CN110634968A - Monocrystalline silicon heterojunction solar cell based on non-grid line and non-doped contact - Google Patents
Monocrystalline silicon heterojunction solar cell based on non-grid line and non-doped contact Download PDFInfo
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 74
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 239000010408 film Substances 0.000 claims description 127
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 62
- 229910052709 silver Inorganic materials 0.000 claims description 62
- 239000004332 silver Substances 0.000 claims description 62
- 238000002161 passivation Methods 0.000 claims description 40
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052782 aluminium Inorganic materials 0.000 claims description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 27
- 229910052737 gold Inorganic materials 0.000 claims description 27
- 239000010931 gold Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 13
- 229910052791 calcium Inorganic materials 0.000 claims description 13
- 239000011575 calcium Substances 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 230000005693 optoelectronics Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000969 carrier Substances 0.000 abstract description 4
- 230000000670 limiting effect Effects 0.000 abstract 1
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 12
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 5
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 5
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 238000002207 thermal evaporation Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000013082 photovoltaic technology Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001868 water Inorganic materials 0.000 description 1
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Abstract
The invention discloses a monocrystalline silicon heterojunction solar cell based on a grid-line-free and non-doped contact structure, which sequentially comprises an antireflection film, an ultrathin metal film, a hole selective contact, monocrystalline silicon, an electron selective contact and a back electrode from top to bottom; the ultrathin metal film is a continuous film, and the thickness of the ultrathin metal film is less than 10 nm. The hole selective contact and the electron selective contact can be respectively two layers or one layer. The ultrathin metal film is introduced, so that the shielding effect of a grid electrode on sunlight in the traditional cell is avoided, the collection efficiency of photon-generated carriers is increased, the limiting effect on long-wave-band sunlight is enhanced, and the short-circuit current of the cell can be greatly improved; the metal film can also improve the stability of the battery and increase the flexibility of the battery; the whole battery has the advantages of simple structure, flexible design, simple process, no need of additional doping process, no need of defining electrode pattern structure, controllable process temperature within 100 ℃ and low cost.
Description
Technical Field
The invention relates to the technical field of solar photovoltaics, in particular to a monocrystalline silicon heterojunction solar cell based on non-grid line and non-doped contact.
Background
The monocrystalline silicon solar cell occupies the most major photovoltaic market in the world and is an important photovoltaic technical scheme. The traditional monocrystalline silicon photovoltaic technology is represented by two solar cells of a homojunction and a heterojunction, wherein the homojunction and the heterojunction adopt p + type hole selective contact and n + type electron selective contact formed by diffusion doping; the latter uses intrinsic amorphous silicon as passivation layer, and p + type and n + type heavily doped amorphous silicon as hole and electron selective contact respectively. These doped contact techniques have several disadvantages: from the physical aspect, the heavy doping inevitably causes unfavorable factors such as Auger recombination, forbidden band narrowing, body/surface recombination, free carrier absorption and the like, and greatly limits the open-circuit voltage and the short-circuit current of the battery; in technical terms, doping often requires high-temperature diffusion and annealing processes, and also requires toxic gases (borane and phosphine) to grow p + type and n + type amorphous silicon, so that the process is complex and high in cost. To overcome the above problems, the use of undoped carrier-selective contacts instead of doped contacts has become an emerging development in the field of single crystal silicon photovoltaic technology (Energy & Environmental Science 9, 1552-1576 (2016)).
At this stage, single crystal silicon heterojunction solar cells have been constructed primarily for which the electron (or hole) selective contact is undoped and the hole (or electron) selective contact is doped, for the exploration of a variety of different electron and hole selective materials. Reports on single crystal silicon heterojunction solar cells in which both electron and hole selective contacts are undoped are not uncommon.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a monocrystalline silicon heterojunction solar cell based on no grid line and no doped contact, simplifies the cell preparation process, reduces the cell cost, improves the photoelectric conversion efficiency of the cell, and can expand the application range of the solar cell to the field of flexible optoelectronic devices.
A monocrystalline silicon heterojunction solar cell based on no grid line and no doped contact sequentially comprises an antireflection film, an ultrathin metal film, a hole selective contact, monocrystalline silicon, an electron selective contact and a back electrode from top to bottom; the ultrathin metal film is a continuous film, and the thickness of the ultrathin metal film is less than 10 nm.
The forbidden band width of the antireflection film is larger than 3 eV, and the thickness of the antireflection film is smaller than 100 nm.
The ultrathin metal film is a silver, gold, copper and aluminum single-layer film; or the double-layer film is aluminum/silver, gold/silver, calcium/silver, germanium/silver, chromium/silver, nickel/silver, copper/silver, titanium/silver, aluminum/gold, nickel/gold and titanium/gold, the thickness ratio is 1:1-1:20, and the total thickness of the double-layer film is less than 10 nm; or an alloy film formed by mixing aluminum/silver, gold/silver, calcium/silver, germanium/silver, chromium/silver, nickel/silver, copper/silver, titanium/silver, aluminum/gold, nickel/gold and titanium/gold according to a certain proportion, wherein the mixing proportion is 1:1-1:20, and the total thickness of the alloy film is less than 10 nm.
The hole selective contact is two layers, namely a hole selective film and a first passivation film, and the first passivation film is in contact with the monocrystalline silicon; or a layer, namely a hole selective film with a passivation function, and is in contact with the monocrystalline silicon.
The monocrystalline silicon is doped in an n type mode, the resistivity is less than 10 omega cm, the thickness is less than 400 mu m, and the surface is smooth or is provided with a suede light trapping structure.
The electron selective contact is two layers, namely an electron selective film and a second passivation film, and the second passivation film is in contact with the monocrystalline silicon; or an electron selective film with passivation function, and is contacted with the monocrystalline silicon.
The back electrode is a silver and aluminum single-layer film, and the thickness of the back electrode is more than 20 nm; or calcium/silver, magnesium/silver, calcium/aluminum and magnesium/aluminum double-layer films with the thickness ratio of 1:1-1:50, and the total thickness of the double-layer films is more than 20 nm.
The work function of the hole selective contact film is higher than that of the monocrystalline silicon, the forbidden band width is larger than 3 eV, and extra doping is not needed; the first passivation film is one or a combination of silicon oxide, aluminum oxide, titanium oxide, hafnium oxide, silicon nitride, silicon oxynitride, nitrogen oxide, intrinsic hydrogenated amorphous silicon and silicon carbide, and the thickness of the first passivation film is less than 10 nm.
The work function of the electron selective contact film is lower than that of the monocrystalline silicon, the forbidden band width is larger than 3 eV, and extra doping is not needed; the second passivation film is one or a combination of more of silicon oxide, aluminum oxide, titanium oxide, hafnium oxide, silicon nitride, silicon oxynitride, nitrogen oxide, intrinsic hydrogenated amorphous silicon and silicon carbide, and the thickness of the second passivation film is less than 10 nm.
The monocrystalline silicon heterojunction solar cell is applied, the thickness of the monocrystalline silicon is smaller than 100 mu m, and the application of the monocrystalline silicon heterojunction solar cell comprises the field of flexible photoelectron.
The invention has the beneficial effects that:
compared with other monocrystalline silicon solar cells, the solar cell disclosed by the invention introduces the ultrathin metal film as the top electrode, replaces the grid line electrode, ITO and other brittle transparent conductive oxides in the traditional solar cell, overcomes the shielding effect of the grid line electrode on sunlight, and is expected to expand the application range of the monocrystalline silicon solar cell to the field of flexible photoelectrons. Theoretically, a metal film with a thickness less than 10 nm would have good optical transmittance. In practice, however, metal thin films are often produced by physical vapor deposition methods. Due to the difference of surface tension between the substrate and the metal, the metal with the thickness less than 10 nm is difficult to form a film continuously, so that the metal film has large absorption of incident light and low conductivity. Therefore, in many reported monocrystalline silicon solar cells, no ultrathin metal thin film is introduced to collect and conduct photogenerated carriers. The invention creatively provides an ultrathin metal film as a top electrode of a monocrystalline silicon solar cell, uses hole selective contact as a substrate, and combines a single-layer metal, a double-layer metal or a metal alloy film to overcome the surface tension difference between the metal and the substrate, thereby generating the ultrathin metal continuous film with the thickness of less than 10 nm. The film has good optical transmittance and electrical conductivity, and the optical transmittance can be further improved by the action of the top antireflection film. Compared with a grid line electrode, the ultrathin metal film completely covers the hole selective contact, so that sunlight is not shielded, and the collection efficiency of photo-generated carriers is high; meanwhile, the reflectivity of the solar cell is high, after long-wave-band sunlight penetrates through the ultrathin metal film, the sunlight can be tightly bound in monocrystalline silicon between the film and the back electrode under the Fabry-Perot effect and is fully absorbed to generate photon-generated carriers, and the thinner the monocrystalline silicon is, the more remarkable the light trapping effect is. In summary, the introduction of the ultra-thin metal film can greatly improve the short-circuit current of the battery. In addition, the ultrathin metal film can protect the hole selective contact film from being polluted by carbon, water, oxygen and the like, and the stability of the battery is improved. In addition, the ultrathin metal film has excellent flexibility, is applied to a monocrystalline silicon battery with the thickness of less than 100 mu m, and can expand the application field of the monocrystalline silicon solar battery to the field of flexible photoelectrons.
The invention has simple structure design and is composed of a plurality of layers of functional films; the structural design can be flexibly adjusted, for example, if the hole selective contact film has a passivation effect, the first passivation film can be removed; if the electron selective contact film has a passivation effect, the second passivation film of the present invention can be removed.
The preparation process is very simple, only multilayer functional films are required to be sequentially deposited on the front side and the back side of the monocrystalline silicon piece, an additional doping process is not required, an electrode pattern structure is not required to be defined, the process temperature can be controlled within 100 ℃, and the cost is low.
Drawings
Figure 1 is a single crystal silicon heterojunction solar cell based on a gridless, undoped contact as shown in example 1;
figure 2 is a single crystal silicon heterojunction solar cell based on a gridless, undoped contact as shown in example 2;
in the figure, an antireflection film 1, an ultrathin metal film 2, a hole selective contact 3, single crystal silicon 4, an electron selective contact 5, a back electrode 6, a hole selective film 7, a first passivation film 8, a second passivation film 9, and an electron selective film 10.
Detailed Description
The invention is further illustrated with reference to the figures and examples.
A monocrystalline silicon heterojunction solar cell based on no grid line and no doped contact sequentially comprises an antireflection film 1, an ultrathin metal film 2, a hole selective contact 3, monocrystalline silicon 4, an electron selective contact 5 and a back electrode 6 from top to bottom; the ultrathin metal film 2 is a continuous film, and the thickness is less than 10 nm.
The forbidden band width of the antireflection film 1 is more than 3 eV, and the thickness of the antireflection film is less than 100 nm.
The ultrathin metal film 2 is a silver, gold, copper and aluminum single-layer film; or the double-layer film is aluminum/silver, gold/silver, calcium/silver, germanium/silver, chromium/silver, nickel/silver, copper/silver, titanium/silver, aluminum/gold, nickel/gold and titanium/gold, the thickness ratio is 1:1-1:20, and the total thickness of the double-layer film is less than 10 nm; or an alloy film formed by mixing aluminum/silver, gold/silver, calcium/silver, germanium/silver, chromium/silver, nickel/silver, copper/silver, titanium/silver, aluminum/gold, nickel/gold and titanium/gold according to a certain proportion, wherein the mixing proportion is 1:1-1:20, and the total thickness of the alloy film is less than 10 nm.
The hole selective contact 3 is formed by two layers, namely a hole selective film 7 and a first passivation film 8, and the first passivation film 8 is in contact with the monocrystalline silicon 4; or a layer, namely a hole selective film with passivation function, and is in contact with the monocrystalline silicon 4.
The monocrystalline silicon 4 is doped in an n-type mode, the resistivity is less than 10 omega-cm, the thickness is less than 400 mu m, and the surface is smooth or is provided with a suede light trapping structure.
The electron selective contact 5 is two layers, namely an electron selective film 9 and a second passivation film 10, and the second passivation film 10 is in contact with the monocrystalline silicon 4; or an electron selective film having a passivation function and being in contact with the single crystal silicon 4.
The back electrode 8 is a silver and aluminum single-layer film, and the thickness is more than 20 nm; or calcium/silver, magnesium/silver, calcium/aluminum and magnesium/aluminum double-layer films with the thickness ratio of 1:1-1:50, and the total thickness of the double-layer films is more than 20 nm.
The work function of the hole selective contact film 7 is higher than that of the monocrystalline silicon 4, the forbidden band width is larger than 3 eV, and extra doping is not needed; the first passivation film 8 is one or a combination of silicon oxide, aluminum oxide, titanium oxide, hafnium oxide, silicon nitride, silicon oxynitride, nitrogen oxide, intrinsic hydrogenated amorphous silicon and silicon carbide, and the thickness of the first passivation film is less than 10 nm.
The work function of the electron selective contact film 9 is lower than that of the monocrystalline silicon 4, the forbidden band width is larger than 3 eV, and extra doping is not needed; the second passivation film 9 is one or a combination of silicon oxide, aluminum oxide, titanium oxide, hafnium oxide, silicon nitride, silicon oxynitride, nitrogen oxide, intrinsic hydrogenated amorphous silicon and silicon carbide, and the thickness is less than 10 nm.
The thickness of the monocrystalline silicon 4 is less than 100 mu m, and the application of the monocrystalline silicon heterojunction solar cell comprises the field of flexible photoelectron.
Example 1
Setting the antireflection film 1 as molybdenum oxide with the thickness of 50 nm; the ultrathin metal film 2 is an alloy film formed by mixing aluminum/silver in a ratio of 1:10, and the thickness is 5 nm; the hole-selective contact 3 comprises a hole-selective film 7 and a first passivation film 8 of molybdenum oxide 10 nm thick and silicon oxide 1 nm thick, respectively; the thickness of the single crystal silicon 4 is 10 μm; the electron selective contact 5 comprises a second passivation film 9 and an electron selective film 10, which are respectively 1 nm thick silicon oxide and 1 nm thick lithium fluoride; the back electrode 6 is aluminum and has a thickness of 100 nm.
On the basis of cleaning the monocrystalline silicon 4, depositing silicon oxide as a first passivation film 8 and a second passivation film 9 by utilizing an atomic layer deposition method, and then sequentially depositing lithium fluoride and aluminum on one surface of the monocrystalline silicon 4 by utilizing a thermal evaporation method to respectively serve as an electron selective film 10 and a back electrode 6; finally, molybdenum oxide, an aluminum-doped silver alloy film and molybdenum oxide are sequentially deposited on the other surface of the monocrystalline silicon 4 by using a thermal evaporation method to respectively serve as the hole selective film 7, the ultrathin metal film 2 and the antireflection film 1. Wherein, the aluminum/silver alloy film can be prepared by adopting a co-evaporation method. Because doping and electrode pattern structure definition are not needed, the whole process is very simple, the times of thermal evaporation and vacuum pumping are only needed twice, the process flow is greatly simplified, and the process time is saved. The thickness of the monocrystalline silicon 4 is 10 μm, and the application of the ultra-thin metal film 2, the battery will have very good flexibility.
Example 2
Setting the antireflection film 1 as molybdenum oxide with the thickness of 50 nm; the ultrathin metal film 2 is an aluminum/silver double-layer film with the thickness ratio of 1:5 and the thickness of 6 nm; the hole selective contact 3 is chromium oxide with a thickness of 20 nm; the thickness of the monocrystalline silicon 4 is 50 mu m, and pyramid textured light trapping structures are arranged on the upper surface and the lower surface of the monocrystalline silicon 4; the electron selective contact 5 is titanium oxide with the thickness of 1 nm; the back electrode 8 is a calcium/aluminum double-layer film with a thickness ratio of 1:20 and a thickness of 100 nm.
By selecting different materials and setting different film thickness parameters, the monocrystalline silicon heterojunction solar cell based on the non-grid line and non-doped contact can be flexibly designed, and the cell can be prepared by adopting a plurality of different film deposition methods, including but not limited to thermal evaporation, chemical vapor deposition, electron beam evaporation, sputtering, atomic layer deposition and thermal oxidation.
Claims (10)
1. A monocrystalline silicon heterojunction solar cell based on no grid line and no doped contact is characterized by comprising an antireflection film (1), an ultrathin metal film (2), a hole selective contact (3), monocrystalline silicon (4), an electron selective contact (5) and a back electrode (6) from top to bottom in sequence; the ultrathin metal film (2) is a continuous film, and the thickness is less than 10 nm.
2. The monocrystalline silicon heterojunction solar cell according to claim 1, wherein said antireflection film (1) has a forbidden bandwidth greater than 3 eV and a thickness less than 100 nm.
3. The monocrystalline silicon heterojunction solar cell according to claim 1, wherein said ultra-thin metal thin film (2) is a single-layer thin film of silver, gold, copper, aluminum; or the double-layer film is aluminum/silver, gold/silver, calcium/silver, germanium/silver, chromium/silver, nickel/silver, copper/silver, titanium/silver, aluminum/gold, nickel/gold and titanium/gold, the thickness ratio is 1:1-1:20, and the total thickness of the double-layer film is less than 10 nm; or an alloy film formed by mixing aluminum/silver, gold/silver, calcium/silver, germanium/silver, chromium/silver, nickel/silver, copper/silver, titanium/silver, aluminum/gold, nickel/gold and titanium/gold according to a certain proportion, wherein the mixing proportion is 1:1-1:20, and the total thickness of the alloy film is less than 10 nm.
4. The monocrystalline silicon heterojunction solar cell according to claim 1, characterized in that said hole-selective contact (3) is two layers, respectively a hole-selective thin film (7) and a first passivation thin film (8), and the first passivation thin film (8) is in contact with said monocrystalline silicon (4); or a layer, namely a hole selective film with passivation function, and is in contact with the monocrystalline silicon (4).
5. The monocrystalline silicon heterojunction solar cell of claim 1, wherein the monocrystalline silicon (4) is n-doped, has a resistivity of less than 10 Ω · cm, a thickness of less than 400 μm, and has a smooth surface or textured light trapping structure.
6. The monocrystalline silicon heterojunction solar cell according to claim 1, characterized in that said electron selective contact (5) is two layers, respectively an electron selective thin film (9) and a second passivation thin film (10), and the second passivation thin film (10) is in contact with said monocrystalline silicon (4); or an electron selective film with passivation function, and is contacted with the monocrystalline silicon (4).
7. The monocrystalline silicon heterojunction solar cell of claim 1, wherein said back electrode (8) is a silver, aluminum single-layer thin film with a thickness greater than 20 nm; or calcium/silver, magnesium/silver, calcium/aluminum and magnesium/aluminum double-layer films with the thickness ratio of 1:1-1:50, and the total thickness of the double-layer films is more than 20 nm.
8. The monocrystalline silicon heterojunction solar cell according to claim 4, wherein the work function of the hole-selective contact film (7) is higher than that of the monocrystalline silicon (4), the forbidden band width is greater than 3 eV, and no additional doping is required; the first passivation film (8) is one or a combination of silicon oxide, aluminum oxide, titanium oxide, hafnium oxide, silicon nitride, silicon oxynitride, intrinsic hydrogenated amorphous silicon and silicon carbide, and the thickness of the first passivation film is less than 10 nm.
9. The single-crystal silicon heterojunction solar cell according to claim 6, wherein the work function of the electron selective contact film (9) is lower than that of the single-crystal silicon (4), the forbidden band width is greater than 3 eV, and no additional doping is required; the second passivation film (9) is one or a combination of silicon oxide, aluminum oxide, titanium oxide, hafnium oxide, silicon nitride, silicon oxynitride, intrinsic hydrogenated amorphous silicon and silicon carbide, and the thickness of the second passivation film is less than 10 nm.
10. Use of a single crystal silicon heterojunction solar cell according to any of claims 1 to 9, characterized in that said single crystal silicon (4) is less than 100 μm thick, said single crystal silicon heterojunction solar cell use comprising the field of flexible optoelectronics.
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