CN110551605A - Auxiliary control device for porous module - Google Patents
Auxiliary control device for porous module Download PDFInfo
- Publication number
- CN110551605A CN110551605A CN201910823397.7A CN201910823397A CN110551605A CN 110551605 A CN110551605 A CN 110551605A CN 201910823397 A CN201910823397 A CN 201910823397A CN 110551605 A CN110551605 A CN 110551605A
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- CN
- China
- Prior art keywords
- module
- porous
- porous module
- support
- control device
- Prior art date
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- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 238000005057 refrigeration Methods 0.000 claims description 15
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003752 polymerase chain reaction Methods 0.000 description 2
- 230000004544 DNA amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 108020004707 nucleic acids Proteins 0.000 description 1
- 150000007523 nucleic acids Chemical class 0.000 description 1
- 102000039446 nucleic acids Human genes 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
- B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
The invention discloses an auxiliary control device for a porous module, which comprises a device platform, a semiconductor refrigerating sheet, an auxiliary heating plate, a temperature sensor and the porous module, wherein the device platform is provided with a radiator, the semiconductor refrigerating sheet is fixed on the radiator, the semiconductor refrigerating sheet is arranged below the porous module, the temperature sensor is arranged in the porous module, and the auxiliary heating plate is arranged on the edge of the porous module. The invention adopts four ways of temperature control modes to control different refrigerating sheets to heat or refrigerate each area of the porous module, and adopts different auxiliary heating control modes to compensate the temperature of the edge of each area, thus greatly improving the temperature control precision and uniformity of the module and further meeting the reagent with higher temperature requirement.
Description
Technical Field
The invention relates to the field of biomedical detection, in particular to an auxiliary control device for a porous module.
Background
The real-time fluorescent quantitative and gene amplification instrument is a basic instrument for Polymerase Chain Reaction (PCR) in the biomedical field, can provide a stable and adjustable temperature environment, and is widely used in the industry as an instrument for amplifying DNA fragments. They all involve a temperature control module which can heat or cool the reaction tube to the exact temperature required for each reaction step, and most of the temperature control modules have poor uniformity at present, and especially do not satisfy the requirements of reagents with higher temperature sensitivity.
Patent CN208684985U discloses a positioning heating device for a deep hole plate for nucleic acid extraction, which comprises a bottom plate and a deep hole plate assembled and disassembled on the bottom plate, wherein the upper part of the bottom plate is provided with a surrounding block component and an elastic sheet, the surrounding block component and the elastic sheet form a deep hole plate assembly position, the bottom of the bottom plate is provided with a heating module, and the heating module is positioned below the assembly position; the deep hole plate is positioned at the assembling position, and the temperature heating and the temperature control are realized through the heating module. The heating device is changed into a plurality of strips, so that the heating is uneven, and the experimental effect is poor.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an auxiliary control device for a porous module, which has uniform temperature control and can meet the experiment of high temperature requirements.
In order to achieve the purpose, the invention adopts the following technical scheme:
The utility model provides a be used for porous module to assist controlling means, the device includes device platform, semiconductor refrigeration piece, auxiliary heating board, temperature sensor and porous module, the device platform is equipped with the radiator, and the semiconductor refrigeration piece is fixed on the radiator, porous module below is located to the semiconductor refrigeration piece, temperature sensor installs in porous module, auxiliary heating board is installed on porous module edge.
Furthermore, the auxiliary heating plate comprises four heating plates, and the four heating plates are enclosed around the porous module.
Furthermore, the semiconductor refrigeration piece comprises four sheet refrigeration pieces, and the refrigeration pieces are arranged below the porous module.
Further, the temperature sensor is mounted in the porous module through a thermal grease.
Further, the auxiliary heating plate is cured on the porous module edge by 4450 heat conductive silicone grease.
Furthermore, the semiconductor refrigeration piece is fixed on the radiator through the module pressing frame.
Furthermore, the device platform comprises a first support, a fan support, a second support and an adapter plate, the fan support is connected and fixed to the middle portions of the first support and the second support, the adapter plate is fixed above the first support and the second support, and the radiator is installed below the adapter plate and fixed to the fan support.
Furthermore, the temperature sensor, the semiconductor refrigerating sheet and the auxiliary heating plate are welded on the adapter plate.
Furthermore, the device is also provided with a temperature control CPU board, and the temperature control CPU board is fixed on the second support.
Furthermore, the temperature control CPU board is connected with the adapter board through a wire harness.
By adopting the technical scheme of the invention, the invention has the beneficial effects that: the invention adopts four ways of temperature control modes to control different refrigerating sheets to heat or refrigerate each area of the porous module, and adopts different auxiliary heating control modes to compensate the temperature of the edge of each area, thus greatly improving the temperature control precision and uniformity of the module and further meeting the reagent with higher temperature requirement.
Drawings
FIG. 1 is a structural diagram of an auxiliary control device for a multi-hole module according to the present invention;
FIG. 2 is a side view structural diagram of an auxiliary control device for a porous module provided by the present invention;
Fig. 3 is a partially enlarged view of the porous module auxiliary control device provided by the invention after the frame pressing module is removed.
The device comprises a porous module 1, a porous module 2, a semiconductor refrigerating sheet 3, an auxiliary heating plate 4, a temperature sensor 5, a radiator 6, a fan 7, a module pressing frame 8, a temperature control CPU board 9, an adapter plate 10, a first support 11, a fan support 12 and a second support.
Detailed Description
Specific embodiments of the present invention will be further described with reference to the accompanying drawings.
as shown in the figure, a be used for 1 auxiliary control device of porous module, the device includes device platform, semiconductor refrigeration piece 2, auxiliary heating board 3, temperature sensor 4 and porous module 1, the device platform is equipped with radiator 5, and semiconductor refrigeration piece 2 is fixed on radiator 5, 1 below porous module is located to semiconductor refrigeration piece 2, temperature sensor 4 is installed in porous module 1, auxiliary heating board 3 is installed on 1 edge of porous module. The auxiliary heating plate 3 is installed at the edge, so that the edge is heated uniformly. The refrigerating device is in a sheet shape, so that the whole refrigerating is uniform. The multi-well module 1 is a 96-well module and other common experimental tools.
The temperature sensor 4 is mounted in the porous block 1 by means of a thermally conductive grease. The temperature measurement is more accurate, and the firmness is higher.
The auxiliary heating plate 3 comprises four heating plates, and the four heating plates are enclosed around the porous module 1. The number of the heating plates is four, the independent temperature can be adjusted through the temperature control CPU, and the four heating plates are flexible and convenient to assemble. The auxiliary heating plate 3 is cured on the edge of the porous module 1 by 4450 heat conductive silicone grease.
The semiconductor refrigerating sheet 2 comprises four sheet refrigerating sheets, and the refrigerating sheets are arranged below the porous module 1. The semiconductor refrigerating sheet 2 is fixed on the radiator 5 through a module pressing frame 7.
The device platform comprises a first support 10, a fan support 11, a second support 12 and an adapter plate 9, wherein the fan support 11 is fixedly connected to the middle parts of the first support 10 and the second support 12, the adapter plate 9 is fixedly arranged above the first support 10 and the second support 12, and the radiator 5 is arranged below the adapter plate 9 and is fixedly arranged on the fan support 11. The fan bracket 11 is provided with a fan 6.
The temperature sensor 4, the semiconductor refrigerating sheet 2 and the auxiliary heating plate 3 are welded on the adapter plate 9. The device is also provided with a temperature control CPU board 8, and the temperature control CPU board 8 is fixed on a second bracket 12. The temperature control CPU board 8 is connected with the adapter board 9 through a wiring harness. The circuit of the temperature control CPU board 8 for controlling the temperature is a common temperature control circuit, and the common temperature control circuits disclosed in the prior art can be used in the invention.
Adjust every semiconductor refrigeration piece 2 through temperature sensor 4 during accuse temperature to 2 edges of every semiconductor refrigeration piece also carry out temperature compensation through auxiliary heating board 3 and adjust, make module temperature homogeneity better like this, thereby satisfy the reagent that requires higher to the temperature.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. The utility model provides a be used for porous module to assist controlling means, its characterized in that, the device includes device platform, semiconductor refrigeration piece, auxiliary heating board, temperature sensor and porous module, the device platform is equipped with the radiator, and the semiconductor refrigeration piece is fixed on the radiator, porous module below is located to the semiconductor refrigeration piece, temperature sensor installs in porous module, auxiliary heating board is installed on porous module edge.
2. An auxiliary control for a multi-well module as recited in claim 1, wherein said auxiliary heating plate comprises four heating plates, said four heating plates being enclosed around the multi-well module.
3. The auxiliary control device for the porous module as claimed in claim 1, wherein the semiconductor chilling plates comprise four plate-shaped chilling plates, and the chilling plates are arranged below the porous module.
4. The auxiliary control device for porous module as claimed in claim 1, wherein the temperature sensor is installed in the porous module through thermal grease.
5. An auxiliary control device for porous modules as claimed in claim 1 or 2, wherein the auxiliary heating plate is cured on the porous module edge by 4450 thermally conductive silicone grease.
6. The auxiliary control device for the porous module as claimed in claim 1 or 3, wherein the semiconductor chilling plate is fixed on the heat sink through a module pressing frame.
7. The auxiliary control device for the porous module as claimed in claim 1, wherein the device platform comprises a first support, a fan support, a second support and an adapter plate, the fan support is fixedly connected to the middle portions of the first support and the second support, the adapter plate is fixed above the first support and the second support, and the radiator is installed below the adapter plate and fixed on the fan support.
8. The auxiliary control device for a porous module as claimed in claim 7, wherein the temperature sensor, the semiconductor chilling plate and the auxiliary heating plate are welded on the adapter plate.
9. The auxiliary control device for a porous module as claimed in claim 7, wherein the device is further provided with a temperature-controlled CPU board, and the temperature-controlled CPU board is fixed on the second support.
10. The auxiliary control device for a multi-aperture module as claimed in claim 8, wherein the temperature control CPU board is connected to the adapter board by a wiring harness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910823397.7A CN110551605A (en) | 2019-09-02 | 2019-09-02 | Auxiliary control device for porous module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910823397.7A CN110551605A (en) | 2019-09-02 | 2019-09-02 | Auxiliary control device for porous module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110551605A true CN110551605A (en) | 2019-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910823397.7A Pending CN110551605A (en) | 2019-09-02 | 2019-09-02 | Auxiliary control device for porous module |
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| Country | Link |
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| CN (1) | CN110551605A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112345123A (en) * | 2020-10-28 | 2021-02-09 | 杭州博日科技股份有限公司 | Calibrating device for temperature measuring probe of PCR instrument module |
Citations (8)
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|---|---|---|---|---|
| JP2000102376A (en) * | 1998-09-30 | 2000-04-11 | Sanyo Electric Co Ltd | Temperature control equipment for incubator |
| JP2009277699A (en) * | 2008-05-12 | 2009-11-26 | Toshiba Corp | Heat sink, heat sink assembly, semiconductor module, and semiconductor device with cooling device |
| CN102854904A (en) * | 2012-09-11 | 2013-01-02 | 天津金思德生物技术有限公司 | Genetic molecule amplifier utilizing semiconductors |
| CN202688330U (en) * | 2011-12-31 | 2013-01-23 | 北京东胜创新生物科技有限公司 | Temperature compensation module for eliminating temperature fringe effect of gene amplifier |
| CN207435446U (en) * | 2017-09-29 | 2018-06-01 | 重庆京因生物科技有限责任公司 | A kind of PCR instrument temperature-controlling system |
| CN108731329A (en) * | 2017-04-17 | 2018-11-02 | 南京先进激光技术研究院 | A kind of cold storage device of microwell plate |
| CN208815024U (en) * | 2018-07-20 | 2019-05-03 | 杭州比格飞序生物科技有限公司 | PCR gene amplification instrument |
| CN210826139U (en) * | 2019-09-02 | 2020-06-23 | 杭州安誉科技有限公司 | Auxiliary control device for porous module |
-
2019
- 2019-09-02 CN CN201910823397.7A patent/CN110551605A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000102376A (en) * | 1998-09-30 | 2000-04-11 | Sanyo Electric Co Ltd | Temperature control equipment for incubator |
| JP2009277699A (en) * | 2008-05-12 | 2009-11-26 | Toshiba Corp | Heat sink, heat sink assembly, semiconductor module, and semiconductor device with cooling device |
| CN202688330U (en) * | 2011-12-31 | 2013-01-23 | 北京东胜创新生物科技有限公司 | Temperature compensation module for eliminating temperature fringe effect of gene amplifier |
| CN102854904A (en) * | 2012-09-11 | 2013-01-02 | 天津金思德生物技术有限公司 | Genetic molecule amplifier utilizing semiconductors |
| CN108731329A (en) * | 2017-04-17 | 2018-11-02 | 南京先进激光技术研究院 | A kind of cold storage device of microwell plate |
| CN207435446U (en) * | 2017-09-29 | 2018-06-01 | 重庆京因生物科技有限责任公司 | A kind of PCR instrument temperature-controlling system |
| CN208815024U (en) * | 2018-07-20 | 2019-05-03 | 杭州比格飞序生物科技有限公司 | PCR gene amplification instrument |
| CN210826139U (en) * | 2019-09-02 | 2020-06-23 | 杭州安誉科技有限公司 | Auxiliary control device for porous module |
Non-Patent Citations (1)
| Title |
|---|
| 张峰;刘述喜;: "基于嵌入式的DPCR仪温度控制系统的研究与设计", 重庆理工大学学报(自然科学), no. 11, pages 127 - 133 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112345123A (en) * | 2020-10-28 | 2021-02-09 | 杭州博日科技股份有限公司 | Calibrating device for temperature measuring probe of PCR instrument module |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191210 |
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| RJ01 | Rejection of invention patent application after publication |