CN110603612B - 导电性粒子、导电性粒子的制造方法、导电材料以及连接结构体 - Google Patents

导电性粒子、导电性粒子的制造方法、导电材料以及连接结构体 Download PDF

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Publication number
CN110603612B
CN110603612B CN201880030129.3A CN201880030129A CN110603612B CN 110603612 B CN110603612 B CN 110603612B CN 201880030129 A CN201880030129 A CN 201880030129A CN 110603612 B CN110603612 B CN 110603612B
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conductive
particles
particle
conductive portion
conductive particles
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CN110603612A (zh
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大秦嘉代
真原茂雄
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
CN201880030129.3A 2017-06-22 2018-06-21 导电性粒子、导电性粒子的制造方法、导电材料以及连接结构体 Active CN110603612B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210997623.5A CN115458206A (zh) 2017-06-22 2018-06-21 导电性粒子、导电性粒子的制造方法、导电材料以及连接结构体

Applications Claiming Priority (3)

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JP2017-122388 2017-06-22
JP2017122388 2017-06-22
PCT/JP2018/023660 WO2018235909A1 (ja) 2017-06-22 2018-06-21 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

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CN110603612A CN110603612A (zh) 2019-12-20
CN110603612B true CN110603612B (zh) 2022-08-30

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CN202210997623.5A Pending CN115458206A (zh) 2017-06-22 2018-06-21 导电性粒子、导电性粒子的制造方法、导电材料以及连接结构体

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JP (2) JP7132122B2 (ja)
KR (2) KR102356887B1 (ja)
CN (2) CN110603612B (ja)
TW (1) TWI768068B (ja)
WO (1) WO2018235909A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996696A (zh) * 2009-08-06 2011-03-30 日立化成工业株式会社 导电性微粒及各向异性导电材料
CN103205215A (zh) * 2012-01-11 2013-07-17 日立化成株式会社 导电粒子、绝缘被覆导电粒子以及各向异性导电性粘接剂
JP2014241280A (ja) * 2013-05-14 2014-12-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN104867530A (zh) * 2014-02-26 2015-08-26 日立金属株式会社 导电性颗粒、导电性粉体、导电性高分子组合物及各向异性导电片
CN105210157A (zh) * 2013-09-12 2015-12-30 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP2016006764A (ja) * 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016015312A (ja) * 2014-06-11 2016-01-28 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2016108563A (ja) * 2014-12-04 2016-06-20 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619675B2 (ja) 2010-08-16 2014-11-05 株式会社日本触媒 導電性微粒子および異方性導電材料

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996696A (zh) * 2009-08-06 2011-03-30 日立化成工业株式会社 导电性微粒及各向异性导电材料
CN103205215A (zh) * 2012-01-11 2013-07-17 日立化成株式会社 导电粒子、绝缘被覆导电粒子以及各向异性导电性粘接剂
JP2014241280A (ja) * 2013-05-14 2014-12-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN105210157A (zh) * 2013-09-12 2015-12-30 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
CN104867530A (zh) * 2014-02-26 2015-08-26 日立金属株式会社 导电性颗粒、导电性粉体、导电性高分子组合物及各向异性导电片
JP2016006764A (ja) * 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016015312A (ja) * 2014-06-11 2016-01-28 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2016108563A (ja) * 2014-12-04 2016-06-20 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体

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KR20220016999A (ko) 2022-02-10
KR102356887B1 (ko) 2022-02-03
CN110603612A (zh) 2019-12-20
KR20200021440A (ko) 2020-02-28
JP2022008631A (ja) 2022-01-13
JP7132122B2 (ja) 2022-09-06
JPWO2018235909A1 (ja) 2020-04-16
TW201905142A (zh) 2019-02-01
WO2018235909A1 (ja) 2018-12-27
CN115458206A (zh) 2022-12-09
TWI768068B (zh) 2022-06-21
JP7288487B2 (ja) 2023-06-07

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