assembly is arranged on each movable plate and is electrically connected with each movable plate.

7. The camera module according to claim 4 or 6, wherein the resilient supporting structure further comprises a vertical flexible board, the vertical flexible board comprises a cantilever portion, a first connecting arm and a second connecting arm, the cantilever portion surrounds the carrier plate, the first connecting arm is connected to the cantilever portion, and is bent from the cantilever portion toward the carrier plate and is electrically connected to the carrier plate, and the second connecting arm is connected to the cantilever portion, and is bent from the cantilever portion away from the carrier plate.

8. The camera module of claim 7, wherein the cantilever portion is a bending plate, the cantilever portion comprises a plurality of cantilever portions, the plurality of cantilever portions are connected in sequence, two adjacent cantilever portions are disposed at an angle to form an enclosed space, at least one cantilever portion is bent toward the carrier plate to form the first connecting arm, at least another cantilever portion is bent away from the carrier plate to form the second connecting arm, and at least a quarter of the carrier plate is located in the enclosed space.

9. The camera module according to claim 4, wherein when the power component is located between the elastic support structure and the lens component, the second holder has a first receiving space with an opening facing away from the lens component, the elastic support structure, the chip component, the first holder, the connecting holder, the first elastic component, the first power component, the second elastic component, and the second power component are all located in the first receiving space, the camera module further comprises a base, the base covers the opening of the first receiving space, and the base has an avoiding groove communicated with the first receiving space, and the avoiding groove is used for avoiding the chip component and the movable plate when the chip component moves in the optical axis direction; or

The power component is located elastic support structure's dorsad during one side of lens subassembly, the second support has the opening orientation the first accommodation space of lens subassembly, the image side of lens subassembly has the opening orientation the second accommodation space of second support, the lens subassembly with the second leg joint, just the second accommodation space with first accommodation space intercommunication, elastic support structure the first support the linking bridge, first elastic component, first power component the second elastic component with second power component all is located in the first accommodation space, the chip subassembly is located in the second accommodation space.

10. The camera module according to any one of claims 1 to 6, wherein the chip assembly and/or the movable plate are provided with spacers, and the chip assembly and the movable plate are connected through the spacers.

11. The camera module of any one of claims 1-6, further comprising a filter, wherein the filter is disposed at one side of the chip assembly facing the lens assembly, the chip assembly passes through the filter and is connected to the power assembly, or the filter is disposed at one side of the lens assembly facing the chip assembly and is disposed corresponding to the chip assembly, or the power assembly is disposed between the elastic support structure and the lens assembly, and the filter is disposed at the connecting bracket and is disposed corresponding to the chip assembly.

12. An electronic device characterized in that the electronic device has a camera module according to any one of claims 1-11.