JP3527382B2 - Heat equalizer - Google Patents

Heat equalizer

Info

Publication number
JP3527382B2
JP3527382B2 JP05922997A JP5922997A JP3527382B2 JP 3527382 B2 JP3527382 B2 JP 3527382B2 JP 05922997 A JP05922997 A JP 05922997A JP 5922997 A JP5922997 A JP 5922997A JP 3527382 B2 JP3527382 B2 JP 3527382B2
Authority
JP
Japan
Prior art keywords
surface plate
flow passage
liquid reservoir
heat source
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP05922997A
Other languages
Japanese (ja)
Other versions
JPH10249863A (en
Inventor
真二 宮崎
久明 山蔭
一幸 津曲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP05922997A priority Critical patent/JP3527382B2/en
Publication of JPH10249863A publication Critical patent/JPH10249863A/en
Application granted granted Critical
Publication of JP3527382B2 publication Critical patent/JP3527382B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、例えば合成樹脂
成型品、半導体ウエハ等、定盤上で加工や成形を行う被
成形物を均一に加熱あるいは冷却することができる均熱
装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat equalizer capable of uniformly heating or cooling an object to be molded or processed on a surface plate, such as a synthetic resin molded product or a semiconductor wafer. .

【0002】[0002]

【従来の技術】従来の均熱装置としては、例えば特開平
6−278139号公報に開示されたものがある。ま
た、その改良されたものとして、特開平8−89508
号公報があり、その概要を図17,図18に示し、これ
ら各図において、1は例えば合成樹脂成型品、半導体ウ
エハ等の被成形製品が載置され、例えば同心状の環状溝
から成る流通路2が複数形成された定盤、3はこの定盤
1に形成された流通路2を覆うように定盤1に接合され
た板状部材、4はこの板状部材3の一部を外方に突出さ
せて形成され、流通路2内と連通してそれら内部を真空
減圧後封入される作動液5を貯溜する液溜め体、6はこ
の液溜め体4を貫通して作動液5中に浸漬され内部にヒ
ータ7が収納される収納体である。
2. Description of the Related Art As a conventional heat equalizer, for example, there is one disclosed in JP-A-6-278139. Further, as an improved version thereof, Japanese Patent Application Laid-Open No. 8-89508
17 and 18, the outlines of which are shown in FIGS. 17 and 18. In each of these figures, reference numeral 1 denotes a distribution formed of concentric annular grooves on which a molded product such as a synthetic resin molded product or a semiconductor wafer is placed. A platen 3 having a plurality of passages 2 formed therein is a plate-like member joined to the platen 1 so as to cover the flow passage 2 formed in the platen 1, 4 is a part of the plate-like member 3 A liquid reservoir body formed so as to project toward one side and communicating with the inside of the flow passage 2 to store the working fluid 5 which is sealed after vacuum decompression inside thereof, 6 penetrates through the liquid reservoir body 4 and is contained in the working fluid 5. It is a housing body that is immersed in the inside of which the heater 7 is housed.

【0003】次に動作について説明する。被成形製品の
加熱成形が必要な場合は、定盤1に被成形製品を載置
し、液溜め体4を貫通して作動液5中に浸漬された収納
体6内部のヒータ7に通電する。ヒータ7の通電により
作動液5が収納体6を介して加熱される。加熱された作
動液5は蒸発気化し、定盤1の流通路2を経て定盤1内
全体に広がり、その潜熱を流通路2壁面で定盤1部へ受
け渡し被成形製品の加熱成形を行う。潜熱を奪われた作
動液5の蒸気は流通路2壁面で凝縮液化し、再度液溜め
体4に環流する。これらの一連の動作が行われることに
より、定盤1表面において被成形製品の均一な加熱を行
う。
Next, the operation will be described. When the product to be molded needs to be heat-molded, the product to be molded is placed on the surface plate 1 and the heater 7 inside the container 6 immersed in the working liquid 5 through the liquid reservoir 4 is energized. . When the heater 7 is energized, the hydraulic fluid 5 is heated via the container 6. The heated hydraulic fluid 5 evaporates and evaporates, spreads throughout the surface plate 1 through the flow passage 2 of the surface plate 1, and the latent heat is transferred to the surface plate 1 part through the wall surface of the flow path 2 to heat-form the molded product. . The vapor of the working fluid 5 deprived of the latent heat is condensed and liquefied on the wall surface of the flow passage 2 and recirculates to the liquid reservoir 4. By performing these series of operations, the product to be molded is uniformly heated on the surface of the surface plate 1.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来装置は、真空減圧後に液溜め体4内に封入される
作動液5の潜熱により、ヒータ7から発せられた熱を定
盤1表面に伝熱する構造であるが、ヒータ7とそのヒー
タ7を収納する収納体6との間に隙間ができてしまうた
め、熱抵抗が大きくなり熱伝達効率が低下するので、定
盤1表面を均一に効率よく加熱することができないとい
う問題点があった。
However, in the above-mentioned conventional apparatus, the heat generated from the heater 7 is transferred to the surface of the surface plate 1 by the latent heat of the working fluid 5 sealed in the liquid reservoir 4 after the vacuum decompression. Although it has a structure to heat, since a gap is formed between the heater 7 and the housing 6 that houses the heater 7, heat resistance increases and heat transfer efficiency decreases, so that the surface of the surface plate 1 is made uniform. There is a problem that heating cannot be performed efficiently.

【0005】この発明は、上記のような問題点を解決す
るためになされたものであり、定盤表面を均一に、効率
よく加熱できる均熱装置を提供することを目的とする。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a soaking apparatus that can uniformly and efficiently heat the surface of a surface plate.

【0006】[0006]

【課題を解決するための手段】この発明の請求項のも
のは、被成形製品が載置され流通路が形成された定盤
と、定盤に形成された流通路を覆うように定盤に接合さ
れた板状部材と、板状部材の一部を外方に突出させて形
成され、流通路内と連通して作動液を貯溜する液溜め体
と、液溜め体を貫通して作動液中に浸漬され内部に熱源
が収納される収納体と、収納体の外周部に沸騰を促進さ
せる表面処理施工体とを設けたものである。
According to a first aspect of the present invention, a surface plate on which a product to be molded is placed and a flow path is formed, and a surface plate so as to cover the flow path formed on the surface plate are provided. The plate-like member joined to the plate-like member, a part of the plate-like member protruding outward, a liquid reservoir that communicates with the inside of the flow passage and stores the working fluid, and an operation that penetrates the liquid reservoir A housing body, which is immersed in a liquid and houses a heat source therein, and a surface-treated construction body that promotes boiling are provided on the outer peripheral portion of the housing body.

【0007】また、この発明の請求項のものは、被成
形製品が載置され流通路が形成された定盤と、定盤に形
成された流通路を覆うように定盤に接合された板状部材
と、板状部材の一部を外方に突出させて形成され、流通
路内と連通して作動液を貯溜する液溜め体と、液溜め体
を貫通して作動液中に浸漬され内部に熱源が収納される
収納体と、収納体と上記熱源との間に充填された高熱伝
導材とを設けたものである。
According to the second aspect of the present invention, the surface plate on which the product to be molded is placed and the flow passage is formed, and the surface plate is joined to the surface plate so as to cover the flow passage. A plate-shaped member, a liquid reservoir formed by projecting a part of the plate-shaped member outward, and communicating with the inside of the flow passage to store the working fluid, and penetrating the liquid reservoir to be immersed in the working fluid In addition, a housing body in which a heat source is housed and a high thermal conductive material filled between the housing body and the heat source are provided.

【0008】また、この発明の請求項のものは、被成
形製品が載置され流通路が形成された定盤と、定盤に形
成された流通路を覆うように定盤に接合された板状部材
と、板状部材の一部を外方に突出させて形成され、流通
路内と連通して作動液を貯溜する液溜め体と、液溜め体
を貫通して作動液中に浸漬された収納体と、収納体の内
寸法と同寸法または収納体の内寸法より大きい寸法を有
し、収納体に圧入された熱源とを設けたものである。
According to a third aspect of the present invention, the surface plate on which the product to be molded is placed and the flow passage is formed, and the surface plate are joined to cover the flow passage formed on the surface plate. A plate-shaped member, a liquid reservoir formed by projecting a part of the plate-shaped member outward, and communicating with the inside of the flow passage to store the working fluid, and penetrating the liquid reservoir to be immersed in the working fluid And a heat source having a size equal to or larger than the inner size of the storage body and press-fitted into the storage body.

【0009】また、この発明の請求項のものは、被成
形製品が載置され流通路が形成された定盤と、定盤に形
成された流通路を覆うように定盤に接合された板状部材
と、板状部材の一部を外方に突出させて形成され、流通
路内と連通して作動液を貯溜する液溜め体と、液溜め体
の外周面に接触して配置された熱源とを設けたものであ
る。
According to the fourth aspect of the present invention, the surface plate on which the product to be molded is placed and the flow passage is formed, and the surface plate are joined to the surface plate so as to cover the flow passage. The plate-shaped member, a liquid reservoir formed by projecting a part of the plate-shaped member outward, and communicating with the inside of the flow passage to store the working fluid, and arranged in contact with the outer peripheral surface of the liquid reservoir. And a heat source.

【0010】[0010]

【発明の実施の形態】実施の形態1. 以下、この発明の実施の形態1を図1、図2に基づいて
説明する。これら各図において、1は定盤、2は流通
路、3は板状部材、4は液溜め体、5は作動液、6収納
体は、7は例えばヒータから成る熱源である。8は収納
体6の外周部に配置され、作動液5の沸騰を促進させる
沸騰促進体であり、例えばウィックや金網等の多孔質体
から構成されている。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In each of these figures, 1 is a surface plate, 2 is a flow passage, 3 is a plate-like member, 4 is a liquid reservoir, 5 is a working fluid, and 6 is a heat source consisting of, for example, a heater. Reference numeral 8 denotes a boiling accelerator that is arranged on the outer peripheral portion of the container 6 and that promotes boiling of the hydraulic fluid 5, and is composed of a porous body such as a wick or a wire net.

【0011】次に、動作について説明する。被成形製品
の加熱成形が必要な場合は、定盤1に被成形製品を載置
し、液溜め体4を貫通して作動液5中に浸漬された収納
体6内部の熱源7に通電する。熱源7の通電により作動
液5が収納体6を介して加熱される。加熱された作動液
5は蒸発気化し、定盤1の流通路2を経て定盤1内全体
に広がり、その潜熱を流通路2壁面で定盤1部へ受け渡
し被成形製品の加熱成形を行う。潜熱を奪われた作動液
5の蒸気は流通路2壁面で凝縮液化し、再度液溜め体4
に環流する。これらの一連の動作が行われることによ
り、定盤1表面において被成形製品の均一な加熱を行
う。この場合、熱源7の熱量は作動液5の蒸気より流通
路2・液溜め体4を含めた密閉容器を成す内部に拡散
し、流通路2壁面での凝縮により熱輸送を行うので、定
盤1表面を均一に加熱することができる。
Next, the operation will be described. When the product to be molded needs to be heat-molded, the product to be molded is placed on the surface plate 1 and the heat source 7 inside the storage body 6 penetrated through the liquid reservoir 4 and immersed in the working liquid 5 is energized. . When the heat source 7 is energized, the hydraulic fluid 5 is heated via the container 6. The heated hydraulic fluid 5 evaporates and evaporates, spreads throughout the surface plate 1 through the flow passage 2 of the surface plate 1, and the latent heat is transferred to the surface plate 1 part through the wall surface of the flow path 2 to heat-form the molded product. . The vapor of the working fluid 5 deprived of the latent heat is condensed and liquefied on the wall surface of the flow passage 2, and is again stored in the liquid reservoir 4.
Return to. By performing these series of operations, the product to be molded is uniformly heated on the surface of the surface plate 1. In this case, the amount of heat of the heat source 7 is diffused from the vapor of the hydraulic fluid 5 into the inside of the closed container including the flow passage 2 and the liquid reservoir 4, and heat is transferred by condensation on the wall surface of the flow passage 2, so that the surface plate 1 The surface can be heated uniformly.

【0012】また、この実施の形態1においては、収納
体6の外周部に例えばウィックや金網等から構成される
沸騰促進体8を配置したことにより、作動液5の沸騰の
促進および伝熱面積を増大させることができ、沸騰気化
における熱抵抗を小さくすることができるので、熱効率
に優れた均熱装置を得ることができる。
Further, in the first embodiment, the boiling promoting body 8 composed of, for example, a wick or a wire net is arranged on the outer peripheral portion of the housing body 6, so that the boiling of the working fluid 5 is promoted and the heat transfer area is increased. Can be increased, and the thermal resistance in boiling vaporization can be reduced, so that a soaking device having excellent thermal efficiency can be obtained.

【0013】実施の形態2. この発明の実施の形態2を図2に基づいて説明する。図
2において、9は収納体6の外周部に形成され、作動液
5の沸騰を促進させる表面処理施工体であり、例えば容
射等の表面処理により多孔質体に施工される。
Embodiment 2. Embodiment 2 of the present invention will be described with reference to FIG. In FIG. 2, reference numeral 9 denotes a surface-treated construction body which is formed on the outer peripheral portion of the storage body 6 and promotes boiling of the hydraulic fluid 5, and is constructed on the porous body by surface treatment such as spraying.

【0014】この実施の形態2においては、上述した実
施の形態1と同様の効果を有すると共に、さらに、表面
処理により収納体6の外周部に表面処理施工体9を形成
するようにしたので、上述した実施の形態1のように沸
騰促進体8を収納体6へ固着する必要が無くなるため、
組立性も向上する。
The second embodiment has the same effects as those of the first embodiment described above, and further, the surface-treated construction body 9 is formed on the outer peripheral portion of the housing body 6 by the surface treatment. Since it is not necessary to fix the boiling promoting body 8 to the storage body 6 as in the first embodiment described above,
Assembling is also improved.

【0015】実施の形態3. この発明の実施の形態3を図3に基づいて説明する。図
3において、10は収納体6と熱源7との間の隙間に充
填された例えば伝熱グリース等から成る高熱伝導材であ
る。
Embodiment 3. The third embodiment of the present invention will be described with reference to FIG. In FIG. 3, 10 is a high thermal conductive material such as heat transfer grease filled in the gap between the housing 6 and the heat source 7.

【0016】この実施の形態3においては、例えば伝熱
グリース等から成る高熱伝導材10を収納体6と熱源7
との間の隙間に充填したことにより、収納体6と熱源7
との間の熱抵抗を小さくすることができ、熱効率の更に
優れた均熱装置を得ることができる。また、充填する高
熱伝導材10が流動性の高い材料である場合は、収納体
6の端部にフタ11を設置してもよく、これにより、流
動性の高い高熱伝導材10でも充填作業を容易に行うこ
とができる。
In the third embodiment, the high thermal conductive material 10 made of, for example, heat transfer grease or the like is used for the housing 6 and the heat source 7.
By filling the gap between the housing 6 and the heat source 7,
It is possible to reduce the thermal resistance between and, and it is possible to obtain a heat equalizer having further excellent thermal efficiency. Further, when the high thermal conductive material 10 to be filled is a material having high fluidity, the lid 11 may be installed at the end portion of the storage body 6, whereby the high thermal conductive material 10 having high fluidity can be filled. It can be done easily.

【0017】実施の形態4. この発明の実施の形態4を図4に基づいて説明する。図
4において、12は液溜め体4を貫通して作動液5中に
浸漬された収納体、13は収納体12の内寸法と同寸法
または収納体12の内寸法より大きい寸法を有し、収納
体12に圧入される例えばヒータ等から成る熱源であ
る。すなわち、収納体12の内寸法が熱源13の外寸法
と同寸法または熱源13の外寸法より小さい寸法とな
る。
Embodiment 4. A fourth embodiment of the present invention will be described based on FIG. In FIG. 4, 12 is a container penetrating the liquid reservoir 4 and immersed in the hydraulic fluid 5, 13 is the same as the inner size of the container 12 or larger than the inner size of the container 12, The heat source is, for example, a heater, which is press-fitted into the housing 12. That is, the inner size of the container 12 is the same as the outer size of the heat source 13 or smaller than the outer size of the heat source 13.

【0018】この実施の形態4においては、収納体12
に熱源13を圧入するので、収納体12と熱源13との
隙間が無くなるため、上述した実施の形態3のように高
熱伝導材10を充填することなく熱抵抗を小さくするこ
とができ、更に熱効率の向上と作業性の向上が図れる。
また、圧入によって熱源13がしっかりと収納体12に
固定されるので、熱源13の固定方法を考える必要が無
くなる。
In the fourth embodiment, the container 12
Since the heat source 13 is press-fitted into the container, the gap between the housing 12 and the heat source 13 is eliminated, so that the thermal resistance can be reduced without filling the high thermal conductive material 10 as in the third embodiment described above, and the thermal efficiency can be further improved. And workability can be improved.
Further, since the heat source 13 is firmly fixed to the housing body 12 by press fitting, it is not necessary to consider a fixing method of the heat source 13.

【0019】実施の形態5. この発明の実施の形態5を図5に基づいて説明する。図
5において、14は液溜め体4の外周面、例えば液溜め
体4の底部の外周壁に接触して配置された面状の熱源で
ある。
Embodiment 5. The fifth embodiment of the present invention will be described with reference to FIG. In FIG. 5, reference numeral 14 is a planar heat source arranged in contact with the outer peripheral surface of the liquid reservoir 4, for example, the outer peripheral wall of the bottom of the liquid reservoir 4.

【0020】この実施の形態5においては、面状の熱源
14を液溜め体4の外周壁に接触させて配置したので、
上述した各実施の形態のような熱源と収納体との隙間に
よる熱抵抗の改善を容易に行うことができると共に、熱
源14の取付けや交換が容易となりメインテナンス性を
向上させることができる。また、熱源14は液溜め体4
の側部の外周壁に接触させて配置しても同様の効果を奏
する。
In the fifth embodiment, since the planar heat source 14 is arranged in contact with the outer peripheral wall of the liquid reservoir 4,
It is possible to easily improve the thermal resistance due to the gap between the heat source and the housing as in the above-described embodiments, and to easily attach or replace the heat source 14 and improve the maintainability. Further, the heat source 14 is the liquid reservoir 4
Even if it is placed in contact with the outer peripheral wall of the side portion, the same effect can be obtained.

【0021】実施の形態6. この発明の実施の形態6を図6に基づいて説明する。図
6において、15は板状部材3の一部を外方に突出させ
て形成され、流通路2内と連通して作動液5を貯溜する
液溜め体、16は液溜め体15の外方に配置される例え
ばヒータ等から成る熱源、17は液溜め体15の例えば
底部を液溜め体15内方側に窪ませて形成され、熱源1
6を設置する熱源設置部、18は熱源設置部17に設置
された熱源16を液溜め体15に取付ける押え板であ
る。
Sixth Embodiment The sixth embodiment of the present invention will be described with reference to FIG. In FIG. 6, 15 is a liquid reservoir formed by projecting a part of the plate-like member 3 to the outside, and communicating with the inside of the flow passage 2 to store the working fluid 5, and 16 is an outside of the liquid reservoir 15. A heat source 17 composed of, for example, a heater and the like is disposed at the bottom of the liquid reservoir 15 and is formed by denting the bottom of the liquid reservoir 15 inward of the liquid reservoir 15.
6 is a heat source installation part, and 18 is a holding plate for attaching the heat source 16 installed in the heat source installation part 17 to the liquid reservoir 15.

【0022】この実施の形態6においては、液溜め体1
5の底部をその内方側に窪ませて形成した熱源設置部1
7に熱源16を設置し、押え板18で固定するようにし
たので、熱源16の固定を容易に行うことができると共
に、押え板18により熱源16を押さえつけることによ
り、液溜め体15と熱源16との密着性もより向上する
ため、接触による熱抵抗を低減することができる。更
に、ネジ止め等で組立が可能となるため組立性も向上さ
せることができる。また、熱源設置部17は液溜め体1
5の側部に配置しても同様の効果を奏する。
In the sixth embodiment, the liquid reservoir 1
Heat source installation part 1 formed by denting the bottom part of 5 inward
Since the heat source 16 is installed in 7 and fixed by the holding plate 18, the heat source 16 can be easily fixed, and by holding down the heat source 16 by the holding plate 18, the liquid reservoir 15 and the heat source 16 can be fixed. Since the adhesiveness with is further improved, the thermal resistance due to contact can be reduced. Furthermore, since it is possible to assemble by screwing or the like, the assembling property can be improved. In addition, the heat source installation unit 17 is the liquid reservoir 1
Even if it is arranged on the side portion of 5, the same effect can be obtained.

【0023】実施の形態7. この発明の実施の形態7を図7に基づいて説明する。図
7において、19は液溜め体4の一部に形成された穴、
20はこの穴19を閉塞し液溜め体4に着脱可能に取付
けられたフランジ、21はこのフランジ20を貫通し穴
19を通して液溜め体4内に封入された作動液5中に浸
漬される例えばヒータ等から成る熱源である。
Embodiment 7. The seventh embodiment of the present invention will be described with reference to FIG. In FIG. 7, 19 is a hole formed in a part of the liquid reservoir 4,
Reference numeral 20 denotes a flange which closes the hole 19 and is detachably attached to the liquid reservoir 4, 21 denotes a flange which penetrates the flange 20 and is immersed in the working fluid 5 enclosed in the liquid reservoir 4 through the hole 19, for example. A heat source composed of a heater and the like.

【0024】この実施の形態7においては、熱源21が
作動液5中に浸漬されているため、上述した実施の形態
1〜4のような熱源と収納体との隙間を何等考慮する必
要が無く、熱源21から発せられた熱がそのまま直接作
動液5に伝達されるため、熱抵抗を著しく小さくするこ
とができ、熱効率を大幅に改善することができる。ま
た、熱源21にフランジ20を設けてネジ止め等により
液溜め体4に着脱可能に取付けるようにしているので、
熱源21の取付けや交換を容易に行うことができる。
In the seventh embodiment, since the heat source 21 is immersed in the hydraulic fluid 5, it is not necessary to consider the gap between the heat source and the container as in the first to fourth embodiments. Since the heat generated from the heat source 21 is directly transmitted to the hydraulic fluid 5, the thermal resistance can be remarkably reduced and the thermal efficiency can be greatly improved. Further, since the heat source 21 is provided with the flange 20 and is detachably attached to the liquid reservoir 4 by screwing or the like,
The heat source 21 can be easily attached and replaced.

【0025】実施の形態8. この発明の実施の形態8を図8に基づいて説明する。図
8において、22は収納体4内に装着され、その収納体
4内に充填される絶縁体22aとその絶縁体22a内に
配置された電熱線等から成る発熱体22bとから成る熱
源である。
Embodiment 8. The eighth embodiment of the present invention will be described with reference to FIG. In FIG. 8, reference numeral 22 denotes a heat source that is mounted in the housing 4 and is composed of an insulator 22a filled in the housing 4 and a heating element 22b made of a heating wire or the like arranged in the insulator 22a. .

【0026】この実施の形態8においては、熱源22が
絶縁体22aを収納体4内に充填されることによりその
収納体4と一体化されるので、熱源と収納体との隙間を
何等考慮する必要が無くなり、組立性を改善することが
できる。
In the eighth embodiment, the heat source 22 is integrated with the storage body 4 by filling the insulator 22a into the storage body 4, so that the clearance between the heat source and the storage body is taken into consideration. The need is eliminated and the assemblability can be improved.

【0027】実施の形態9. この発明の実施の形態9を図9に基づいて説明する。図
9において、23は収納体4内に装着され、両端部23
aの位置を収納体4端面より中央部側にL寸法離間され
て配置された例えばヒータ等から成る熱源である。すな
わち、熱源23を上述した実施の形態のより短くし、熱
源23全体が収納体4の内方に収納されるものである。
Ninth Embodiment The ninth embodiment of the present invention will be described with reference to FIG. In FIG. 9, 23 is mounted in the storage body 4, and both ends 23
It is a heat source composed of, for example, a heater and the like, which is arranged at a position of a on the central portion side from the end surface of the housing body 4 with a distance of L dimension. That is, the heat source 23 is made shorter than that of the above-described embodiment, and the entire heat source 23 is stored inside the storage body 4.

【0028】この実施の形態9においては、熱源23の
両端部23aの位置が、収納体4の端面よりL寸法離間
されて中央部側に位置しているので、熱源23と収納体
4の端面との間の熱抵抗を増大させ、これにより収納体
4端面壁から液溜め体4壁を伝わり、定盤1表面へ直接
伝わる熱を低減することができ、上述した実施の形態の
ものより、定盤1表面の均熱特性をより一層向上させる
ことができる。
In the ninth embodiment, since the end portions 23a of the heat source 23 are located on the central portion side by being separated from the end surface of the housing 4 by the L dimension, the end surfaces of the heat source 23 and the housing 4 are located. It is possible to increase the heat resistance between the storage unit 4 and the end face wall of the storage unit 4, thereby reducing the heat that is directly transmitted to the surface of the surface plate 1 from the end face wall of the storage unit 4. The soaking property of the surface of the surface plate 1 can be further improved.

【0029】実施の形態10. この発明の実施の形態10を図10に基づいて説明す
る。図10において、24は液溜め体4を貫通して作動
液5中に浸漬され、両端部24aの寸法が中央部24b
の寸法より大きく形成された収納体、25は収納体24
内に装着され、中央部25aが収納体24の中央部24
bに位置し、両端部25bの位置が収納体24の両端部
24aに配置された例えばヒータ等から成る熱源であ
り、熱源25の両端部25bと収納体24の両端部24
aとの間に隙間が形成されている。
Embodiment 10. The tenth embodiment of the present invention will be described with reference to FIG. In FIG. 10, reference numeral 24 penetrates the liquid reservoir 4 and is immersed in the hydraulic fluid 5, and the dimensions of both end portions 24a are the central portion 24b.
The storage body formed larger than the size of
The central part 25a is mounted inside the central part 25a of the housing 24.
b, and both ends 25b are located at both ends 24a of the housing 24 and are a heat source such as a heater. Both ends 25b of the heat source 25 and both ends 24 of the housing 24 are located.
A gap is formed between a and a.

【0030】この実施の形態10においては、熱源25
の両端部25bと収納体24の両端部24aとの間に形
成された隙間により、収納体24の両端面24a壁から
液溜め体4壁を伝わり、定盤1表面へ直接伝わる熱を低
減することができ、上述した実施の形態9と同様の効果
を奏する。また、熱源25の両端部25bと収納体24
の両端部24aとの間に隙間を設けたことにより、熱源
25の寸法を大きく構成することができるので、単位面
積当たりの発熱量が小さくなり、熱源25の寿命を比較
的長く維持することができる。
In the tenth embodiment, the heat source 25
The gap formed between both ends 25b of the container 24 and both ends 24a of the container 24 reduces the heat transmitted from the walls 24a of the container 24 through the liquid reservoir 4 wall and directly to the surface of the surface plate 1. Therefore, the same effect as that of the ninth embodiment can be obtained. In addition, both ends 25b of the heat source 25 and the housing 24
By providing a gap between both end portions 24a of the heat source 25, the size of the heat source 25 can be made large, so that the heat generation amount per unit area becomes small and the life of the heat source 25 can be maintained relatively long. it can.

【0031】実施の形態11. この発明の実施の形態11を図11に基づいて説明す
る。図11において、26は液溜め体4内の作動液5中
に浸漬配置される収納体、27,28はこの収納体26
より熱伝導率の低い材料で構成され、その収納体26を
液溜め体4に取付ける接続体であり、図は一例として、
接続体27,28より内方側に収納体26が位置してい
る場合を示しており、例えば溶接等で固着されている。
29は収納体26内に装着される例えばヒータ等から成
る熱源である。
Eleventh Embodiment The eleventh embodiment of the present invention will be described with reference to FIG. In FIG. 11, reference numeral 26 is a container that is immersed in the hydraulic fluid 5 in the liquid reservoir 4, and 27 and 28 are the containers 26.
It is a connection body that is made of a material having a lower thermal conductivity and that attaches the storage body 26 to the liquid reservoir body 4.
It shows a case where the storage body 26 is located on the inner side of the connection bodies 27 and 28, and is fixed by welding, for example.
Reference numeral 29 is a heat source that is mounted in the housing 26 and includes, for example, a heater.

【0032】この実施の形態11においては、接続体2
7,28より内方側に収納体26が位置しているので、
熱源29の両端部と接続体27,28との間に隙間が生
じ、上述した実施の形態10と同様の効果を奏する。さ
らに、収納体26と液溜め体4との間に位置する接続体
27,28は収納体26より熱伝導率の低い材料で構成
しているので、熱源29から収納体26を伝わり、液溜
め体4壁への伝熱を大幅に低減することができ、上述し
た実施の形態10より均熱特性を向上させることができ
る。
In the eleventh embodiment, the connecting body 2
Since the storage body 26 is located inward of 7, 28,
A gap is created between both ends of the heat source 29 and the connectors 27 and 28, and the same effect as that of the tenth embodiment described above is achieved. Further, since the connecting bodies 27 and 28 located between the storage body 26 and the liquid reservoir 4 are made of a material having a lower thermal conductivity than the storage body 26, they are transmitted from the heat source 29 through the storage body 26 to store the liquid. Heat transfer to the wall of the body 4 can be significantly reduced, and the soaking characteristics can be improved as compared with the tenth embodiment described above.

【0033】ところで、上述した図11では、接続体2
7,28と収納体26とは溶接により固着される場合に
ついて述べたが、図12に示すように、ネジ方式による
固着としてもよく、組立性を改善することができる。
By the way, in the above-mentioned FIG.
Although the case where the Nos. 7 and 28 and the housing 26 are fixed to each other by welding has been described, as shown in FIG.

【0034】実施の形態12. この発明の実施の形態12を図13,図14に基づいて
説明する。これら各図において、1は定盤、2は流通
路、3は板状部材、30は定盤1の外周部に設けられ、
作動液31を貯溜する液相部30aとその液相部30a
の上方に気相部30bを有する液溜め体、32は液溜め
体30の液相部30a周囲に配置された例えばヒータ等
から成る熱源であり、図は一例として実線で示すよう
に、液溜め体30の液相部30aの外側の周壁に設けた
場合を示しているが、破線で示すように液相部30aの
底部周壁や液相部30aの内側の周壁に設けてもよい。
33は定盤1の下部の板状部材3に装着された断熱材で
ある。
Twelfth Embodiment A twelfth embodiment of the present invention will be described with reference to FIGS. In each of these drawings, 1 is a surface plate, 2 is a flow passage, 3 is a plate-like member, and 30 is provided on an outer peripheral portion of the surface plate 1,
Liquid phase portion 30a for storing hydraulic fluid 31 and its liquid phase portion 30a
Is a liquid reservoir having a vapor phase portion 30b above, and 32 is a heat source which is arranged around the liquid phase portion 30a of the liquid reservoir 30 and is composed of, for example, a heater. As shown in FIG. Although the case where it is provided on the outer peripheral wall of the liquid phase portion 30a of the body 30 is shown, it may be provided on the bottom peripheral wall of the liquid phase portion 30a or the inner peripheral wall of the liquid phase portion 30a as indicated by the broken line.
Reference numeral 33 is a heat insulating material attached to the plate-like member 3 below the surface plate 1.

【0035】この実施の形態12においては、定盤1の
外周部からも、熱源32により液溜め体30の液相部3
0a内の作動液31が加熱される。加熱された作動液3
1は蒸発気化し、定盤1の外周部に位置する液溜め体3
0の気相部30b全体に広がり、その潜熱を定盤1の外
周部へ熱輸送する。潜熱を奪われた作動液31の蒸気は
凝縮液化し、再度液溜め体30の液相部30a内に環流
する。これらの一連の動作が行われることにより、定盤
1の外周部からも熱輸送することができ、定盤1の外周
部からの放熱を防止でき、定盤1の表面温度分布の外周
部の温度低下を防止でき、安定した均熱特性を得ること
ができる。また、断熱材33により定盤1下方からの放
熱を防止でき、定盤1の表面温度分布の改善や放熱ロス
の軽減を図ることができる。
In the twelfth embodiment, the liquid phase portion 3 of the liquid reservoir 30 is also heated by the heat source 32 from the outer peripheral portion of the surface plate 1.
The hydraulic fluid 31 in 0a is heated. Heated hydraulic fluid 3
1 evaporates and vaporizes, and a liquid reservoir 3 located on the outer periphery of the platen 1
0 spreads over the entire vapor phase portion 30b and transfers the latent heat to the outer peripheral portion of the surface plate 1. The vapor of the working fluid 31 deprived of latent heat is condensed and liquefied, and recirculates into the liquid phase portion 30a of the liquid reservoir 30 again. By performing these series of operations, heat can be transported also from the outer peripheral portion of the surface plate 1, heat radiation from the outer peripheral portion of the surface plate 1 can be prevented, and the outer peripheral portion of the surface temperature distribution of the surface plate 1 can be prevented. It is possible to prevent a temperature decrease and obtain stable soaking characteristics. Further, the heat insulating material 33 can prevent heat radiation from below the surface plate 1, and can improve the surface temperature distribution of the surface plate 1 and reduce heat dissipation loss.

【0036】ところで、上述した図13,図14では、
液溜め体30の液相部30aが一層構造の場合について
述べたが、図15に示すように、液溜め体30の液相部
30aを外層部と内層部との二層構造とし、その液相部
30aを外層部と内層部との間の周壁に熱源32を配置
することにより、熱源32の放熱面全面が作動液31と
熱的接触する面積として利用できるので、作動液31の
蒸気の発生量が増大し熱抵抗を低減することができ、さ
らに熱効率を向上させることができる。
By the way, in FIGS. 13 and 14 described above,
Although the case where the liquid phase portion 30a of the liquid reservoir 30 has a single layer structure has been described, as shown in FIG. 15, the liquid phase portion 30a of the liquid reservoir 30 has a two-layer structure of an outer layer portion and an inner layer portion, and By disposing the heat source 32 on the peripheral wall between the outer layer portion and the inner layer portion, the phase portion 30a can be used as an area in which the entire heat radiating surface of the heat source 32 is in thermal contact with the working fluid 31, so that the vapor of the working fluid 31 The generated amount can be increased, the thermal resistance can be reduced, and the thermal efficiency can be further improved.

【0037】実施の形態13. この発明の実施の形態13を図16に基づいて説明す
る。図16において、34は定盤1の外周部に設けら
れ、作動液35を貯溜する液相部34aとその液相部3
4aの上方に気相部34bを有する液溜め体、36は定
盤1に形成された流通路2を覆うと共にその流通路2が
液溜め体34と連通するよう且つ作動液35の流通路2
からの環流促進のために傾斜されて液溜め体34に取付
けられた板状部材、37は液溜め体34の液相部34a
周囲に配置された例えばヒータ等から成る熱源である。
Thirteenth Embodiment The thirteenth embodiment of the present invention will be described with reference to FIG. In FIG. 16, 34 is provided on the outer peripheral portion of the surface plate 1, and stores a liquid phase portion 34 a for storing the working fluid 35 and the liquid phase portion 3 thereof.
4a is a liquid reservoir having a vapor phase portion 34b, 36 covers the flow passage 2 formed in the platen 1, and the flow passage 2 communicates with the liquid reservoir 34 and the flow passage 2 for the working liquid 35 is provided.
A plate-shaped member that is inclined and attached to the liquid reservoir 34 to promote recirculation from the liquid, and 37 denotes a liquid phase portion 34a of the liquid reservoir 34.
The heat source is composed of, for example, a heater or the like arranged around the periphery.

【0038】この実施の形態13においては、熱源37
により液溜め体34の液相部34a内の作動液35が加
熱される。加熱された作動液35は蒸発気化し、定盤1
の外周部に位置する液溜め体34の気相部34b全体に
広がると共に、定盤1の流通路2全体に広がる。定盤1
の流通路2全体に広がった作動液35の蒸気は、その潜
熱を流通路2壁面で定盤1部へ受け渡し被成形製品の加
熱成形を行い、潜熱を奪われた作動液35の蒸気は流通
路2壁面で凝縮液化し、板状部材36の傾斜面に沿って
液溜め体34の液相部34a内に環流する。一方、液溜
め体34の気相部34b全体に広がった作動液35の蒸
気は、その潜熱を定盤1の外周部へ熱輸送し、潜熱を奪
われた作動液35の蒸気は凝縮液化し、再度液溜め体3
4の液相部34a内に環流する。これらの一連の動作が
行われることにより、定盤1の内外周両方から熱輸送す
ることができ、定盤1の外周部からの放熱も防止でき、
定盤1の表面温度分布の外周部の温度低下を防止でき、
安定した均熱特性を得ることができる。また、板状部材
36に傾斜を設けたことにより、定盤1の流通路2にて
凝縮液化した作動液35が円滑に液溜め体34の液相部
34a内に環流できるため、蒸発部である液溜め体34
の液相部34aに作動液35が円滑に戻らず枯れてしま
う現象を防止することができ、安定した動作を行うこと
ができる。
In the thirteenth embodiment, the heat source 37
Thereby, the hydraulic fluid 35 in the liquid phase portion 34a of the liquid reservoir 34 is heated. The heated hydraulic fluid 35 evaporates and vaporizes, and the surface plate 1
It spreads over the entire vapor phase portion 34b of the liquid reservoir 34 located on the outer peripheral portion of, and spreads over the entire flow passage 2 of the surface plate 1. Surface plate 1
The vapor of the working fluid 35 spread over the entire flow passage 2 is transferred to the surface plate 1 by the latent heat of the flow passage 2 wall surface to heat-mold the product to be molded, and the vapor of the working fluid 35 deprived of the latent heat flows. It condenses and liquefies on the wall surface of the passage 2 and recirculates into the liquid phase portion 34a of the liquid reservoir 34 along the inclined surface of the plate member 36. On the other hand, the vapor of the working fluid 35 spread over the entire vapor phase portion 34b of the liquid reservoir 34 transfers its latent heat to the outer peripheral portion of the surface plate 1, and the vapor of the working fluid 35 deprived of the latent heat is condensed and liquefied. , Liquid reservoir 3 again
It recirculates into the liquid phase part 34a of No. 4 of FIG. By performing a series of these operations, heat can be transported from both the inner and outer peripheries of the surface plate 1, and heat dissipation from the outer peripheral portion of the surface plate 1 can be prevented,
It is possible to prevent the temperature drop in the outer peripheral part of the surface temperature distribution of the surface plate 1,
It is possible to obtain stable soaking characteristics. Further, since the plate-shaped member 36 is provided with the inclination, the working liquid 35 condensed and liquefied in the flow passage 2 of the surface plate 1 can be smoothly recirculated into the liquid phase portion 34a of the liquid reservoir 34, so that the evaporation portion can be used. Some liquid reservoir 34
The phenomenon that the hydraulic fluid 35 does not smoothly return to the liquid phase portion 34a and withers can be prevented, and stable operation can be performed.

【0039】[0039]

【発明の効果】この発明の請求項1のものは以上説明し
たとおり、被成形製品が載置され流通路が形成された定
盤と、定盤に形成された流通路を覆うように定盤に接合
された板状部材と、板状部材の一部を外方に突出させて
形成され、流通路内と連通して作動液を貯溜する液溜め
体と、液溜め体を貫通して作動液中に浸漬され内部に熱
源が収納される収納体と、収納体の外周部に沸騰を促進
させる表面処理施工体とを設けたことにより、上記請求
項2のように沸騰促進体を収納体へ固着する必要が無く
なるため、組立性も向上する。
The first aspect of the present invention has been described above.
As described above, the surface plate on which the molded product is placed and the flow passage is formed, the plate-like member joined to the surface plate so as to cover the flow passage formed on the surface plate, and a part of the plate-like member A liquid reservoir formed so as to project outwardly and communicating with the inside of the flow passage to store the working fluid; a housing body that penetrates the fluid reservoir and is immersed in the working fluid to accommodate a heat source therein; By providing the outer peripheral portion of the storage body with the surface-treated construction body that promotes boiling, it is not necessary to fix the boiling promotion body to the storage body as in the second aspect of the present invention, so that the assembling property is also improved.

【0040】また、この発明の請求項のものは、被成
形製品が載置され流通路が形成された定盤と、定盤に形
成された流通路を覆うように定盤に接合された板状部材
と、板状部材の一部を外方に突出させて形成され、流通
路内と連通して作動液を貯溜する液溜め体と、液溜め体
を貫通して作動液中に浸漬され内部に熱源が収納される
収納体と、収納体と上記熱源との間に充填された高熱伝
導材とを設けたことにより、収納体と熱源との間の熱抵
抗を小さくすることができ、熱効率の更に優れた均熱装
置を得ることができる。
According to the second aspect of the present invention, the surface plate on which the product to be molded is placed and the flow passage is formed, and the surface plate are joined to the surface plate so as to cover the flow passage. A plate-shaped member, a liquid reservoir formed by projecting a part of the plate-shaped member outward, and communicating with the inside of the flow passage to store the working fluid, and penetrating the liquid reservoir to be immersed in the working fluid By providing the housing body in which the heat source is housed and the high thermal conductive material filled between the housing body and the heat source, the thermal resistance between the housing body and the heat source can be reduced. It is possible to obtain a heat equalizer having further excellent thermal efficiency.

【0041】また、この発明の請求項のものは、被成
形製品が載置され流通路が形成された定盤と、定盤に形
成された流通路を覆うように定盤に接合された板状部材
と、板状部材の一部を外方に突出させて形成され、流通
路内と連通して作動液を貯溜する液溜め体と、液溜め体
を貫通して作動液中に浸漬された収納体と、収納体の内
寸法と同寸法または収納体の内寸法より大きい寸法を有
し、収納体に圧入された熱源とを設けたことにより、請
求項3のように高熱伝導材を充填することなく熱抵抗を
小さくすることができ、更に熱効率の向上と作業性の向
上が図れる。
According to the third aspect of the present invention, the surface plate on which the product to be molded is placed and the flow passage is formed, and the surface plate are joined to the surface plate so as to cover the flow passage. A plate-shaped member, a liquid reservoir formed by projecting a part of the plate-shaped member outward, and communicating with the inside of the flow passage to store the working fluid, and penetrating the liquid reservoir to be immersed in the working fluid The heat-conducting material according to claim 3, wherein the stored container and a heat source having the same inner dimension as the container or a dimension larger than the inner dimension of the container and press-fitted into the container are provided. It is possible to reduce the thermal resistance without filling in, and further improve the thermal efficiency and workability.

【0042】また、この発明の請求項のものは、被成
形製品が載置され流通路が形成された定盤と、定盤に形
成された流通路を覆うように定盤に接合された板状部材
と、板状部材の一部を外方に突出させて形成され、流通
路内と連通して作動液を貯溜する液溜め体と、液溜め体
の外周面に接触して配置された熱源とを設けたことによ
り、熱源と収納体との隙間による熱抵抗の改善を容易に
行うことができると共に、熱源の取付けや交換が容易と
なりメインテナンス性を向上させることができる。
According to a fourth aspect of the present invention, the surface plate on which the product to be molded is placed and the flow passage is formed, and the surface plate is joined to the surface plate so as to cover the flow passage. The plate-shaped member, a liquid reservoir formed by projecting a part of the plate-shaped member outward, and communicating with the inside of the flow passage to store the working fluid, and arranged in contact with the outer peripheral surface of the liquid reservoir. By providing the heat source, the heat resistance due to the gap between the heat source and the housing can be easily improved, and the heat source can be easily attached and replaced to improve the maintainability.

【図面の簡単な説明】[Brief description of drawings]

【図1】 この発明の実施の形態1による均熱装置を示
す横断面図である。
FIG. 1 is a transverse sectional view showing a heat equalizer according to Embodiment 1 of the present invention.

【図2】 この発明の実施の形態2による均熱装置を示
す横断面図である。
FIG. 2 is a cross-sectional view showing a heat equalizer according to Embodiment 2 of the present invention.

【図3】 この発明の実施の形態3による均熱装置を示
す横断面図である。
FIG. 3 is a cross-sectional view showing a heat equalizer according to Embodiment 3 of the present invention.

【図4】 この発明の実施の形態4による均熱装置を示
す横断面図である。
FIG. 4 is a transverse sectional view showing a heat equalizer according to Embodiment 4 of the present invention.

【図5】 この発明の実施の形態5による均熱装置を示
す横断面図である。
FIG. 5 is a cross-sectional view showing a heat equalizer according to Embodiment 5 of the present invention.

【図6】 この発明の実施の形態6による均熱装置を示
す横断面図である。
FIG. 6 is a cross-sectional view showing a heat equalizer according to Embodiment 6 of the present invention.

【図7】 この発明の実施の形態7による均熱装置を示
す横断面図である。
FIG. 7 is a cross-sectional view showing a heat equalizer according to Embodiment 7 of the present invention.

【図8】 この発明の実施の形態8による均熱装置を示
す横断面図である。
FIG. 8 is a transverse sectional view showing a heat equalizer according to Embodiment 8 of the present invention.

【図9】 この発明の実施の形態9による均熱装置を示
す横断面図である。
FIG. 9 is a transverse sectional view showing a heat equalizer according to Embodiment 9 of the present invention.

【図10】 この発明の実施の形態10による均熱装置
を示す横断面図である。
FIG. 10 is a transverse sectional view showing a heat equalizer according to Embodiment 10 of the present invention.

【図11】 この発明の実施の形態11による均熱装置
を示す横断面図である。
FIG. 11 is a cross-sectional view showing a heat equalizer according to Embodiment 11 of the present invention.

【図12】 この発明の実施の形態11による均熱装置
を示す横断面図である。
FIG. 12 is a cross-sectional view showing a heat equalizer according to Embodiment 11 of the present invention.

【図13】 この発明の実施の形態12による均熱装置
を示す平面図である。
FIG. 13 is a plan view showing a heat equalizer according to Embodiment 12 of the present invention.

【図14】 この発明の実施の形態12による均熱装置
を示す横断面図である。
FIG. 14 is a transverse sectional view showing a heat equalizer according to Embodiment 12 of the present invention.

【図15】 この発明の実施の形態12による均熱装置
を示す横断面図である。
FIG. 15 is a cross-sectional view showing a heat equalizer according to Embodiment 12 of the present invention.

【図16】 この発明の実施の形態13による均熱装置
を示す横断面図である。
FIG. 16 is a transverse sectional view showing a heat equalizer according to Embodiment 13 of the present invention.

【図17】 従来の均熱装置を示す平面図である。FIG. 17 is a plan view showing a conventional heat equalizer.

【図18】 従来の均熱装置を示す横断面図である。FIG. 18 is a cross-sectional view showing a conventional heat equalizer.

【符号の説明】[Explanation of symbols]

1 定盤、2 流通路、3,36 板状部材、4,1
5,30,34 液溜め体、5,31,35 作動液、
6,12,24,26 収納体、7,13,14,1
6,21,22,23,25,29,32,37 熱
源、8 沸騰促進体、9 表面処理施工体、10 高熱
伝導材、17 熱源設置部、18 押え板、19 穴、
20 フランジ、22a 絶縁体、22b 発熱体、2
3a 両端部、24a 端部、24b 中央部、27,
28 接続体、30a,34a 液相部、30b,34
b 気相部。
1 surface plate, 2 flow passages, 3,36 plate-shaped members, 4, 1
5,30,34 liquid reservoir, 5,31,35 hydraulic fluid,
6,12,24,26 container, 7,13,14,1
6, 21, 22, 23, 25, 29, 32, 37 Heat source, 8 Boiling accelerator, 9 Surface treatment body, 10 High thermal conductive material, 17 Heat source installation part, 18 Holding plate, 19 holes,
20 flange, 22a insulator, 22b heating element, 2
3a both end portions, 24a end portion, 24b central portion, 27,
28 connection body, 30a, 34a liquid phase part, 30b, 34
b Gas phase part.

フロントページの続き (56)参考文献 特開 平9−327827(JP,A) 特開 平8−187760(JP,A) 特開 平8−156027(JP,A) 特開 昭60−2322(JP,A) (58)調査した分野(Int.Cl.7,DB名) B29C 33/02 - 33/04 B29C 35/02 - 35/04 F28D 15/02 H01L 21/30 Continuation of the front page (56) Reference JP-A-9-327827 (JP, A) JP-A-8-187760 (JP, A) JP-A-8-156027 (JP, A) JP-A-60-2322 (JP , A) (58) Fields investigated (Int.Cl. 7 , DB name) B29C 33/02-33/04 B29C 35/02-35/04 F28D 15/02 H01L 21/30

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 被成形製品が載置され、流通路が形成さ
れた定盤と、上記定盤に形成された上記流通路を覆うよ
うに上記定盤に接合された板状部材と、上記板状部材の
一部を外方に突出させて形成され、上記流通路内と連通
して作動液を貯溜する液溜め体と、上記液溜め体を貫通
して上記作動液中に浸漬され内部に熱源が収納される収
納体と、上記収納体の外周部に沸騰を促進させる表面処
理施工体とを備えたことを特徴とする均熱装置。
1. A product to be molded is placed and a flow passage is formed.
Cover the surface plate and the flow passage formed on the surface plate.
And a plate-like member joined to the surface plate,
It is formed by protruding a part to the outside and communicates with the inside of the flow passage.
Through the liquid reservoir that stores the working fluid and the above liquid reservoir.
Then, it is immersed in the hydraulic fluid and the heat source is stored inside.
A surface treatment for promoting boiling on the container and the outer periphery of the container.
A heat equalizing device, which is equipped with a physical construction body.
【請求項2】 被成形製品が載置され、流通路が形成さ
れた定盤と、上記定盤に形成された上記流通路を覆うよ
うに上記定盤に接合された板状部材と、上記板状部材の
一部を外方に突出させて形成され、上記流通路内と連通
して作動液を貯溜する液溜め体と、上記液溜め体を貫通
して上記作動液中に浸漬され内部に熱源が収納される収
納体と、上記収納体と上記熱源との間に充填された高熱
伝導材とを備えたことを特徴とする均熱装置。
2. A molded product is placed and a flow passage is formed.
Cover the surface plate and the flow passage formed on the surface plate.
And a plate-like member joined to the surface plate,
It is formed by protruding a part to the outside and communicates with the inside of the flow passage.
Through the liquid reservoir that stores the working fluid and the above liquid reservoir.
Then, it is immersed in the hydraulic fluid and the heat source is stored inside.
High heat filled between the container and the container and the heat source
A heat equalizing device comprising a conductive material.
【請求項3】 被成形製品が載置され、流通路が形成さ
れた定盤と、上記定盤に形成された上記流通路を覆うよ
うに上記定盤に接合された板状部材と、上記板状部材の
一部を外方に突出させて形成され、上記流通路内と連通
して作動液を貯溜する液溜め体と、上記液溜め体を貫通
して上記作動液中に浸漬された収納体と、上記収納体の
内寸法と同寸法または上記収納体の内寸法より大きい寸
法を有し、上記収納体に圧入された熱源とを備えたこと
を特徴とする均熱装置。
3. A product to be molded is placed and a flow passage is formed.
Cover the surface plate and the flow passage formed on the surface plate.
And a plate-like member joined to the surface plate,
It is formed by protruding a part to the outside and communicates with the inside of the flow passage.
Through the liquid reservoir that stores the working fluid and the above liquid reservoir.
And the container immersed in the working fluid,
The same as the internal dimensions or larger than the internal dimensions of the above-mentioned storage
And having a heat source press-fitted into the container.
Soaking device characterized by.
【請求項4】 被成形製品が載置され、流通路が形成さ
れた定盤と、上記定盤に形成された上記流通路を覆うよ
うに上記定盤に接合された板状部材と、上記板状部材の
一部を外方に突出させて形成され、上記流通路内と連通
して作動液を貯溜する液溜め体と、上記液溜め体の外周
面に接触して配置された熱源とを備えたことを特徴とす
る均熱装置。
4. A product to be molded is placed and a flow passage is formed.
Cover the surface plate and the flow passage formed on the surface plate.
And a plate-like member joined to the surface plate,
It is formed by protruding a part to the outside and communicates with the inside of the flow passage.
And the outer circumference of the above-mentioned liquid reservoir
And a heat source arranged in contact with the surface.
Soaking device.
JP05922997A 1997-03-13 1997-03-13 Heat equalizer Expired - Lifetime JP3527382B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05922997A JP3527382B2 (en) 1997-03-13 1997-03-13 Heat equalizer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05922997A JP3527382B2 (en) 1997-03-13 1997-03-13 Heat equalizer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004015181A Division JP3799043B2 (en) 2004-01-23 2004-01-23 Soaking equipment

Publications (2)

Publication Number Publication Date
JPH10249863A JPH10249863A (en) 1998-09-22
JP3527382B2 true JP3527382B2 (en) 2004-05-17

Family

ID=13107350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05922997A Expired - Lifetime JP3527382B2 (en) 1997-03-13 1997-03-13 Heat equalizer

Country Status (1)

Country Link
JP (1) JP3527382B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222214A (en) * 2005-02-09 2006-08-24 Dainippon Screen Mfg Co Ltd Heat treatment apparatus
JP5153201B2 (en) * 2007-05-01 2013-02-27 三菱電機株式会社 Soaking equipment
JP5897275B2 (en) * 2011-07-25 2016-03-30 東京エレクトロン株式会社 Temperature control unit, substrate mounting table, substrate processing apparatus, temperature control system, and substrate processing method

Also Published As

Publication number Publication date
JPH10249863A (en) 1998-09-22

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