CN102854904A - Genetic molecule amplifier utilizing semiconductors - Google Patents
Genetic molecule amplifier utilizing semiconductors Download PDFInfo
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- CN102854904A CN102854904A CN2012103349829A CN201210334982A CN102854904A CN 102854904 A CN102854904 A CN 102854904A CN 2012103349829 A CN2012103349829 A CN 2012103349829A CN 201210334982 A CN201210334982 A CN 201210334982A CN 102854904 A CN102854904 A CN 102854904A
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Abstract
The invention provides a genetic molecule amplifier utilizing semiconductors. The genetic molecule amplifier comprises an embedded temperature controller and an aluminum holder for containing reactants. The embedded temperature controller comprises an embedded processor, a touch display screen module, a data storage module and a radiating module, the touch screen module, the data storage module and the radiating module are connected with the embedded processor, the embedded processor is connected with multiple control loops, each control loop comprises a temperature collection module, a semiconductor refrigerating fin driving module and semiconductor refrigerating fins, the temperature collection module comprises a temperature collection circuit and a temperature sensor connected with the temperature collection circuit, and the semiconductor refrigerating fins and the temperature sensor are distributed on the outer side of the aluminum holder. The genetic molecule amplifier utilizing the semiconductors has the advantages that as the multiple temperature collection units and multiple semiconductor heating and refrigerating units form a closed loop system in a one-to-one corresponding manner, and by combination of the closed loop system and the radiating module, gradient temperature control is realized, temperature uniformity and accuracy are guaranteed, man and machine interaction is convenient and rapid, massive data can be stored, and the genetic molecule amplifier is safe and reliable.
Description
Technical field
The invention belongs to electronic technology field, especially relate to a kind of semiconductor gene molecule and increase the expansion instrument.
Background technology
PCR is called for short in PCR (Polymerase Chain Reaction).PCR (PCR) is a kind of method of the synthetic specific DNA fragment of external enzymatic, by a few step reaction composition one-periods such as high-temperature denatured, process annealing (renaturation) and thermophilic extensions, loop, make target DNA be able to rapid amplification, have high specificity, highly sensitive, easy and simple to handle, the characteristics such as save time.The temperature control method of PCR instrument is divided into two kinds: waters formula heating arrangement is realized the control of temperature and the control that semiconductor heating and cooling technology realizes temperature.
In existing technology, adopt semiconductor heating and cooling technology to realize the temperature regulating device of temperature, although realize allowing controlled module heat up fast and cooling function,, also exist temperature unstable, can not finish grads PCR, and the problem of complicated operation.
Summary of the invention
The problem to be solved in the present invention provides a kind of man-machine interaction practical convenient, and temperature homogeneity is good, and the semiconductor gene molecule of dependable performance increases the expansion instrument.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of semiconductor gene molecule increases the expansion instrument, comprise that embedded temperature regulating device and the described embedded temperature regulating device of the aluminium seat that is connected reactant comprise flush bonding processor and the touching display screen module that is connected with the I/O IO interface of flush bonding processor, data memory module, radiating module, also be connected to a plurality of control loops on the described flush bonding processor, described control loop comprises temperature collect module, semiconductor chilling plate driver module and semiconductor chilling plate, described temperature collect module comprises temperature collection circuit and connected temperature sensor, described temperature collection circuit is connected with flush bonding processor with the semiconductor chilling plate driver module, the control end of semiconductor chilling plate is connected with the other end of semiconductor chilling plate driver module, described semiconductor chilling plate is distributed in radiating module and holds in the middle of the reactant aluminium seat, and described temperature sensor is distributed in the aluminium seat that holds reactant;
Described flush bonding processor is to adopt the ARM chip, carries out software development based on Android operating system, is responsible for the operation of whole device, the stability of optimization system;
Described touching display screen module realizes easily man-machine control function, and the information such as the literal that demonstration needs and figure are finished corresponding operation according to the action of touch-control simultaneously;
Described data memory module is for data messages such as the user profile of storing user's establishment and PC experimental techniques.
Further, described temperature collection circuit comprises temperature sensor signal treatment circuit, filtering circuit and the A/D convertor circuit that electric signal connects, described temperature sensor signal treatment circuit comprises signal amplification circuit, described amplifying circuit is connected with temperature sensor, and A/D convertor circuit is connected with flush bonding processor.
Further, described semiconductor chilling plate driver module is H bridge driving circuit, and described semiconductor chilling plate is formed by connecting by a slice or several pieces.
Further, described data memory module adopts the SD storage card that has file system.
Further; the system software of described embedded temperature regulating device adopts user authority management mechanism; can be the user's setting code that oneself creates; simultaneously; can be stored in the SD card of file system by the content of password authority with user and experiment; both protected privacy of user safety, the copy establishment for method provides convenience again.
Further, described radiating module mainly by aluminium radiator, the control circuit of cooling fan that is connected radiator temperature sensor, radiator fan, control radiator fan with it forms, described control circuit of cooling fan and radiator temperature sensor all are connected with flush bonding processor.
Further, described multi-channel semiconductor cooling piece is symmetrically distributed in aluminium radiator according to X-axis axis and Y-direction axis and holds in the middle of the reactant aluminium seat.
Further, described a plurality of temperature sensor is symmetrically distributed in the aluminium seat outside that holds reactant according to X-axis axis and Y-direction axis.
Further, described touching display screen module adopts 7 cun true color capacitance touch screens.
Further, be connected with the overheat protector module on the described flush bonding processor.
Advantage and good effect that the present invention has are: adopt multiplex temperature collection unit and multi-channel semiconductor heating and cooling unit to form one to one closed-loop system, and in conjunction with radiating module, the control of realization gradient temperature, homogeneity and the more convenient convenience of accuracy man-machine interaction of temperature have been guaranteed, the mass data storage function, safe and reliable.
Description of drawings
Fig. 1 is module connection diagram of the present invention;
Fig. 2 is the connection layout of temperature collection circuit of the present invention;
Fig. 3 is the schematic diagram of aluminium seat part of the present invention.
Among the figure:
1, flush bonding processor 2, touching display screen module 3, data memory module
4, aluminium seat 5, semiconductor chilling plate driving 6, semiconductor chilling plate
Module
7, temperature collection circuit 8, temperature sensor 9, overheat protector module
10, radiator temperature sensor 11, aluminium radiator 12, radiator fan
13, control circuit of cooling fan
Embodiment
As shown in Figures 1 to 3:
A kind of semiconductor gene molecule of the present invention increases the expansion instrument, comprise embedded temperature regulating device and the aluminium seat 4 that holds reactant, described embedded temperature regulating device comprises flush bonding processor 1 and the touching display screen module 2 that is connected with the I/O IO interface of flush bonding processor 1, data memory module 3, radiating module, also be connected to two control loops on the described flush bonding processor 1, described control loop comprises temperature collect module, semiconductor chilling plate driver module 5 and semiconductor chilling plate 6, described temperature collect module comprises temperature collection circuit 7 and connected temperature sensor 8, described temperature collection circuit 7 is connected with flush bonding processor 1 with semiconductor chilling plate driver module 5, and the control end of semiconductor chilling plate 6 is connected with the other end of semiconductor chilling plate driver module 5;
Described radiating module mainly by aluminium radiator 11, be connected radiator temperature sensor 10, radiator fan 12, control circuit of cooling fan 13 with it and form, described control circuit of cooling fan 13 is connected with the radiator temperature sensor and all is connected with flush bonding processor 1;
It is middle with the aluminium seat 4 that holds reactant that described multi-channel semiconductor cooling piece 6 is symmetrically distributed in aluminium radiator 11 according to X-axis axis and Y-direction axis;
Described a plurality of temperature sensor 8 is symmetrically distributed in aluminium seat 4 outsides that hold reactant according to X-axis axis and Y-direction axis;
Described flush bonding processor 1 is to adopt the ARM chip, carries out software development based on Android operating system, is responsible for the operation of whole device, the stability of optimization system;
Described touching display screen module 2 realizes easily man-machine control function, and the information such as the literal that demonstration needs and figure are finished corresponding operation according to the action of touch-control simultaneously;
Described data memory module 3 is for data messages such as the user profile of storing user's establishment and PC experimental techniques.
As shown in Figure 2, described temperature collection circuit 7 comprises temperature sensor signal treatment circuit, filtering circuit and the A/D convertor circuit that electric signal connects, described temperature sensor signal treatment circuit comprises signal amplification circuit, described amplifying circuit adopts amplifier AD620 chip, described amplifying circuit is connected with temperature sensor, and A/D convertor circuit is connected with flush bonding processor 1;
Described semiconductor chilling plate driver module 5 is H bridge driving circuit, and described semiconductor chilling plate 6 is formed by connecting by a slice or several pieces;
Described data memory module 3 adopts the SD storage card that has file system;
The system software of described embedded temperature regulating device adopts user authority management mechanism, can be the user's setting code that oneself creates, simultaneously, can be stored in the SD card of file system by the content of password authority with user and experiment, both protected privacy of user safety, the copy establishment for method provides convenience again;
Described touching display screen module 2 adopts 7 cun true color capacitance touch screens;
Be connected with overheat protector module 9 on the described flush bonding processor 1.
The course of work of this example:
Flush bonding processor 1 is core controller, carry out software development based on Android operating system, be responsible for the operation of whole device, flush bonding processor 1 is according to needed temperature value, the temperature data that gathers with temperature collection circuit 7 compares, as there is a gap, then control semiconductor chilling plate 6 work, simultaneously the heat that transmits to aluminium radiator 11 according to semiconductor chilling plate 6 of flush bonding processor 1 what, determine the speed of radiator fan 12 rotating speeds, realize that radiating module according to the temperature change radiating effect of aluminium seat 4, makes aluminium seat 4 can reach rapidly and accurately assigned temperature, thereby press quickly and accurately the temperature required circulation change of PCR, finish the amplification of DNA; Touching display screen module 2 realizes easily man-machine control function, and the information such as the literal that demonstration needs and figure are finished corresponding operation according to the action of touch-control simultaneously; Data memory module 3 is for data messages such as the user profile of storing user's establishment and PC experimental techniques.
Above one embodiment of the present of invention are had been described in detail, but described content only is preferred embodiment of the present invention, can not be considered to be used to limiting practical range of the present invention.All equalizations of doing according to the present patent application scope change and improve etc., all should still belong within the patent covering scope of the present invention.
Claims (10)
1. a semiconductor gene molecule increases the expansion instrument, comprises embedded temperature regulating device and the aluminium seat that holds reactant, it is characterized in that:
Described embedded temperature regulating device comprises flush bonding processor and the touching display screen module that is connected with the I/O IO interface of flush bonding processor, data memory module, radiating module, also be connected to a plurality of control loops on the described flush bonding processor, described control loop comprises temperature collect module, semiconductor chilling plate driver module and semiconductor chilling plate, described temperature collect module comprises temperature collection circuit and connected temperature sensor, described temperature collection circuit is connected with flush bonding processor with the semiconductor chilling plate driver module, the control end of semiconductor chilling plate is connected with the other end of semiconductor chilling plate driver module, described semiconductor chilling plate is distributed in radiating module and holds in the middle of the reactant aluminium seat, and described temperature sensor is distributed on the aluminium seat that holds reactant;
Described flush bonding processor is to adopt the ARM chip, carries out software development based on Android operating system, is responsible for the operation of whole device, the stability of optimization system;
Described touching display screen module realizes easily man-machine control function, and the information such as the literal that demonstration needs and figure are finished corresponding operation according to the action of touch-control simultaneously;
Described data memory module is for data messages such as the user profile of storing user's establishment and PC experimental techniques.
2. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: described temperature collection circuit comprises temperature sensor signal treatment circuit, filtering circuit and the A/D convertor circuit that electric signal connects, described temperature sensor signal treatment circuit comprises signal amplification circuit, described amplifying circuit is connected with temperature sensor, and A/D convertor circuit is connected with flush bonding processor.
3. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: described semiconductor chilling plate driver module is H bridge driving circuit, and described semiconductor chilling plate is formed by connecting by a slice or several pieces.
4. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: described radiating module mainly by aluminium radiator, the control circuit of cooling fan that is connected radiator temperature sensor, radiator fan, control radiator fan with it forms, described control circuit of cooling fan and radiator temperature sensor all are connected with flush bonding processor.
5. semiconductor gene molecule according to claim 4 increases the expansion instrument, it is characterized in that: described multi-channel semiconductor cooling piece is symmetrically distributed in aluminium radiator according to X-axis axis and Y-direction axis and holds in the middle of the reactant aluminium seat.
6. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: described a plurality of temperature sensors are symmetrically distributed in the aluminium seat outside that holds reactant according to X-axis axis and Y-direction axis.
7. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: described data memory module adopts the SD storage card that has file system.
8. semiconductor gene molecule according to claim 7 increases the expansion instrument, it is characterized in that: the system software of described embedded temperature regulating device adopts user authority management mechanism, can be the user's setting code that oneself creates, simultaneously, can be stored in the SD card of file system by the content of password authority with user and experiment.
9. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: described touching display screen module adopts 7 cun true color capacitance touch screens.
10. semiconductor gene molecule according to claim 1 increases the expansion instrument, it is characterized in that: be connected with the overheat protector module on the described flush bonding processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103349829A CN102854904A (en) | 2012-09-11 | 2012-09-11 | Genetic molecule amplifier utilizing semiconductors |
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| CN2012103349829A CN102854904A (en) | 2012-09-11 | 2012-09-11 | Genetic molecule amplifier utilizing semiconductors |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677013A (en) * | 2013-12-17 | 2014-03-26 | 中国石油集团渤海钻探工程有限公司 | Automatic temperature adjusting device |
| CN108508819A (en) * | 2018-06-29 | 2018-09-07 | 公安部第研究所 | A kind of thermal cycler TT＆C system based on embedded technology |
| CN110456842A (en) * | 2018-05-08 | 2019-11-15 | 北京中科生仪科技有限公司 | A kind of temperature control equipment and method for nucleic acid reaction |
| CN110551605A (en) * | 2019-09-02 | 2019-12-10 | 杭州安誉科技有限公司 | Auxiliary control device for porous module |
| CN112345123A (en) * | 2020-10-28 | 2021-02-09 | 杭州博日科技股份有限公司 | Calibrating device for temperature measuring probe of PCR instrument module |
| CN112963982A (en) * | 2021-04-15 | 2021-06-15 | 上海申彦生物科技有限公司 | Heating and refrigerating module for nucleic acid extractor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110551605A (en) * | 2019-09-02 | 2019-12-10 | 杭州安誉科技有限公司 | Auxiliary control device for porous module |
| CN112345123A (en) * | 2020-10-28 | 2021-02-09 | 杭州博日科技股份有限公司 | Calibrating device for temperature measuring probe of PCR instrument module |
| CN112963982A (en) * | 2021-04-15 | 2021-06-15 | 上海申彦生物科技有限公司 | Heating and refrigerating module for nucleic acid extractor |
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