CN110629207B - 全自动化学镍钯金生产设备控制系统 - Google Patents
全自动化学镍钯金生产设备控制系统 Download PDFInfo
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- CN110629207B CN110629207B CN201911058860.XA CN201911058860A CN110629207B CN 110629207 B CN110629207 B CN 110629207B CN 201911058860 A CN201911058860 A CN 201911058860A CN 110629207 B CN110629207 B CN 110629207B
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- plc
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- industrial computer
- acquisition module
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000010931 gold Substances 0.000 title claims abstract description 27
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 27
- 239000000126 substance Substances 0.000 title claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title description 5
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 title description 3
- 238000004891 communication Methods 0.000 claims description 4
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 11
- 230000005856 abnormality Effects 0.000 abstract description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911058860.XA CN110629207B (zh) | 2019-11-01 | 2019-11-01 | 全自动化学镍钯金生产设备控制系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911058860.XA CN110629207B (zh) | 2019-11-01 | 2019-11-01 | 全自动化学镍钯金生产设备控制系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110629207A CN110629207A (zh) | 2019-12-31 |
CN110629207B true CN110629207B (zh) | 2024-02-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911058860.XA Active CN110629207B (zh) | 2019-11-01 | 2019-11-01 | 全自动化学镍钯金生产设备控制系统 |
Country Status (1)
Country | Link |
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CN (1) | CN110629207B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111679628A (zh) * | 2020-07-14 | 2020-09-18 | 华业金属表面处理(五莲)有限公司 | 一种智能化控制系统 |
CN113692128B (zh) * | 2021-08-25 | 2022-11-15 | 惠州市特创电子科技股份有限公司 | 一种电镀通孔蚀刻线的除钯控制装置及方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4692346A (en) * | 1986-04-21 | 1987-09-08 | International Business Machines Corporation | Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath |
JP2003058220A (ja) * | 2001-08-15 | 2003-02-28 | Fuji Photo Film Co Ltd | 製造加工設備の制御システム |
CN1851587A (zh) * | 2005-12-08 | 2006-10-25 | 北京圆合电子技术有限责任公司 | 半导体制造设备控制系统及其方法 |
CN105629941A (zh) * | 2016-03-07 | 2016-06-01 | 松阳上上德盛不锈钢有限公司 | 一种利用rfid对钢管流转工序的实时品质管理系统 |
CN106011983A (zh) * | 2016-07-16 | 2016-10-12 | 厦门建霖工业有限公司 | 智能电镀设备及其使用方法 |
CN106101659A (zh) * | 2016-08-12 | 2016-11-09 | 南宁市桂润环境工程有限公司 | 一种分散型污水处理装置远程监控系统及方法 |
CN108206827A (zh) * | 2016-12-16 | 2018-06-26 | 基岩自动化平台公司 | 用于安全工业控制系统的图像捕获设备 |
CN108469809A (zh) * | 2018-03-30 | 2018-08-31 | 南京理工大学 | 基于嵌入式计算机的plc数据采集、处理和上传方法 |
CN110116365A (zh) * | 2019-06-25 | 2019-08-13 | 吉姆西半导体科技(无锡)有限公司 | 化学机械研磨设备机台监控系统 |
CN210856336U (zh) * | 2019-11-01 | 2020-06-26 | 吉姆西半导体科技(无锡)有限公司 | 全自动化学镍钯金生产设备控制系统 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MXPA05009294A (es) * | 2003-03-04 | 2005-10-05 | Valspar Sourcing Inc | Sistema de manejo de electrorrevestimiento. |
US10569967B2 (en) * | 2016-12-13 | 2020-02-25 | Mark Rolfes | Integrated control systems and methods |
-
2019
- 2019-11-01 CN CN201911058860.XA patent/CN110629207B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4692346A (en) * | 1986-04-21 | 1987-09-08 | International Business Machines Corporation | Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath |
JP2003058220A (ja) * | 2001-08-15 | 2003-02-28 | Fuji Photo Film Co Ltd | 製造加工設備の制御システム |
CN1851587A (zh) * | 2005-12-08 | 2006-10-25 | 北京圆合电子技术有限责任公司 | 半导体制造设备控制系统及其方法 |
CN105629941A (zh) * | 2016-03-07 | 2016-06-01 | 松阳上上德盛不锈钢有限公司 | 一种利用rfid对钢管流转工序的实时品质管理系统 |
CN106011983A (zh) * | 2016-07-16 | 2016-10-12 | 厦门建霖工业有限公司 | 智能电镀设备及其使用方法 |
CN106101659A (zh) * | 2016-08-12 | 2016-11-09 | 南宁市桂润环境工程有限公司 | 一种分散型污水处理装置远程监控系统及方法 |
CN108206827A (zh) * | 2016-12-16 | 2018-06-26 | 基岩自动化平台公司 | 用于安全工业控制系统的图像捕获设备 |
CN108469809A (zh) * | 2018-03-30 | 2018-08-31 | 南京理工大学 | 基于嵌入式计算机的plc数据采集、处理和上传方法 |
CN110116365A (zh) * | 2019-06-25 | 2019-08-13 | 吉姆西半导体科技(无锡)有限公司 | 化学机械研磨设备机台监控系统 |
CN210856336U (zh) * | 2019-11-01 | 2020-06-26 | 吉姆西半导体科技(无锡)有限公司 | 全自动化学镍钯金生产设备控制系统 |
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CN110629207A (zh) | 2019-12-31 |
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Address after: No.45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant after: GMC SEMITECH Co.,Ltd. Address before: No. 45, Yougu Enterprise Park, 58 Jinghong Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant before: GMC SEMITECH Co.,Ltd. |
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Address after: No. 1 Jingxiang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Applicant after: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd. Address before: No.45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant before: GMC SEMITECH Co.,Ltd. |
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