CN110634754A - Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode - Google Patents
Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode Download PDFInfo
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- CN110634754A CN110634754A CN201910846872.2A CN201910846872A CN110634754A CN 110634754 A CN110634754 A CN 110634754A CN 201910846872 A CN201910846872 A CN 201910846872A CN 110634754 A CN110634754 A CN 110634754A
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000002347 injection Methods 0.000 claims abstract description 50
- 239000007924 injection Substances 0.000 claims abstract description 50
- 229920003023 plastic Polymers 0.000 claims abstract description 42
- 239000004033 plastic Substances 0.000 claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 claims abstract description 28
- 238000003466 welding Methods 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 10
- 239000000565 sealant Substances 0.000 abstract description 10
- 230000007613 environmental effect Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 238000010008 shearing Methods 0.000 description 13
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000007493 shaping process Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- NNIPDXPTJYIMKW-UHFFFAOYSA-N iron tin Chemical compound [Fe].[Sn] NNIPDXPTJYIMKW-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010099 solid forming Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a method for manufacturing a power integrated circuit part with an external radiating fin by adopting an injection molding mode, wherein an integral injection molding insert formed by a power integrated circuit packaging body with the radiating fin and a conducting strip, the external radiating fin and the like are placed in a shell injection mold, high-temperature plastic is injected into the shell injection mold to form a shell, and the manufacture of the power integrated circuit part is finished after demolding. The method reduces the production links of adhering external radiating fins, encapsulating sealant, adhering protective cover plates and the like, has the advantages of reducing production cost, realizing efficient production, and manufacturing products with good consistency, can be suitable for various application modes and can work at full power at various environmental temperatures, particularly high temperature.
Description
Technical Field
The invention belongs to the field of electronic component manufacturing of application integrated circuits. And more particularly, to a method of injection molding a power integrated circuit component with an external heat sink.
Background
With the development of integrated circuit technology, how to simplify the process flow of applying integrated circuits to manufacture integrated circuit components is an increasingly important issue for those skilled in the art. Common power integrated circuit components are: the system comprises an automobile voltage regulator, a motor controller, an electric regulator, a power module, an electronic switch, a rectifier and the like. Taking an important electronic component of an automobile as an example, the production process flow mainly comprises 3 ways:
mode 1, step one, welding a chip and other electronic components on a circuit board through an electronic product assembly process such as smt and the like to form PCBA; assembling the PCBA, the external radiating fins and the regulator bracket together in a bonding mode; connecting the conducting strips on the regulator bracket with the corresponding functional pads of the PCBA in a wire welding mode; step four, encapsulating sealant; and step five, adhering a protective cover plate to finally form the automobile voltage regulator. It should be noted that many kinds of regulator holders are commercially available (the regulator holder is a kind of a housing, and a housing generally used for producing a regulator is called a regulator holder), and the regulator holder is manufactured by pressing a molten high-temperature plastic (e.g., PPS plastic, PBT plastic, ABS plastic, PA66 plastic, etc.) into a housing injection mold, i.e., a regulator injection mold, by high temperature and high pressure of an injection molding machine and inserting conductive sheets into the plastic.
Mode 2, step one, placing the regulator packaging chip into a regulator bracket which is injected in advance; welding a conducting plate in the regulator bracket and a functional pin of the chip together; step three, adhering external radiating fins; step four, encapsulating sealant; and step five, adhering a protective cover plate to finally manufacture the automobile voltage regulator assembly.
Mode 3, step one, bonding the unpackaged bare regulator chip on the heat sink of the regulator bracket; step two, the connection between the chip bonding pad and the bracket conducting strip is realized through a chip binding process; step three, encapsulating sealant; and step four, adhering a protective cover plate to finally manufacture the automobile voltage regulator assembly.
In the three processes, the external radiating fins and the protective cover plate are adhered by using the adhesive, and the next process can be continued after the adhesive is solidified; similarly, after the sealant (a kind of high-temperature glue) is filled, the workpiece must be placed in a high-temperature oven, and the next step can be continued after the sealant is cured.
The current manufacturing method of power integrated circuit components such as a motor controller, an electric regulator, a power module, an electronic switch, a rectifier and the like is similar to that of the automobile voltage regulator, and is also a complex step of welding a power integrated circuit chip and a conducting strip, adhering an external radiating fin, encapsulating sealant, installing a shell, adhering a protective cover plate and the like. The production modes of the power integrated circuit components such as the automobile voltage regulator, the motor controller, the electronic regulator, the power module, the electronic switch, the rectifier and the like are analyzed, and the problems of multiple production procedures, complex production equipment, long circuit board and support processing period, multiple materials and consumable varieties, long production period, difficulty in realizing one-stream production, high production and management cost and the like exist in the conventional production modes. How to overcome these problems and simplify the process flow of manufacturing the integrated circuit components by applying the integrated circuit package body is a problem to be solved urgently in the industry.
Disclosure of Invention
The present invention is directed to a method for manufacturing a power integrated circuit device with a heat sink by injection molding, which solves the above-mentioned problems, and simplifies the process flow of manufacturing the integrated circuit device by using an integrated circuit, and simultaneously, the manufactured power integrated circuit device can operate at full power at various environmental temperatures, especially at high temperatures.
In order to achieve the above object, the present invention adopts a method of manufacturing an integrated circuit device comprising:
step 1, preparing a power integrated circuit packaging body with a radiating fin, a conducting strip, a shell injection mold and an external radiating fin;
step 2, welding the functional pins of the power integrated circuit packaging body with the radiating fins to corresponding positions of the conducting strips to form an integral injection molding insert;
step 3, placing the external radiating fins into the shell injection mold;
step 4, placing the integral injection molding insert into the shell injection mold;
and 5, injecting high-temperature plastic into the shell injection mold to form a shell, and demolding to finish the manufacture of the power integrated circuit part.
The power integrated circuit package provided by the invention is a plastic-packaged integrated circuit device which is packaged by IC packaging technology and has an operating current of more than 3 amperes, such as TO-220, TO-263, TO-3P, TO-247, Multiwatt8 and the like. In the prior art, a common application of a power integrated circuit package in public data and product applications is to solder a circuit board and bond an external heat sink. The external radiating fin is exposed outside the processed part, and has an effect of increasing the radiating effect. The conducting strip of the invention can be a metal strip which is formed by punching and has a fixed shape and is used for playing a role of a current path, and can also be a metal strip which is formed by installing a lead, a screw rod, a connector assembly and the like on the metal strip. The number of the conducting strips can be one or a plurality of, or a conducting strip frame formed by connecting a plurality of conducting strips through the connecting rib parts.
Further, in the step of preparing the power integrated circuit package with the heat sink, the conductive sheet, the case injection mold, and the external heat sink, an insulating heat conduction pad is prepared, the heat conduction pad is placed on the external heat sink, and the power integrated circuit package with the heat sink is fixed on the insulating heat conduction pad.
Further, step 1 further comprises preparing accessory parts such as screws, nuts, support pillars, wires, connectors and the like, and before step 5, placing 1 or more of the accessory parts such as screws, nuts, support pillars, wires, connectors and the like into the injection mold of the shell.
Further, the power integrated circuit package with heat sink in step 1 is formed by packaging 1 or more chips, or is a circuit board module composed of a circuit board, a chip, and a resistor-capacitor component. Further, step 1 further includes preparing 1 or more of diode, resistor, and capacitor components, and step 2 further includes soldering functional pins of 1 or more of the diode, resistor, and capacitor components to corresponding positions of the conductive sheet, in a manner that: 1 or more of resistance welding, laser welding, ultrasonic welding, and brazing are used in combination.
Furthermore, the radiating area of the radiating fin of the power integrated circuit package body with the radiating fin is not less than 60mm2(ii) a The heat dissipation area of the external heat dissipation fins is not less than 240mm2To ensure the power integrated circuit part manufactured by the invention to work at full power under various environmental temperatures, especially high temperature.
Furthermore, the pins of the power integrated circuit package body with the radiating fins belong to a direct insertion type and are arranged in one side or multiple sides, the distance between the pins is larger than 0.7mm, and the size of the pins is as follows: the length is not less than 3mm, the width is not less than 0.6mm, and the thickness is not less than 0.4 mm.
Furthermore, the packaging material of the power integrated circuit packaging body with the radiating fin is a high-temperature-resistant die pressing material and can resist the instantaneous high temperature during injection molding.
In step 2, the functional pins of the power integrated circuit package with the heat sink and the conductive sheets are welded by 1 or more of resistance welding, laser welding, ultrasonic welding, soldering, and the like.
Further, before the step 1, the method also comprises a process of placing the conducting strip into a fixed forming mould for injection molding to manufacture a solidified and formed connected conducting strip.
Further, the method also comprises the following steps after the step 2 and before the step 3: and (3) placing the integral injection molding insert in the step (2) into a fixed forming die for injection molding to prepare a reinforced integral insert.
Compared with the prior art, the invention has the beneficial effects that:
firstly, because the injection molding manufacturing mode is adopted to combine a plurality of steps of the assembly of the prior power integrated circuit component (see the production process flow of 3 modes of the automobile voltage regulator in the partial background technology) into one process of the injection molding processing of the shell, the production steps of adhering external radiating fins, encapsulating sealant, adhering a protective cover plate and the like are reduced. According to estimation, the purchasing cost of glue can be saved by 0.6-1.2 yuan/machine in the production of the automobile regulator through the improvement, more than 3 workers in the production links of adhering external radiating fins, encapsulating sealant, adhering a protective cover plate and the like can be reduced in each production line, and the equipment investment of an automatic glue dispenser, a high-temperature oven, a tooling tray and the like is saved. Secondly, because the method commonly used in the production of the regulator at present needs to solidify the high-temperature adhesive by a high-temperature baking means, which takes 20-60 minutes, and the method provided by the invention greatly reduces the production period of the regulator because the injection molding process time is less than 2 minutes. The present manufacturing method of the power integrated circuit components such as the motor controller, the electric regulator, the power module, the electronic switch, the rectifier and the like is similar to that of the automobile voltage regulator, and the production period of the product can be greatly shortened by applying the invention. Thirdly, the commonly used method for producing the regulator at present is to manufacture the conducting strip into a regulator bracket by an injection molding mode, then install the power integrated circuit packaging body in the regulator bracket, and bond the external radiating fin and the protective cover, which takes time and labor. The invention does not need a special regulator bracket manufacturing process any more, and directly changes the conducting plate into an external assembly mode, namely, the welding process of the functional pin of the power integrated circuit packaging body and the conducting plate is completed in an external space, and the assembly process of forming an integral injection molding insert is not limited by space and position any more, so that the conducting plate and the packaging body pin are more convenient to apply a special tool clamp and more advanced equipment in the welding process, and the quality and the efficiency are improved. The present manufacturing method of the power integrated circuit components such as the motor controller, the electric regulator, the power module, the electronic switch, the rectifier and the like is similar to that of the automobile voltage regulator, and the product quality and the production efficiency can be greatly improved by applying the invention. Fourthly, through replacing the glue for bonding with structural plastic, the fixed structural strength of outside fin can be made higher, the uniformity of product appearance is better, and the product also can be more stable in using. Fifthly, according to the power integrated circuit component with the external heat sink manufactured by the invention, the injection molded housing can have various complex structural characteristics according to the difference between the three-dimensional shape of the cavity of the housing injection mold and the lodging insert in the step 1 in claim 1, wherein the housing comprises functional structures such as mounting holes, external connecting plugs, fixing screws, fixing nuts and the like, and can be applied to various application modes.
Detailed Description
The present invention will be described in detail with reference to specific examples. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those of ordinary skill in the art in light of these embodiments are intended to be within the scope of the present invention.
Example 1: the automobile voltage regulator with the external radiating fins is manufactured in an injection molding mode. Preparing a TO-3P packaged regulator chip packaging body, connecting a functional pin of the packaging body with a position corresponding TO a copper nickel plating conducting strip through resistance welding TO form an integral injection molding insert, putting an external radiating fin and the integral injection molding insert into a shell injection mold for manufacturing a regulator, pressing molten PPS plastic into the plastic mold through high temperature and high pressure of an injection molding machine, wherein the injection molding parameters are as follows: the cylinder temperature was 310 ℃, the injection pressure was 120Mpa, and the mold temperature was 160 ℃. And opening the mold after cooling, taking out the molded regulator module, and shearing off the water gap and burrs by using scissors to finish the assembly of the regulator.
In the embodiment, production links such as fin bonding, potting sealant and bonding of a protective cover plate which are mostly adopted in the production of the conventional automobile voltage regulator are reduced, various raw materials such as a circuit board and soldering tin are saved, the time for processing the regulator bracket and the circuit board is saved, and the investment of equipment and personnel is reduced. Because the packaging body and the conducting strip are welded in an open environment (the welding in the traditional process is not limited by the operation space of the bracket), the welding operation is convenient, and higher welding efficiency and quality are brought. Thus having various advantageous effects and reducing the production cost.
Example 2: the automobile voltage regulator with the external radiating fins is manufactured in an injection molding mode. Prepare a regulator chip packaging body of multiwatt8, pass through laser welding the function pin of packaging body and link to each other with the position that iron tinning conducting strip frame corresponds, form a whole mold insert of moulding plastics, prepare outside fin, insulating heat conduction pad, nut, support column, put into the casing injection mold of preparation regulator outside fin, whole mold insert, nut, support column of moulding plastics, through the high temperature high pressure of injection molding machine, in the plastic mold is impressed to the PBT plastics of state of melting, the parameter of moulding plastics is: the cylinder temperature was 240 ℃, the injection pressure was 80Mpa, and the mold temperature was 80 ℃. And (3) opening the die after cooling, taking out the formed regulator module, shearing off a water gap and burrs by using scissors, and cutting off the connecting rib part of the conducting strip frame by using die punching to finish the assembling process of the regulator.
Example 3: the automobile voltage regulator with the external radiating fins is manufactured in an injection molding mode. Put into fixed forming die earlier a plurality of copper tin-plating conducting strips, through the high temperature and high pressure of injection molding machine, impress the PPS plastics of melting the state in the plastic mold, the parameter of moulding plastics is: the cylinder temperature was 310 ℃, the injection pressure was 120Mpa, and the mold temperature was 160 ℃. And opening the mold after cooling, taking out the solidified and molded integrated conducting strip, and shearing off the water gap and burrs by using scissors. Preparing a plug-in capacitor, and connecting the plug-in capacitor with the corresponding position of the solidified and molded conducting strip through ultrasonic welding. Preparing a TO220-5L regulator chip packaging body, performing punch forming on a functional pin of the packaging body through a die, and connecting the formed functional pin with a position corresponding TO the solidified and formed integrated conducting strip through ultrasonic welding TO form an integral injection molding insert. Preparing external radiating fins and nuts, putting the external radiating fins, the integral injection molding inserts and the nuts into an injection mold, pressing 30% glass fiber reinforced PA66 plastic in a melting state into a shell injection mold through high temperature and high pressure of an injection molding machine, wherein injection molding parameters are as follows: the cylinder temperature was 260 ℃, the injection pressure was 80Mpa, and the mold temperature was 80 ℃. And opening the mold after cooling, taking out the molded regulator module, and shearing off the water gap and burrs by using scissors to complete the assembly of the regulator.
Example 4: the automobile voltage regulator with the external radiating fins is manufactured in an injection molding mode. Preparing an iron nickel plating conducting strip frame and a connector, preparing a TO220-5L regulator chip packaging body, connecting with the corresponding position of the assembled iron tin plating conducting strip frame through resistance welding, preparing a phosphor copper conducting strip, connecting with the corresponding function pin of the packaging body through resistance welding TO form an integral injection molding insert, putting the integral injection molding insert into a fixed forming die, pressing molten PPS plastic into the fixed forming die through high temperature and high pressure of an injection molding machine, wherein the injection molding parameters are as follows: the cylinder temperature was 310 ℃, the injection pressure was 120Mpa, and the mold temperature was 160 ℃. And opening the mold after cooling, taking out the reinforced integral insert, and shearing off the water gap and burrs by using scissors. Prepare outside fin, nut, support column, put into casing injection mold to above-mentioned integral mold insert, outside fin, nut, support column again, through the high temperature high pressure of injection molding machine, impress the fine reinforcing PBT plastics of 30% glass of melting state into casing injection mold, the parameter of moulding plastics is: the cylinder temperature was 260 ℃, the injection pressure was 100Mpa, and the mold temperature was 100 ℃. And opening the mold after cooling, taking out the molded regulator part, and shearing off the water gap and burrs by using scissors to finish the assembly of the regulator.
Example 5: the automobile voltage regulator with the external radiating fins is manufactured in an injection molding mode. Prepare a TO 220-5L's regulator chip package body, two tinned copper plates, pass through mould stamping forming TO the function pin of packaging body, the packaging body pin after the shaping passes through laser welding and links TO each other with the position that tinned copper plate corresponds, the relevant shape conducting strip of connecting in every function pin is formed in the cutting of rethread laser, put into the fixed forming die who is used for fixed conducting strip, high temperature and high pressure through the injection molding machine, in the fixed forming die of impressing the PPS plastics of melting state, the parameter of moulding plastics is: the cylinder temperature was 310 ℃, the injection pressure was 120Mpa, and the mold temperature was 160 ℃. And opening the mold after cooling, taking out the reinforced integral insert, and shearing off the water gap and burrs by using scissors. Put into stamping forming die to integral mold insert and bend the shaping, prepare outside fin, insulating heat conduction pad, nut, support column, put into the casing injection mold of preparation regulator outside fin, nut, support column, the integral mold insert after the shaping, through the high temperature high pressure of injection molding machine, impress the fine reinforcing PA66 plastics of 30% glass of state of melting in the casing injection mold, the injection molding parameter is: the cylinder temperature was 260 ℃, the injection pressure was 80Mpa, and the mold temperature was 80 ℃. And opening the mold after cooling, taking out the molded regulator part, and shearing off the water gap and burrs by using scissors to finish the assembly of the regulator.
Example 6: the automobile voltage regulator with the external radiating fins is manufactured in an injection molding mode. Preparing a TO-246 regulator chip package body and 1 tinned copper plate, connecting functional pins of the package body with the corresponding positions of the tinned copper plate through laser welding, and then forming 2 conducting strips connected with the corresponding functional pins through laser cutting. Preparing 1 preformed conductive sheet, connecting the non-welded functional pin of the packaging body and the corresponding position of the conductive sheet through laser welding to form an integral insert, putting the integral insert into a fixed forming die for fixing the conductive sheet, pressing molten PPS plastic into the solid forming die through the high temperature and high pressure of an injection molding machine, wherein the injection molding parameters are as follows: the cylinder temperature was 310 ℃, the injection pressure was 120Mpa, and the mold temperature was 160 ℃. And opening the mold after cooling, taking out the reinforced integral insert, and shearing off the water gap and burrs by using scissors. Put into stamping forming die to the integral mold insert and bend the shaping, prepare outside fin, nut, support column, put into the casing injection mold who makes the regulator to the integral mold insert after outside fin, nut, support column, shaping, through the high temperature high pressure of injection molding machine, impress the PPS plastics of state of melting in the casing injection mold, the parameter of moulding plastics is: the cylinder temperature was 310 ℃, the injection pressure was 120Mpa, and the mold temperature was 160 ℃. And opening the mold after cooling, taking out the molded regulator part, and shearing off the water gap and burrs by using scissors to finish the assembly of the regulator.
Example 7: and manufacturing the three-phase rectifier with the external radiating fins in an injection molding mode. Prepare 6 rectifier diode packaging body of TO220-3L encapsulation, through mould punching press TO packaging body pin shaping TO fixed dimension and shape, it links TO each other with the position that copper tinning conducting strip corresponds through resistance welding, form a whole mold insert of moulding plastics, prepare outside fin, insulating heat conduction pad, the support column, outside fin, insulating heat conduction pad, the whole mold insert that moulds plastics, the support column is put into casing injection mold in proper order, high temperature high pressure through the injection molding machine, the casing plastic mold is impressed TO the glass fibre reinforcing PA66 plastics of 30% that melt the state, the injection molding parameter is: the cylinder temperature was 260 ℃, the injection pressure was 80Mpa, and the mold temperature was 80 ℃, and the case member of the three-phase rectifier was formed by an injection molding method. And opening the die after cooling, taking out the molded three-phase rectifier part, and shearing off a water gap and burrs by using scissors to finish the assembly of the three-phase rectifier.
Example 8: a plastic casing part containing a power device and an external radiating fin is manufactured by adopting an injection molding mode. Prepare the MOS pipe packaging body of 1 TO-3P encapsulation, through mould punching press the size and the shape of packaging body pin shaping TO needs, link TO each other through the position that resistance welding and copper tin-plating conducting strip correspond, form a whole mold insert of moulding plastics, put into casing injection mold in proper order TO outside fin, insulating heat conduction pad, nut, whole mold insert of moulding plastics, through the high temperature high pressure of injection molding machine, impress the ABS plastics of state of melting in the casing plastic mold, the injection molding parameter is: the cylinder temperature is 200 ℃, the injection pressure is 100Mpa, the mold temperature is 70 ℃, and a plastic shell component containing the power device and the external heat sink is formed by an injection molding method. And opening the mold after cooling, taking out the molded plastic shell component containing the power device and the external radiating fins, and shearing off the water gap and burrs by using scissors to finish the assembly of the shell.
The method is suitable for the fields of electronic switches, relays, power modules and the like.
Example 9: and adopting an injection molding mode to carry out the electric-tuning assembly with the external radiating fins. Prepare an assembled electricity accent PCBA, outside fin, put into casing injection mold in proper order outside fin and PCBA to on PCBA is fixed in outside fin, through the high temperature high pressure of injection molding machine, impress the PBT plastics of melting the state in the casing injection mold, the parameter of moulding plastics is: the temperature of the charging barrel is 240 ℃, the injection pressure is 80Mpa, the temperature of the die is 80 ℃, and the electrically-adjusted outer shell is formed by an injection molding method. After cooling, the mold is opened, the molded part is taken out, and the water gap and burrs are cut off by scissors. Preparing 704 silica gel, and encapsulating 704 silica gel in the electrically-adjusted shell for sealing and protecting the component area which is not molded on the PCBA.
The method is suitable for the field of assembling electronic components with plastic shells and external radiating fins, such as DC-DC voltage converters, waterproof switching power supplies, LED power supplies, motor controllers and the like.
Example 10: and manufacturing the active rectifier power module with the external radiating fins in an injection molding mode. Preparing a PCBA of an assembled active rectifier power module, preparing external radiating fins, conducting strips, supporting columns and screws, sequentially placing the external radiating fins and the PCBA into a shell injection mold, fixing a circuit board on the external radiating fins, and pressing molten PPS plastic into a shell through high temperature and high pressure of an injection molding machine
In the injection mold, the injection molding parameters are as follows: the temperature of the charging barrel is 310 ℃, the injection pressure is 120Mpa, the temperature of the die is 160 ℃, and the outer shell of the active rectifier power module with the external radiating fins is formed by an injection molding method. After cooling, the mold is opened, the molded module is taken out, and the water gap and burrs are cut off by scissors. And finishing the production of the active rectifier power module.
Example 11: and manufacturing the power module with the external radiating fins in an injection molding mode. Preparing 6 TO-220-3L packaged MOS tubes, external radiating fins and heat-conducting insulating pads, sequentially putting the MOS tubes, the external radiating fins and the heat-conducting insulating pads into a shell injection mold, injecting the molten ABS plastic into the shell injection mold through high temperature, wherein the injection molding parameters are as follows: the charging barrel temperature is 200 ℃, the injection pressure is 100Mpa, the mould temperature is 70 ℃, and the power module assembly is formed by an injection molding method. And opening the mold after cooling, taking out the molded power module assembly with the external radiating fins, and shearing off water gaps and burrs by using scissors to finish the production of the power module assembly.
Claims (11)
1. A method for manufacturing an integrated circuit component with an external heat sink by injection molding is characterized by comprising the following steps:
step 1, preparing a power integrated circuit packaging body with a radiating fin, a conducting strip, a shell injection mold and an external radiating fin;
step 2, welding the functional pins of the power integrated circuit packaging body with the radiating fins to corresponding positions of the conducting strips to form an integral injection molding insert;
step 3, putting the external radiating fins into the shell injection mold;
step 4, putting the integral injection molding insert into the shell injection mold;
and 5, injecting high-temperature plastic into the shell injection mold to form a shell, and demolding to finish the manufacture of the power integrated circuit part.
2. The method of claim 1, wherein step 1 further comprises providing an insulating thermal pad; placing the insulating thermal pad on the external heat sink after step 3 and before step 4; and fixing the self-radiating power integrated circuit on the insulating heat conduction pad after the step 4 and before the step 5.
3. The method of claim 1, wherein step 1 further comprises preparing screws, nuts, support posts, wires, connectors, and other accessory parts; before the step 5, 1 or more of the auxiliary parts such as the screw, the nut, the support column, the lead, the connector and the like are placed in the shell injection mold.
4. The method of claim 1, wherein the self-cooling power ic package in step 1 is a circuit board module formed by packaging 1 or more chips or a circuit board, a chip, and a resistor-capacitor device.
5. The method of claim 1, wherein step 1 further comprises preparing 1 or more of diode, resistor, and capacitor components; and the step 2 further comprises the step of welding 1 or more functional pins of the diode, the resistor and the capacitor to corresponding positions of the conducting strips.
6. The method of claim 1, 2, 3, 4 or 5 wherein the self-leaded power IC package has a heatsink area of no less than 60mm2(ii) a The heat dissipation area of the external heat dissipation fins is not less than 240mm2。
7. The method of claim 1, 2, 3, 4 or 5, wherein the self-leaded power IC package has pins in an in-line configuration, the pins are arranged in one or more sides, the pin-to-pin distance is greater than 0.7mm, and the pin size is: the length is not less than 3mm, the width is not less than 0.6mm, and the thickness is not less than 0.4 mm.
8. The method of claim 1, 2, 3, 4 or 5, wherein the heat spreader power IC package is made of a high temperature molding compound.
9. The method of claim 1, further comprising the step of injection molding the integrated circuit component with the external heat sink, wherein the injection molding step comprises: the pin welding mode in the step 2 is 1 mode or a combination of multiple modes of resistance welding, laser welding, ultrasonic welding, brazing and the like.
10. The method of claim 1, further comprising the step of injection molding the integrated circuit component with the external heat sink, wherein the injection molding step comprises: and (2) before the step (1), the process of placing the conducting strip into a fixed forming die for injection molding to manufacture a solidified and formed integrated conducting strip is also included.
11. The method of claim 1, further comprising the step of injection molding the integrated circuit component with the external heat sink, wherein the injection molding step comprises: the method also comprises the following steps after the step 2 and before the step 3: and (3) placing the integral injection molding insert in the step (2) into a fixed forming die for injection molding to prepare a reinforced integral insert.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910846872.2A CN110634754A (en) | 2019-09-01 | 2019-09-01 | Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode |
| CN202010070178.9A CN111092022A (en) | 2019-09-01 | 2020-01-15 | Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode |
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| CN201910846872.2A CN110634754A (en) | 2019-09-01 | 2019-09-01 | Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode |
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| CN201910846872.2A Pending CN110634754A (en) | 2019-09-01 | 2019-09-01 | Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode |
| CN202010070178.9A Pending CN111092022A (en) | 2019-09-01 | 2020-01-15 | Method for manufacturing power integrated circuit assembly component with external radiating fins in injection molding mode |
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| CN113910515B (en) * | 2021-10-29 | 2024-04-26 | 西安微电子技术研究所 | Device and method for reinforcing heat dissipation gasket in power module |
| CN115365628A (en) * | 2022-08-31 | 2022-11-22 | 浙江鑫辉光伏科技有限公司 | Resistance welding process for diodes of photovoltaic junction box |
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| JP2004095965A (en) * | 2002-09-02 | 2004-03-25 | Sanken Electric Co Ltd | Resin sealed semiconductor device |
| CN102723314A (en) * | 2012-06-11 | 2012-10-10 | 四川立泰电子有限公司 | Insulation TO220AB power device based on aluminum radiating fin and production method |
| CN104385534B (en) * | 2014-11-18 | 2017-06-16 | 佛山市蓝箭电子股份有限公司 | A kind of plastic-sealing mould structure |
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Application publication date: 20191231 |