CN203643928U - Automatic temperature control module for high-power integrated operational amplifier chip - Google Patents
Automatic temperature control module for high-power integrated operational amplifier chip Download PDFInfo
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- CN203643928U CN203643928U CN201320763013.5U CN201320763013U CN203643928U CN 203643928 U CN203643928 U CN 203643928U CN 201320763013 U CN201320763013 U CN 201320763013U CN 203643928 U CN203643928 U CN 203643928U
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- Prior art keywords
- control module
- arm processor
- automatic temperature
- power integrated
- temperature control
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- 238000001816 cooling Methods 0.000 claims description 27
- 238000007599 discharging Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract 5
- 230000003321 amplification Effects 0.000 description 7
- 238000003199 nucleic acid amplification method Methods 0.000 description 7
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000002463 transducing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
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Abstract
The utility model provides an automatic temperature control module for a high-power integrated operational amplifier chip. The automatic temperature control module structurally comprises an ARM processer, a heat dissipation mechanism in control connection with the ARM processer, and a temperature sensor connected with the heat dissipation mechanism, wherein the ARM processer is in both-way communicative connection with the temperature sensor through a unibus; the ARM processer is further connected with the heat dissipation mechanism through a heat dissipation control device. Compared with the prior art, the automatic temperature control module for the high-power integrated operational amplifier chip has the characteristics of reasonable design, simple structure, convenience for use and the like, can realize the constant temperature control to a power amplifier system, can effectively guarantee heat dissipation, can effectively protect electronic parts and components when the temperature rises extremely fast and is extremely high, is strong in practicability and facilitates popularization.
Description
Technical field
The utility model relates to field of computer technology, specifically a kind of integrated transporting discharging chip automatic temperature-adjusting control module simple in structure, high-power.
Background technology
Along with the develop rapidly of integrated circuit technique, adopt the power amplification system that integrated transporting discharging chip forms progressively to substitute discrete component power amplification system, become the major product in power amplifier market.But the power amplification system that adopts integrated transporting discharging chip to form is often serious compared with generating heat greatly because of power, and traditional radiating mode just increases larger heat radiator, and this radiating mode tends to increase system and takes up room, and also can increase cost simultaneously.Be unfavorable for produce market popularization.
For this reason, this patent has proposed a kind of high-power integrated transporting discharging chip automatic temperature-adjusting control module, and this module can detect power amplification system temperature in real time, automatically controls cooling system, realizes the temperature control to power amplification system.
Summary of the invention
Technical assignment of the present utility model is to solve the deficiencies in the prior art, and a kind of simple in structure, high-power integrated transporting discharging chip automatic temperature-adjusting control module is provided.
The technical solution of the utility model realizes in the following manner, the high-power integrated transporting discharging chip of this one automatic temperature-adjusting control module, the temperature sensor that its structure comprises arm processor, is connected by the cooling mechanism of arm processor control linkage, with cooling mechanism, described arm processor is connected with temperature sensor two-way communication by unibus, and this arm processor also connects above-mentioned cooling mechanism by controller for heat sink.The automatic temperature-adjusting control module that this patent proposes is mainly to adopt arm processor as master controller, the temperature value of the continuous reading temperature sensor of processor, by the rotating speed of the temperature value control cooling system fan read, this closed-loop control process realizes by pid algorithm, to realize the thermostatic control to high-power amplifier chip temperature, this mode both can ensure that chip temperature was in a constant scope, can effectively control again cooling system volume and power.
As preferably, described cooling mechanism comprises radiator fan and semiconductor chilling plate, corresponding, controller for heat sink comprises fan control device and cooling piece control device, wherein fan control device refers to the fan governor being arranged between arm processor and radiator fan, and cooling piece control device refers to and is arranged between arm processor and radiator fan and relay and the semiconductor chilling plate controller of sequentially connecting.In this technical scheme, radiator fan is also connected with aluminum thermal fin, and then ensures radiating effect; Semiconductor chilling plate is electric current transducing matrix part, by the control of input current, can realize high-precision temperature control, adds temperature measurement and control means, is easy to realize remote control, program control, computer control, is convenient to form automatic control system.
Further, described arm processor is also connected with crystal.
In sum, the beneficial effect that the utility model compared with prior art produced is:
That the high-power integrated transporting discharging chip of one of the present utility model automatic temperature-adjusting control module has is simple in structure, easy to use, novel, integrated level is high, the feature such as safe and reliable; can realize the thermostatic control of power amplification system; both can effectively ensure heat radiation; again can be too fast in temperature rise, effective protection electronic devices and components when excess Temperature; the control module that the utility model provides can effectively reduce volume; reduce system cost; meet the heat radiation requirement of high-power integrated transporting discharging power amplification system completely; practical, be easy to promote.
Brief description of the drawings
Accompanying drawing 1 is structural representation block diagram of the present utility model.
Mark in accompanying drawing represents respectively:
1, arm processor, 2, crystal, 3, relay, 4, semiconductor chilling plate controller, 5, fan governor, 6, cooling mechanism, 6.1, radiator fan, 6.2, semiconductor chilling plate, 7, temperature sensor.
Embodiment
Below in conjunction with accompanying drawing, the high-power integrated transporting discharging chip of one of the present utility model automatic temperature-adjusting control module is described in detail below.
As shown in Figure 1, the high-power integrated transporting discharging chip of this one automatic temperature-adjusting control module, the temperature sensor 7 that its structure comprises arm processor 1, is connected by the cooling mechanism 6 of arm processor 1 control linkage, with cooling mechanism 6, described arm processor 1 is connected with temperature sensor 7 two-way communications by unibus, and this arm processor 1 also connects above-mentioned cooling mechanism 6 by controller for heat sink.
Described cooling mechanism 6 comprises radiator fan 6.1 and semiconductor chilling plate 6.2, corresponding, controller for heat sink comprises fan control device and cooling piece control device, wherein fan control device refers to the fan governor 5 being arranged between arm processor 1 and radiator fan 6.1, and cooling piece control device refers to and is arranged between arm processor 1 and radiator fan 6.1 and relay 3 and the semiconductor chilling plate controller 4 of sequentially connecting.
Described arm processor 1 is also connected with crystal 2.
Described radiator fan 6.1 is also connected with aluminum thermal fin, and then ensures radiating effect; Semiconductor chilling plate 6.2 is electric current transducing matrix parts, by the control of input current, can realize high-precision temperature control, add temperature measurement and control means, be easy to realize remote control, program control, computer control, be convenient to form automatic control system, rotation speed of the fan can be controlled, to realize the control to temperature, cooling system increases semiconductor chilling plate 6.2 simultaneously, can raise at temperature of heating elements too fast, in the situation that fan cannot ensure to dispel the heat, start cooling piece refrigeration, temperature is reduced rapidly.
The main control module of this patent adopts STM32F103R8T6 as arm processor 1, this processor is a 32 arm processors 1 based on Cortex-M3 core, nearly in the sheet of 64KB, flash provides abundant program's memory space, the on-chip SRAM of 20KB provides abundant program running space, in addition the integrated 2 road SPI of this processor, 2 road I2C, 3 road USART, 1 road USB and 1 road CAN bus, inside and outside abundant sheet, be made as chip and bring convenience with communicating by letter of equipment, realized the high-speed cruising of program up to the processor host frequency of 72MHz.
Fan governor 5 can adopt STM32F103 chip and configuration circuit thereof to form, and control circuit is mainly responsible for reading temperature sensor temperature value, and according to temperature value control rotation speed of the fan, to reach the control to system temperature; 4 of semiconductor chilling plate controllers can adopt the control chip of existing based semiconductor cooling piece.
If power amplifier chips power is relatively low when work, only depend on fan can meet heat radiation requirement, cooling piece is not worked; If fan cannot meet radiating requirements, will start cooling piece and carry out refrigeration radiating, can effectively ensure like this system radiating, protection power amplifier chips can not burn out because of excess Temperature.
Except the technical characterictic described in instructions, be the known technology of those skilled in the art.
Claims (3)
1. a high-power integrated transporting discharging chip automatic temperature-adjusting control module, it is characterized in that: the temperature sensor that its structure comprises arm processor, is connected by the cooling mechanism of arm processor control linkage, with cooling mechanism, described arm processor is connected with temperature sensor two-way communication by unibus, and this arm processor also connects above-mentioned cooling mechanism by controller for heat sink.
2. the high-power integrated transporting discharging chip of one according to claim 1 automatic temperature-adjusting control module, it is characterized in that: described cooling mechanism comprises radiator fan and semiconductor chilling plate, corresponding, controller for heat sink comprises fan control device and cooling piece control device, wherein fan control device refers to the fan governor being arranged between arm processor and radiator fan, and cooling piece control device refers to and is arranged between arm processor and radiator fan and relay and the semiconductor chilling plate controller of sequentially connecting.
3. the high-power integrated transporting discharging chip of one according to claim 1 automatic temperature-adjusting control module, is characterized in that: described arm processor is also connected with crystal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320763013.5U CN203643928U (en) | 2013-11-28 | 2013-11-28 | Automatic temperature control module for high-power integrated operational amplifier chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320763013.5U CN203643928U (en) | 2013-11-28 | 2013-11-28 | Automatic temperature control module for high-power integrated operational amplifier chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203643928U true CN203643928U (en) | 2014-06-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320763013.5U Expired - Fee Related CN203643928U (en) | 2013-11-28 | 2013-11-28 | Automatic temperature control module for high-power integrated operational amplifier chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN203643928U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106681396A (en) * | 2016-12-02 | 2017-05-17 | 安徽波维电子科技有限公司 | Far-infrared intelligent temperature control system |
| CN106708122A (en) * | 2016-11-20 | 2017-05-24 | 广西大学 | Laboratory petri dish integrated temperature detection and management system |
| CN106774492A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of small-sized quick high accuracy constant temperature system based on TEC |
| CN106774504A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of low noise temperature control system based on digital PID |
| CN110674007A (en) * | 2019-09-05 | 2020-01-10 | 浪潮电子信息产业股份有限公司 | Server heat dissipation system, method and device and whole cabinet server |
| WO2021129757A1 (en) * | 2019-12-25 | 2021-07-01 | 中兴通讯股份有限公司 | Temperature control method and system and storage medium |
-
2013
- 2013-11-28 CN CN201320763013.5U patent/CN203643928U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106708122A (en) * | 2016-11-20 | 2017-05-24 | 广西大学 | Laboratory petri dish integrated temperature detection and management system |
| CN106681396A (en) * | 2016-12-02 | 2017-05-17 | 安徽波维电子科技有限公司 | Far-infrared intelligent temperature control system |
| CN106774492A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of small-sized quick high accuracy constant temperature system based on TEC |
| CN106774504A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of low noise temperature control system based on digital PID |
| CN110674007A (en) * | 2019-09-05 | 2020-01-10 | 浪潮电子信息产业股份有限公司 | Server heat dissipation system, method and device and whole cabinet server |
| WO2021129757A1 (en) * | 2019-12-25 | 2021-07-01 | 中兴通讯股份有限公司 | Temperature control method and system and storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20161128 |
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| CF01 | Termination of patent right due to non-payment of annual fee |