CN110608825A - Flexible pressure sensor based on polyimide substrate microstructure and its preparation method - Google Patents
Flexible pressure sensor based on polyimide substrate microstructure and its preparation method Download PDFInfo
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
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Abstract
本发明公开了一种基于聚酰亚胺基底微结构的柔性压力传感器及其制备方法。本发明的柔性压力传感器包括下层柔性基底、力敏结构层和上层柔性封装层；下层柔性基底为聚酰亚胺薄膜，其上表面具有凸起的微结构阵列；力敏结构层与下层柔性基底上表面紧密贴合，其从下至上包括下部电极层、柔性压阻材料层和上部电极层，柔性压阻材料层是具有压阻特性的碳基纳米颗粒/聚合物压阻材料；上层柔性封装层与力敏结构层上表面紧密贴合，用以保护传感器和防水。本发明通过采用自下而上的微纳制造技术制备基于聚酰亚胺基底微结构的柔性压力传感器，具有灵敏度高、超薄超轻、工艺简单、易于阵列化制造和应用性强的优点。
The invention discloses a flexible pressure sensor based on a polyimide substrate microstructure and a preparation method thereof. The flexible pressure sensor of the present invention comprises a lower flexible substrate, a force-sensitive structural layer and an upper flexible encapsulation layer; the lower flexible substrate is a polyimide film, and its upper surface has a raised microstructure array; the force-sensitive structural layer and the lower flexible substrate The upper surface is tightly bonded, which includes a lower electrode layer, a flexible piezoresistive material layer, and an upper electrode layer from bottom to top. The flexible piezoresistive material layer is a carbon-based nanoparticle/polymer piezoresistive material with piezoresistive properties; the upper flexible package The layer is closely attached to the upper surface of the force-sensitive structure layer to protect the sensor and waterproof. The invention prepares a flexible pressure sensor based on a polyimide substrate microstructure by adopting bottom-up micro-nano manufacturing technology, and has the advantages of high sensitivity, ultra-thin and ultra-light, simple process, easy array manufacturing and strong applicability.
Description
技术领域technical field
本发明属于压力测量技术领域，尤其是涉及一种基于聚酰亚胺基底微结构的柔性压力传感器及其制备方法。The invention belongs to the technical field of pressure measurement, and in particular relates to a flexible pressure sensor based on a polyimide substrate microstructure and a preparation method thereof.
背景技术Background technique
皮肤在人类的生活中发挥出巨大的作用，在皮肤的帮助下很多工作才可以开展实施。但对于一些已经丧失部分皮肤感知功能的截肢、烧伤患者，一些高危精细的机械臂工作场合，有其他健康指标信号监测的患者，需要实时反馈出的外界信号及人身健康状况，柔性压力传感器因此产生并得到发展。The skin plays a huge role in human life, and many tasks can be carried out with the help of the skin. However, for some amputee and burn patients who have lost part of the skin perception function, some high-risk and fine robotic arm workplaces, and patients with other health index signal monitoring, they need real-time feedback of external signals and personal health conditions, so the flexible pressure sensor is produced. and get developed.
柔性压阻式压力传感器可以轻易得将压缩、弯曲和扭转等诸多形变转化为电信号，同时压阻式传感器较之压电式、电容式应变传感器，测试简便，干扰信号小，在对外界的压力感知方面不亚于人类皮肤。Flexible piezoresistive pressure sensors can easily convert many deformations such as compression, bending and torsion into electrical signals. Compared with piezoelectric and capacitive strain sensors, piezoresistive sensors are easier to test and have less interference signals. Pressure perception is no less than that of human skin.
近年来，国内外多家研究机构为了追求柔性压阻式压力传感器的高拉伸率和高灵敏度，将碳基导电颗粒与柔性聚合物相互混合制备出新型柔性压阻材料。常见的柔性聚合物例如聚酰亚胺（PI）、聚氨酯（PU）、聚偏氟乙烯（PVDF）、苯乙烯系热塑性弹性体（SBS）和聚二甲基硅氧烷（PDMS）等，赋予传感器可拉伸性、可弯曲性和透明性等特殊属性；碳基导电颗粒例如石墨烯、碳纳米管、石墨纳米片等赋予传感器电学性能。聚合物和导电颗粒相互混合并配合特殊的结构，可容易地满足压力传感器需求。但是大多数基于碳基导电颗粒掺杂聚合物的压力传感器存在尺寸大、工艺与结构复杂和应用性差的缺点。In recent years, many research institutions at home and abroad have mixed carbon-based conductive particles and flexible polymers to prepare new flexible piezoresistive materials in order to pursue high stretchability and high sensitivity of flexible piezoresistive pressure sensors. Common flexible polymers such as polyimide (PI), polyurethane (PU), polyvinylidene fluoride (PVDF), styrene-based thermoplastic elastomer (SBS) and polydimethylsiloxane (PDMS), etc., endow The sensor has special properties such as stretchability, bendability, and transparency; carbon-based conductive particles such as graphene, carbon nanotubes, graphite nanosheets, etc. endow the sensor with electrical properties. Polymers and conductive particles are mixed with each other and matched with special structures, which can easily meet the needs of pressure sensors. However, most pressure sensors based on carbon-based conductive particles doped with polymers have the disadvantages of large size, complex process and structure, and poor applicability.
发明内容Contents of the invention
本发明旨在提供一种基于聚酰亚胺基底微结构的柔性压力传感器及其制备方法。本发明通过采用自下而上的微纳制造技术制备基于聚酰亚胺基底微结构的柔性压力传感器，具有灵敏度高、超薄超轻、工艺简单、易于阵列化制造和应用性强的优点。本发明的技术方案具体介绍如下。The invention aims to provide a flexible pressure sensor based on polyimide substrate microstructure and its preparation method. The invention prepares a flexible pressure sensor based on a polyimide substrate microstructure by adopting bottom-up micro-nano manufacturing technology, and has the advantages of high sensitivity, ultra-thin and ultra-light, simple process, easy array manufacturing and strong applicability. The technical solution of the present invention is specifically introduced as follows.
本发明提供一种基于聚酰亚胺基底微结构的柔性压力传感器，其整体为薄膜结构，包括从下至上紧密贴合的下层柔性基底、力敏结构层和上层柔性封装层；所述下层柔性基底为聚酰亚胺薄膜，聚酰亚胺薄膜的上表面具有凸起的微结构阵列；所述力敏结构层从下至上包括下部电极层、柔性压阻材料层和上部电极层，柔性压阻材料层为一种或几种碳基纳米颗粒掺杂一种聚合物的压阻材料，其通过旋涂固化碳基纳米颗粒/聚合物混合溶液制备而成。The invention provides a flexible pressure sensor based on the microstructure of polyimide substrate, which is a film structure as a whole, including a lower flexible substrate, a force-sensitive structural layer and an upper flexible packaging layer that are closely fitted from bottom to top; the lower flexible The substrate is a polyimide film, and the upper surface of the polyimide film has a raised microstructure array; the force-sensitive structure layer includes a lower electrode layer, a flexible piezoresistive material layer and an upper electrode layer from bottom to top, and the flexible piezoresistive layer The resistive material layer is a piezoresistive material in which one or more carbon-based nanoparticles is doped with a polymer, which is prepared by spin-coating and solidifying a carbon-based nanoparticle/polymer mixed solution.
进一步的，微结构阵列通过光刻和等离子体刻蚀工艺制备而成，微结构之间的间距为10~500 μm，微结构的横截面为矩形、梯形或穹顶形。 Further, the microstructure array is prepared by photolithography and plasma etching processes, the distance between the microstructures is 10-500 μm, and the cross-section of the microstructures is rectangular, trapezoidal or dome-shaped.
进一步的，下部电极层为金属薄膜，其材料为导电金属，通过溅射或蒸镀技术图案化制造于下层柔性基底的上表面上，与下层柔性基底紧密贴合，下部电极层的厚度为100 n~1000 nm。Further, the lower electrode layer is a metal thin film, and its material is conductive metal, which is patterned and manufactured on the upper surface of the lower flexible substrate by sputtering or evaporation technology, and is closely attached to the lower flexible substrate. The thickness of the lower electrode layer is 100 n~1000nm.
进一步的，柔性压阻材料层中的碳基纳米颗粒为石墨烯、碳纳米管或石墨纳米片，聚合物为聚酰亚胺PI、聚氨酯PU、聚偏氟乙烯PVDF、苯乙烯系热塑性弹性体SBS或聚二甲基硅氧烷PDMS。在压力的作用下，柔性压阻材料层与下层柔性基底上微结构的接触区域，会产生应力集中现象，可以增大柔性压阻材料层的变形，进一步提高压力传感器的灵敏度。Further, the carbon-based nanoparticles in the flexible piezoresistive material layer are graphene, carbon nanotubes or graphite nanosheets, and the polymers are polyimide PI, polyurethane PU, polyvinylidene fluoride PVDF, styrene-based thermoplastic elastomers SBS or polydimethylsiloxane PDMS. Under the action of pressure, stress concentration occurs in the contact area between the flexible piezoresistive material layer and the microstructure on the lower flexible substrate, which can increase the deformation of the flexible piezoresistive material layer and further improve the sensitivity of the pressure sensor.
进一步的，所述上部电极层为金属薄膜，其材料为导电金属，通过溅射或蒸镀技术图案化制造于柔性压阻材料层的上表面上，上部电极层的厚度为100 ~1000 nm；上部电极层与柔性压阻材料层紧密贴合，上下部电极层对应处形成力敏单元，用于测量所述碳基纳米颗粒/聚合物压阻层上下表面间的电阻值及其变化，根据电阻值及其变化可以检测接触压力大小。Further, the upper electrode layer is a metal thin film, and its material is conductive metal, which is patterned and manufactured on the upper surface of the flexible piezoresistive material layer by sputtering or evaporation technology, and the thickness of the upper electrode layer is 100-1000 nm; The upper electrode layer is closely attached to the flexible piezoresistive material layer, and a force-sensitive unit is formed at the corresponding position of the upper and lower electrode layers, which is used to measure the resistance value and its change between the upper and lower surfaces of the carbon-based nanoparticle/polymer piezoresistive layer, according to The resistance value and its change can detect the contact pressure.
进一步的，所述上层柔性封装层由柔性聚合物经过浇筑、旋涂固化或蒸镀等工艺制备在力敏结构层上，柔性聚合物为聚酰亚胺（PI）或聚对二甲苯(Parylene)， 厚度为1~20μm；上层柔性封装层作为力敏结构层的力传递层，同时用以保护传感器和防水。上层柔性封装层受到外界接触压力作用时，会将压力传递至柔性压阻材料层，柔性压阻材料层会发生挤压变形，并且变形幅度会随着外界压力的增加而增大；当柔性压阻材料层发生挤压变形时，上部电极层和下部电极层之间的电阻发生变化，从而反应外界接触压力大小。Further, the upper flexible encapsulation layer is prepared on the force-sensitive structural layer by casting, spin-coating, curing, or vapor deposition of a flexible polymer. The flexible polymer is polyimide (PI) or parylene (Parylene ), with a thickness of 1-20 μm; the upper flexible packaging layer is used as the force transmission layer of the force-sensitive structural layer, and is used to protect the sensor and waterproof at the same time. When the upper flexible packaging layer is subjected to external contact pressure, it will transmit the pressure to the flexible piezoresistive material layer, and the flexible piezoresistive material layer will be squeezed and deformed, and the deformation amplitude will increase with the increase of external pressure; when the flexible piezoresistive material layer When the resistance material layer is squeezed and deformed, the resistance between the upper electrode layer and the lower electrode layer changes, thereby reflecting the external contact pressure.
本发明还提供一种上述的柔性压力传感器的制备方法，具体步骤如下：The present invention also provides a method for preparing the above-mentioned flexible pressure sensor, the specific steps are as follows:
（1）旋涂聚酰亚胺溶液于硅晶圆上，固化后得到聚酰亚胺薄膜；(1) Spin-coat the polyimide solution on the silicon wafer, and obtain a polyimide film after curing;
（2）在聚酰亚胺薄膜的上表面旋涂光刻胶，经过光刻工艺后可形成光刻胶微结构阵列；以光刻胶微结构阵列作为掩膜，使用等离子体刻蚀工艺对聚酰亚胺薄膜上表面进行等离子体刻蚀加工，刻蚀气体使用O2和SF6，刻蚀结束后使用除胶液去除聚酰亚胺表面上的光刻胶，再丙酮清洗干净，制备成压力传感器的下层柔性基底；(2) The photoresist is spin-coated on the upper surface of the polyimide film, and the photoresist microstructure array can be formed after the photolithography process; the photoresist microstructure array is used as a mask, and the plasma etching process is used to form the photoresist microstructure array. The upper surface of the polyimide film is processed by plasma etching. The etching gas uses O 2 and SF 6 . Form the lower flexible substrate of the pressure sensor;
（3）通过溅射或蒸镀技术在下层柔性基底的上表面上制造图案化金属电极，形成压力传感器的下部电极层；(3) Manufacture patterned metal electrodes on the upper surface of the lower flexible substrate by sputtering or evaporation technology to form the lower electrode layer of the pressure sensor;
（4）将一种或几种碳基纳米颗粒和一种聚合物在有机溶剂中混合均匀，旋涂碳基纳米颗粒/聚合物溶液于下层柔性基底上，加热固化后形成柔性压阻材料层；(4) Mix one or several carbon-based nanoparticles and a polymer in an organic solvent, spin-coat the carbon-based nanoparticles/polymer solution on the lower flexible substrate, and form a flexible piezoresistive material layer after heating and curing ;
（5）通过溅射或蒸镀技术在柔性压阻材料层的上表面上制造图案化金属电极，形成压力传感器的上部电极层；(5) Manufacture patterned metal electrodes on the upper surface of the flexible piezoresistive material layer by sputtering or evaporation technology to form the upper electrode layer of the pressure sensor;
（6）由柔性聚合物经过浇筑、旋涂固化或蒸镀工艺在力敏结构层上制备上层柔性封装层。(6) The upper flexible encapsulation layer is prepared on the force-sensitive structural layer from the flexible polymer through casting, spin-coating curing or evaporation process.
和现有技术相比，本发明的有益效果在于：Compared with the prior art, the beneficial effects of the present invention are:
1、本发明基于聚酰亚胺基底微结构制造技术的柔性压力传感器可对接触压力大小进行测量；1. The flexible pressure sensor based on the polyimide substrate microstructure manufacturing technology of the present invention can measure the contact pressure;
2、传感器压力传感器整体为薄膜结构，各部分均使用柔性材料，更便于布置于曲面表面；2. Sensor The pressure sensor is a film structure as a whole, and all parts are made of flexible materials, which is more convenient to arrange on curved surfaces;
3、传感器的聚酰亚胺基底微结构可增大受力时柔性压阻材料层的应变，具有压力灵敏度高的优点；3. The polyimide substrate microstructure of the sensor can increase the strain of the flexible piezoresistive material layer when the force is applied, which has the advantage of high pressure sensitivity;
4、传感器采用自下而上的微纳制造技术制备而成，具有超薄超轻、精度高、应用性强和易于实现阵列化制造的优点。4. The sensor is prepared by bottom-up micro-nano manufacturing technology, which has the advantages of ultra-thin and ultra-light, high precision, strong applicability and easy array manufacturing.
附图说明Description of drawings
图1为本发明的压力传感器结构示意图。Fig. 1 is a structural schematic diagram of a pressure sensor of the present invention.
图2为本发明的聚酰亚胺基底表面穹顶形微结构阵列扫描电镜表征图。Fig. 2 is a scanning electron microscope characterization diagram of the dome-shaped microstructure array on the surface of the polyimide substrate of the present invention.
图3为本发明的压力传感器截面图。Fig. 3 is a sectional view of the pressure sensor of the present invention.
图4为本发明的力敏结构层受力变形示意图。Fig. 4 is a schematic diagram of deformation of the force-sensitive structural layer of the present invention under force.
具体实施方式Detailed ways
下面结合附图和实施例对本发明进行详细说明。The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
本发明提供一种基于聚酰亚胺基底微结构的柔性压力传感器，压力传感器整体为薄膜结构，通体采用柔性材料制成。如图1所示，压力传感器包括下层柔性基底1、力敏结构层2和上层柔性封装层3，三者紧密贴合。力敏结构层2包括下部电极层201、柔性压阻材料层202和上部电极层203。传感器具有结构简单，易于阵列化制造的优点。制备工艺具体如下：The invention provides a flexible pressure sensor based on the microstructure of the polyimide substrate. The pressure sensor has a film structure as a whole, and the whole body is made of flexible materials. As shown in FIG. 1 , the pressure sensor includes a lower flexible substrate 1 , a force-sensitive structural layer 2 and an upper flexible packaging layer 3 , and the three are tightly bonded. The force sensitive structure layer 2 includes a lower electrode layer 201 , a flexible piezoresistive material layer 202 and an upper electrode layer 203 . The sensor has the advantages of simple structure and easy array manufacturing. The preparation process is as follows:
（1） 旋涂聚酰亚胺溶液于硅晶圆上，固化温度和时间分别为120℃ 30 min、180℃ 30min和250℃ 30 min。固化后聚酰亚胺薄膜的厚度可根据聚酰亚胺溶液的浓度与旋涂转速调整；(1) Spin-coat the polyimide solution on the silicon wafer, and the curing temperature and time are 120°C for 30 min, 180°C for 30 min and 250°C for 30 min, respectively. The thickness of the cured polyimide film can be adjusted according to the concentration of the polyimide solution and the spin coating speed;
（2）在聚酰亚胺薄膜的上表面旋涂光刻胶，经过光刻工艺后可形成光刻胶微结构阵列。以光刻胶微结构阵列作为掩膜，使用等离子体刻蚀工艺对聚酰亚胺薄膜上表面进行等离子体刻蚀加工，刻蚀气体使用O2和SF6，刻蚀功率不超过100 W。光刻胶微结构的高度与形貌可根据光刻工艺参数调整，刻蚀深度与形貌可根据刻蚀参数调整。刻蚀结束后使用除胶液去除聚酰亚胺表面上的光刻胶，使用丙酮清洗干净后，制备成压力传感器下层柔性基底1；柔性聚酰亚胺基底的上表面存在微结构阵列，图2为本发明的聚酰亚胺基底表面穹顶形微结构阵列扫描电镜表征图。如图3所示，下层柔性基底1上的微结构阵列与力敏结构层2紧密贴合，在压力的作用下，微结构阵列与力敏结构层2的接触区域产生应力集中现象，增大柔性压阻材料层202的变形。(2) The photoresist is spin-coated on the upper surface of the polyimide film, and a photoresist microstructure array can be formed after a photolithography process. Using the photoresist microstructure array as a mask, the upper surface of the polyimide film was plasma etched using a plasma etching process. The etching gas used O 2 and SF 6 , and the etching power did not exceed 100 W. The height and shape of the photoresist microstructure can be adjusted according to the photolithography process parameters, and the etching depth and shape can be adjusted according to the etching parameters. After etching, remove the photoresist on the surface of polyimide with glue remover, clean it with acetone, and prepare the lower flexible substrate 1 of the pressure sensor; there is a microstructure array on the upper surface of the flexible polyimide substrate, as shown in Fig. 2 is a scanning electron microscope characterization diagram of the dome-shaped microstructure array on the surface of the polyimide substrate of the present invention. As shown in Figure 3, the microstructure array on the lower flexible substrate 1 is closely attached to the force-sensitive structure layer 2, and under the action of pressure, stress concentration occurs in the contact area between the microstructure array and the force-sensitive structure layer 2, increasing Deformation of the flexible piezoresistive material layer 202 .
（3）通过溅射或蒸镀技术图案化金属电极制造于下层柔性基底1的上表面上，与下层柔性基底1紧密贴合，形成压力传感器的下部电极层201，电极的厚度为100~1000 nm；(3) The patterned metal electrode is manufactured on the upper surface of the lower flexible substrate 1 by sputtering or evaporation technology, and is closely attached to the lower flexible substrate 1 to form the lower electrode layer 201 of the pressure sensor. The thickness of the electrode is 100~1000 nm;
（4）将石墨烯、碳纳米管或石墨纳米片与和聚氨酯（PU）、苯乙烯系热塑性弹性体（SBS）或聚二甲基硅氧烷（PDMS）在甲苯中混合均匀，旋涂碳基纳米颗粒/聚合物溶液于下层柔性基底1上，加热固化后形成柔性压阻材料层202，柔性压阻材料层202的厚度可根据混合溶液浓度和旋涂转速调整，其电阻率可根据碳基导电颗粒掺杂比例调整；(4) Mix graphene, carbon nanotubes or graphite nanosheets with polyurethane (PU), styrene-based thermoplastic elastomer (SBS) or polydimethylsiloxane (PDMS) in toluene, spin-coat carbon The base nanoparticle/polymer solution is placed on the lower flexible substrate 1, and the flexible piezoresistive material layer 202 is formed after heating and curing. The thickness of the flexible piezoresistive material layer 202 can be adjusted according to the concentration of the mixed solution and the spin coating speed, and its resistivity can be adjusted according to the carbon Doping ratio adjustment of base conductive particles;
（5）通过溅射或蒸镀技术图案化银、铬/金金属电极制造于柔性压阻材料层202的上表面上，形成压力传感器的上部电极层203，电极的厚度为100 ~1000 nm；(5) Fabricate silver, chromium/gold metal electrodes on the upper surface of the flexible piezoresistive material layer 202 by sputtering or evaporation technology to form the upper electrode layer 203 of the pressure sensor, and the thickness of the electrode is 100-1000 nm;
（6）柔性封装层3由聚酰亚胺（PI）或聚对二甲苯(Parylene)经过浇筑、旋涂固化或蒸镀等工艺制备在所述的力敏结构层上，作为力敏结构层的力传递层，同时用以保护传感器和防水，柔性封装层3厚度为1~20 μm。(6) The flexible packaging layer 3 is prepared on the force-sensitive structural layer by polyimide (PI) or parylene (Parylene) through pouring, spin-coating curing or evaporation processes, as the force-sensitive structural layer The force transmission layer is used to protect the sensor and waterproof at the same time, and the thickness of the flexible packaging layer 3 is 1-20 μm.
本发明的工作原理：Working principle of the present invention:
如图4所示，柔性压阻材料层202为碳基纳米颗粒/聚合物复合材料，下部电极层201和上部电极层203之间的电阻，即为柔性压阻材料层202的电阻，取决于柔性压阻材料层202中导电碳基纳米颗粒构成的导电网络。在没有外界压力时，柔性压阻材料层202的电阻为R0。当受到外界接触压力F作用时，上层柔性封装层3将压力传递至柔性压阻材料层202，柔性压阻材料层202在压力作用时，发生压缩变形，变形导致柔性压阻材料层202内碳基导电颗粒之间的间距减小、接触面积增大，使得碳基导电颗粒之间接触电阻降低，导电通路增多，最终柔性压阻材料层202的电阻降低至R1。电阻变化量R0-R1大小和接触压力F呈正相关。进一步的，根据电阻值的变化，可以反应外界接触压力大小。As shown in Figure 4, the flexible piezoresistive material layer 202 is a carbon-based nanoparticle/polymer composite material, and the resistance between the lower electrode layer 201 and the upper electrode layer 203, which is the resistance of the flexible piezoresistive material layer 202, depends on A conductive network composed of conductive carbon-based nanoparticles in the flexible piezoresistive material layer 202 . When there is no external pressure, the resistance of the flexible piezoresistive material layer 202 is R 0 . When subjected to external contact pressure F, the upper flexible packaging layer 3 transmits the pressure to the flexible piezoresistive material layer 202, and the flexible piezoresistive material layer 202 undergoes compression deformation when the pressure is applied, and the deformation causes The distance between the carbon-based conductive particles is reduced and the contact area is increased, so that the contact resistance between the carbon-based conductive particles is reduced, the conductive path is increased, and finally the resistance of the flexible piezoresistive material layer 202 is reduced to R 1 . The resistance variation R 0 -R 1 is positively correlated with the contact pressure F. Further, according to the change of the resistance value, the external contact pressure can be reflected.
以上所述仅为本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应该视为本发明的保护范围。The foregoing is only a preferred embodiment of the present invention, and it should be pointed out that for those skilled in the art, some improvements and modifications can also be made without departing from the principle of the present invention. It should be regarded as the protection scope of the present invention.
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