CN110095223A - A kind of pressure sensor - Google Patents
A kind of pressure sensor Download PDFInfo
- Publication number
- CN110095223A CN110095223A CN201910458835.4A CN201910458835A CN110095223A CN 110095223 A CN110095223 A CN 110095223A CN 201910458835 A CN201910458835 A CN 201910458835A CN 110095223 A CN110095223 A CN 110095223A
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- Prior art keywords
- resistance
- circuit board
- bulge
- pressure sensor
- strain
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The present invention relates to field of sensing technologies more particularly to a kind of pressure sensors.The pressure sensor principle and structure are simple, and volume and quality are smaller, easy to carry, can be used for the measurement of the physiological parameters such as human pulse, heartbeat.The embodiment of the present invention provides a kind of pressure sensor, including circuit board, the resistance-strain portion of setting on circuit boards；Resistance-strain portion is used to its transformation for strain mechanically be resistance variations；The surface of the close circuit board in resistance-strain portion has the first bulge-structure, and along the thickness direction of circuit board, the cross section of the first bulge-structure is in tapered along the direction for moving closer to circuit board；Circuit board includes circuit board body and is set in circuit board body, and the conductive layer being electrically connected with circuit board body；Resistance-strain portion passes through the first bulge-structure and conductive layer contact and is electrically connected, and the material of the first bulge-structure includes flexible material.The embodiment of the present invention is used to prepare pressure sensor using interface resistance effect.
Description
Technical field
The present invention relates to field of sensing technologies more particularly to a kind of pressure sensors.
Background technique
With interpenetrating for electronic technology, computer technology and sensing technology, sensor is applied as sensing element
In technical fields such as robot delicate, medical rehabilitation and robot detections, to copy the haptic system of the mankind to improve inspection
Survey sensitivity.
Summary of the invention
It is a primary object of the present invention to provide a kind of pressure sensor.The pressure sensor principle and structure are simple, body
Long-pending and quality is smaller, easy to carry, can be used for the measurement of the physiological parameters such as human pulse, heartbeat.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
The embodiment of the present invention provides a kind of pressure sensor, answers including circuit board, the resistance being arranged on the circuit board
Change portion；The resistance-strain portion is used to its transformation for strain mechanically be resistance variations；The close institute in the resistance-strain portion
State circuit board surface have the first bulge-structure, along the thickness direction of the circuit board, first bulge-structure it is transversal
Face is in tapered along the direction for moving closer to the circuit board；The circuit board includes circuit board body and is set to the circuit
On plate ontology, and the conductive layer being electrically connected with the circuit board body；The resistance-strain portion passes through first bulge-structure
With the conductive layer contact and be electrically connected, the material of first bulge-structure includes flexible material.
Optionally, first bulge-structure is multiple, and first bulge-structure is dome-shaped structure of contact terminal.
Optionally, the resistance-strain portion includes flexible substrate and is set to the flexible substrate close to the circuit board
The resistance-strain layer of one side surface, the flexible substrate have multiple first protrusions close to the resistance-strain layer；Described first
The cross section of protrusion is in tapered along the direction for moving closer to the resistance-strain layer；Each first protrusion and it is located at described
Part composition first bulge-structure of first raised side and the resistance-strain layer of contact.
Optionally, the pressure sensor further includes insulating protective layer, and the insulating protective layer is set to the resistance and answers
Side of the change portion far from the circuit board.
It optionally, is multiple in first bulge-structure, and first bulge-structure is dome-shaped structure of contact terminal
In the case where；Multiple dome-shaped structure of contact terminals are divided into multiple sets of contacts；Dome-shaped contact knot in each sets of contacts
Structure is arranged in array format；The insulating protective layer has multiple second bulge-structures far from the surface in the resistance-strain portion,
On the insulating protective layer thickness direction, the orthographic projection of each second bulge-structure touching adjacent at least two
The orthographic projection of head group region partly overlaps.
Optionally, each second bulge-structure is truncated rectangular pyramids structure, on the thickness direction of the insulating protective layer,
The center of the orthographic projection of four apex angles of each truncated rectangular pyramids structure and 4 sets of contacts regions in array format arrangement
Orthographic projection overlapping.
Optionally, the pressure sensor further includes power module, the first voltage end of the power module and the electricity
Hinder Response Division electrical connection, second voltage end and the circuit board electrical connection.
Optionally, the material of the resistance-strain layer includes graphene oxide composite material.
Optionally, the insulating protective layer and the material of the flexible substrate include polydimethyl siloxane material.
The embodiment of the present invention provides a kind of pressure sensor, application interface electricresistance effect, i.e., with the first bulge-structure
The characteristics of contact area between conductive layer increases, and the interface resistance between first bulge-structure and circuit board changes.It is logical
It crosses to circuit board and resistance-strain portion and applies constant voltage, according to electric current equal to voltage divided by resistance, in entire circuit,
In the case that other resistance do not change, as the interface resistance between the first bulge-structure and circuit board changes, electricity is flowed through
Road plate and the electric current in resistance-strain portion change, and are examined by the size of current of convection current oversampling circuit plate and resistance-strain portion
It surveys, the pressure size being applied on pressure sensor can be detected.The pressure sensor principle and structure are simple, volume
It is smaller with quality, it is easy to carry.In addition, flowing through the number of the curent change in circuit board and resistance-strain portion by observation, may be used also
It is measured with physiological parameters such as pulse, heartbeats to human body.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of pressure sensor provided in an embodiment of the present invention；
Fig. 2 is between a kind of dome-shaped structure of contact terminal and circuit board provided in an embodiment of the present invention by face contact to face face
The schematic illustration of contact；
Fig. 3 is the structural schematic diagram of another pressure sensor provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another pressure sensor provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of another pressure sensor provided in an embodiment of the present invention；
Fig. 6 is a kind of schematic cross-sectional view in the region Q based on Fig. 5 provided in an embodiment of the present invention；
Fig. 7 is the schematic perspective view in another region Q based on Fig. 5 provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.?
In description of the invention, unless otherwise indicated, the meaning of " plurality " is two or more.
The embodiment of the present invention provides a kind of pressure sensor, and referring to Fig. 1, including circuit board 1, setting are in the circuit board 1
On resistance-strain portion 2, which is used to its transformation for strain mechanically be resistance variations.
The surface close to the circuit board 1 in the resistance-strain portion 2 has the first bulge-structure 3, along the thickness of the circuit board 1
Direction, the cross section of first bulge-structure 3 are in tapered along the direction for moving closer to the circuit board 1.The circuit board 1 includes circuit
Plate ontology 11 and the conductive layer 12 for being set in the circuit board body 11, and being electrically connected with the circuit board body 11.The resistance is answered
Change portion 2 is contacted and is electrically connected with the conductive layer 12 by first bulge-structure 3, and the material of first bulge-structure 3 includes soft
Property material.
In embodiments of the present invention, along the thickness direction of the circuit board 1, when applying pressure to the pressure sensor, by
It include flexible material in the material of first bulge-structure 3, therefore, the first bulge-structure 3 can deformation occurs for this.And due to edge
The thickness direction of the circuit board 1, the cross section of first bulge-structure 3 along moving closer to the direction of the circuit board 1 in tapered, because
This increases with pressure is applied to the pressure sensor, and the contact area between first bulge-structure 3 and the conductive layer 12 increases
Greatly.
Since the resistance-strain portion 2 is used to its transformation for strain mechanically be resistance variations, with the first protrusion
Deformation occurs for structure 3, and contact area between first bulge-structure 3 and the conductive layer 12 increases, according to interface resistance effect,
In the case where external condition is constant, the contact area size of resistance and two objects between two surfaces to contact with each other has
It closes.
Based on this, in pressure sensor provided in an embodiment of the present invention, application interface electricresistance effect, i.e., as first is convex
The contact area risen between structure 3 and conductive layer 12 increases, and the interface resistance between first bulge-structure 3 and circuit board 1 becomes
The characteristics of change.By applying constant voltage to circuit board 1 and resistance-strain portion 2, voltage is equal to divided by resistance according to electric current,
In entire circuit, in the case where other resistance do not change, with the interface between the first bulge-structure 3 and circuit board 1
Resistance variations, the electric current for flowing through circuit board 1 and resistance-strain portion 2 change, and pass through convection current oversampling circuit plate 1 and resistance-strain portion
2 size of current is detected, and can be detected to the pressure size being applied on pressure sensor.The pressure sensor is former
Reason and structure are simple, and volume and quality are smaller, easy to carry.
In addition, the number of the curent change in circuit board 1 and resistance-strain portion 2 is flowed through by observation, it can also be to human body
The physiological parameters such as pulse, heartbeat measure.
Wherein, the resistance-strain portion 2 and circuit board 1 can realize contact by the way that Gauss adhesive tape is fixed.
Without limitation to the concrete shape of first bulge-structure 3, as long as along the thickness direction of the circuit board 1, with to
The pressure sensor applies pressure and increases, and the contact area between first bulge-structure 3 and the conductive layer 12 increases.
In one embodiment of the invention, as shown in Figure 1, first bulge-structure 3 is multiple, and each first protrusion is tied
Structure 3 is dome-shaped structure of contact terminal.So, when not applying pressure to the pressure sensor, as shown in Fig. 2, each first
It can be point face contact between bulge-structure 3 and the circuit board 1, increase with pressure is applied to the pressure sensor, the protrusion
Shape structure of contact terminal 3 and the circuit board 1 become plane-plane contact, so as to applying what pressure increased to the pressure sensor
In the case of, increase the contact area between the first bulge-structure 3 and circuit board 1.
Wherein, without limitation to the specific structure in the resistance-strain portion 2.
In one embodiment of the invention, as shown in figures 1 and 3, which includes flexible substrate 21 and setting
In the flexible substrate 21 close to the resistance-strain layer 22 of 1 one side surface of circuit board, the flexible substrate 21 is close to the resistance-strain
Layer 22 has multiple first protrusions；The cross section of first protrusion is in tapered along the direction for moving closer to the resistance-strain layer 22；
Each first protrusion and to constitute this positioned at the part of the first raised side and the resistance-strain layer 22 of contact first convex
Play structure 3.
In embodiments of the present invention, resistance-strain is formed by the side surface with the first protrusion in flexible substrate 21
Layer 22, can be obtained can the first bulge-structure 3 that deformation occurs, and between first bulge-structure 3 and the conductive layer 12
Contact area increase, the interface resistance between first bulge-structure 3 and the conductive layer 12 becomes smaller, to the resistance-strain layer
22 and circuit board 1 when applying constant voltage, by being detected to the electric current for flowing through the resistance-strain layer 22 and circuit board 1,
The pressure being applied on the pressure sensor can be detected.
Specifically, can be in the golden simple substance of the edge of resistance-strain layer 22 vapor deposition to form electrode, it should by conductive silver glue
Electrode is electrically connected with external circuit, to constitute the series-connection circuit of the resistance-strain layer 22 and circuit board 1, to the resistance-strain
Layer 22 and circuit board 1 apply constant voltage.
Wherein, optionally, the material of the resistance-strain layer 22 includes graphene oxide material.
Graphene is a kind of two dimensional crystal, is arranged by carbon atom according to hexagon, is connected with each other, and carbon point is formed
Son, structure is highly stable, and stable lattice structure makes it have excellent electric conductivity, therefore, in the embodiment of the present invention
In, resistance-strain layer 22 is made by using graphene oxide composite material, the detection spirit of the pressure sensor can be further increased
Quick property.
In the case where the material of the resistance-strain layer 22 includes graphene oxide material, in production, layer can be passed through
The graphene oxide material is assembled in surface of the flexible substrate 21 with the first protrusion by the mode of layer self assembly.
In addition, in embodiments of the present invention, being arranged by the way that flexible substrate 21 is arranged, and by the resistance-strain layer 22 in flexibility
The surface of substrate 21, when applying pressure to the pressure sensor, which is able to drive the resistance-strain layer 22 hair
Raw deformation, improves detection sensitivity.Simultaneously, additionally it is possible to the flexibility of pressure sensor is improved, so that the pressure sensor can be extensive
Applied to fields such as wearing, medical treatment and biologies.
Wherein, the material of the flexible substrate 21 is not specifically limited.
Optionally, the material of the flexible substrate 21 may include dimethyl silicone polymer (Polydimethylsiloxane,
PDMS) material.Since PDMS has very big resilience, as shown in Fig. 2, being applied on pressure sensor in revocation
Pressure when, additionally it is possible to so that the first bulge-structure 3 is returned to the original form rapidly, so as to further increase the pressure sensing
The detection sensitivity of device, and extend the service life of the pressure sensor.
In another embodiment of the present invention, as shown in figure 3, the pressure sensor can also include power module 4, the power supply
The first voltage end of module 4 is electrically connected with the resistance-strain portion 2, and second voltage end is electrically connected with circuit board 1.
In embodiments of the present invention, it is capable of forming the series-connection circuit in resistance-strain portion 2 and circuit board 1.In the series connection
It connects in circuit, which is electrically connected by first bulge-structure 3 with conductive layer 12, conductive layer 12 and the circuit
Plate ontology 21 is electrically connected, and applies constant voltage U to the resistance-strain portion 2 and circuit board 1 by the power module 4, according to string
Join in circuit, formula electric current I=U/R can be learnt: with the interface electricity between multiple first bulge-structures 3 and circuit board 1
Resistive is small, and the all-in resistance R in the series circuit becomes smaller, and the electric current for flowing through the resistance-strain portion 2 and circuit board 1 increases, so as to
It is enough that the pressure size being applied on pressure sensor is detected.
In another embodiment of the present invention, the material of the circuit board body 11 may include PET (Polyethylene
Terephthalate, polyethylene terephthalate) material, which can be to be formed in the circuit board body 11
ITO (Indium Tin Oxides, tin indium oxide) film.I.e. the circuit board 1 is flexible circuit board, can be further increased
The flexibility of the pressure sensor.
In another embodiment of the present invention, as shown in figure 4, the pressure sensor further includes insulating protective layer 5, which is protected
Sheath 5 is set to the side of the resistance-strain portion 2 far from the circuit board 1.
Optionally, the material of the insulating protective layer 5 includes PDMS material.The soft of the pressure sensor can be further increased
Property and detection sensitivity.
In addition, by using PDMS material, the insulating protective layer 5 and flexible substrate 21 can by respective surface sun from
Son is directly pasted after carrying out hydrophilic modifying, does not need to introduce other stickup substances.
In another embodiment of the present invention, as shown in Figure 5 and Figure 6, be in first bulge-structure 3 it is multiple, and each the
In the case that one bulge-structure 3 is dome-shaped structure of contact terminal；Multiple dome-shaped structure of contact terminals are divided into multiple sets of contacts 31；Each
Dome-shaped structure of contact terminal in sets of contacts 31 is arranged in array format；The surface of the insulating protective layer 5 far from the resistance-strain portion 2
With multiple second bulge-structures 6, on the thickness direction of insulating protective layer 5, the orthographic projection of each second bulge-structure 6 with
The orthographic projection of at least two adjacent 31 regions of sets of contacts partly overlaps.
In embodiments of the present invention, by being arranged multiple second far from the surface in the resistance-strain portion 2 in insulating protective layer 5
Bulge-structure 6, due on the thickness direction of insulating protective layer 5, orthographic projection and at least two phases of each second bulge-structure 6
The orthographic projection of adjacent 31 region of sets of contacts partly overlaps, and the second bulge-structure 6 not set on insulating protective layer 5, to
When one position of the insulating protective layer 5 applies pressure, it can only make dome-shaped structure of contact terminal corresponding with the position that shape occur
Covert ratio, can act on the second bulge-structure 6 in pressure applied, will act on second bulge-structure 6
Pressure decomposes in multiple sets of contacts 31, so as to further increase the detection sensitivity of the pressure sensor.
In an alternative embodiment of the invention, as shown in fig. 7, each second bulge-structure 6 is truncated rectangular pyramids structure, at this
On the thickness direction of insulating protective layer 5, the orthographic projection of four apex angles of each truncated rectangular pyramids structure is with 4 in array format arrangement
The orthographic projection at the center of sets of contacts region is overlapped.
Wherein, the dome-shaped structure of contact terminal in each sets of contacts 31 can be in the arrangement of 4 × 4 matrix form.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of pressure sensor, which is characterized in that including circuit board, the resistance-strain portion being arranged on the circuit board；Institute
Resistance-strain portion is stated for being resistance variations by its transformation for strain mechanically；
The surface close to the circuit board in the resistance-strain portion has the first bulge-structure, along the thickness side of the circuit board
To the cross section of first bulge-structure is in tapered along the direction for moving closer to the circuit board；
The circuit board includes circuit board body and is set in the circuit board body, and is electrically connected with the circuit board body
The conductive layer connect；
The resistance-strain portion passes through first bulge-structure and the conductive layer contact and is electrically connected, and first protrusion is tied
The material of structure includes flexible material.
2. pressure sensor according to claim 1, which is characterized in that
First bulge-structure is multiple, and first bulge-structure is dome-shaped structure of contact terminal.
3. pressure sensor according to claim 1 or 2, which is characterized in that
The resistance-strain portion includes flexible substrate and is set to the flexible substrate close to one side surface of circuit board
Resistance-strain layer, the flexible substrate have multiple first protrusions close to the resistance-strain layer；It is described first protrusion it is transversal
Face is in tapered along the direction for moving closer to the resistance-strain layer；
The part of each described first raised and resistance-strain layer positioned at the described first raised side and contact is constituted
First bulge-structure.
4. pressure sensor according to claim 1 or 2, which is characterized in that
The pressure sensor further includes insulating protective layer, and the insulating protective layer is set to the resistance-strain portion far from described
The side of circuit board.
5. pressure sensor according to claim 4, which is characterized in that
It is in the case that multiple and described first bulge-structure is dome-shaped structure of contact terminal in first bulge-structure；
Multiple dome-shaped structure of contact terminals are divided into multiple sets of contacts；Dome-shaped structure of contact terminal in each sets of contacts is in battle array
The arrangement of column form；
The insulating protective layer has multiple second bulge-structures far from the surface in the resistance-strain portion, in the insulation protection
On the thickness direction of layer, the orthographic projection of each second bulge-structure sets of contacts region adjacent at least two
Orthographic projection partly overlap.
6. pressure sensor according to claim 5, which is characterized in that
Each second bulge-structure is truncated rectangular pyramids structure, on the thickness direction of the insulating protective layer, each described four
The orthographic projection weight of the orthographic projection of four apex angles of terrace with edge structure and the center of 4 sets of contacts regions in array format arrangement
It is folded.
7. pressure sensor according to claim 1, which is characterized in that
The pressure sensor further includes power module, and the first voltage end of the power module is electrically connected with the resistance-strain portion
It connects, second voltage end and the circuit board electrical connection.
8. pressure sensor according to claim 3, which is characterized in that
The material of the resistance-strain layer includes graphene oxide composite material.
9. pressure sensor according to claim 4, which is characterized in that
The insulating protective layer and the material of the flexible substrate include polydimethyl siloxane material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910458835.4A CN110095223A (en) | 2019-05-29 | 2019-05-29 | A kind of pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910458835.4A CN110095223A (en) | 2019-05-29 | 2019-05-29 | A kind of pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110095223A true CN110095223A (en) | 2019-08-06 |
Family
ID=67449613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910458835.4A Pending CN110095223A (en) | 2019-05-29 | 2019-05-29 | A kind of pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110095223A (en) |
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| CN110608825A (en) * | 2019-09-12 | 2019-12-24 | 复旦大学 | Flexible pressure sensor based on polyimide substrate microstructure and preparation method thereof |
| CN112556894A (en) * | 2020-11-24 | 2021-03-26 | 四川省机械技术服务中心 | MEMS depth force vector and position sensor |
| WO2022266811A1 (en) * | 2021-06-21 | 2022-12-29 | 鹏鼎控股(深圳)股份有限公司 | Pressure-sensitive circuit board, and manufacturing method for pressure-sensitive circuit board |
| CN117288354A (en) * | 2023-09-21 | 2023-12-26 | 北京软体机器人科技股份有限公司 | Pressure sensor |
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| CN110608825A (en) * | 2019-09-12 | 2019-12-24 | 复旦大学 | Flexible pressure sensor based on polyimide substrate microstructure and preparation method thereof |
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| CN117288354A (en) * | 2023-09-21 | 2023-12-26 | 北京软体机器人科技股份有限公司 | Pressure sensor |
| CN117288354B (en) * | 2023-09-21 | 2024-06-11 | 北京软体机器人科技股份有限公司 | Pressure sensor |
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Application publication date: 20190806 |