JP5897275B2 - Temperature control unit, substrate mounting table, substrate processing apparatus, temperature control system, and substrate processing method - Google Patents

Description

  The present invention relates to a temperature control unit, a substrate mounting table, a substrate processing apparatus, a temperature control system, and a substrate processing method that are used when a plurality of heat treatments having different processing temperatures are performed on a substrate.

  In the manufacturing process of an FPD (Flat Panel Display), a solar cell, or a MEMS (Micro Electro Mechanical Systems), the substrate is subjected to various heat treatments, for example, film formation. Conventionally, when a plurality of heat treatments with different processing temperatures are performed on a substrate, a different substrate processing apparatus performs the corresponding heat treatment on the substrate for each heat treatment. In recent years, in order to improve throughput from the viewpoint of improving productivity, It is required to perform a plurality of heat treatments with different processing temperatures in one substrate processing apparatus.

  As such a substrate processing apparatus, a substrate mounting table for mounting a substrate in a processing chamber is provided, and the substrate mounting table includes a cooling jacket in which a medium flow path is formed and a heater disposed under the cooling jacket. A substrate processing apparatus having the same is known (for example, see Patent Document 1).

  In the substrate processing apparatus of Patent Document 1, the heater is heated to heat the substrate by raising the temperature of the mounting surface of the substrate mounting table, specifically, the contact surface of the cooling jacket with the substrate. The substrate is cooled by flowing a low-temperature refrigerant through the medium flow path to lower the temperature of the contact surface.

Japanese Examined Patent Publication No. 7-105422

  However, in the substrate processing apparatus of Patent Document 1, since the cooling jacket and the heater are separated, a physical boundary is generated between the cooling jacket and the heater. For example, when the substrate is heated by the heater, the boundary hinders the heat from the heater from being transferred to the cooling jacket as a thermal resistance, so that the temperature of the substrate does not change quickly.

  An object of the present invention is to provide a temperature control unit, a substrate mounting table, a substrate processing apparatus, a temperature control system, and a substrate processing method that can change the temperature of the substrate quickly.

In order to achieve the above object, the temperature control unit according to claim 1 is a temperature control unit for controlling the temperature of the substrate in contact with the substrate, the plate-shaped body in contact with the substrate, and the body a plurality of heater set embedded within the formed within the body and a medium flow passage through the interior predetermined temperature of the medium, the plurality of heaters sets of each of the plurality of linear A heater and a wiring for connecting the heaters to each other; the heaters are arranged in parallel to each other; the medium flow path is arranged to pass through a portion between two adjacent heaters ; in the surface opposite to the contact surface with the substrate in the body, further comprising characterized Rukoto the placed openable lid to correspond to the position of each of said heaters embedded in the body.

  A temperature control unit according to a second aspect is the temperature control unit according to the first aspect, wherein each heater and the medium flow path are alternately spaced at equal intervals in a direction perpendicular to the one heater in a plan view of the main body. It is characterized by being arranged.

Temperature control unit according to claim 3, wherein, in the temperature control unit according to claim 1 or 2, wherein said body has a threaded hole for screws for attaching the lid, the medium flow path of the two adjacent said The meandering is performed between the heaters so as to avoid the screw holes.

A temperature control unit according to a fourth aspect is the temperature control unit according to the third aspect , wherein a curvature of the curved portion of the meandering medium flow path in a plan view of the main body is 40 mm or more.

In order to achieve the above object, the substrate mounting table according to claim 5 is a substrate mounting table on which a substrate is mounted, the temperature control unit for controlling the temperature of the substrate in contact with the substrate, and the temperature and a base for supporting the control unit, the temperature control unit includes a plate-like body in contact with the substrate, and a plurality of Heater sets embedded in said body, is formed in said body inner Each of the plurality of heater sets includes a plurality of linear heaters and a wiring for connecting the heaters to each other, and Arranged in parallel to each other, the medium flow path is arranged so as to pass through a portion between two adjacent heaters, and the temperature control unit is a surface of the main body opposite to the contact surface with the substrate In each front embedded in the main body Further comprising wherein the Rukoto the placed openable lid to correspond to the position of the heater.

In order to achieve the above object, a substrate processing apparatus according to a sixth aspect of the present invention is a substrate processing apparatus for processing a substrate, wherein the substrate is accommodated in a accommodating chamber for accommodating the substrate, and the substrate is mounted on the accommodating chamber. The substrate mounting table includes a temperature control unit that controls the temperature of the substrate in contact with the substrate, and a base that supports the temperature control unit, and the temperature control unit is closed and a plate-like body in contact with the substrate, and a plurality of Heater sets embedded in said body, and a medium flow passage through the interior predetermined temperature of the medium is formed in said body Each of the plurality of heater sets includes a plurality of linear heaters and a wiring for connecting the heaters to each other, the heaters are arranged in parallel to each other, and the medium flow paths are adjacent to each other. Arranged to go through the part between the two heaters The temperature control unit, said contact surface with the substrate in the body at the side opposite, further arranged openable lid to correspond to the position of each of said heaters embedded in the body equipped and wherein the Rukoto.

In order to achieve the above object, a temperature control system according to claim 7 is a temperature control system for controlling the temperature of a substrate, wherein a plate-shaped main body that comes into contact with the substrate and a plurality of embedded main bodies are embedded in the main body. and Heater set of, and a medium flow passage through the interior predetermined temperature of the medium is formed in said body, a temperature control unit for controlling the temperature of the substrate in contact with said substrate, said A heater control unit that controls the amount of heat generated by the heater; and a medium control unit that controls the flow rate and temperature of the medium flowing through the medium flow path. In the main body of the temperature control unit , each of the plurality of heater sets is And a plurality of linear heaters and wiring for connecting the heaters to each other, the heaters are arranged in parallel to each other, and the medium flow path passes through a portion between two adjacent heaters. Arranged as Is, the temperature control unit, in the surface opposite to the contact surface with the substrate in the body, the placed openable lid to correspond to the position of each of said heaters embedded in the body further comprising wherein the Rukoto.

In order to achieve the above object, the substrate processing method according to claim 8 is a temperature control unit for controlling the temperature of the substrate in contact with the substrate, the plate-shaped body in contact with the substrate, and the body A plurality of linear heaters embedded in the medium, and a medium flow path formed in the main body through which a medium having a predetermined temperature flows. The heaters are arranged in parallel to each other, and the medium flow path Is a substrate processing method using a temperature control unit arranged so as to pass through a portion between two adjacent heaters, and when the substrate is cooled to a target cooling temperature, the target cooling to the medium flow path When a medium having a temperature lower than the temperature is supplied and the substrate is heated to a target heating temperature, the heater is caused to generate heat, and a medium having a temperature higher than the target heating temperature is supplied to the medium flow path. And

The substrate processing method according to claim 9 is the substrate processing method according to claim 8 , wherein the temperature of the main body of the temperature control unit is set to a first control change temperature that is higher than the target cooling temperature by a first predetermined temperature. When the temperature reaches, the temperature of the medium supplied to the medium flow path is changed to the target cooling temperature.

A substrate processing method according to a tenth aspect is the substrate processing method according to the ninth aspect , wherein the first predetermined temperature is 2 ° C. or higher and lower than 20 ° C.

The substrate processing method of claim 11, wherein the substrate processing method of claim 9 or 10, wherein the temperature of the body of the temperature control unit, a second control change higher second predetermined temperature than the target cooling temperature When the temperature is reached, the heater is caused to generate heat, and the second predetermined temperature is lower than the first predetermined temperature.

A substrate processing method according to a twelfth aspect is the substrate processing method according to the eleventh aspect , wherein the second predetermined temperature is 1 ° C. or higher and lower than 10 ° C.

  According to the present invention, since not only the medium flow path but also a plurality of heaters are arranged in the main body of the temperature control unit, the transfer of heat from the heater to the main body is not hindered. As a result, the temperature of the substrate can be changed quickly. Moreover, since each heater is arrange | positioned mutually parallel and a medium flow path is arrange | positioned so that it may be located between two adjacent heaters, the balance of the arrangement | positioning of the heating location in the main body and a cooling location can be improved, Thus, the temperature of the substrate in contact with the main body can be changed stably and uniformly.

  According to the present invention, when the substrate is cooled to the target cooling temperature, the medium having a temperature lower than the target cooling temperature is supplied to the medium flow path in the main body of the temperature control unit, so that the substrate is rapidly cooled. Therefore, the temperature of the substrate can be changed quickly.

It is sectional drawing which shows schematically the structure of the substrate processing apparatus which concerns on embodiment of this invention. FIG. 2 is a diagram schematically showing a configuration of a temperature control unit in FIG. 1, FIG. 2 (A) is a horizontal sectional view, FIG. 2 (B) is a longitudinal sectional view, and FIG. 2 (C) is a bottom view. is there. It is a figure which shows schematically the structure of the modification of the temperature control unit in FIG. 1, FIG. 3 (A) is a horizontal sectional view, FIG.3 (B) is a longitudinal cross-sectional view, FIG.3 (C) is FIG. It is a bottom view. It is a sequence diagram which shows each part temperature at the time of the cooling of the board | substrate in the substrate processing method which concerns on embodiment of this invention. It is a sequence diagram which shows each part temperature at the time of the cooling of the board | substrate in the modification of the substrate processing method which concerns on embodiment of this invention. It is a sequence diagram which shows each part temperature at the time of the heating of the board | substrate in the substrate processing method which concerns on embodiment of this invention. It is a sequence diagram which shows each part temperature at the time of the heating of the board | substrate in the modification of the substrate processing method which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, a substrate processing apparatus according to an embodiment of the present invention will be described.

  FIG. 1 is a cross-sectional view schematically showing a configuration of a substrate processing apparatus according to the present embodiment.

  In FIG. 1, a substrate processing apparatus 10 includes a storage chamber 11 that stores a substrate, a substrate mounting table 12 that is placed in a lower portion of the storage chamber 11 and places a substrate W, and a substrate in an upper portion of the storage chamber 11. A gas supply unit 13 having a shower head shape disposed so as to face the mounting table 12 is provided, and a film forming process is performed on the substrate W accommodated in the accommodating chamber 11.

  The substrate mounting table 12 controls the temperature of the mounted substrate W, and the gas supply unit 13 supplies a processing gas into the storage chamber 11. In the substrate processing apparatus 10, the gas supply unit 13 supplies a film forming process gas, and the substrate mounting table 12 heats the substrate W to a predetermined high temperature, thereby performing a film forming process on the substrate W.

  The substrate mounting table 12 includes a base portion 14 standing from below the storage chamber 11 and a temperature control unit 15 supported by the base portion 14 at the upper end. The temperature control unit 15 is embedded in a plate-like unit main body 16 that contacts the substrate W, a heater 17 embedded therein, a chiller channel 18 (medium channel) formed therein, and the inside thereof. Temperature sensor A. The unit main body 16 is made of a material having high heat conductivity, for example, aluminum, and the heater 17 is connected to an external heater controller 19 (heater control unit) via a wiring 20 and supplied with electric power from the heater controller 19. Fever. The chiller flow path 18 is connected to an external chiller controller 21 (medium control unit) via a pipe 22, and a medium such as Galden (registered trademark) circulated and supplied from the chiller controller 21 flows through the chiller flow path 18. .

  The heater 17 generates heat to raise the temperature of the unit main body 16 to heat the substrate W in contact with the unit main body 16, and the chiller flow path 18 has a low-temperature medium (refrigerant) flowing through the inside of the unit main body 16. The substrate W in contact with the unit main body 16 is cooled by lowering the temperature. The heater controller 19, the chiller controller 21 and the temperature sensor A are connected to the device controller 23. The device controller 23 is connected to the heater controller 19 and the chiller so that the temperature of the temperature sensor A embedded in the unit body 16 is within a predetermined range. The controller 21 is controlled. Specifically, the heater controller 19 receives a signal from the apparatus controller 23 and controls the supply amount and supply timing of the electric power supplied to the heater 17 according to the signal, and the chiller controller 21 also receives the signal from the apparatus controller 23 and receives the signal. The temperature, supply amount, and supply timing of the medium supplied to the chiller channel 18 are controlled according to

  2 is a diagram schematically showing the configuration of the temperature control unit in FIG. 1, FIG. 2 (A) is a horizontal sectional view, FIG. 2 (B) is a longitudinal sectional view, and FIG. 2 (C). Is a bottom view.

  In FIG. 2, a temperature sensor A is embedded in the unit main body 16 of the temperature control unit 15, and six linear heaters 17 are arranged in parallel to each other. The position where the temperature sensor A is embedded is preferably a portion close to the contact surface 16a with the substrate W in the cross-sectional view (see FIG. 2B), and the central portion is desirable in the bottom view (FIG. 2 ( C)) is not particularly limited. Each heater 17 is divided into two sets having an E shape in plan view by two electric wires 20 connecting the three heaters 17 respectively. Each set is arranged such that the open ends of the E-shapes face each other, and one heater 17 in the other set is interposed between two adjacent heaters 17 in one set.

  A single chiller channel 18 is formed inside the unit body 16. The chiller flow path 18 passes through a portion between the two heaters 17 so as to be located at an equal distance between the two heaters 17 between the two adjacent heaters 17 in plan view, and bends at the end of each heater 17. It arrange | positions so that it may have a part. Further, in the unit main body 16, the heaters 17 and the chiller flow paths 18 are alternately arranged at equal intervals in the direction D perpendicular to the one heater 17 in a plan view (FIG. 2A).

  On the back surface 16b of the unit body 16 opposite to the contact surface 16a with the substrate W, the maintenance lids 24, 25 exhibiting an E shape so as to correspond to each set of heaters 17 embedded in the unit body 16. Is provided. The unit main body 16 has screw holes 26 for mounting screws for attaching the lids 24 and 25 for maintenance to the unit main body 16. In the present embodiment, as shown in FIG. 2A, two screw holes 26 are provided for one heater 17, but the number of screw holes 26 is not particularly limited.

  In the temperature control unit 15, when the temperature sensor A fails or when a certain heater 17 is disconnected, the unit main body 16 is removed, and the mounting screw 24 is removed to open the rear maintenance lid 24 or 25. Then, the failed temperature sensor A or the disconnected heater 17 is replaced.

  According to the temperature control unit 15 of FIG. 2, not only the chiller flow path 18 but also a plurality of heaters 17 are arranged in the unit main body 16, and thus occurs when the heater 17 and the chiller flow path 18 are provided as separate units. Since there is no boundary between the heater 17 and the chiller flow path 18 and there is no thermal resistance due to the boundary, the transfer of heat from the heater 17 to the unit body 16 is not hindered. Moreover, since the temperature sensor A is embedded in the unit main body 16, the temperature of the unit main body 16 can be measured with high accuracy. As a result, the temperature of the substrate W can be changed quickly.

  In the temperature control unit 15, the heaters 17 are arranged in parallel to each other, the chiller flow path 18 is arranged so as to pass through a portion between two adjacent heaters 17, and 1 in a plan view of the unit main body 16. Since the heaters 17 and the chiller flow paths 18 are alternately arranged at equal intervals in the direction D perpendicular to the two heaters 17, the balance of the arrangement of heating points and cooling points in the unit main body 16 can be improved. As a result, the temperature of the substrate W in contact with the unit main body 16 can be changed stably and uniformly.

  Further, by embedding a temperature sensor A for monitoring the temperature of the unit main body 16 at a position as close as possible to the contact surface 16a with the substrate W, the temperature between the substrate W and the unit main body 16 measured by the temperature sensor A is measured. Since the gradient can be reduced, the temperature of the substrate W can be accurately controlled.

  In addition, the temperature control unit 15 further includes maintenance covers 24 and 25 that can be opened and closed arranged on the back surface 16b of the unit body 16 so as to correspond to the positions of the heaters 17, so that the temperature sensor A or Even if the heater 17 is damaged, the heater 17 can be replaced, and the running cost of the temperature control unit 15 can be reduced. Further, since the maintenance lids 24 and 25 are arranged not on the contact surface 16a of the unit main body 16 but on the back surface 16b, the boundary between the maintenance lids 24 and 25 and the unit main body 16 becomes a thermal resistance. The heating of the substrate W by the heater 17 and the cooling of the substrate W by the refrigerant flowing inside the chiller channel 18 are not hindered, and the temperature of the substrate W can be changed more quickly.

  In the present embodiment, the heater 17 has been described as a linear heater parallel to each other. However, according to the shape of the area where heat exchange is performed, the distance between the heaters of the same shape is constant. You may arrange | position so that it may become. In this case, the curved heater may be, for example, a heater formed of an arcuate curve or a parabolic curve, or a curved heater that meanders in one direction. Also good. In the case of a meandering heater, adjacent heaters may have a mirror-symmetrical shape or may have a parallel-moving shape.

  Furthermore, in the present embodiment, the chiller flow path 18 has been described as a single-line flow path consisting of a single flow path. However, the chiller flow path 18 is configured as a multiple-line flow path consisting of two or more flow paths. Also good. A single flow path is likely to cause a temperature difference between upstream and downstream, but if it is configured with multiple flow paths, the single system flow path will be shortened, so the temperature difference between the upstream and downstream should be reduced. And non-uniformity of heat exchange in the surface of the unit body 16 can be alleviated.

  3 is a diagram schematically showing a configuration of a variation of the temperature control unit in FIG. 1, FIG. 3 (A) is a horizontal sectional view, FIG. 3 (B) is a longitudinal sectional view, and FIG. (C) is a bottom view. This modification differs from the temperature control unit 15 of FIG. 2 in the number of heaters and the shape of the chiller.

  By the way, in order to ensure the function of each screw hole 26, for example, the exertion of the fastening force and the resistance to the fastening force, it is necessary to dispose each screw hole 26 apart from the heater 17 and the chiller channel 18 by a certain distance or more. . As a result, the location of the heater 17 and the chiller channel 18 depends on the location of the screw hole 26. Specifically, in the temperature control unit 15 of FIG. 2, the heater 17 and the chiller flow path 18 are formed in a straight line. Since the number of heaters 17 that cannot be placed closer to each other is limited, and the medium flow path 18 cannot be bent finely, the in-plane temperature distribution in the unit main body 16 may be non-uniform. On the other hand, in the temperature control unit 27 of FIG. 3, the chiller flow path 18 meanders so as to avoid the screw hole 26 for the mounting screw between the two adjacent heaters 17. Accordingly, if each screw hole 26 is arranged inside each curved portion 18a in the chiller flow path 18, a certain distance from each screw hole 26 to the chiller flow path 18 can be secured, and the curved portion adjacent to the curved portion 18a. The part 18 b can be brought close to the heater 17. Thereby, each heater 17 and the chiller flow path 18 can be brought closer to the heater 17 and the chiller flow path 18 in the temperature control unit 15 of FIG. As a result, more heaters 17 can be arranged in the unit main body 16 and the chiller channel 18 can be bent more finely, so that in-plane temperature uniformity in the unit main body 16 can be improved. For example, in the temperature control unit 27 of FIG. 3, eight heaters 17 can be arranged.

  In the temperature control unit 27, the curvature of the meandering chiller channel 18 in the plan view of the unit body 16 is set to a radius of 40 mm or more. Thereby, since the conductance of the chiller flow path 18 does not extremely decrease, the pressure loss of the medium flowing in the chiller flow path 18 does not occur, and the supply efficiency of the medium can be prevented from decreasing.

  In the present modification, the chiller channel 18 is meandered to avoid the screw hole 26, but the heater 17 may meander instead of the chiller channel 18 to avoid the screw hole 26.

  Next, a substrate processing method according to an embodiment of the present invention will be described. The substrate processing method according to the present embodiment is executed by the apparatus controller 23 in the substrate processing apparatus 10 including the temperature control unit 15. In the substrate processing method according to the present embodiment, the temperature of the unit main body 16 is controlled by the heater 17 and the chiller channel 18 on the assumption that the temperature of the unit main body 16 substitutes the temperature of the substrate W.

  FIG. 4 is a sequence diagram showing the temperature of each part during substrate cooling in the substrate processing method according to the present embodiment.

  In FIG. 4, for example, when cooling to a target cooling temperature of the substrate W of 250 ° C., for example, 120 ° C. is started, the heater controller 19 stops supplying power to the heater 17, and the chiller controller 21 The temperature of the medium supplied to the path 18 is lowered to a cooling temperature, for example, 80 ° C., which is lower than the target cooling temperature. Thereafter, the unit main body 16 is cooled by a medium having a cooling temperature, and a temperature (first control change temperature) that is higher than the target cooling temperature by a predetermined temperature (first predetermined temperature) of 2 ° C. or higher and lower than 20 ° C., For example, when reaching 130 ° C., the chiller controller 21 changes the temperature of the medium supplied to the chiller flow path 18 to the target cooling temperature, and reduces the temperature drop rate of the unit body 16 by reducing the temperature drop rate.

  According to the substrate processing method according to the present embodiment, when the substrate W is cooled to the target cooling temperature, a medium having a temperature (cooling temperature) lower than the target cooling temperature is supplied to the chiller channel 18. Therefore, the temperature of the substrate W can be changed quickly. Further, in the substrate processing method according to the present embodiment, when the temperature of the unit body 16 reaches the first control change temperature that is higher than the target cooling temperature, the temperature of the medium supplied to the chiller flow path 18 is targeted. Since the temperature is changed to the cooling temperature, the unit main body 16 is not excessively cooled, and the temperature of the unit main body 16 can be prevented from falling below the target cooling temperature.

  In the substrate processing method according to the present embodiment described above, when the supply of power to the heater 17 is stopped, the supply of power is not resumed thereafter, but the supply of power may be intentionally resumed.

  FIG. 5 is a sequence diagram showing the temperature of each part during the cooling of the substrate in the modification of the substrate processing method according to the present embodiment.

  In FIG. 5, when the cooling of the substrate W is started, the heater controller 19 stops the supply of power to the heater 17, and the chiller controller 21 reduces the temperature of the medium supplied to the chiller flow path 18 to the cooling temperature. When the unit main body 16 is cooled and reaches the first control change temperature, the chiller controller 21 changes the temperature of the medium supplied to the chiller flow path 18 to the target cooling temperature.

  Thereafter, the unit body 16 is further cooled to a temperature (second control change temperature) higher than a target cooling temperature by a predetermined temperature (second predetermined temperature) that is 1 ° C. or higher and lower than 10 ° C., for example, 125 ° C. When reaching, the heater controller 19 resumes the supply of power to the heater 17. As a result, even after the temperature of the medium is changed to the target cooling temperature, the cooling rate of the unit body 16 can be reduced by heating the unit body 16 even if the cooling rate of the unit body 16 does not decrease as expected. Thus, it is possible to reliably prevent the temperature of the unit body 16 from falling below the target cooling temperature.

  In the substrate processing method according to the present embodiment, the temperature of the medium supplied to the chiller flow path 18 may be changed even when the substrate W is heated.

  FIG. 6 is a sequence diagram showing the temperature of each part when the substrate is heated in the substrate processing method according to the present embodiment.

  In FIG. 6, for example, when heating to a target heating temperature of the substrate W of 60 ° C., for example, 250 ° C. is started, the heater controller 19 starts supplying power to the heater 17, and the chiller controller 21 The temperature of the medium supplied to the path 18 is increased to a heating temperature that is higher than the target heating temperature, for example, 280 ° C. After that, when the unit main body 16 is heated and reaches a temperature (third control change temperature) that is lower than the target heating temperature by a predetermined temperature of 2 ° C. or more and less than 20 ° C. (for example, 240 ° C.), for example, 240 ° C. The temperature of the medium supplied to the flow path 18 is changed to the target heating temperature.

  In the substrate processing method described above, when the substrate W is heated to the target heating temperature, a medium having a temperature (heating temperature) higher than the target heating temperature is supplied to the chiller flow path 18, so that the substrate W is heated quickly. Therefore, the temperature of the substrate W can be changed quickly.

  In the substrate processing method described above, when the temperature of the unit body 16 reaches the third control change temperature lower than the target heating temperature, the temperature of the medium supplied to the chiller flow path 18 is changed to the target heating temperature. Therefore, the unit main body 16 is not heated excessively, and thus the temperature of the unit main body 16 can be prevented from exceeding the target heating temperature.

  In the substrate processing method described above, when the supply of power to the heater 17 is started, the supply of power is not stopped thereafter, but the supply of power may be intentionally stopped.

  FIG. 7 is a sequence diagram showing the temperature of each part at the time of heating the substrate in the modification of the substrate processing method according to the present embodiment.

  In FIG. 7, when the heating of the substrate W is started, the heater controller 19 starts supplying power to the heater 17, and the chiller controller 21 raises the temperature of the medium supplied to the chiller flow path 18 to the heating temperature. When the unit main body 16 is heated and reaches the third control change temperature, the chiller controller 21 changes the temperature of the medium supplied to the chiller flow path 18 to the target heating temperature.

  After that, when the unit main body 16 is further heated and reaches a temperature (fourth control change temperature) lower than the target heating temperature by a predetermined temperature that is 1 ° C. or more and less than 10 ° C., for example, 245 ° C., the heater controller 19 The supply of power to the heater 17 is stopped. Thus, after changing the temperature of the medium to the target heating temperature, even if the rate of temperature increase of the unit body 16 does not decrease as expected, the heat generation of the heater 17 is stopped and the amount of heat supplied to the unit body 16 is rapidly increased. Thus, the rate of temperature increase of the unit main body 16 can be relaxed, so that the temperature of the unit main body 16 can be reliably prevented from exceeding the target heating temperature.

  As described above, the temperature control unit 15 in the substrate mounting table 12 of the substrate processing apparatus 10 in which the substrate processing method according to the present embodiment is performed includes not only the chiller flow path 18 but also a plurality of The heater 17 and the temperature sensor A are arranged, and the temperature of the unit body 16 is as shown in FIGS. 6 and 7 by monitoring the temperature of the medium flowing through the chiller flow path 18 and the temperature of the heater 17 by the temperature sensor A. In addition, it is possible to accurately execute the substrate processing method in which heating by the heater 17 and heating by the chiller flow path 18 are used in combination.

  The substrate processing method according to the present embodiment described above is preferably used for temperature adjustment of the substrate W during a plurality of film forming processes having different processing temperatures. However, the substrate processing method in the storage chamber 11 when the substrate processing method is executed. The pressure is not particularly limited and may be atmospheric pressure or vacuum.

  In addition, although the case where the film formation process is performed has been described in the present embodiment, the process to which the present invention can be applied may be a process that requires a rapid temperature change, and is limited to the above-described film formation process. I can't.

  In addition, the substrate processing method according to the present embodiment described above is executed by the apparatus controller 23, but an external server (not shown) connected to the substrate processing apparatus 10 via a network is connected to the heater controller 19 or the chiller controller 21. You may perform by controlling operation | movement.

  Furthermore, the medium supplied to the chiller channel 18 is not limited to Galden, and for example, silicone oil which is an oil-based medium can be used.

  Although the present invention has been described using the above embodiment, the present invention is not limited to the above embodiment.

  An object of the present invention is to supply a computer or the like a storage medium that records a software program that implements the functions of the above-described embodiments, and the computer CPU reads and executes the program stored in the storage medium. Is also achieved.

  In this case, the program itself read from the storage medium realizes the functions of the above-described embodiment, and the program and the storage medium storing the program constitute the present invention.

  Examples of storage media for supplying the program include RAM, NV-RAM, floppy (registered trademark) disk, hard disk, magneto-optical disk, CD-ROM, CD-R, CD-RW, DVD (DVD-). Any optical disc such as ROM, DVD-RAM, DVD-RW, DVD + RW), magnetic tape, non-volatile memory card, other ROM, or the like may be used. Alternatively, the program may be supplied to the computer by downloading it from another computer or database (not shown) connected to the Internet, a commercial network, a local area network, or the like.

  Further, by executing the program read by the CPU of the computer, not only the functions of the above embodiments are realized, but also an OS (operating system) running on the CPU based on the instructions of the program. A case where part or all of the actual processing is performed and the functions of the above-described embodiments are realized by the processing is also included.

  Furthermore, after the program read from the storage medium is written to a memory provided in a function expansion board inserted into the computer or a function expansion unit connected to the computer, the function expansion board or This includes a case where the CPU or the like provided in the function expansion unit performs part or all of the actual processing and the functions of the above-described embodiments are realized by the processing.

  The form of the program may be in the form of object code, a program executed by an interpreter, script data supplied to the OS, and the like.

A Temperature sensor 10 Substrate processing apparatus 12 Substrate mounting table 15, 27 Temperature control unit 16 Unit body 17 Heater 18 Chiller flow path 19 Heater controller 21 Chiller controllers 24, 25 Maintenance cover 26 Screw hole

Claims (12)

A temperature control unit for controlling the temperature of the substrate in contact with the substrate,
Comprising a plate-shaped body in contact with the substrate, and a plurality of Heater sets embedded in said body, and a medium flow passage through the interior predetermined temperature of the medium is formed in said body,
Each of the plurality of heater sets includes a plurality of linear heaters and wirings that connect the heaters to each other.
The heaters are arranged in parallel to each other, and the medium flow path is arranged so as to pass through a portion between two adjacent heaters ,
In the surface opposite to the contact surface with the substrate in the body, further comprising characterized Rukoto the placed openable lid to correspond to the position of each of said heaters embedded in the body Temperature control unit.   2. The temperature control unit according to claim 1, wherein the heater and the medium flow path are alternately arranged at equal intervals in a direction perpendicular to one of the heaters in a plan view of the main body. The body has a threaded hole for screws for attaching the lid, the medium flow path claim 1, wherein the meandering so as to avoid the screw hole between the adjacent two of the heater or 2. The temperature control unit according to 2 . The temperature control unit according to claim 3 , wherein a curvature of the curved portion in the meandering medium flow path in a plan view of the main body is a radius of 40 mm or more. A substrate mounting table for mounting a substrate,
A temperature control unit that controls the temperature of the substrate in contact with the substrate; and a base that supports the temperature control unit;
The temperature control unit includes a plate-like body in contact with the substrate, a plurality of Heater set embedded within the body and the medium flow flowing a predetermined temperature of the medium inside is formed in said body Road and
Each of the plurality of heater sets includes a plurality of linear heaters and wirings that connect the heaters to each other.
The heaters are arranged in parallel to each other, and the medium flow path is arranged so as to pass through a portion between two adjacent heaters ,
The temperature control unit further includes an openable / closable lid disposed on the surface of the main body opposite to the contact surface with the substrate so as to correspond to the position of each of the heaters embedded in the main body. A substrate mounting table. A substrate processing apparatus for processing a substrate,
A storage chamber for storing the substrate; and a substrate mounting table disposed in the storage chamber for mounting the substrate;
The substrate mounting table includes a temperature control unit that controls the temperature of the substrate in contact with the substrate, and a base that supports the temperature control unit,
The temperature control unit includes a plate-like body in contact with the substrate, a plurality of Heater set embedded within the body and the medium flow flowing a predetermined temperature of the medium inside is formed in said body Road and
Each of the plurality of heater sets includes a plurality of linear heaters and wirings that connect the heaters to each other.
The heaters are arranged in parallel to each other, and the medium flow path is arranged so as to pass through a portion between two adjacent heaters ,
The temperature control unit further includes an openable / closable lid disposed on the surface of the main body opposite to the contact surface with the substrate so as to correspond to the position of each of the heaters embedded in the main body. A substrate processing apparatus. A temperature control system for controlling the temperature of a substrate,
Has a plate-like body in contact with the substrate, and a plurality of Heater sets embedded in said body, and a medium flow passage inside is formed in said body through a predetermined temperature of the medium, A temperature control unit for controlling the temperature of the substrate in contact with the substrate;
A heater control unit for controlling the amount of heat generated by the heater;
A medium control unit for controlling the flow rate and temperature of the medium flowing through the medium flow path,
In the main body of the temperature control unit, each of the plurality of heater sets includes a plurality of linear heaters and wirings that connect the heaters to each other, and the heaters are arranged in parallel to each other, The medium flow path is disposed so as to pass through a portion between two adjacent heaters ,
The temperature control unit further includes an openable / closable lid disposed on the surface of the main body opposite to the contact surface with the substrate so as to correspond to the position of each of the heaters embedded in the main body. A temperature control system characterized by that. A temperature control unit for controlling the temperature of a substrate in contact with the substrate, formed in the body, a plate-shaped main body in contact with the substrate, a plurality of linear heaters embedded in the main body And a medium flow path through which a medium having a predetermined temperature flows. The heaters are arranged in parallel to each other, and the medium flow path is arranged so as to pass through a portion between two adjacent heaters. A substrate processing method using a temperature control unit comprising:
When cooling the substrate to a target cooling temperature, supply a medium having a temperature lower than the target cooling temperature to the medium flow path ,
When heating the substrate to a target heating temperature, the heater generates heat, and a medium having a temperature higher than the target heating temperature is supplied to the medium flow path . When the temperature of the main body of the temperature control unit reaches a first control change temperature that is higher than the target cooling temperature by a first predetermined temperature, the temperature of the medium supplied to the medium flow path is set to the target cooling temperature. The substrate processing method according to claim 8, wherein: The substrate processing method according to claim 9, wherein the first predetermined temperature is 2 ° C. or higher and lower than 20 ° C. When the temperature of the main body of the temperature control unit reaches a second control change temperature that is higher than the target cooling temperature by a second predetermined temperature, the heater is heated.
The second predetermined temperature the substrate processing method according to claim 9 or 10, wherein a lower than the first predetermined temperature. The substrate processing method according to claim 11, wherein the second predetermined temperature is 1 ° C. or higher and lower than 10 ° C. 12.

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