CN110611027A - 具有连续绝缘的电流传感器封装 - Google Patents

具有连续绝缘的电流传感器封装 Download PDF

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Publication number
CN110611027A
CN110611027A CN201910526268.1A CN201910526268A CN110611027A CN 110611027 A CN110611027 A CN 110611027A CN 201910526268 A CN201910526268 A CN 201910526268A CN 110611027 A CN110611027 A CN 110611027A
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China
Prior art keywords
sensing device
current path
seal
package
conductive trace
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CN201910526268.1A
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R·M·沙勒
V·施特鲁茨
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Infineon Technologies AG
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Infineon Technologies AG
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Abstract

一种电流传感器封装(100)包括电流路径(102)和感测装置(104)。所述感测装置与所述电流路径(102)间隔开，所述感测装置(104)被配置为感测由流经所述电流路径(102)的电流产生的磁场。此外，感测装置(104)包括传感器元件(106)。该感测装置(104)被电连接到导电迹线(112)。密封件(116)在所述电流路径(102)和所述感测装置(104)之间连续延伸。

Description

具有连续绝缘的电流传感器封装
技术领域
本发明涉及电流传感器封装以及制造电流传感器封装的方法。
背景技术
封装可以被表示为具有电连接的被包封电子芯片，电连接从密封件延伸出来并被安装到电子外围装置，例如印刷电路板上。
磁性电流传感器，即，感测待测量的电流产生的磁场的电流传感器提供了对电流的非接触式测量，并允许待测量电流和传感器的电分离。
封装成本是该行业的重要驱动力。与此相关的是性能、尺度和可靠性。不同的封装方案是多种多样的并且必须要解决特定应用的需求。
DE 112012003079T5公开了一种集成电路封装中封装的电流传感器，其包括磁场感测电路、电流导体和符合UL 60950-1标准下对加强绝缘的安全隔离要求的绝缘体。绝缘体被设置为具有至少两层薄片状材料的绝缘结构。设定绝缘结构的尺度，使得形成封装的模制塑料主体的塑料材料提供加强的绝缘。根据一个实施例，该绝缘结构具有两层绝缘带。每个绝缘带层都包括聚酰亚胺膜和粘合剂。该绝缘结构和模制塑料主体可以被构造成实现至少500VRMS额定工作电压。
发明内容
可能需要制造具有高可靠水平的电流传感器封装。
根据本文所公开主题的第一方面，提供了一种电流传感器封装。
根据实施例，该电流传感器封装包括电流路径；感测装置(例如，传感器芯片)，该感测装置与电流路径间隔开，并且该感测装置被配置为感测由流经电流路径的电流产生的磁场；该感测装置包括传感器元件，该感测装置电连接到导电迹线；该电流传感器封装还包括在电流路径和感测装置之间连续延伸的密封件。
根据本文所公开主题的第二方面，提供了一种制造电流传感器封装的方法。
根据实施例，该方法包括：提供电流路径；提供感测装置(例如，传感器芯片)，该感测装置被配置为感测由流经电流路径的电流产生的磁场；该感测装置包括传感器元件；该感测装置被设置为与电流路径间隔开；将该感测装置电连接到导电迹线；提供在电流路径和感测装置之间连续延伸的密封件。
根据第一方面的其它实施例，该电流传感器封装适于提供本文公开的实施例的一个或多个的功能和/或提供本文公开的实施例的一个或多个需要的功能，尤其是本文公开的第一和第二方面的实施例所需要的功能。
根据第二方面的其它实施例，该方法适于提供本文公开的实施例的一个或多个的功能和/或提供本文公开的实施例，尤其是本文公开的第一和第二方面的实施例的一个或多个所需的功能。
其它示范性实施例的描述
在下文中，描述了本文所公开主题的其它示范性实施例，在实施本文所公开主题的各方面时可以实现任意数量的其它示范性实施例及其任意组合。
在本申请的语境中，术语“连续延伸”可以特别表示没有任何内部界面(密封件之内的界面)的(例如，密封件的)延伸。
在本申请的语境中，术语“电流传感器封装”(或简称“封装”)可以尤其表示至少一个至少部分封装的具有至少一个外部电接触部的传感器芯片。
术语“感测装置”可以特别表示离散的传感器元件或包括传感器元件的传感器芯片。
术语“传感器芯片”可以特别表示，例如，在其表面部分中具有至少一个集成传感器元件(例如，霍尔传感器或磁阻传感器)的芯片。根据实施例，所述至少一个集成传感器元件位于传感器芯片的接触焊盘所在的同一主表面。传感器芯片可以是裸管芯或者可以已经被封装或包封。
在本申请的语境中，术语“密封件”可以特别表示围绕(例如，密闭地围绕)电流路径的基本电绝缘且优选导热的材料，以提供机械保护、电绝缘和对工作期间散热任选地提供贡献。这样的密封件可以是例如模制化合物。
在本申请的语境中，术语“载体”可以特别表示可以充当(至少一个)芯片的支撑件的导电结构。此外，载体还可以有助于部件之间的电连接和/或有助于电连接到例如，电流传感器封装的周边。换言之，载体可以实现机械支撑功能和/或电连接功能。
在本申请的语境中，术语“部件”可以特别表示可以安装和电连接到封装以为封装提供其功能的任何电子构件。具体而言，部件可以是诸如电感器(尤其是线圈)、电容器(例如陶瓷电容器)、欧姆电阻、电感、二极管、变压器、传感器等的无源部件。具体而言，可以将不能通过另一电信号控制电流的部件表示为无源部件。不过，部件也可以是有源部件，尤其可以是能够通过另一电信号控制电流的部件。有源部件可以是能够放大信号或产生功率增益的模拟电子滤波器、振荡器、晶体管或另一集成电路元件。
根据实施例，封装可以是例如表面安装器件(SMD)或通孔器件(THD)。
在实施例中，封装被配置用于100伏(V)和1000V之间范围的工作电压，例如，用于大约800V的工作电压。
术语“装置”可以特别表示任何适于包括封装的装置。具体而言，根据实施例，该装置是至少部分电驱动车辆(例如，电动车辆或混合车辆)的动力系。
根据实施例，该封装提供了高度可靠性并符合安全要求。对电流路径和传感器装置之间的电绝缘强度和长期可靠性的要求越高，电绝缘的内部界面就越重要。根据实施例，避免了电绝缘的内部界面，尤其是电流路径和感测装置和/或电流路径和导电迹线之间的内部界面。避免内部界面是有利的，因为与内部界面的分层路径一起可能会打开漏电甚至清除路径，这可能导致更大的泄露电流甚至击穿。在电绝缘中的断裂或狭缝中，可能会出现放电，这可能导致绝缘材料的长期劣化，在最坏情况下，导致击穿事件。
拯救绝缘表示隔离可靠性和电击保护(例如，由意外电压瞬变导致)中的最高置信度。这种质量级别被称为“基本”，或者，对于更高程度的耐受“强化”。根据后面的级别，例如必须要相对于寿命保护确保在产品寿命几乎结束时能够在瞬时电压下存活。
另一方面，有时难以利用廉价标准半导体封装技术，尤其是在中低电压区域中，实现高可靠性电绝缘。在此，可靠的单层绝缘可能是有利的。在最好的情况下，该绝缘来自封装概念和材料，由此大大降低了成本。具体地讲，额外的居间层可能提高封装成本，因为对于堆叠管芯方式就是这种情况，其中使用独立的绝缘板实现电绝缘目的。
本文公开的主题的实施例使用在电流传感器封装的电流路径和感测装置之间连续延伸的密封件中。连续延伸的密封件可以实现感测装置中电流路径的分层耐绝缘(delamination resistant insulation)。这继而实现封装中可靠的绝缘。
根据实施例，密封件还在电流路径和导电迹线(感测装置的接触路径电连接到其上)之间连续延伸。因此，在实施例中，密封件在一方面电流路径与另一方面传感器装置及其关联电连接之间连续延伸。
根据实施例，导电迹线是载体，具体而言是金属载体，更具体而言是引线框架。
根据另一实施例，感测装置被附接到载体。例如，在导电迹线为载体的情况下，在制造封装的方法中，定位感测装置可以包括将感测装置附接到导电迹线，提供密封件可以包括在一方面电流路径与另一方面感测装置和导电迹线之间连续提供密封件。
根据另一实施例，由至少一条键合引线和/或至少一个穿硅过孔(TSV)提供感测装置和导电迹线之间的互连。
根据实施例，感测装置具有主表面，主表面的部分被附接到载体，而主表面的剩余部分延伸超过载体并在电流路径上方延伸。根据实施例，感测装置的传感器位于感测装置之内以便被定位成邻近电流路径。根据实施例，载体具有附接部分，感测装置的主表面的该部分附接到其上。根据另一实施例，载体的附接部分是平坦的。
根据实施例，感测装置被附接到密封件。例如，制造封装的该方法可以包括在电流路径的至少一部分上方提供密封件，其中感测装置的定位包括将感测装置附接到密封件。
例如，根据实施例，封装包括由密封件形成的预模制部分。根据实施例，预模制部分在电流路径的至少一部分上方以及电流路径和导电迹线之间连续延伸。根据实施例，密封件在导电迹线的至少一部分上方延伸。根据实施例，制造电流传感器封装的方法包括绕电流路径(例如，绕电流路径的部分)和/或绕导电迹线(例如，绕导电迹线的部分)提供密封件，从而提供预模制部分。因此，在实施例中，预模制部分包括密封件以及电流路径和导电迹线中的至少一者。
根据实施例，感测装置被附接到预模制部分，例如，在预模制部分的附接表面中。根据实施例，密封件中具有凹陷，其中在凹陷的底部提供附接表面。通过这种方式，围绕底表面的凹陷壁提供了对感测装置的机械保护。根据另一实施例，凹陷覆盖有盖和/或填充有填充材料。盖/填充材料可以对感测装置和/或键合引线(如果存在的话)提供额外的保护。根据实施例，填充材料包括硅树脂、环氧树脂等。
根据实施例，感测装置通过管芯附接层附接到密封件(或在另一实施例中，附接到载体)。根据实施例，管芯附接层被施加到晶圆级的感测装置上。换言之，根据实施例，在通过例如锯切将晶圆分割成个体管芯之前，将管芯附接层施加到晶圆。典型地，为了进行锯切流程，管芯附接层被施加到晶圆，以便将晶圆附接到锯箔。根据实施例，管芯附接层是管芯附接膜(DAF)。由于管芯附接膜通常看起来对晶圆而言比对锯箔更好，所以从锯箔去除个体管芯会使管芯附接膜保留在管芯上。根据实施例，使用从分隔流程(锯切流程)获得的这种管芯附接膜将管芯(感测装置)附接到载体或密封件。根据另一实施例，管芯附接层包括导电粘合剂(例如，是一层导电粘合剂)。根据另一实施例，管芯附接层包括非导电粘合剂(例如，是一层非导电粘合剂)。根据另一实施例，管芯附接层可以包括焊料(或由焊料构成)，例如，软焊料、硬焊料、扩散焊料等。
在另一实施例中，感测装置被安装(具体而言是直接焊接、烧结或粘合)到载体或密封件的表面。换言之，焊料的材料、烧结材料和/或胶(尤其是导电胶)可以是一方面感测装置与另一方面载体之间仅有的材料。
根据实施例，电流路径由引线框架形成。
根据实施例，一开始(即，在早期制造阶段中)由单个引线框架元件提供电流路径和导电迹线，其包括电流路径、导电迹线以及连接电流路径和导电迹线的连接部分。在电流路径和导电迹线的至少部分上方提供密封件之后，可以去除连接部分，从而获得独立的，电隔离的电流路径和导电迹线。在其它实施例中，一开始可以使用任何其它单个载体(而不是引线框架)来通过单个载体提供电流路径和导电迹线。
在实施例中，载体是金属载体，具体而言是引线框架。在本申请的语境中，术语“引线框架”可以特别表示被配置为片状金属结构的载体的优选示例，该金属结构可以被冲压或构图，从而形成用于安装芯片的引线框架段，以及连接引线作为用于将芯片安装到引线框架上时封装到电子环境电连接的管芯段。在实施例中，该引线框架可以是金属板(尤其是由铜制成)，例如，可以通过压印或蚀刻对其进行构图。将载体形成为引线框架是有成本效率且机械和电气方面高度有利的配置，其中芯片(以及任选的其它部件)的低欧姆连接可以与引线框架的鲁棒支持能力组合。此外，引线框架可以有助于封装的导热，并可以消除在芯片(如果存在的话，还有部件)工作期间由于引线框架的金属(尤其是铜)材料的高热导率产生的热量。由于其简单，可以优选引线框架或任何其它金属载体。
在实施例中，至少一个传感器芯片包括由控制器电路、驱动电路和传感器元件构成的至少一个组。所有这些电路都可以集成到一个半导体芯片中，或独立集成在不同芯片中。例如，可以由芯片实现相应的电流传感器应用，其中这样的传感器芯片的集成电路元件可以包括至少一个传感器元件和半导体元件，例如晶体管(尤其是MOSFET、金属氧化物半导体场效应晶体管)、至少一个二极管等。
在实施例中，至少一个感测装置至少部分被嵌入独立的密封件(即，另一个密封件，可以在物理上与电流路径和感测装置之间连续延伸的密封件不同)。换言之，可以在封装中提供两个独立的密封件，并可以执行两次独立的包封流程。例如，可以通过第一密封件(例如，第一模制化合物)将感测装置与载体的一部分包封在一起。此外，可以在将感测装置附接到载体或第一密封件之后，将感测装置的一部分与独立的密封件包封在一起。
在实施例中，该封装包括至少部分地包封载体、感测装置、(第一)密封件和至少一个部件的公共或总体密封件。因此，还可以(尤其是通过进一步的模制流程，尤其是包覆成型流程)由又一密封件包作为鲁棒片来封装一方面载体、芯片和密封件与另一方面另一密封件和部件构成的组装后子组件，用于对封装的所有构成部分提供机械保护。
在实施例中，(第一)密封件和/或独立密封件和/或总体密封件的任意密封件包括模制化合物。因此，相应的密封件可以包括模制件，具体而言包括塑料模制件。例如，可以通过在上模制工具和下模制工具之间放置部件(或更一般地，至少一个部件)并在其间注射液体模制材料，提供对应的包封部件(尤其是感测装置、电流路径和导电迹线中的一个或多个)。在模制材料固化之后，完成了密封件(这里为模制体)的形成。如果需要，模制材料可以填充有改善其属性的颗粒。
根据实施例，在提供(例如，注入)密封件之前提供用于导电迹线的支撑元件。根据另一实施例，在提供(例如，注入)密封件之前提供用于电流路径的支撑元件。支撑元件可以防止或至少减小对应的被支撑元件(即，导电迹线或电流路径)由于提供(例如，注入)密封件而变形。
根据另一实施例，在支撑元件的至少一部分和对应的被支撑元件(即，导电迹线或电流路径)上方提供密封件之后，去除支撑元件。具体而言，根据实施例，在密封件(例如，模制材料)固化之后去除支撑元件。去除支撑元件在密封件中获得孔。根据实施例，密封件中的孔填充有电绝缘填充材料。
根据实施例，密封件包括孔，具体而言包括暴露导电迹线的孔。根据另一实施例，密封件包括暴露电流路径的孔。根据另一实施例，孔(即，至少一个孔)填充有电绝缘填充材料。
根据实施例，该封装还包括安装侧，该安装侧被配置为被安装到支撑件(例如，印刷电路板(PCB)或直接铜结合(DCB))。根据另一实施例，传感器元件背对安装侧和/或背对电流路径。根据另一实施例，定位所述感测装置包括背对所述安装侧和/或背对所述电流路径定位所述传感器元件。
根据另一个实施例，支撑件为印刷电路板(PCB)。尤其可以基于树脂(尤其是环氧树脂)制造支撑件，如果需要，与颗粒(例如，纤维，例如玻璃纤维)混合。用于PCB的适当电介质材料是例如预浸材料或FR4。用于PCB的适当导电材料是铜。
根据实施例，支撑件是包括陶瓷部分和金属部分的层状结构。例如，根据实施例，该支撑件是包括陶瓷板和结合到其一侧(或其相对两侧)的铜层的直接铜结合(DCB)。可以通过铜氧共晶体来提供铜层和陶瓷板之间的结合，铜氧共晶体在铜层和陶瓷板之间形成结合。可以通过在包含20-40ppm量的氧的氮氛围中将铜层和陶瓷板加热到受控温度来形成铜氧共晶体。可以将结合到陶瓷的铜层在结合到陶瓷板之前成形为图案(例如，可以对铜层进行预成形(例如，冲压))，或者可以进行结构化(例如，通过蚀刻)。根据实施例，在陶瓷板上形成铜层包括施加种子层并对种子层电镀。陶瓷材料可以包括例如氧化铝(Al2O3)、氮化铝(AlN)或氧化铍(BeO)中的一种或多种。铜层的厚度可以在200微米(μm)和300μm之间的范围中，并可以利用例如镍、镍合金、铝镍或铝来电镀铜层。
根据实施例，导电迹线包括第一端部，电流路径包括第二端部，其中第一和第二端部限定导电迹线和电流路径之间的距离(最小间距)。根据另一实施例，第一端部、第二端部和感测装置位于垂直于感测装置主表面的方向上不同层级。根据实施例，第一端部位于感测装置和第二端部之间的层级。根据另一实施例，第二端部位于感测装置和第一端部之间的层级。
根据另一实施例，第一端部位于感测装置下方的层级，例如，感测装置和电流路径之间的层级。在本申请中，术语“层级”可以具体表示距封装底表面的距离。根据另一实施例，第一端部位于电流路径下方的层级。
根据实施例，导电迹线包括与感测装置隔开的升高部分。例如，第一端部可以位于升高部分的层级下方的层级。这样允许在第一端部位于密封件之内时从密封件暴露出升高部分。这可以允许在密封件中牢固地附接导电迹线。
根据实施例，由相应引线框架部分的三维形状决定电流路径在导电迹线中的相对位置。可以通过弯折引线框架来获得相应引线框架的形状。
根据实施例，封装还包括电连接导电迹线和接触焊盘的键合引线。因此，在制造封装的方法中，将接触焊盘电连接到导电迹线可以包括在接触焊盘和导电迹线之间提供键合引线。
键合引线可以具有圆丝的形状或平带的形状，从而键合引线也可以被构造为结合带。通过一个或多个键合引线建立连接是一个简单的流程，可以实现由铜和/或铝制造的键合引线。
根据导电迹线相对于接触焊盘的几何形状，其它电连接也是可能的。
根据实施例，电流路径至少部分地被密封件围绕。
根据另一实施例，电流路径包括形成封装外表面一部分的暴露部分。换言之，根据实施例，形成电流路径的引线框架可以被成形为暴露焊盘。
根据实施例，感测装置包括至少一个霍尔传感器，具体而言至少两个霍尔传感器。
根据另一个实施例，感测装置包括至少一个磁致电阻传感器，具体而言至少两个磁致电阻传感器。
两个或更多传感器(霍尔传感器和/或磁致电阻传感器)提供如下优点：可以组合其信号，以便提供差分信号，外部磁场(与待测量电流无关且不是希望有的)的影响已经从差分信号去除或至少减小。
根据实施例，电流路径被电连接到第一组接触管脚；导电迹线被电连接到第二组接触管脚的接触管脚；第一组接触管脚和第二组接触管脚位于封装的相对侧上。接触管脚这样的几何形状可以有利于电流路径的电绝缘以及电连接到感测装置。
电流路径可以具有适于提供适当电流密度并因此为传感器装置提供适当磁场的任何几何形状。
根据实施例，电流路径包括缩小截面的测量部分；该测量部分在(电流路径的)两个间隔开的侧部之间延伸。根据实施例，测量部分是电流路径的直的部分。这样可以有利于提供具有限定尺度的测量部分。
根据实施例，侧部具有比直的部分的热质量更大的热质量，尤其是大至少两倍，例如，至少四倍或至少六倍。根据实施例，每个侧部都电连接到一个或多个引线(在实施例中，引线也由引线框架形成，测量部分和侧部是由引线框架形成的)。侧部相对较大的热质量改进了从测量部分去除热能，这又允许更高的电流密度，因此允许电流传感器封装更好的敏感度。
根据实施例，侧部之间的测量部分的长度小于垂直于长度的测量部分的宽度。换言之，测量部分的长度对应于被测量部分桥接的侧部的距离。例如，测量部分的长度与其宽度的比率在0.5和0.95之间的范围中，例如为0.75。
根据实施例，侧部中的至少一个，例如，每个侧部包括通孔。由于侧部较大的表面积，这样的通孔可以减少或防止密封件中孔隙的形成和/或可以改进侧部和密封件组合的结构完整性。
结合附图考虑以下描述和所附权利要求，本发明的以上和其它目的、特征和优点将变得显而易见。
附图说明
附图被包括在说明书中以提供对说明书示范性实施例的进一步理解并构成说明书的一部分，其示出了本文所公开主题的示范性实施例。
在附图中：
图1示出了根据本文所公开主题的实施例的电流传感器封装的截面图。
图2示出了根据本文所公开主题的实施例的另一电流传感器封装的截面图。
图3示出了根据本文公开的主题的实施例，用于图1的电流传感器封装的一些隔离方面。
图4示出了根据本文所公开主题的实施例的另一电流传感器封装的截面图。
图5到图10示出了根据本文所公开主题的实施例的电流路径(例如，电流轨道)的不同几何形状。
图11示出了图6的电流路径示范性第二几何形状并示出了两个霍尔传感器的可能位置。
图12示出了图6的电流路径示范性第二几何形状并示出了两个磁致电阻传感器的可能位置。
图13示出了根据本文所公开主题的实施例的引线框架。
具体实施方式
附图中的图示为示意性的且不成比例。在附图中，类似元件或功能类似的元件由相同的附图标记或彼此仅在第一位不同的参考标记表示。为了避免不必要的重复，在后续附图中未重复此类类似元件的描述。
图1示出了根据本文所公开主题的实施例的电流传感器封装100的截面图。
根据实施例，封装100包括电流路径102，例如，电流轨道。根据另一实施例，封装100包括感测装置104。根据实施例，传感器装置104是包括至少一个传感器元件，例如，两个传感器元件106、两个霍尔传感器或两个磁致电阻传感器的传感器芯片。根据实施例，感测装置104包括第一主表面105，其中至少一个传感器元件106位于第一主表面105中或靠近第一主表面105。根据实施例，第一主表面105背对电流路径102。换言之，根据实施例，至少一个传感器元件106背对电流路径102。
根据实施例，感测装置104与电流路径102间隔开距离108。感测装置104包括背对电流路径102的接触焊盘110，例如，如图1所示。接触焊盘110由键合引线114电连接到导电迹线112。根据实施例，导电迹线112是传感器管脚，例如，如图1所示。
根据另一实施例，该封装100包括连续延伸而在电流路径102和感测装置104之间没有内部界面的密封件116。根据实施例，密封件116、电流路径102和导电迹线112形成预模制部分的部分，在单独的制造步骤中(例如，在固化密封件116之后)可以将感测装置附接到该部分。
根据实施例，在电流路径102和感测装置104之间延伸的密封件116将电流路径102处的高电势与导电迹线112处的低电压电势电隔离。
根据实施例，导电迹线112包括第一端部118，电流路径102包括第二端部119，端部限定导电迹线112和电流路径102之间的距离120。根据实施例，第一端部118位于感测装置104下方的层级122处。换言之，第一端部118与感测装置104的下主表面124隔开。
根据实施例，电流路径102的第二端部119位于感测装置104和第一端部118之间的层级126处。换言之，电流路径102的第二端部119与下主表面124间隔一距离108，第一端部118与下主表面124间隔比距离108更大的另一距离128。
根据实施例，导电迹线112包括与感测装置104隔开的升高部分130。根据实施例，键合引线114被键合到接触区域132中的升高部分130处的导电迹线112。根据实施例，相对于接触区域132中的密封件116暴露升高部分130。
根据实施例，电流路径102被连接到从封装100延伸出去的第一组接触管脚134。根据另一实施例，导电迹线112被电连接到从封装100延伸出去的第二组接触管脚136的接触管脚。根据实施例，第一组接触管脚134和第二组接触管脚136位于封装100的相对侧上，例如，如图1所示。
根据实施例，密封件116包括暴露导电迹线112的孔138。根据实施例，孔138从支撑管脚(图1中未示出)升起，支撑管脚在形成密封件116期间，尤其是在形成电流路径102和导电迹线112之间的密封件116期间支撑导电迹线112。根据实施例，孔138填充有诸如硅树脂、环氧树脂等的电绝缘填充材料139。根据实施例，孔138所处的位置使得密封件116和填充材料139之间的界面140不在电流路径102和感测装置104之间或电流路径102和导电迹线112之间。
根据另一实施例，密封件116包括暴露电流路径102的孔142。根据实施例，孔142从支撑管脚(图1中未示出)升起，支撑管脚在形成密封件116期间，尤其是在形成电流路径102和感测装置104之间的密封件116期间支撑电流路径102。根据实施例，孔142填充有诸如硅树脂、环氧树脂等的电绝缘填充材料144。根据实施例，孔142所处的位置使得密封件116和填充材料139之间的界面146不在电流路径102和感测装置104之间或电流路径102和导电迹线112之间。
根据实施例，例如，利用管芯附接层150(例如管芯附接膜)，将感测装置104附接到密封件116的附接表面148。根据实施例，在密封件中成形有凹陷152，感测装置104和键合引线114位于凹陷中。根据实施例，凹陷152填充有诸如环氧树脂、硅树脂等的绝缘填充材料154。根据实施例，可以提供绝缘填充材料154，用于保护感测装置104和/或键合引线114。根据实施例，感测装置104至少部分地由密封件116(模制主体)包围。
根据实施例，提供盖156以密封凹陷152。
此外，图1示出了根据本文所公开主题的实施例的一些隔离方面。具体而言，图1进一步具体示出了高电压侧160(尤其包括电流路径102)和电源电压侧162(低压侧，尤其包括导电迹线112、键合引线114和感测装置104)之间的距离108、120。图1中进一步示出了(尤其是电流路径102的)高压侧160和(尤其是导电迹线112的)低压侧162的暴露部分之间的漏电/净距离164。因此，根据实施例，可能会沿电流传感器封装的外表面而不沿电流传感器封装之内的界面(例如，密封件(116)之内的界面，如此一来避免了这样的界面(只要可能/适当))发生漏电。在实施例中，至少避免了电流路径102和导电迹线112之间以及电流路径102和感测装置104之间的界面(即，在这些区域中，密封件116没有界面)。
根据另一实施例，电流传感器封装300包括安装侧163，安装侧被配置为安装到支撑件，例如，印刷电路板、直接铜焊接等。根据实施例，传感器元件106面向主表面105/背对安装侧163。
图2示出了根据本文所公开主题的实施例另一电流传感器封装200的截面图。
在图2的描述中，避免重复与图1的两个元件相似或相同的元件的描述。对于图2而言，结合图1提供的此类元件的描述同样有效。
根据实施例，导电迹线112是载体或载体的部分，尤其是引线框架的引线指。根据另一实施例，感测装置104，例如通过管芯附接层150至少部分地被附接到导电迹线112。具体而言，根据实施例，感测装置104延伸超出导电迹线112，从而有位于电流路径102上方的自由端151(与电流路径102间隔)。根据另一实施例(图2中未示出)，电流路径102被暴露并形成封装200表面的一部分。
取代电连接接触焊盘110和导电迹线112的键合引线114，可以提供穿过感测装置104延伸的穿硅过孔(图2中未示出)。
根据实施例，在定位电流路径102、感测装置104和导电迹线118之后且在将感测装置104与导电迹线118电连接之后，提供密封件116。根据实施例，密封件116是模制主体，如图2所示。
根据另一实施例，导电迹线112的第一端部118位于感测装置104和第二端部119之间的层级，例如，如图2所示。
图3示出了根据本文所公开主题的实施例另一电流传感器封装300的截面图。
电流传感器封装300类似于图2的电流传感器封装200，除了第一侧相对于感测装置104的位置。具体而言，根据实施例，导电迹线112包括两个相反的第一侧和第二侧158、159，其中感测装置104附接到导电迹线112的第一侧158，键合引线114附接到导电迹线112的第二侧159，例如，如图3所示。要指出的是，与此实施例相反，在图2的电流传感器封装200中，感测装置104和键合引线114都附接到导电迹线112的同一侧。
根据实施例，导电迹线112的端部118位于电流路径102的端部119和感测装置104之间的层级，例如，如图3所示。
根据另一实施例，密封件116没有任何暴露导电迹线112或电流路径102的孔。换言之，根据实施例，密封件116不包括参照图1所描述的孔138、142。
根据实施例，感测装置104的第一主表面105(或换言之，至少一个传感器元件106)面向电流路径102。根据另一实施例，至少一个传感器元件106背对电流传感器封装300的安装侧163。安装侧163被配置成安装在支撑件165上。
图4示出了根据本文所公开主题的实施例另一电流传感器封装400的截面图。
在图4的描述中，避免重复与图1的元件相似或相同的元件的描述。对于图4而言，结合图1提供的此类元件的描述同样有效。
根据实施例，电流路径102包括形成封装400外表面168的一部分的暴露部分166。
图5到图10示出了根据本文所公开主题的实施例的电流路径102(电流轨道)的不同几何形状。
图5示出了电流路径102的示范性第一几何形状170。
根据实施例，电流路径102是电流轨道。根据实施例，电流路径102包括测量部分172，其中该测量部分具有缩小的横截面。换言之，如果电流路径的厚度大致恒定，则可以通过电流路径的不同横向尺度估计电流路径的不同位置处的不同截面。根据另一实施例，电流路径102包括两个间隔的侧部174。根据另一实施例，测量部分172在两个侧部174之间延伸。
根据实施例，测量部分172是电流路径102的直的部分。根据另一实施例，侧部174具有比直的部分的热质量更大的热质量，尤其是大至少两倍，例如，如图5所示。根据实施例，每个侧部174都连接到一条或多条引线176，例如，如图5所示的一条引线176。因此，在实施例中，每个侧部174都由测量部分172和引线176界定。根据实施例，侧部174之间的测量部分172的长度178小于垂直于长度178的测量部分的宽度180。例如，根据实施例，该长度178为大约300μm，该宽度180为大约400μm，电流路径102的整个长度179为4.56mm。
图6示出了电流路径102的示范性第二几何形状270。
根据实施例，每个侧部174都包括通孔182，例如，如图6所示。根据实施例，通孔182具有三角形形状，如图6所示。
图7示出了电流路径102的示范性第三几何形状370。
第三几何形状370类似于图5的第一几何形状170。根据实施例，每个侧部都连接到两条引线176，例如，如图7所示。
图8示出了电流路径102的示范性第四几何形状470。
第四几何形状470类似于第一几何形状170和第三几何形状370。根据实施例，每个侧部174都电连接到一条引线176，引线176具有类似于侧部174的最大宽度的宽度，例如，如图8所示。例如，根据实施例，引线176的最大宽度在侧部174最大宽度的大约80％到120％的范围内。此外，根据实施例，通孔184形成于引线176中。
图9示出了电流路径102的示范性第五几何形状570。
第五几何形状570类似于图7的第三几何形状370。根据实施例，通孔182形成于侧部174中，例如，如图9所示。根据实施例，通孔具有圆形的形状，例如，如图9所示。
图10示出了电流路径102的示范性第六几何形状670。
根据实施例，侧部174具有大致矩形的形状。
总之，关于图5到图10，根据实施例，侧部的形状在从引线176到测量部分172的方向上逐渐变细，并具有大致三角形形状，例如，如图5、7、8和9所示。根据实施例，每个侧部在从引线176到测量部分172的方向上具有截面增大的第一部分以及截面增大的第二部分，例如，如图5、6、7、8和9所示。根据另一个实施例，电流轨道102的相对侧部174之间的距离从相对引线176的第一距离186(参见图10)变为测量部分172的长度178，尤其是以阶跃方式变化，例如，如图5到图10所示。
图11示出了图6的电流路径102的示范性第二几何形状270并示出了两个霍尔传感器188的可能位置。
根据实施例，第一霍尔传感器188位于邻近于(例如，在旁边)测量部分172的两个侧部174之间。根据实施例，第二霍尔传感器188与第一霍尔传感器188相对，测量部分172在两个传感器188之间延伸，例如，如图11所示。
图12示出了图6的电流路径102的示范性第二几何形状270并示出了两个磁致电阻传感器190的可能位置。
根据实施例，电流路径102包括两个侧部174之间的狭缝192。根据实施例，第一磁致电阻传感器190位于狭缝192和两个侧部174之一的开口182之间，第二磁致电阻传感器190位于狭缝192和两个侧部174中另一个的开口182之间，例如，如图12所示。
图13示出了根据本文所公开主题的实施例的引线框架194的透视图。
根据实施例，引线框架194包括电流路径102、四条导电迹线112以及连接电流路径102和导电迹线112的连接部分196。在根据本文公开主题的实施例，基于引线框架194制造电流传感器封装100之后，将第一组接触管脚134(即，电流路径102的引线176)和第二组接触管脚136(还比较图1)与连接部分196分隔开。
应当指出，术语“包括”不排除其它元件或特征，“一”或“一个”不排除多个。而且，结合不同实施例描述的元件可以被组合。还应该指出的是，附图标记不应被理解为限制权利要求的范围。此外，本申请的范围并非意在限于说明书中描述的过程、机器、制造以及物质组成、手段、方法和步骤的特定实施例。因此，所附权利要求意在在其范围之内包括这样的过程、机器、制造、物质组成、手段、方法或步骤。

Claims (24)

1.一种电流传感器封装(100，200，300)，包括：
·电流路径(102)；
·感测装置(104)，具体而言是传感器芯片，所述感测装置与所述电流路径(102)间隔开并且所述感测装置(104)被配置为感测由流经所述电流路径(102)的电流产生的磁场；
·所述感测装置(104)包括传感器元件，所述感测装置(104)电连接到导电迹线(112)；
·在所述电流路径(102)和所述感测装置(104)之间连续延伸的密封件(116)。
2.根据权利要求1所述封装，所述密封件(116)在所述电流路径(102)和所述导电迹线(112)之间连续延伸。
3.根据权利要求2所述的封装，所述导电迹线(112)是载体，具体而言是引线框架(194)，所述感测装置(104)附接到所述载体。
4.根据权利要求1到2中的任一项所述的封装，所述感测装置(104)附接到所述密封件(116)。
5.根据前述权利要求中的任一项所述的封装，所述电流路径(102)是由金属载体，尤其是引线框架(194)形成的。
6.根据权利要求2到5中的任一项所述的封装，所述密封件包括暴露所述导电迹线(112)的孔(138)，所述孔(138)填充有电绝缘填充材料(139)。
7.根据前述权利要求中的任一项所述的封装，
所述导电迹线(112)包括第一端部(118)，所述电流路径(102)包括第二端部(119)，其中所述第一端部(118)和所述第二端部(119)限定所述导电迹线(112)和所述电流路径(102)之间的距离(120)，其中，所述第一端部(118)、所述第二端部(119)和所述感测装置(104)在垂直于所述感测装置的主表面的方向上位于不同层级；
具体而言，其中，所述第一端部(118)位于所述感测装置(104)和所述第二端部(119)之间的层级，或者其中，所述第二端部位于所述感测装置和所述第一端部(118)之间的层级。
8.根据权利要求7所述的封装，所述导电迹线(112)包括与所述感测装置(104)间隔开的升高部分(130)。
9.根据前述权利要求中的任一项所述的封装，所述感测装置还包括接触焊盘，所述封装还包括电连接所述导电迹线(112)和所述接触焊盘(110)的键合引线(114)。
10.根据前述权利要求中的任一项所述的封装，其中，所述电流路径(102)包括形成所述封装(300)的外表面(168)的一部分的暴露部分(166)。
11.根据前述权利要求中的任一项所述的封装，其中，所述感测装置包括至少一个另外的传感器元件。
12.根据前述权利要求中的任一项所述的封装，其中，所述感测装置的每个所述传感器元件是霍尔传感器(188)和磁致电阻传感器(190)之一，具体而言，其中，所述磁致电阻传感器是各向异性磁致电阻传感器、巨磁致电阻传感器、超大磁致电阻传感器或隧道磁致电阻传感器。
13.根据前述权利要求中的任一项所述的封装，
所述电流路径电连接到第一组接触管脚(134)；
所述导电迹线电连接到第二组接触管脚(136)中的接触管脚；并且
所述第一组接触管脚(134)和所述第二组接触管脚(136)位于所述封装的相对侧上。
14.根据前述权利要求中的任一项所述的封装，
所述电流路径(102)包括减小截面的测量部分(172)；
所述测量部分在两个间隔开的侧部(174)之间延伸；
具体而言，其中，所述测量部分是所述电流路径(102)的直的部分；
具体而言，其中，所述侧部(174)具有比所述直的部分的热质量更大的热质量，尤其是大至少两倍。
15.根据权利要求14所述的封装，其中，所述侧部(174)之间的所述测量部分(172)的长度(178)小于垂直于所述长度(178)的所述测量部分(172)的宽度(180)。
16.根据权利要求14或15所述的封装，其中，每个侧部(174)包括通孔(182)。
17.根据前述权利要求中的任一项所述的封装，其中，所述密封件(116)、所述导电迹线(112)和所述电流路径(102)形成预模制部分的一部分，具体而言，其中，所述预模制部分包括附接表面，所述感测装置(104)附接到所述附接表面。
18.根据前述权利要求中的任一项所述的封装，
还包括被配置成安装到支撑件(165)的安装侧(163)；
所述传感器元件(106)背对所述安装侧(163)和/或背对所述电流路径(102)。
19.一种制造电流传感器封装的方法，所述方法包括：
·提供电流路径(102)；
·提供感测装置(104)，具体而言是传感器芯片，所述感测装置被配置为感测由流经所述电流路径(102)的电流产生的磁场并且包括传感器元件(106)；
·将所述感测装置(104)定位成与所述电流路径(102)间隔开；
·将所述感测装置(104)电连接到导电迹线(112)；
·提供在所述电流路径(102)和所述感测装置(104)之间连续延伸的密封件(116)。
20.根据权利要求19所述的方法，还包括：
·其中，所述提供所述密封件(116)包括在所述电流路径(102)的至少一部分上方提供所述密封件；
·其中，所述定位所述感测装置(104)包括将所述感测装置(104)附接到所述密封件(116)。
21.根据权利要求19所述的方法，
·其中，所述导电迹线(112)是载体，具体而言是引线框架(194)；并且
·其中，所述定位所述感测装置(104)包括将所述感测装置(104)附接到所述导电迹线(112)；
·其中，所述提供所述密封件(116)包括在一方面所述电流路径(102)与另一方面所述感测装置(104)和所述导电迹线(112)之间连续提供所述密封件。
22.根据权利要求19到21中的任一项所述的方法，其中，所述感测装置包括接触焊盘(110)；所述将感测装置电连接到所述导电迹线(112)包括在所述接触焊盘(110)和所述导电迹线(112)之间提供键合引线(140)和/或穿硅过孔。
23.根据权利要求19到21中的任一项所述的方法，还包括：
·在提供所述密封件(116)之前提供用于所述导电迹线的支撑元件；
·在绕所述导电迹线(112)和所述支撑元件提供所述密封件(116)之后，去除所述支撑元件，被去除的支撑元件在所述密封件(116)中留下孔(138)；
·利用电绝缘填充材料(139)填充所述密封件(116)中的所述孔(138)。
24.根据权利要求19到23中的任一项所述的方法，其中，所述电流传感器封装还包括被配置成安装到支撑件(165)的安装侧(163)；
其中，定位所述感测装置(104)包括将所述传感器元件(106)定位成背对所述安装侧(163)和/或背对所述电流路径(102)。
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