CN213878027U

CN213878027U - Heating device with consistent wafer surface temperature

Info

Publication number: CN213878027U
Application number: CN202022939625.8U
Authority: CN
Inventors: 钟兴进
Original assignee: Guangzhou Honghao Optoelectronic Semiconductor Co ltd
Current assignee: Guangzhou Honghao Optoelectronic Semiconductor Co ltd
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-08-03
Anticipated expiration: 2030-12-09

Abstract

A heating device with consistent wafer surface temperature comprises a fixing plate, wherein supporting columns are arranged on two sides of the top end of the fixing plate, a top plate is arranged at the top ends of the supporting columns, supporting legs are arranged on two sides of the bottom end of the fixing plate, a cylinder is arranged on the fixing plate, a mounting plate is arranged at the top end of the cylinder, a telescopic rod is arranged on the mounting plate, a placing disc is arranged at the top end of the telescopic rod, a second heating element is arranged in the placing disc, a groove is formed in the outer wall of the placing disc, when the heating device is used, a wafer is placed on a heat-conducting plate, the cylinder drives the telescopic rod to enable the placing disc to ascend, the upper disc is guided into the groove through an inserting plate, the upper disc is connected with the placing disc, the second heating element heats the bottom end of the wafer through the heat-conducting plate, the first heating element heats the upper portion of the wafer in the upper disc, heating temperature is kept consistent, and the wafer is heated more uniformly through holes formed in the heat-conducting plate, the practicability and the temperature consistency of the heating device are improved.

Description

Heating device with consistent wafer surface temperature

Technical Field

The utility model relates to the field of semiconductor technology, specifically be a heating device that wafer surface temperature is unanimous.

Background

In a semiconductor manufacturing process, a Wafer (Wafer) is heated by a Wafer heating apparatus, and the Wafer heating is aimed at Chemical Vapor Deposition (CVD) for depositing films (oxide film) required by integrated circuits (ics), but the Wafer heating apparatus has a considerable influence in order to achieve temperature uniformity and reduce thermal stress, so that the Wafer has a better temperature uniformity.

For example, the patent publication "CN 201920528620.0" is named as: the patent of the 'wafer heating device' discloses that the wafer heating device comprises a hot plate for heating a wafer and a bearing structure which is arranged on the hot plate and used for fixing the wafer, wherein an included angle formed between the end face of one end, far away from the hot plate, of the bearing structure and the surface of the hot plate is adjustable, the bearing structure can stretch in the axial direction of the hot plate, and the bearing structure can stretch in the axial direction of the hot plate, so that in the using process of the wafer heating device, the bearing structure can stretch to a preset height to change the distance between the wafer to be heated and the hot plate which are fixed on the bearing structure; because the included angle formed by the end face of the bearing structure far away from the hot plate and the surface of the hot plate is adjustable, and the wafer is fixed on the end face of the bearing structure far away from the hot plate, that is, the structure can automatically adjust the inclination angle of the end face of the bearing structure abutted against the wafer to keep consistent with the inclination angle of the wafer when the wafer is obliquely placed relative to the hot plate, thereby ensuring that the wafer and the end face of the bearing structure have enough contact area, effectively avoiding the situation that the contact area of the wafer and the bearing structure is reduced due to the oblique placement of the wafer, so that the wafer cannot be stably fixed on the bearing structure, enabling the wafer to be stably obliquely placed on the wafer heating device, and further enabling the heating temperature of the wafer at each position in the heating process to be different, and because the thickness of the photoresist film attached to the surface of the wafer can be changed along with the change of the heating temperature, therefore, the wafer heating device can form photoresist films with different thicknesses on the wafer. The bearing structure comprises a body part and a moving part, wherein the body part is arranged on the hot plate and is provided with a first accommodating space, the moving part is fixed in the first accommodating space, at least one of the body part and the moving part can stretch in the axial direction of the hot plate, and an included angle formed between the moving part and the surface of the hot plate is adjustable. By the mode, a manufacturer can manufacture the telescopic body part and/or the telescopic moving part according to actual requirements, so that the manufacturing process of the wafer heating device is more flexible.

The existing wafer heating device is easy to have inconsistent heating temperature when in use, and in case of nonuniform wafer heating, great inconvenience is brought to later-stage production and test, and even the quality of a product is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

To the deficiency of the prior art, the utility model provides a convenient to use's unanimous heating device of wafer surface temperature.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a heating device that wafer surface temperature is unanimous, includes the fixed plate, fixed plate top both sides are provided with the support column, and the support column top is provided with the roof, fixed plate bottom both sides are provided with the stabilizer blade, are provided with the cylinder on the fixed plate, and the cylinder top is provided with the mounting panel, be provided with the telescopic link on the mounting panel, the telescopic link top is provided with places the dish, place the inside second that is provided with of dish and add the heat-conducting member, it is provided with the recess to place a set outer wall, the second adds the heat-conducting member and is provided with temperature sensor, and second adds the heat-conducting member top and is provided with the heat-conducting plate, the roof bottom is provided with the erection column, is provided with first heating member on the erection column, first heating member bottom is provided with the hanging wall, be provided with the controller on the fixed plate.

In order to realize better control, the utility model discloses the improvement has, controller and first heating member and second heating member electric connection, temperature sensor and controller electric connection.

In order to realize better use, the utility model discloses the improvement has, first heating member is resistance wire heater with the second heating member.

In order to realize better heating, the utility model discloses the improvement has, both sides are provided with the picture peg in the hanging wall, picture peg and recess looks adaptation.

In order to realize better cooperation, the utility model discloses the improvement has, it is corresponding with the hanging wall position to place the dish.

In order to realize better heat conduction, the utility model discloses the improvement has, be provided with the through-hole on the heat-conducting plate, the through-hole is provided with the several to equidistant even setting up on the heat-conducting plate.

(III) advantageous effects

Compared with the prior art, the utility model provides a heating device that wafer surface temperature is unanimous possesses following beneficial effect:

this heating device that wafer surface temperature is unanimous, when using, place the wafer on the heat-conducting plate (on, then the cylinder drives the telescopic link messenger and places the dish and rise, inside making the hanging wall pass through the leading-in recess of picture peg, the hanging wall with place the dish and be connected, the second heating member heat the setting of wafer bottom through the heat-conducting plate, first heating member heats wafer upper portion in hanging wall inside, makes heating temperature keep unanimous to the through-hole that sets up on the heat-conducting plate makes the wafer heat and makes more even, improves heating device's practicality and temperature uniformity.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the connection structure of fig. 1 according to the present invention;

FIG. 3 is an enlarged schematic view of FIG. 1 at 15 according to the present invention;

fig. 4 is an enlarged schematic view of fig. 1 at 7 according to the present invention;

in the figure: 1. a fixing plate; 2. a support pillar; 3. a top plate; 4. a support leg; 5. mounting a column; 6. a first heating member; 7. hanging the plate; 8. a cylinder; 9. mounting a plate; 10. a telescopic rod; 11. placing a tray; 12. a groove; 13. a second heating member; 14. a temperature sensor; 15. a heat conducting plate; 16. a controller; 17. a through hole; 18. and (4) inserting plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a heating device with uniform wafer surface temperature includes a fixing plate 1, two sides of the top end of the fixed plate 1 are provided with supporting columns 2, the top ends of the supporting columns 2 are provided with top plates 3, two sides of the bottom end of the fixed plate 1 are provided with support legs, the fixed plate 1 is provided with an air cylinder 8, the top end of the air cylinder 8 is provided with a mounting plate 9, the mounting plate 9 is provided with a telescopic rod 10, the top end of the telescopic rod 10 is provided with a placing disc 11, the placing tray 11 is internally provided with a second heating element 13, the outer wall of the placing tray 11 is provided with a groove 12, the second heating member 13 is provided with a temperature sensor 14, the top end of the second heating member 13 is provided with a heat conducting plate 15, the bottom of roof 3 is provided with erection column 5, is provided with first heating member 6 on the erection column 5, the first heating member 6 bottom is provided with hanging wall 7, be provided with controller 16 on the fixed plate 1.

In order to realize better control, the utility model discloses the improvement has, controller 16 and first heating member 6 and second heating member 13 electric connection, temperature sensor 14 and controller 16 electric connection.

In order to realize better use, the utility model discloses the improvement has, first heating member 6 is resistance wire heater with second heating member 13.

In order to realize better heating, the utility model discloses the improvement has, both sides are provided with picture peg 18 in the hanging wall 7, picture peg 18 and recess 12 looks adaptation.

In order to realize better cooperation, the utility model discloses the improvement has, it is corresponding with upper plate 7 position to place dish 11.

In order to realize better heat conduction, the utility model discloses the improvement has, be provided with through-hole 17 on the heat-conducting plate 15, through-hole 17 is provided with the several to equidistant even setting up on the heat-conducting plate 15.

To sum up, the working principle and the working process of the heating device with the consistent wafer surface temperature are that, when in use, a wafer to be heated is firstly placed on the heat conducting plate 15, the cylinder 8 drives the telescopic rod 10 to enable the placing plate 11 to ascend, so that the groove 12 for placing the plate 11 is connected with the inserting plate 18 of the upper plate 7, the second heating element 13 heats the bottom end of the wafer through the heat conducting plate 15, the first heating element 6 heats the upper part of the wafer in the upper plate 7 to keep the heating temperature consistent, and the wafer is heated more uniformly through the through hole 17 arranged on the heat conducting plate 15, so that the practicability and the temperature consistency of the heating device are improved, the temperature sensor 14 arranged on the first heating element 6 can detect the temperature in real time and transmit the value to the controller 16, the heating temperature can be observed through control, and the heating temperature of the first heating element 6 and the second heating element 13 can be adjusted through the controller 16, the practicability of the heating device is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heating device with uniform wafer surface temperature is characterized in that: comprises a fixed plate (1), support columns (2) are arranged on two sides of the top end of the fixed plate (1), a top plate (3) is arranged on the top ends of the support columns (2), support legs are arranged on two sides of the bottom end of the fixed plate (1), a cylinder (8) is arranged on the fixed plate (1), a mounting plate (9) is arranged on the top end of the cylinder (8), a telescopic rod (10) is arranged on the mounting plate (9), a placing disc (11) is arranged on the top end of the telescopic rod (10), a second heating element (13) is arranged in the placing disc (11), a groove (12) is formed in the outer wall of the placing disc (11), a temperature sensor (14) is arranged on the second heating element (13), a heat-conducting plate (15) is arranged on the top end of the second heating element (13), a mounting column (5) is arranged on the bottom end of the top plate (3), a first heating element (6) is arranged on the mounting column (7) at the bottom end of the first heating element (6), the fixed plate (1) is provided with a controller (16).

2. The heating apparatus of claim 1, wherein: the controller (16) is electrically connected with the first heating element (6) and the second heating element (13), and the temperature sensor (14) is electrically connected with the controller (16).

3. A heating apparatus according to claim 2, wherein: the first heating element (6) and the second heating element (13) are resistance wire heaters.

4. The heating apparatus of claim 1, wherein: inserting plates (18) are arranged on two sides in the upper plate (7), and the inserting plates (18) are matched with the grooves (12).

5. The heating apparatus of claim 4, wherein: the placing disc (11) corresponds to the upper disc (7).

6. The heating apparatus of claim 1, wherein: the heat-conducting plate (15) is provided with a plurality of through holes (17), and the through holes (17) are uniformly arranged on the heat-conducting plate (15) at equal intervals.