TWI550753B - A temperature control unit, a substrate stage, a substrate processing device, a temperature control system, and a substrate processing method - Google Patents

Description

Temperature control unit, substrate mounting table, substrate processing device, temperature control system, and substrate processing method

The present invention relates to a temperature control unit, a substrate stage, a substrate processing apparatus, a temperature control system, and a substrate processing method which are used when a plurality of heat treatments having different processing temperatures are applied to a substrate.

In the FPD (Flat Panel Display), solar cell or MEMS (Micro Electro Mechanical Systems) manufacturing process, various heat treatments such as film formation treatment are performed on the substrate. Conventionally, when a plurality of heat treatments having different processing temperatures are applied to the substrate, the substrate processing apparatus having different heat treatments performs the heat treatment on the substrate. However, in recent years, in order to improve the processing ability, it is required to improve the processing ability. A plurality of heat treatments having different processing temperatures are performed in one substrate processing apparatus.

As such a substrate processing apparatus, there is provided a substrate mounting table on which a substrate is placed in a processing chamber, the substrate mounting table including a cooling jacket in which a media flow path is formed, and a heater disposed under the cooling jacket The substrate processing apparatus is known (for example, refer to Patent Document 1).

In the substrate processing apparatus of Patent Document 1, the mounting surface of the substrate mounting table is heated by the heater, specifically, the temperature of the contact surface of the cooling jacket with the substrate is raised, thereby heating the substrate and cooling the substrate. The medium flow path flows a low-temperature refrigerant to lower the temperature of the contact surface, thereby cooling the substrate.

[prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 7-105422

However, in the substrate processing apparatus of Patent Document 1, since the cooling jacket and the heater are separately separated, a physical boundary is created between the cooling jacket and the heater. This boundary is, for example, a thermal resistance when the substrate is heated by a heater, and the heat from the heater is prevented from being transferred to the cooling jacket, so that the temperature of the substrate does not change rapidly.

An object of the present invention is to provide a temperature control unit, a substrate mounting table, a substrate processing apparatus, a temperature control system, and a substrate processing method which can rapidly change the temperature of a substrate.

In order to achieve the above object, the temperature control unit according to claim 1 is a temperature control unit that is in contact with a substrate to control the temperature of the substrate, and is characterized in that: a plate-shaped body that is in contact with the substrate and is embedded in the temperature control unit. a plurality of linear heaters in the body, and a media flow path of a medium formed in the body and flowing inside the predetermined temperature, wherein the heaters are arranged in parallel with each other, and the media flow path is arranged to be adjacent A portion between two of the aforementioned heaters.

The temperature control unit according to claim 2 is the one of the above-described heating in a plane view of the main body in the temperature control unit described in claim 1 In the vertical direction of the device, each of the heaters and the media flow path are alternately arranged at equal intervals.

The temperature control unit according to claim 3 is further provided in the temperature control unit according to claim 1 or 2, wherein the surface of the main body opposite to the contact surface of the substrate is disposed so as to be embedded in the present The cover of the position of each heater in the body can be opened and closed.

The temperature control unit according to claim 4 is the temperature control unit according to claim 3, wherein the system has a screw hole for screwing the cover, and the medium flow path is connected to two adjacent heaters. Snakes are made to avoid the aforementioned screw holes.

The temperature control unit according to claim 5 is the temperature control unit according to claim 4, wherein the curvature of the body of the curved portion of the meandering media flow path has a radius of 40 mm or more.

In order to achieve the above object, the substrate mounting table according to claim 6 is a substrate mounting table on which a substrate is placed, and is characterized in that: a temperature control unit that contacts the substrate to control the temperature of the substrate, and a temperature control unit that supports the temperature control unit In the base portion, the temperature control unit includes a plate-shaped body that is in contact with the substrate, and a plurality of linear heaters embedded in the body, and a medium that is formed in the body and flows a predetermined temperature inside. Media stream, Each of the heaters is disposed in parallel with each other, and the media flow path is disposed to pass between a portion of the adjacent two heaters.

In the substrate processing apparatus according to the seventh aspect of the invention, the substrate processing apparatus according to the seventh aspect of the invention includes a storage chamber in which the substrate is housed, and a substrate on which the substrate is placed in the storage chamber. In the mounting table, the substrate mounting table has a temperature control unit that contacts the substrate to control the temperature of the substrate, and a base that supports the temperature control unit, wherein the temperature control unit has a plate-shaped body that is in contact with the substrate. And a plurality of linear heaters embedded in the body, and a media flow path of a medium formed in the body and flowing inside the predetermined temperature, wherein the heaters are arranged in parallel with each other, and the media flow path is arranged It is configured to pass through a portion between two adjacent heaters.

In order to achieve the above object, the temperature control system according to claim 8 is a temperature control system for controlling the temperature of the substrate, characterized in that the temperature control unit includes a plate-shaped body that is in contact with the substrate, and is embedded. a plurality of linear heaters in the body, and a media flow path of a medium formed in the body and flowing inside the predetermined temperature, and contacting the substrate to control the temperature of the substrate; and a heater control unit Controlling the amount of heat generated by the heater; and a media control unit that controls the flow rate or temperature of the medium flowing through the media flow path, In the above-described body of the temperature control unit, each of the heaters is disposed in parallel with each other, and the media flow path is disposed to pass through a portion between two adjacent heaters.

In order to achieve the above object, the substrate processing method according to claim 9 is a substrate processing method using a temperature control unit that controls a temperature control unit that is in contact with a substrate to control the temperature of the substrate, and is provided in contact with the substrate. a plate-shaped body, a plurality of linear heaters embedded in the body, and a media flow path formed by the medium formed in the body and flowing a predetermined temperature inside, and the heaters are arranged in parallel with each other. The media flow path is disposed between the adjacent two heaters, and is characterized in that when the substrate is cooled to a target cooling temperature, a temperature lower than the target cooling temperature is supplied to the media flow path. media.

The substrate processing method according to claim 10, wherein, in the substrate processing method of claim 9, when the temperature of the main body of the temperature control unit reaches a first control change temperature that is higher than the target cooling temperature by a first predetermined temperature, The temperature of the medium supplied to the media flow path is changed to the target cooling temperature.

The substrate processing method according to claim 10, wherein the first predetermined temperature is 2° C. or more and less than 20° C.

The substrate processing method according to claim 12, wherein the temperature control unit is used in the substrate processing method according to any one of claims 9 to 11. When the temperature of the main body reaches the second control change temperature which is higher than the target cooling temperature by the second predetermined temperature, the heater generates heat, and the second predetermined temperature is lower than the first predetermined temperature.

The substrate processing method according to claim 12, wherein the second predetermined temperature is 1 ° C or more and less than 10 ° C.

The substrate processing method according to any one of claims 9 to 13, wherein when the substrate is heated to a target heating temperature, the heater is heated to the media stream. The road supplies a medium having a temperature higher than the aforementioned target heating temperature.

According to the present invention, since not only the media flow path but also a plurality of heaters are disposed in the body of the temperature control unit, there is no possibility that the heat from the heater is blocked from being transmitted to the main body. As a result, the temperature of the substrate can be changed rapidly. Further, since the heaters are arranged in parallel with each other, and the media flow path is disposed between the adjacent two heaters, the balance between the arrangement of the heating portion and the cooling portion of the body can be improved, and the substrate in contact with the body can be made. The temperature is stable and uniform.

Further, according to the present invention, when the substrate is cooled to the target cooling temperature, since the medium having a temperature lower than the target cooling temperature is supplied to the medium flow path in the body of the temperature control unit, the substrate can be quickly cooled. Further, the temperature of the substrate can be changed rapidly.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First, a substrate processing apparatus according to an embodiment of the present invention will be described.

Fig. 1 is a cross-sectional view schematically showing a configuration of a substrate processing apparatus of the embodiment.

In FIG. 1, the substrate processing apparatus 10 is provided with a storage chamber 11 in which a substrate is housed, a substrate mounting table 12 on which a substrate W is placed in a lower portion of the storage chamber 11, and an upper portion in the storage chamber 11 is disposed in an The substrate supply table 12 faces the shower head-shaped gas supply unit 13 and performs a film forming process on the substrate W housed in the storage chamber 11.

The substrate stage 12 controls the temperature of the substrate W to be placed, and the gas supply unit 13 supplies the processing gas to the inside of the storage chamber 11. In the substrate processing apparatus 10, the gas supply unit 13 supplies the processing gas for film formation, and the substrate stage 12 heats the substrate W to a predetermined high temperature, thereby performing a film formation process on the substrate W.

The substrate stage 12 has a base portion 14 that is erected from below the storage chamber 11, and a temperature control unit 15 that is supported at the upper end of the base portion 14. The temperature control unit 15 is a plate-shaped unit main body 16 that contacts the substrate W, a heater 17 that is embedded inside, a cooler flow path 18 (media flow path) that is formed inside, and is embedded in the same interior. Temperature sensor A. The unit body 16 is made of a material having high heat conductivity such as aluminum, and the heater 17 is The external heater controller 19 (heater control unit) is connected via the wiring 20, and electric power is supplied from the heater controller 19 to generate heat. The cooler flow path 18 is connected to an external cooler controller 21 (media control unit) via a pipe 22, and a medium in which the internal flow of the cooler flow path 18 is circulated and supplied from the cooler controller 21, such as Galden® (registered trademark) ).

The heater body 17 generates heat to raise the temperature of the unit body 16 to heat the substrate W contacting the unit body 16, and the cooler flow path 18 causes the temperature of the unit body 16 to flow through a low-temperature medium (refrigerant) inside. The substrate W that is in contact with the unit body 16 is cooled while being cooled. The heater controller 19, the cooler controller 21, and the temperature sensor A are connected to the device controller 23, and the device controller 23 is capable of being received in a predetermined range by the temperature of the temperature sensor A embedded in the unit body 16. The heater controller 19 and the cooler controller 21 are controlled in a manner. Specifically, the heater controller 19 receives a signal from the device controller 23, and controls the supply amount or supply timing of the power supplied to the heater 17 in accordance with the signal, and the cooler controller 21 also receives the signal from the device controller 23. The temperature, the supply amount, or the supply timing of the medium supplied to the cooler flow path 18 is controlled in accordance with the signal.

Fig. 2 is a view schematically showing a configuration of a temperature control unit of Fig. 1. Fig. 2(A) is a horizontal sectional view, Fig. 2(B) is a longitudinal sectional view, and Fig. 2(C) is a bottom view.

In FIG. 2, inside the unit body 16 of the temperature control unit 15, a temperature sensor A is embedded, and six linear heaters 17 are arranged in parallel with each other. The position of the buried temperature sensor A is the best view of the section The bottom surface is preferably the center portion (see Fig. 2(C)) where it is in contact with the substrate W (see Fig. 2(B)), but it is not particularly specified. Each of the heaters 17 is divided into two groups of E-shaped in plan view by two electric wires 20 that connect the three heaters 17. Each group has an open end of the E-shape opposed to each other, and is arranged such that one heater 17 of the other group exists between two heaters 17 adjacent to one group.

Further, one cooler flow path 18 is formed inside the unit body 16. The cooler flow path 18 is a plan view and passes through a portion between the two heaters 17 so as to be equidistant from the two heaters 17 between the adjacent two heaters 17, and is disposed at the end of each heater 17. It has a curved part. Further, in the unit main body 16, each heater 17 and the cooler flow path 18 are alternately arranged at equal intervals in a direction D perpendicular to one heater 17 in plan view (FIG. 2(A)).

On the back surface 16b of the unit main body 16 on the side opposite to the contact surface 16a of the substrate W, the E-shaped maintenance covers 24, 25 are provided so as to correspond to the groups of the heaters 17 embedded in the unit main body 16. The unit body 16 is a screw hole 26 for mounting screws for mounting the maintenance covers 24 and 25 to the unit body 16. Further, as shown in FIG. 2(A), in the present embodiment, two screw holes 26 are provided for one heater 17, but the number of the screw holes 26 is not particularly limited.

In the temperature control unit 15, when the temperature sensor A fails, or when a certain heater 17 is disconnected, the unit body 16 is removed, and the mounting screws are removed, thereby opening the rear maintenance cover 24 or 25, and replacing Faulty temperature sensor A or disconnected heater 17.

According to the temperature control unit 15 of Fig. 2, not only the cooler flow path 18 but also a plurality of heaters 17 are disposed in the unit main body 16, so that when the heater 17 and the cooler flow path 18 are provided as individual units, The boundary between the generated heater 17 and the cooler flow path 18 does not exist, and there is no thermal resistance caused by the boundary portion, so that the heat from the heater 17 to the unit body 16 is not hindered. Further, since the temperature sensor A is embedded in the unit body 16, the temperature of the unit body 16 can be accurately measured. As a result, the temperature of the substrate W can be changed rapidly.

Further, in the temperature control unit 15, each of the heaters 17 is disposed in parallel with each other, and the cooler flow path 18 is a portion that is disposed between the adjacent two heaters 17, and is in a plane view from the unit body 16. Since the heaters 17 are perpendicular to the direction D, and the heaters 17 and the cooler channels 18 are alternately arranged at equal intervals, the balance between the arrangement of the heating portion and the cooling portion of the unit body 16 can be improved. As a result, the temperature of the substrate W that is in contact with the unit body 16 can be stabilized and uniformly changed.

Further, by embedding the temperature sensor A of the temperature of the monitoring unit body 16 as close as possible to the contact surface 16a of the substrate W, the substrate W and the unit body 16 measured by the temperature sensor A can be reduced. The temperature gradient between them makes it possible to precisely control the temperature of the substrate W.

Further, the temperature control unit 15 further includes an openable and closable cover 24, 25 disposed on the rear surface 16b of the unit main body 16 so as to correspond to the position of each heater 17, so that even the temperature sensor A or the heater 17 Damage or replacement of the heater 17 can further reduce the operating cost of the temperature control unit 15. Also, since the maintenance covers 24, 25 are not configured The contact surface 16a of the unit body 16 is the back surface 16b, so that the boundary between the maintenance covers 24, 25 and the unit body 16 does not become a thermal resistance and hinders the heating or flow of the substrate W of the heater 17 to the cooler. The cooling of the substrate W of the refrigerant inside the flow path 18 can further change the temperature of the substrate W more quickly.

Further, in the present embodiment, the heaters 17 are linear heaters which are parallel to each other. However, the shape of the region in which the heat exchange is performed may be arranged, and the curved heaters of the same shape may be arranged at a distance therebetween. Form a certain. In this case, the curved heater may be, for example, a heater formed by an arc-shaped curve or a linear curve, or may be a curved heater that is meandered in one direction. In the case of a snake heater, the adjacent heaters may be in a shape that is mirror-symmetrical to each other or a shape that moves in parallel.

Further, in the present embodiment, the cooler flow path 18 is a flow path for describing one system constituted by one flow path, but may be configured as a flow path of a complex system composed of two or more flow paths. One flow path is likely to have a temperature difference between the upstream and downstream, but if it is constituted by a plurality of flow paths, the flow path of one system becomes short, so that the temperature difference between the upstream and the downstream can be reduced, and the temperature difference can be alleviated. The heat exchange in the plane of the unit body 16 is not uniform.

Fig. 3 is a structural view schematically showing a modification of the temperature control unit of Fig. 1. Fig. 3(A) is a horizontal sectional view, Fig. 3(B) is a longitudinal sectional view, and Fig. 3(C) is a bottom view. In the present modification, the number of heaters and the shape of the cooler are different from those of the temperature control unit 15 of Fig. 2 .

However, in order to ensure the function of each of the screw holes 26, for example, the exertion of the locking force or the resistance to the locking force, it is necessary to arrange the screw holes 26 at a certain distance or more from the heater 17 or the cooler flow path 18. As a result, the arrangement place of the heater 17 or the cooler flow path 18 is left and right by the arrangement place of the screw holes 26. Specifically, in the temperature control unit 15 of FIG. 2, since the heater 17 or the cooler flow path 18 is formed in a linear shape, the heaters 17 and the coolers cannot be made in consideration of the arrangement positions of the screw holes 26. When the flow path 18 is closer to a certain extent, the number of configurable heaters 17 is limited, and the media flow path 18 cannot be bent, so that the temperature distribution in the plane of the unit body 16 may become uneven. In this regard, the temperature control unit 27 of FIG. 3 causes the cooler flow path 18 to meander between the adjacent two heaters 17 so as to be able to avoid the screw holes 26 for mounting screws. Thereby, by arranging the screw holes 26 inside the curved portions 18a of the cooler flow path 18, a certain distance can be secured from each of the screw holes 26 to the cooler flow path 18, and the adjacent curved portion 18a can be adjacent to the curved portion 18a. The curved portion 18b approaches the heater 17. Thereby, each of the heaters 17 and the cooler flow path 18 can be brought closer to the heater 17 and the cooler flow path 18 of the temperature control unit 15 of Fig. 2 . As a result, more heaters 17 can be disposed in the unit body 16, and the cooler flow path 18 can be made finer, so that the temperature uniformity in the plane of the unit body 16 can be improved. For example, eight heaters 17 can be arranged in the temperature control unit 27 of FIG.

Further, in the temperature control unit 27, the curvature of the unit body 16 of the meandering cooler flow path 18 is set to have a radius of 40 mm or more. Thereby, there is no extreme decrease in the conductance of the cooler flow path 18. Since the pressure loss of the medium flowing in the cooler flow path 18 does not occur, the supply efficiency of the medium can be prevented from being lowered.

Further, in the present modification, the cooler flow path 18 is snaked back and forth to avoid the screw hole 26. However, the heater 17 may not be circumvented to avoid the screw hole 26, instead of the cooler flow path 18.

Next, a substrate processing method according to an embodiment of the present invention will be described. The substrate processing method of the present embodiment is executed by the device controller 23 in the substrate processing apparatus 10 including the temperature control unit 15. Further, in the substrate processing method of the present embodiment, the temperature of the unit body 16 is used instead of the temperature of the substrate W, and the temperature of the unit body 16 is controlled by the heater 17 or the cooler flow path 18.

4 is a sequence diagram showing temperatures of respective portions during cooling of the substrate in the substrate processing method of the embodiment.

In FIG. 4, once the cooling to the target cooling temperature of the substrate W of, for example, 250 ° C, for example, 120 ° C, is started, the heater controller 19 stops the supply of electric power to the heater 17, and the cooler controller 21 causes the flow to the cooler. The temperature of the medium supplied by the path 18 is lowered to a cooling temperature lower than the target cooling temperature, for example, 80 °C. Then, once the unit body 16 is cooled by the medium for cooling, it reaches a temperature (first control change temperature) which is only 2 ° C or more higher than the target cooling temperature and less than 20 ° C (first predetermined temperature). For example, at 130 ° C, the cooler controller 21 changes the temperature of the medium supplied to the cooler flow path 18 to the target cooling temperature, lowers the temperature drop rate, and moderates the temperature drop of the unit body 16.

According to the substrate processing method of the present embodiment, the substrate W is When cooling to the target cooling temperature, the medium of the temperature (cooling temperature) lower than the target cooling temperature is supplied to the cooler flow path 18, so that the cooling of the substrate W can be quickly performed, and the temperature of the substrate W can be quickly changed. .

Further, in the substrate processing method of the present embodiment, when the temperature of the unit body 16 reaches the first control change temperature higher than the target cooling temperature, the temperature of the medium supplied to the cooler flow path 18 is changed to the target cooling temperature. Therefore, there is no case where the unit body 16 is excessively cooled, and thus it is possible to prevent the temperature of the unit body 16 from being lower than the target cooling temperature.

In the substrate processing method according to the above-described embodiment, when the supply of electric power to the heater 17 is stopped, the supply of electric power is not restored, but the supply of electric power can be restarted intentionally.

FIG. 5 is a sequence diagram showing temperatures of respective portions during cooling of the substrate in a modification of the substrate processing method according to the embodiment.

In FIG. 5, once the cooling of the substrate W is started, the heater controller 19 stops the supply of electric power to the heater 17, and the cooler controller 21 lowers the temperature of the medium supplied to the cooler flow path 18 to the cooling temperature. When the unit body 16 is cooled and reaches the first control change temperature, the cooler controller 21 changes the temperature of the medium supplied to the cooler flow path 18 to the target cooling temperature.

Thereafter, once the unit body 16 is cooled again and reaches a temperature (second control change temperature) of a predetermined temperature (second predetermined temperature) which is only 1 ° C or more and less than 10 ° C higher than the target cooling temperature, for example, 125 ° C, heating is performed. The controller 19 restores the power supply to the heater 17. In this way, the media will be After the temperature of the unit body 16 is changed to the target cooling temperature, even if the temperature drop rate of the unit body 16 does not fall to a desired level, the temperature of the unit body 16 can be moderated by the heating unit body 16, and the temperature of the unit body 16 can be reliably prevented. Below the target cooling temperature.

Further, in the substrate processing method of the present embodiment, the temperature of the medium supplied to the cooler flow path 18 can be changed during heating of the substrate W.

FIG. 6 is a sequence diagram showing temperatures of respective portions during heating of the substrate in the substrate processing method of the embodiment.

In Fig. 6, once heating to a target heating temperature of the substrate W of, for example, 60 ° C, for example, 250 ° C, the heater controller 19 starts power supply to the heater 17, and the cooler controller 21 causes the cooler to flow. The temperature of the medium supplied from the path 18 rises to a temperature higher than the target heating temperature, for example, 280 °C. Then, once the unit body 16 is heated to reach a temperature (third control change temperature) of only a predetermined temperature lower than the target heating temperature by 2 ° C or more and less than 20 ° C, for example, 240 ° C, the cooler controller 21 is going to The temperature of the medium supplied from the cooler flow path 18 is changed to the target heating temperature.

In the above-described substrate processing method, when the substrate W is heated to the target heating temperature, a medium having a temperature higher than the target heating temperature (heating temperature) is supplied to the cooler flow path 18, so that the substrate W can be quickly heated. Further, the temperature of the substrate W can be changed to be faster.

Further, in the substrate processing method described above, when the temperature of the unit main body 16 reaches a third control change temperature lower than the target heating temperature, the temperature of the medium supplied to the cooler flow path 18 is changed to the target heating temperature. This does not allow the unit body 16 to be overheated, thereby preventing the temperature of the unit body 16 from being higher than the target heating temperature.

In the above-described substrate processing method, when the supply of electric power to the heater 17 is started, the supply of electric power is not stopped, but the supply of electric power can be intentionally stopped.

FIG. 7 is a sequence diagram showing temperatures of respective portions during heating of the substrate in a modification of the substrate processing method according to the embodiment.

In FIG. 7, when heating of the substrate W is started, the heater controller 19 starts supplying electric power to the heater 17, and the cooler controller 21 raises the temperature of the medium supplied to the cooler flow path 18 to the heating temperature. When the unit body 16 is heated to reach the third control change temperature, the cooler controller 21 changes the temperature of the medium supplied to the cooler flow path 18 to the target heating temperature.

Then, once the unit body 16 is heated again to reach a temperature (fourth control change temperature) of only a predetermined temperature lower than the target heating temperature by 1 ° C or more and less than 10 ° C, for example, 245 ° C, the heater controller 19 stops The power supply of the heater 17 is supplied. By this, after the temperature of the medium is changed to the target heating temperature, even if the temperature increase rate of the unit main body 16 does not fall to a desired level, the amount of heat supplied to the unit main body 16 can be drastically reduced by stopping the heat generation of the heater 17. Further, by easing the temperature increase rate of the unit body 16, it is possible to surely prevent the temperature of the unit body 16 from being higher than the target heating temperature.

Further, the temperature control unit 15 of the substrate stage 12 of the substrate processing apparatus 10 that performs the substrate processing method of the present embodiment is as described above. In the unit body 16, not only the cooler flow path 18 but also a plurality of heaters 17 and a temperature sensor A are disposed, and the temperature of the unit body 16 is monitored by the temperature sensor A to flow inside the cooler flow path 18. The temperature of the medium or the temperature of the heater 17 can accurately perform the substrate processing method using the heating of the heater 17 and the heating of the cooler flow path 18 as shown in Fig. 6 or Fig. 7 .

The substrate processing method according to the present embodiment is applied to temperature adjustment of the substrate W between a plurality of film formation processes having different processing temperatures. However, the pressure in the storage chamber 11 when the substrate processing method is performed is not particularly limited, and the atmospheric pressure is not limited. It can be vacuumed.

Further, in the above-described embodiment, the film forming process is described. However, the process to which the present invention is applicable is not particularly limited to the above-described film forming process as long as it requires a rapid temperature change.

Further, although the substrate processing method according to the above embodiment is executed by the device controller 23, the heater controller 19 or the cooler may be controlled by an external server (not shown) connected to the substrate processing apparatus 10 via the network. The operation of the controller 21 is carried out.

Further, the medium supplied to the cooler flow path 18 is not limited to Galden®, and for example, an oil-based medium can be used.

Although the present invention has been described above using the above embodiments, the present invention is not limited to the above embodiments.

It is also an object of the present invention to provide a memory medium for recording a software program that realizes the functions of the above-described embodiments to a computer or the like, and the CPU of the computer reads the program stored in the memory medium and executes it.

In this case, the program itself read from the memory medium realizes the functions of the above embodiment, and the program and the memory medium for storing the program constitute the present invention.

Further, the memory medium for supplying the program is, for example, RAM, NV-RAM, floppy (registered trademark), hard disk, optical disk, CD-ROM, CD-R, CD-RW, DVD ( A disc, a magnetic tape, a non-volatile memory card, and other ROMs such as a DVD-ROM, a DVD-RAM, a DVD-RW, and a DVD+RW are used to store the above programs. Alternatively, the program may be downloaded and supplied to a computer from another computer or database (not shown) connected to the Internet, a commercial network, or a local area network.

Further, by executing the program read by the CPU of the computer, not only the functions of the above-described embodiments but also the OS (operating system) operating on the CPU are actually processed according to the instructions of the program. Some or all of the functions of the above embodiment are realized by this processing.

It also includes the CPU of the function expansion board or the function expansion unit after the program read from the memory medium is written to the memory expansion unit of the computer or the memory expansion unit connected to the computer. Some or all of the actual processing is performed in accordance with the instruction of the program, and the function of the above embodiment is realized by the processing.

The form of the above program may be constituted by an object code (Object Code), a program executed by an interpreter, or a script data supplied to the OS.

A‧‧‧Temperature Sensor

10‧‧‧Substrate processing unit

12‧‧‧Substrate mounting table

15,27‧‧‧temperature control unit

16‧‧‧ Unit Ontology

17‧‧‧heater

18‧‧‧ cooler flow path

19‧‧‧heater controller

21‧‧‧cooler controller

24,25‧‧‧ Cover for maintenance

26‧‧‧ screw holes

FIG. 1 is a cross-sectional view schematically showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2 is a view schematically showing a configuration of a temperature control unit of Fig. 1. Fig. 2(A) is a horizontal sectional view, Fig. 2(B) is a longitudinal sectional view, and Fig. 2(C) is a bottom view.

Fig. 3 is a structural view schematically showing a modification of the temperature control unit of Fig. 1. Fig. 3(A) is a horizontal sectional view, Fig. 3(B) is a longitudinal sectional view, and Fig. 3(C) is a bottom view.

4 is a sequence diagram showing temperatures of respective portions during cooling of the substrate in the substrate processing method according to the embodiment of the present invention.

FIG. 5 is a sequence diagram showing temperatures of respective portions during cooling of the substrate in a modification of the substrate processing method according to the embodiment of the present invention.

FIG. 6 is a sequence diagram showing temperatures of respective portions during heating of the substrate in the substrate processing method according to the embodiment of the present invention.

FIG. 7 is a sequence diagram showing temperatures of respective portions during heating of the substrate in a modification of the substrate processing method according to the embodiment of the present invention.

A‧‧‧Temperature Sensor

15‧‧‧ Temperature Control Unit

16‧‧‧ Unit Ontology

16a‧‧‧Contact surface

16b‧‧‧Back

17‧‧‧heater

18‧‧‧ cooler flow path

20‧‧‧ wiring

24,25‧‧‧ Cover for maintenance

26‧‧‧ screw holes

Claims (14)

A temperature control unit is a temperature control unit that is in contact with a substrate to control the temperature of the substrate, and is characterized in that: a plate-shaped body that is in contact with the substrate, and a plurality of linear heaters embedded in the body And the plurality of straight-line heaters are divided into two pairs of wires that are connected to each other in the opposite direction, and a media flow path of the medium that is formed in the body and flows inside the predetermined temperature, and each of the heaters In parallel with each other, one heater of the other group of the two groups is present between two heaters adjacent to one of the two groups, and the one group and the other group are open. In a manner in which the ends are opposed to each other, one of the two sets of wires is connected to one end of the heater by one of the two electric wires, and the other one is connected by the other electric wire of the two electric wires. The other end portion of the heater is connected, and the medium flow path is disposed so as to pass through a portion between the adjacent two heaters, and is bent at an end portion of the heater. The temperature control unit according to claim 1, wherein each of the heaters and the media flow path are alternately arranged at equal intervals in a direction perpendicular to one of the heaters in plan view of the main body. The temperature control unit according to claim 1 or 2, wherein the surface of the main body opposite to the contact surface of the substrate further includes a position corresponding to each of the heaters embedded in the body The cover can be opened and closed. The temperature control unit of claim 3, wherein the system has a screw hole for a screw for mounting the cover, and the media flow path is snaking between two adjacent heaters to avoid the foregoing Screw hole. The temperature control unit of claim 4, wherein the curvature of the body of the curved portion of the meandering media flow path has a radius of 40 mm or more. A substrate mounting table is a substrate mounting table on which a substrate is mounted, and is characterized in that: a temperature control unit that contacts the substrate to control the temperature of the substrate, and a base that supports the temperature control unit, wherein the temperature control unit has: a plate-shaped body that is in contact with the substrate, and a plurality of linear heaters that are embedded in the body, and two wires that connect the plurality of linear heaters into two opposing groups. And a media flow path of the medium formed in the body and flowing inside the predetermined temperature, wherein the heaters are arranged in parallel with each other so that the two heaters are adjacent to each other in one of the two groups. One of the heaters of the other group of the group is connected to each other by one of the two electric wires so that the one of the two groups faces the open end of the other group. One end of the heater, and the other one of the two sets is connected to the other end of the heater by the other electric wire of the two electric wires, and the media flow path is configured After set to two adjacent of said heater The portion between the ends is bent at the end of the aforementioned heater. A substrate processing apparatus which is a substrate processing apparatus that performs processing on a substrate, and includes: a storage chamber in which the substrate is housed; and a substrate mounting table in which the substrate is placed in the storage chamber, wherein the substrate mounting table has a temperature control unit that controls the temperature of the substrate in contact with the substrate, and a base portion that supports the temperature control unit. The temperature control unit has a plate-shaped body that is in contact with the substrate, and is embedded in the body. a plurality of straight-line heaters, and two electric wires that connect the plurality of linear heaters into two opposite pairs, and a media stream that is formed in the body and flows inside the predetermined temperature Each of the heaters is arranged in parallel with each other so that one heater of the other of the two groups is present between two heaters adjacent to one of the two groups, and the one of the groups is In the above-described one of the groups, the one of the two sets of the electric wires is connected to one of the heaters. In the other end, the other group is configured by connecting the other end of the heater with the other electric wire of the two electric wires, and the media flow path is disposed between the adjacent two heaters The portion is bent at the end of the aforementioned heater. A temperature control system is a temperature control system for controlling the temperature of a substrate, and has the following features: The temperature control unit includes a plate-shaped body that is in contact with the substrate, a plurality of linear heaters that are embedded in the body, and two groups that divide the plurality of linear heaters into opposite directions. And the two connected wires and the media flow path of the medium formed in the body and flowing inside the predetermined temperature, and the substrate is in contact with the substrate to control the temperature of the substrate; and the heater control unit controls the heater And a media control unit that controls a flow rate or a temperature of a medium flowing through the media flow path, wherein each of the heaters is disposed in parallel with each other in the body of the two groups in the body of the temperature control unit One heater of the other group of the two groups is present between two adjacent heaters in one of the groups, and the one of the one group and the open end of the other group are opposed to each other. In the group, one end of the heater is connected to one of the two electric wires, and the other group is connected to the other electric wire of the two electric wires. The other end of the heat being configured, the media flow path system passing portion arranged between two adjacent heater of the bent end portion of the heater. A substrate processing method using a substrate processing method of a temperature control unit that is in contact with a substrate to control a temperature of the substrate, and includes a plate-shaped body that is in contact with the substrate, and is embedded in a plurality of linear heaters in the body, and The plurality of linear heaters are divided into two wires that are connected in two opposite directions, and a media flow path of a medium that is formed in the body and that flows inside the predetermined temperature, and the heaters are parallel to each other. One heater of the other group of the two groups is disposed between two heaters adjacent to one of the two groups, and the open ends of the one group and the other group are arranged In the above-described manner, one of the two sets of wires is connected to one end of the heater by one of the two electric wires, and the other one is connected to the other by the other electric wires of the two electric wires. The other end of the device is configured such that the medium flow path is disposed so as to pass through a portion between the adjacent two heaters and is bent at an end portion of the heater. It is characterized in that when the substrate is cooled to a target cooling temperature, a medium having a temperature lower than the target cooling temperature is supplied to the medium flow path. The substrate processing method according to claim 9, wherein when the temperature of the main body of the temperature control unit reaches a first control change temperature that is higher than the target cooling temperature by a first predetermined temperature, the medium flow path is supplied. The temperature of the medium is changed to the aforementioned target cooling temperature. The substrate processing method according to claim 10, wherein the first predetermined temperature is 2 ° C or more and less than 20 ° C. The substrate processing method of claim 10 or 11, wherein when the temperature of the body of the temperature control unit reaches only the aforementioned When the second control changes the temperature at which the cooling temperature is higher than the second predetermined temperature, the heater is heated, and the second predetermined temperature is lower than the first predetermined temperature. The substrate processing method according to claim 12, wherein the second predetermined temperature is 1 ° C or more and less than 10 ° C. The substrate processing method according to any one of claims 9 to 11, wherein when the substrate is heated to a target heating temperature, the heater is heated, and the medium flow path is supplied to the target. A medium that heats the temperature at a higher temperature.