CN110603235B - 气密封装体的制造方法 - Google Patents
气密封装体的制造方法 Download PDFInfo
- Publication number
- CN110603235B CN110603235B CN201880029501.9A CN201880029501A CN110603235B CN 110603235 B CN110603235 B CN 110603235B CN 201880029501 A CN201880029501 A CN 201880029501A CN 110603235 B CN110603235 B CN 110603235B
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- CN
- China
- Prior art keywords
- glass
- container
- containers
- transparent substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 129
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000003566 sealing material Substances 0.000 claims abstract description 45
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 238000005304 joining Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 4
- 239000011358 absorbing material Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Inorganic materials O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- -1 zirconium phosphate compound Chemical class 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laser Beam Processing (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-105563 | 2017-05-29 | ||
| JP2017105563A JP6972661B2 (ja) | 2017-05-29 | 2017-05-29 | 気密パッケージの製造方法 |
| PCT/JP2018/006117 WO2018220909A1 (ja) | 2017-05-29 | 2018-02-21 | 気密パッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110603235A CN110603235A (zh) | 2019-12-20 |
| CN110603235B true CN110603235B (zh) | 2022-06-24 |
Family
ID=64455245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880029501.9A Active CN110603235B (zh) | 2017-05-29 | 2018-02-21 | 气密封装体的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6972661B2 (ko) |
| KR (1) | KR102478227B1 (ko) |
| CN (1) | CN110603235B (ko) |
| TW (1) | TWI708407B (ko) |
| WO (1) | WO2018220909A1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7388112B2 (ja) * | 2019-10-10 | 2023-11-29 | 日本電気硝子株式会社 | 接合体の製造方法及び接合体の製造装置 |
| WO2022071107A1 (ja) | 2020-09-29 | 2022-04-07 | 日本電気硝子株式会社 | 接合体の製造方法 |
| JP2023005724A (ja) * | 2021-06-29 | 2023-01-18 | 日本電気硝子株式会社 | 接合体の製造方法及び接合体の製造装置 |
| JP2023005725A (ja) * | 2021-06-29 | 2023-01-18 | 日本電気硝子株式会社 | 接合体の製造方法及び接合体の製造装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168222A (ja) * | 1999-09-30 | 2001-06-22 | Seiko Epson Corp | 電子部品用パッケージの封止装置及び電子部品用パッケージの封止方法 |
| DE102009006932A1 (de) * | 2009-01-30 | 2010-08-19 | Centrotherm Thermal Solutions Gmbh + Co. Kg | Anordnung und Verfahren zum gasdichten Versiegeln von OLED-Bauelementen |
| CN102208312A (zh) * | 2010-03-29 | 2011-10-05 | 佳能株式会社 | 气密容器的制造方法 |
| CN102224115A (zh) * | 2008-11-26 | 2011-10-19 | 旭硝子株式会社 | 带密封材料层的玻璃构件以及使用该构件的电子器件及其制造方法 |
| CN102386043A (zh) * | 2010-08-25 | 2012-03-21 | 佳能株式会社 | 气密密封容器的制造方法 |
| CN102498075A (zh) * | 2009-09-22 | 2012-06-13 | 皇家飞利浦电子股份有限公司 | 用于密封装置的玻璃封装以及包括玻璃封装的系统 |
| JP2012252827A (ja) * | 2011-06-01 | 2012-12-20 | Canon Inc | 気密容器の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001320256A (ja) * | 2000-05-10 | 2001-11-16 | Daishinku Corp | 圧電振動デバイスの気密封止方法 |
| JP5064142B2 (ja) * | 2007-08-24 | 2012-10-31 | シチズンファインテックミヨタ株式会社 | 圧電デバイスの製造方法 |
| JP2014236202A (ja) | 2013-06-05 | 2014-12-15 | 旭硝子株式会社 | 発光装置 |
| CN103715371A (zh) * | 2013-12-16 | 2014-04-09 | 京东方科技集团股份有限公司 | 一种封装方法及显示装置 |
| TWM493160U (zh) * | 2014-08-21 | 2015-01-01 | Chunghwa Picture Tubes Ltd | 玻璃膠密封裝置 |
-
2017
- 2017-05-29 JP JP2017105563A patent/JP6972661B2/ja active Active
-
2018
- 2018-02-21 KR KR1020197021808A patent/KR102478227B1/ko active IP Right Grant
- 2018-02-21 CN CN201880029501.9A patent/CN110603235B/zh active Active
- 2018-02-21 WO PCT/JP2018/006117 patent/WO2018220909A1/ja active Application Filing
- 2018-03-12 TW TW107108227A patent/TWI708407B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168222A (ja) * | 1999-09-30 | 2001-06-22 | Seiko Epson Corp | 電子部品用パッケージの封止装置及び電子部品用パッケージの封止方法 |
| CN102224115A (zh) * | 2008-11-26 | 2011-10-19 | 旭硝子株式会社 | 带密封材料层的玻璃构件以及使用该构件的电子器件及其制造方法 |
| DE102009006932A1 (de) * | 2009-01-30 | 2010-08-19 | Centrotherm Thermal Solutions Gmbh + Co. Kg | Anordnung und Verfahren zum gasdichten Versiegeln von OLED-Bauelementen |
| CN102498075A (zh) * | 2009-09-22 | 2012-06-13 | 皇家飞利浦电子股份有限公司 | 用于密封装置的玻璃封装以及包括玻璃封装的系统 |
| CN102208312A (zh) * | 2010-03-29 | 2011-10-05 | 佳能株式会社 | 气密容器的制造方法 |
| CN102386043A (zh) * | 2010-08-25 | 2012-03-21 | 佳能株式会社 | 气密密封容器的制造方法 |
| JP2012252827A (ja) * | 2011-06-01 | 2012-12-20 | Canon Inc | 気密容器の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110603235A (zh) | 2019-12-20 |
| KR20200014261A (ko) | 2020-02-10 |
| JP6972661B2 (ja) | 2021-11-24 |
| TW201901992A (zh) | 2019-01-01 |
| KR102478227B1 (ko) | 2022-12-16 |
| WO2018220909A1 (ja) | 2018-12-06 |
| JP2018199600A (ja) | 2018-12-20 |
| TWI708407B (zh) | 2020-10-21 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |