CN110691474A - 一种辐射单元的焊接方法 - Google Patents
一种辐射单元的焊接方法 Download PDFInfo
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- CN110691474A CN110691474A CN201910901093.8A CN201910901093A CN110691474A CN 110691474 A CN110691474 A CN 110691474A CN 201910901093 A CN201910901093 A CN 201910901093A CN 110691474 A CN110691474 A CN 110691474A
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- 230000005855 radiation Effects 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000003466 welding Methods 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 claims abstract description 29
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 17
- 239000010959 steel Substances 0.000 claims abstract description 17
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract 3
- 230000010287 polarization Effects 0.000 claims description 23
- 238000009826 distribution Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 29
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical compound ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 description 25
- 101150049492 DVR gene Proteins 0.000 description 25
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- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 4
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 4
- 238000012938 design process Methods 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910901093.8A CN110691474B (zh) | 2019-09-23 | 2019-09-23 | 一种辐射单元的焊接方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910901093.8A CN110691474B (zh) | 2019-09-23 | 2019-09-23 | 一种辐射单元的焊接方法 |
Publications (2)
Publication Number | Publication Date |
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CN110691474A true CN110691474A (zh) | 2020-01-14 |
CN110691474B CN110691474B (zh) | 2021-02-12 |
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CN201910901093.8A Active CN110691474B (zh) | 2019-09-23 | 2019-09-23 | 一种辐射单元的焊接方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113422201A (zh) * | 2021-06-18 | 2021-09-21 | 京信通信技术(广州)有限公司 | 辐射单元及天线 |
CN114535740A (zh) * | 2022-03-03 | 2022-05-27 | 京信通信技术(广州)有限公司 | 天线、辐射单元及辐射单元的焊接方法 |
WO2023207133A1 (zh) * | 2022-04-25 | 2023-11-02 | 中兴通讯股份有限公司 | 天线振子、天线、通信设备及天线的组装方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060273865A1 (en) * | 2005-06-02 | 2006-12-07 | Timofeev Igor E | Dipole antenna array |
US20150116176A1 (en) * | 2013-10-31 | 2015-04-30 | Huawei Device Co., Ltd. | Dipole Antenna and Wireless Terminal Device |
CN204481126U (zh) * | 2015-04-23 | 2015-07-15 | 佛山市迪安通讯设备有限公司 | 一种宽带高频双极化振子 |
CN104900987A (zh) * | 2015-05-13 | 2015-09-09 | 武汉虹信通信技术有限责任公司 | 一种宽频辐射单元及天线阵列 |
KR20160037205A (ko) * | 2013-08-01 | 2016-04-05 | 레이던 컴퍼니 | 통합 발룬을 구비하는 적층된 보우타이 라디에이터 |
CN109103592A (zh) * | 2018-08-29 | 2018-12-28 | 江苏亨鑫科技有限公司 | 一种双极化辐射单元及带有该双极化辐射单元的阵列天线 |
-
2019
- 2019-09-23 CN CN201910901093.8A patent/CN110691474B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060273865A1 (en) * | 2005-06-02 | 2006-12-07 | Timofeev Igor E | Dipole antenna array |
KR20160037205A (ko) * | 2013-08-01 | 2016-04-05 | 레이던 컴퍼니 | 통합 발룬을 구비하는 적층된 보우타이 라디에이터 |
US20150116176A1 (en) * | 2013-10-31 | 2015-04-30 | Huawei Device Co., Ltd. | Dipole Antenna and Wireless Terminal Device |
CN204481126U (zh) * | 2015-04-23 | 2015-07-15 | 佛山市迪安通讯设备有限公司 | 一种宽带高频双极化振子 |
CN104900987A (zh) * | 2015-05-13 | 2015-09-09 | 武汉虹信通信技术有限责任公司 | 一种宽频辐射单元及天线阵列 |
CN109103592A (zh) * | 2018-08-29 | 2018-12-28 | 江苏亨鑫科技有限公司 | 一种双极化辐射单元及带有该双极化辐射单元的阵列天线 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113422201A (zh) * | 2021-06-18 | 2021-09-21 | 京信通信技术(广州)有限公司 | 辐射单元及天线 |
CN113422201B (zh) * | 2021-06-18 | 2023-07-07 | 京信通信技术(广州)有限公司 | 辐射单元及天线 |
CN114535740A (zh) * | 2022-03-03 | 2022-05-27 | 京信通信技术(广州)有限公司 | 天线、辐射单元及辐射单元的焊接方法 |
WO2023207133A1 (zh) * | 2022-04-25 | 2023-11-02 | 中兴通讯股份有限公司 | 天线振子、天线、通信设备及天线的组装方法 |
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CN110691474B (zh) | 2021-02-12 |
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Effective date of registration: 20200116 Address after: 510730 No. 6, layered Road, Guangzhou economic and Technological Development Zone, Guangdong Applicant after: COMBA TELECOM TECHNOLOGY (GUANGZHOU) Ltd. Address before: 510730 Guangdong city of Guangzhou province Guangzhou economic and Technological Development Zone Jinbi Road No. 6 Applicant before: COMBA TELECOM TECHNOLOGY (GUANGZHOU) Ltd. Applicant before: COMBA TELECOM SYSTEMS (CHINA) Ltd. Applicant before: COMBA TELECOM SYSTEMS (GUANGZHOU) Ltd. Applicant before: TIANJIN COMBA TELECOM SYSTEMS Ltd. |
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