TW202401195A - Temperature compensation system, semiconductor equipment and emperature compensation method - Google Patents

Abstract

The present disclosure provides a temperature compensation system, comprising a cavity, a temperature feedback module, a heating plate, a main heating module, a multi-zone temperature control module, a distributed temperature control module and an auxiliary temperature control module; at least one temperature control compensation area is arranged on the bottom surface of the heating plate, and the auxiliary temperature control module is arranged corresponding to the temperature control compensation area; A temperature feedback module detects the temperature of the heating plate to obtain a first temperature value and a second temperature value; the multi-zone temperature control module controls the main heating module to perform temperature adjustment on the heating plate according to the first temperature value, and the distributed temperature control module controls the auxiliary temperature control module to perform temperature compensation adjustment on the temperature control compensation zone according to the second temperature value. The complicated outlet design is avoided, the volume space is small, the cost is saved, and the temperature control accuracy is high. The present disclosure also provides a semiconductor equipment and an emperature compensation method.

Description

Temperature compensation system, semiconductor device and temperature compensation method

The present invention relates to the field of semiconductor manufacturing, and in particular to a temperature compensation system, a semiconductor device and a temperature compensation method.

Currently, in the wafer baking process in the semiconductor manufacturing process, substrate baking units need to be frequently used. In the heating and baking process, the temperature uniformity of the substrate is crucial to whether the process indicators can be achieved. Therefore, it is equally important to effectively adjust the temperature uniformity of the substrate.

At present, the industry's conventional solution for adjusting substrate temperature is to optimize the heating circuit of the heater and appropriately increase the number of heater zones to improve the temperature uniformity of the hot plate. However, this solution has its limitations. First of all, simply optimizing the heater circuit layout, optimizing the hardware structure around the heater, or even performing some necessary thermal field analysis cannot significantly improve the temperature uniformity during the wafer baking process. sex. If you want to greatly improve the temperature uniformity during the wafer baking process, the solution adopted is to increase the number of heater partitions, so that different heater partitions can be controlled separately through a multi-zone temperature control system. However, this traditional solution will significantly Increasing the development cycle of the heater will increase the cost of heater research and development, and the heater manufacturing process will be more strictly controlled, resulting in a decrease in the heater yield, and the price of multi-zone high-precision heaters will be more expensive; another On the other hand, the solution of optimizing the heating circuit by adding partitions will lead to more power lines and temperature sensors, and the wiring will be more complicated, which will increase the difficulty of designing the structure around the heater. When the heater partitions are added, the problem will be greatly increased. This greatly increases the cost of the temperature control part and takes up a larger space for installation hardware.

Therefore, it is necessary to provide a temperature compensation system, a semiconductor device and a temperature compensation method to solve the above-mentioned problems existing in the prior art.

The object of the present invention is to provide a temperature compensation system, a semiconductor device and a temperature compensation method to solve the problems in the prior art of high cost of adjusting the substrate temperature and occupying a large space for hardware installation.

In order to achieve the above purpose, it includes a cavity, a temperature feedback module, a heating plate, a multi-zone temperature control module, a distributed temperature control module, a main heating module for heating the heating plate and at least one auxiliary regulator. Temperature module, the cavity and the bottom surface of the heating plate form an installation cavity, and the main heating module, the auxiliary temperature control module and the distributed temperature control module are arranged in the installation cavity, so The distributed temperature control module is communicatively connected to the temperature feedback module and the auxiliary temperature control module, and the multi-zone temperature control module is communicatively connected to the temperature feedback module and the main heating module; At least one temperature control compensation area is provided on the bottom surface of the heating plate, and the auxiliary temperature control module is provided corresponding to the temperature control compensation area; The temperature feedback module performs temperature detection on the heating plate to obtain a first temperature value and a second temperature value; The multi-zone temperature control module controls the main heating module to adjust the temperature of the heating plate according to the first temperature value; The distributed temperature control module controls the auxiliary temperature control module to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value.

The beneficial effects of the temperature compensation system of the present invention are: By setting the auxiliary temperature adjustment module correspondingly in the temperature control compensation area to perform temperature compensation and adjustment on the heating plate, complex outlet design is avoided, and the volume space is small. In the existing technology, the cost of adjusting the substrate temperature is high and the hardware is occupied. The problem of large installation space. The heating plate is detected by the temperature feedback module to obtain the first temperature value and the second temperature value. The multi-zone temperature control module controls the main heating module to adjust the temperature of the heating plate according to the first temperature value. , the distributed temperature control module controls the auxiliary temperature control module to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value; through temperature adjustment and temperature compensation adjustment, the temperature of the heating plate is made more uniform, The temperature uniformity of the semiconductor substrate is effectively controlled with the lowest possible manufacturing and maintenance costs, and the temperature control accuracy is high.

After the heating power of the main heating module stabilizes, the temperature feedback module performs a first round of temperature detection on the heating plate to obtain the first temperature value, and feeds the first temperature value back to the heating plate. Described multi-zone temperature control module; After the temperature adjustment is completed, the temperature feedback module performs a second round of temperature detection on the heating plate to obtain the second temperature value, and feeds the second temperature value back to the distributed temperature control module. group.

Optionally, a partition is provided between the main heating module and the distributed temperature control module, and the auxiliary temperature control module is provided on the partition.

Optionally, the partition plate is provided with lead holes that allow lead wires to pass through.

Optionally, the auxiliary temperature control module includes a temperature compensation unit, the temperature compensation unit is communicatively connected to the distributed temperature control module, and the distance between the temperature compensation unit and the corresponding temperature control compensation area is Greater than or equal to 0.

Optionally, the auxiliary temperature control module further includes a fixing component used to fix the temperature compensation unit to the corresponding temperature control compensation area.

Optionally, the auxiliary temperature control module further includes a support member provided on the partition, an elastic member provided inside the support member, and an installation portion provided on the top of the elastic member. The temperature compensation The unit is arranged on a side of the mounting part facing the heating plate; The elastic member exerts an acting force on the temperature compensation unit in a direction corresponding to the temperature control compensation area under the action of the support member to adjust the distance between the temperature compensation unit and the corresponding temperature control compensation area. distance.

Optionally, the support member is provided with lead holes allowing lead wires to pass through.

Optionally, the temperature compensation unit includes a heating unit and a cooling unit, and the heating unit is spaced apart from the cooling unit.

Optionally, when the second temperature value is less than a preset second target temperature, the distributed temperature control module controls the heating unit to perform temperature adjustment on the temperature control compensation area corresponding to the second temperature value. Compensation adjustment.

Optionally, when the second temperature value is greater than the preset second target temperature, the distributed temperature control module controls the cooling unit to perform temperature control on the temperature control compensation area corresponding to the second temperature value. Compensation adjustment.

Optionally, the temperature compensation system further includes a temperature control sealing plate disposed in the installation cavity, the temperature control sealing plate is located at the bottom end of the heating plate, and the temperature control sealing plate is in contact with the heating plate. A heat preservation space is formed between the heat preservation space and the inner wall of the installation cavity, and the distributed temperature control module and the auxiliary temperature control module are both arranged in the heat preservation space.

Optionally, the top surface of the heating plate includes a substrate contact area, the bottom surface of the heating plate includes a bottom control area corresponding to the substrate contact area, and the temperature control compensation area is within the bottom control area. any area.

The invention also provides a semiconductor device, including the temperature compensation system.

The invention also provides a temperature compensation method, which includes the following steps: S1: Perform temperature detection on the heating plate to obtain the first temperature value and the second temperature value; S2: Control the main heating module to adjust the temperature of the heating plate according to the first temperature value; S3: Control the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value.

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making any progress fall within the scope of protection of the present invention. Unless otherwise defined, technical or scientific terms used herein shall have their ordinary meaning understood by one of ordinary skill in the art to which this invention belongs. The use of "comprising" and similar words herein means that the elements or things appearing before the word include the elements or things listed after the word and their equivalents, without excluding other elements or things.

In order to solve the problems existing in the prior art, embodiments of the present invention provide a temperature compensation system. Figure 1 is a schematic cross-sectional structural diagram of the temperature compensation system according to the embodiment of the present invention. Figure 2 is a schematic diagram of the circuit connection frame of the temperature compensation system according to the embodiment of the present invention.

Referring to Figures 1 and 2, the temperature compensation system of the present invention includes a cavity 1, a temperature feedback module 4, a heating plate 2, a distributed temperature control module 5, and a multi-zone temperature control module 90. The main heating module 9 and at least one auxiliary temperature adjustment module 6 used for heating by the heating plate 2; The bottom surface of the cavity 1 and the heating plate 2 forms an installation cavity 11, and the main heating module 9, the auxiliary temperature control module 6 and the distributed temperature control module are arranged in the installation cavity 11. 5; Referring to Figure 2, the distributed temperature control module 5 is communicatively connected to the temperature feedback module 4 and the auxiliary temperature regulation module 6. The multi-zone temperature control module 90 is connected to the temperature feedback module 4 and The main heating module 9 is connected through communication.

In some embodiments, the heating plate 2 is made of thermally conductive material to facilitate the main heating module 9 to adjust the temperature of the heating plate 2 .

In some specific embodiments, the shape of the main heating module 9 is consistent with the shape of the heating plate 2, and the heating plate 2 is seamlessly connected to the main heating module to improve temperature regulation efficiency.

In some embodiments, the main heating module and the heating plate 2 are connected through a sintering process.

In a specific implementation, the main heating module 9 is embedded inside the heating plate 2 through a sintering process, that is, the main heating module 9 is embedded in the middle layer of the heating plate 2 .

In another specific implementation, the main heating module 9 is sintered on the back of the heating plate 2 through a sintering process, so that the main heating module 9 and the heating plate 2 are seamlessly connected.

In other embodiments, the main heating module 9 and the heating plate 2 are connected by adhesion or welding.

Referring to Figures 1 and 2, at least one temperature control compensation area (not labeled in the figure) is provided on the bottom surface of the heating plate 2, and the auxiliary temperature control module 6 is provided corresponding to the temperature control compensation area.

In some specific embodiments, the specific range of the temperature control compensation area and the distance between adjacent temperature control compensation areas are determined by the structural performance, process requirements and installation conditions of the heating plate 2 itself.

The temperature feedback module 4 detects the temperature of the heating plate 2 to obtain the first temperature value and the second temperature value; The multi-zone temperature control module 90 controls the main heating module 9 to adjust the temperature of the heating plate 2 according to the first temperature value; The distributed temperature control module 5 controls the auxiliary temperature control module 6 to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value.

In some embodiments, the distributed temperature control module 5 includes a control board composed of a printed circuit board (PCB) and functional devices provided on the PCB board.

The advantages of the temperature compensation system of the present invention are: by setting the auxiliary temperature adjustment module 6 correspondingly in the temperature control compensation area to perform temperature compensation and adjustment on the heating plate 2, complex outlet design is avoided, and it occupies less space and solves the problem of In the existing technology, the cost of adjusting the substrate temperature is high and the hardware installation space is occupied. The temperature feedback module 4 detects the heating plate 2 to obtain a first temperature value and a second temperature value, and the multi-zone temperature control module 90 controls the main heating module 9 to control the temperature of the heating plate 2 according to the first temperature value. The heating plate 2 performs temperature adjustment, and the distributed temperature control module 5 controls the auxiliary temperature adjustment module 6 to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value, so that the temperature of the heating plate 2 is more uniform. , effectively controlling the temperature uniformity of the semiconductor substrate with high temperature control accuracy at the lowest possible manufacturing and maintenance costs. It can effectively reduce the number of partitions increased by using traditional technical solutions and reduce the cost of the temperature control part.

As an optional embodiment of the present invention, the top surface of the heating plate 2 includes a substrate contact area, the bottom surface of the heating plate 2 includes a bottom surface control area corresponding to the substrate contact area, and the temperature control compensation area Any area within the bottom surface control area.

In some embodiments, the heating plate 2 is provided with multiple heating zones, and the main heating module 9 is equipped with a multi-zone heating circuit to facilitate heating of multiple heating zones.

Figure 3 is a schematic structural diagram of a temperature feedback module and a distributed temperature control module according to an embodiment of the present invention.

In some embodiments, referring to Figure 3, the temperature compensation system also includes a cover 13. A heating cavity 10 is formed between the cover 13 and the cavity 1. The heating cavity 10 is used to place the components that need to be processed. For wafers in the wafer baking process or temperature measurement wafers used to detect temperature, the cover 13 is used to cover the top of the heating cavity 10 to reduce heat loss. The heating plate 2 is arranged in the heating cavity. At the bottom of the cavity 10, the decentralized temperature control module 5 is located at the bottom of the heating plate 2, and the decentralized temperature control module 5 is not in contact with the heating plate 2.

As an optional embodiment of the present invention, with reference to Figures 1 and 2, the temperature feedback module 4 performs a first round of temperature detection on the heating plate 2 after the heating power of the main heating module 9 is stabilized. To obtain the first temperature value, and feed the first temperature value back to the multi-zone temperature control module 90; After the temperature adjustment is completed, the temperature feedback module 4 performs a second round of temperature detection on the heating plate 2 to obtain the second temperature value, and feeds the second temperature value back to the distributed temperature controller. Control module 5.

In some embodiments, the temperature feedback module 4 includes a temperature measurement wafer 41 and a temperature measurement sensor 42. The temperature measurement wafer 41 and the temperature measurement sensor 42 are connected. The temperature measurement sensor The controller 42 is communicatively connected with the distributed temperature control module 5 .

In some embodiments, the steps for the temperature feedback module 4 to perform the first round of temperature detection are: After the heating power of the main heating module 9 is stabilized, the temperature measurement wafer 41 is placed in the heating cavity 10 on the top surface of the heating plate 2, and the temperature measurement sensor 42 is used to measure the temperature. The temperature measurement wafer 41 performs a first round of temperature detection on the heating plate 2 to obtain the first temperature value, and feeds the first temperature value back to the multi-zone temperature control module 90 .

In some embodiments, the specific adjustment steps for the multi-zone temperature control module 90 to control the main heating module 9 to adjust the temperature of the heating plate 2 according to the first temperature value are: When the first temperature value is less than the preset first target temperature, the multi-zone temperature control module 90 controls the main heating module 9 to increase its heating power to increase the temperature of the heating plate 2 until the The first temperature value is adjusted to the first target temperature to keep the output power of the main heating module 9 stable; When the first temperature value is greater than the preset first target temperature, the multi-zone temperature control module 90 controls the main heating module 9 to reduce its heating power to reduce the temperature of the heating plate 2 until Adjust the first temperature value to the first target temperature to keep the output power of the main heating module 9 stable.

In some embodiments, referring to Figures 2 and 3, the steps for the temperature feedback module 4 to perform the second round of temperature detection are: After the temperature adjustment is completed, the temperature measurement wafer 41 is placed in the heating cavity 10 on the top of the heating plate 2, and the temperature measurement sensor 42 is used to detect the temperature of the temperature measurement wafer 41. temperature to achieve temperature detection of the heating plate 2; After obtaining the second temperature value, the temperature sensor 42 feeds back the second temperature value to the distributed temperature control module 5 .

In some embodiments, multiple temperature measurement points are provided on the temperature measurement wafer 41 , each temperature measurement point is connected to at least one temperature measurement sensor 42 , and the temperature control compensation area is connected to the temperature measurement sensor 42 . Corresponding temperature points are used to detect whether each area of the heating plate 2 needs temperature compensation adjustment, so as to perform temperature detection on each temperature control compensation area, and perform temperature detection on the temperature compensation area that needs temperature compensation. Compensation adjustment facilitates orderly temperature compensation adjustment of the heating plate 2.

In some specific embodiments, a plurality of the temperature control compensation areas are distributed in an array relative to the center of the bottom surface control area. Specific array distribution types include, but are not limited to, circular arrays and rectangular arrays.

As an optional embodiment of the present invention, referring to Figure 1, the temperature compensation system also includes a partition 7 disposed between the main heating module and the distributed temperature control module 5. The temperature module group 6 is arranged on the partition 7 .

In some embodiments, the partition 7 is made of heat-insulating material, and the outer edge of the partition 7 is sealingly connected to the lower side wall of the heating plate 2 to play the role of heat insulation and reduce the While the heat in the heating cavity 10 is lost, it also prevents the heat in the heating cavity 10 from affecting the operation of the decentralized temperature control module 5 and increases the service life of the decentralized temperature control module 5 .

As an optional embodiment of the present invention, the partition 7 is provided with lead holes that allow lead wires to pass through.

Figure 4 is a front view of the auxiliary temperature control module according to the embodiment of the present invention. Figure 5 is a cross-sectional view of the auxiliary temperature control module according to the embodiment of the present invention. Figure 6 is an enlarged structural diagram of A in Figure 1.

As an optional implementation mode of the present invention, referring to Figures 1, 4, 5 and 6, the auxiliary temperature control module 6 includes a temperature compensation unit 60, and the temperature compensation unit 60 is communicatively connected to the distributed temperature control module. Control module 5, the distance between the temperature compensation unit 60 and the corresponding temperature control compensation area is greater than or equal to 0.

As an optional embodiment of the present invention, the auxiliary temperature control module 6 also includes a fixing component (not shown in the figure), which is used to fix the temperature compensation unit 60 to the corresponding control unit. Temperature compensation zone.

As an optional implementation manner of the present invention, referring to FIG. 4 , the temperature compensation unit 60 includes a heating unit 601 and a cooling unit 602. The heating unit 601 is spaced apart from the cooling unit 602.

In some embodiments, there is a contact interaction between the temperature compensation unit 60 and the heating plate 2 , that is, the top of the temperature compensation unit 60 and the corresponding temperature control compensation area (not labeled in the figure) The distance between them is equal to 0, so that the top of the temperature compensation unit 60 is in contact with the temperature control compensation area (not marked in the figure).

In some specific embodiments, the fixing component is a high-temperature resistant adhesive, and the temperature compensation unit 60 is adhered to the corresponding temperature control compensation area on the bottom surface of the heating plate 2 through the high-temperature resistant adhesive. The high-temperature-resistant adhesive can maintain good viscosity in a high-temperature environment, ensuring that the temperature compensation unit 60 is adhered to the bottom surface of the heating plate 2, and the temperature compensation adjustment effect is better.

In some specific embodiments, the temperature increasing unit 601 of the temperature compensation unit 60 is a ceramic heating plate.

In some specific embodiments, the cooling unit 602 of the temperature compensation unit 60 is a semiconductor refrigeration chip.

In other embodiments, the temperature compensation unit 60 is suspended between the heating plate 2 and the distributed temperature control module 5 through the fixing component, so that the top end of the temperature compensation unit 60 is aligned with the corresponding The distance between the temperature control compensation areas is greater than 0. There is a non-contact interaction between the temperature compensation unit 60 and the heating plate 2 .

In some specific embodiments, the temperature increasing unit 601 of the temperature compensation unit 60 is an LED lamp or a halogen lamp.

As an optional implementation manner of the present invention, when the second temperature value is less than the preset second target temperature, the distributed temperature control module 5 controls the heating unit 601 to perform temperature compensation adjustment on the heating zone. , until the second temperature value is adjusted to the second target temperature; When the second temperature value is greater than the preset second target temperature, the distributed temperature control module 5 controls the cooling unit 602 to perform temperature compensation adjustment on the heating zone until the second temperature value is adjusted. to the second target temperature.

In some embodiments, the cooling unit 602 of the temperature compensation unit 60 is a small air supply component.

In some embodiments, the small air supply component is configured to inject clean refrigerant gas into the corresponding temperature control compensation area under the control of the distributed temperature control module 5 .

In some specific embodiments, the small air supply component includes a gas circulation pipeline provided corresponding to each temperature control compensation zone, and the small air supply component is disposed at the end of the distributed temperature control module 5 Clean refrigeration gas is circulated through the gas circulation pipeline under control to cool the corresponding temperature control compensation area; the gas circulation pipeline is close to or against the heating plate 2 on the back to improve the cooling effect.

In other embodiments, the cooling unit 602 of the temperature compensation unit 60 is a small liquid supply component.

In some specific embodiments, the small liquid supply component includes a liquid circulation pipeline corresponding to each of the temperature control compensation zones, and the small liquid supply component is configured to be in the distributed temperature control module 5 The refrigeration liquid is circulated in the liquid circulation pipeline under the control to cool down the corresponding temperature control compensation area; the liquid circulation pipeline is close to or against the back of the heating plate 2 to improve Cooling effect.

As an optional embodiment of the present invention, referring to Figure 5, the auxiliary temperature control module 6 also includes a support member 61 provided on the partition 7, an elastic member 62 provided inside the support member 61 and The installation part 63 is provided at the top of the elastic member 62, and the temperature compensation unit 60 is provided on the side of the installation part 63 facing the heating plate 2; The elastic member 62 exerts an acting force on the temperature compensation unit 60 in the direction corresponding to the temperature control compensation area under the action of the support member 61 to adjust the temperature compensation unit 60 and the corresponding temperature control compensation area. distance between zones.

In some embodiments, the support member 61 is provided with a groove 64 inside that allows the mounting portion 63 to slide in a direction away from or close to the bottom surface of the heating plate 2 , and the elastic member 62 is disposed in the groove 64 . The groove 64 defines the radial movement range of the mounting portion 63 to adjust the distance between the temperature compensation unit 60 and the temperature control compensation area according to needs, so that the temperature compensation unit 60 can effectively act on Corresponding to the temperature control compensation area.

In some embodiments, the elastic member 62 is in a compressed working state to exert a force on the temperature compensation unit 60 in a direction corresponding to the temperature control compensation area (not shown in the figure) to make the temperature compensation unit 60 The top end is fitted with the corresponding temperature control compensation area (not marked in the figure).

In some specific embodiments, the elastic member 62 is a spring.

As an optional embodiment of the present invention, the support member 61 is provided with lead holes that allow lead wires to pass through, and the mounting portion 63 is also provided with lead wire holes that allow lead wires to pass through.

In some embodiments, referring to FIG. 5 , the partition 7 is provided with a first lead hole (not labeled in the figure) that allows the lead to pass through, and a second lead hole that allows the lead to pass through is provided in the support member 61 . The lead hole 610 is provided with a third lead hole 630 inside the mounting part 63 that allows the lead to pass through, so that the temperature compensation unit 60 can pass the lead through the third lead hole 630, the groove 64, and the second lead respectively. The hole 610 and the first lead hole are connected to the distributed temperature control module 5 to realize the communication connection between the temperature compensation unit 60 and the distributed temperature control module 5 .

As an optional embodiment of the present invention, with reference to Figure 1, a temperature control sealing plate 3 is also included. The temperature control sealing plate 3 is provided in the installation cavity 11. The temperature control sealing plate 3 is located on the heating plate 2. At the bottom end, a heat preservation space is formed between the temperature control sealing plate 3, the heating plate 2 and the inner wall of the heating cavity 10, the decentralized temperature control module 5 and the auxiliary temperature regulation module 6 All are installed in the thermal insulation space.

In some embodiments, the temperature control sealing plate 3 is made of heat-insulating material. The outer surface of the temperature control sealing plate 3 is sealingly connected to the inner wall of the heating cavity 10 and can be connected with the heating plate 2 and the heating cavity 10 . A thermal insulation space is formed between the inner walls, which makes it easier to maintain the temperature in the heating cavity 10, thereby ensuring the temperature stability during the processing of the semiconductor substrate, and has the effect of saving power and energy; the temperature control sealing plate 3 also serves as a sealing protection It functions to protect circuit components such as the distributed temperature control module 5 and the auxiliary temperature regulation module 6 located between the heating plate 2 and the temperature control sealing plate 3.

The invention also provides a semiconductor device, including the temperature compensation system.

Figure 7 is a flow chart of a temperature compensation method according to an embodiment of the present invention.

Referring to Figure 7, the present invention also provides a temperature compensation method, including the following steps: S0: Provide a heating plate, a main heating module and an auxiliary temperature control module. The bottom surface of the heating plate is provided with at least one temperature control compensation area, and the auxiliary temperature control module is set corresponding to the temperature control compensation area; S1: Perform temperature detection on the heating plate to obtain the first temperature value and the second temperature value; S2: Control the main heating module to adjust the temperature of the heating plate according to the first temperature value; S3: Control the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value.

In some specific implementations, referring to Figures 1 to 7, combined with the temperature compensation system of the present invention, the specific operating steps of the temperature compensation method of the present invention are as follows: (1) After the heating power of the main heating module 9 is stabilized, place the temperature measuring wafer 41 on the heating surface on the top surface of the heating plate 2, and measure the temperature through the temperature measuring sensor 42. The temperature measurement wafer 41 performs a first round of temperature detection on the heating plate 2 to obtain the first temperature value, and feeds the first temperature value back to the multi-zone temperature control module 90; (2) The multi-zone temperature control module 90 controls the main heating module 9 according to the first temperature value to adjust the temperature of the heating plate 2, specifically: When the first temperature value is less than the preset first target temperature, the multi-zone temperature control module controls the main heating module to increase its heating power to increase the temperature of the heating plate until the first temperature is The value is adjusted to the first target temperature to keep the output power of the main heating module stable; When the first temperature value is greater than the preset first target temperature, the multi-zone temperature control module controls the main heating module to reduce its heating power to reduce the temperature of the heating plate until the first temperature reaches The value is adjusted to the first target temperature to keep the output power of the main heating module stable. (3) In the temperature compensation adjustment stage of the heating plate 2, that is, after the temperature adjustment is completed, multiple temperature measurement points on the temperature measurement wafer 41 are measured by multiple temperature measurement sensors 42 to obtain multiple The second temperature value is fed back to the distributed temperature control module 5 to realize online monitoring of the temperature of the temperature control compensation area; (4) The distributed temperature control module 5 controls the auxiliary temperature control module 6 to perform temperature compensation adjustment on the temperature control compensation area according to the second temperature value, specifically: When the second temperature value is less than the second target temperature, the distributed temperature control module 5 controls the heating unit 601 of the temperature control compensation area corresponding to the temperature measurement sensor 42 to increase the temperature of the temperature control compensation area until the The second temperature value corresponding to the temperature control compensation area is at the second target temperature; When the measured second temperature value is greater than the second target temperature, the distributed temperature control module 5 controls the cooling unit 602 of the temperature control compensation area corresponding to the temperature measurement sensor 42 to cool the temperature control compensation area until The second temperature value corresponding to the temperature control compensation area is at the second target temperature.

In the prior art, the temperature uniformity of the heating plate is usually adjusted by zoning control of the heating plate. For example, the heating plate is divided into seven zones, thirteen zones, fifteen zones, etc. Considering the layout requirements of functional devices and the limitations of wiring installation, the partitions of the heating plate cannot be infinitely large. Each partition includes multiple temperature measurement sampling points on the temperature measurement wafer. When a certain partition is displayed through the temperature measurement wafer, if the temperature uniformity of the first partition does not meet the process requirements, the temperature rise adjustment needs to be made, and the main control unit will control the first partition to raise the temperature. However, this adjustment will bring about the following problems: the average temperature of some of the multiple temperature measurement sampling points included in the first partition will be lower than the target temperature, but some of the temperature measurement sampling points The temperature of the spot will be higher than the target temperature, and the temperature difference between it and the target temperature is most likely to be different from each other. Even for each temperature control area where the temperature is lower than the target temperature, the temperature difference between the temperature and the target temperature is very likely to be different from each other. It can be seen that temperature adjustment of a single zone can easily cause temperature unevenness across the entire heating plate again.

In addition, the above-mentioned partition control method requires independent temperature control for each partition, which significantly increases the cost of the temperature control part. The more partitions, the more heating devices are required, which significantly increases the cost of temperature control.

In the technical solution of the embodiment of the present invention, after the heating power of the main heating module 9 is stabilized, the temperature feedback module 4 performs a first round of temperature detection on the heating plate 2 to obtain the first temperature value. , and feeds back the first temperature value to the multi-zone temperature control module 90. The multi-zone temperature control module 90 controls the main heating module 9 according to the first temperature value to heat the Disk 2 performs temperature adjustment until the first temperature value remains within the first temperature range; After the temperature adjustment is completed, the temperature information of the temperature measurement wafer 41 is obtained through the temperature measurement sensor 42 to obtain a second temperature value. According to the second temperature value, it is determined that the bottom surface of the heating plate 2 needs to be temperature compensated. A plurality of temperature control compensation areas are adjusted; finally, the corresponding temperature compensation unit 60 is controlled by the distributed temperature control module 5 to heat or cool down the temperature control compensation area to achieve the purpose of temperature compensation adjustment until The second temperature value is maintained at the second target temperature. Two rounds of temperature detection and two rounds of temperature adjustment of the heating plate are realized, and the functions of independent temperature measurement and independent temperature compensation adjustment of multiple temperature compensation units 60 are realized, thereby making the temperature of each temperature control compensation zone The preset temperature range is reached, thereby ensuring the temperature uniformity on the heating plate 2 and ensuring the temperature uniformity of each zone on the heating plate 2 .

Although the embodiments of the present invention have been described in detail above, it will be obvious to those of ordinary skill in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the invention described in the specification. Furthermore, the invention described herein is capable of other embodiments and of being practiced or carried out in various ways.

1:Cavity 10: Heating cavity 11:Installation cavity 13: cover 2:Heating plate 3: Temperature control sealing plate 4:Temperature feedback module 41: Temperature measurement wafer 42:Temperature sensor 5: Distributed temperature control module 6: Auxiliary temperature control module 60: Temperature compensation unit 601: Heating unit 602: Cooling unit 61:Support 610: Second lead hole 62: Elastic parts 63:Installation Department 630:Third lead hole 64: Groove 7:Partition 9: Main heating module 90:Multi-zone temperature control module

Figure 1 is a schematic cross-sectional structural diagram of a temperature compensation system according to an embodiment of the present invention; Figure 2 is a schematic diagram of the circuit connection framework of the temperature compensation system according to the embodiment of the present invention; Figure 3 is a schematic structural diagram of a temperature feedback module and a distributed temperature control module according to an embodiment of the present invention; Figure 4 is a front view of the auxiliary temperature control module according to the embodiment of the present invention; Figure 5 is a cross-sectional view of the auxiliary temperature control module according to the embodiment of the present invention; Figure 6 is an enlarged structural diagram of A in Figure 1; Figure 7 is a flow chart of a temperature compensation method according to an embodiment of the present invention.

1:Cavity

10: Heating cavity

11:Installation cavity

13: Cover

2:Heating plate

3: Temperature control sealing plate

41: Temperature measurement wafer

5: Distributed temperature control module

6: Auxiliary temperature control module

7:Partition

Claims (14)

A temperature compensation system, including: a cavity, a temperature feedback module, a heating plate, a multi-zone temperature control module, a decentralized temperature control module, a main heating module and at least one auxiliary temperature control module ,in, The main heating module and the auxiliary temperature regulating module are used to heat the heating plate; The cavity and the bottom surface of the heating plate form an installation cavity. The main heating module, the auxiliary temperature control module and the distributed temperature control module are arranged in the installation cavity. The distributed temperature control module is communicatively connected to the The temperature feedback module and the auxiliary temperature control module, the multi-zone temperature control module are communicatively connected to the temperature feedback module and the main heating module; The bottom surface of the heating plate is provided with at least one temperature control compensation area, and the auxiliary temperature control module is provided corresponding to the temperature control compensation area; The temperature feedback module performs a temperature detection on the heating plate to obtain a first temperature value and a second temperature value; The multi-zone temperature control module controls the main heating module to perform a temperature adjustment on the heating plate according to the first temperature value; and The distributed temperature control module controls the auxiliary temperature control module to perform a temperature compensation adjustment on the temperature control compensation area according to the second temperature value. The temperature compensation system as claimed in claim 1, wherein, After the heating power of the main heating module stabilizes, the temperature feedback module performs a first round of temperature detection on the heating plate to obtain the first temperature value, and feeds the first temperature value back to the multi-zone temperature control Modules; and After the temperature adjustment is completed, the temperature feedback module performs a second round of temperature detection on the heating plate to obtain the second temperature value, and feeds the second temperature value back to the distributed temperature control module. The temperature compensation system according to claim 1 further includes a partition provided between the main heating module and the distributed temperature control module, and the auxiliary temperature control module is provided on the partition. The temperature compensation system as claimed in claim 3, wherein the partition plate is provided with a lead hole allowing lead wires to pass through. The temperature compensation system according to claim 3, wherein the auxiliary temperature control module includes a temperature compensation unit, the temperature compensation unit is communicatively connected to the distributed temperature control module, and the temperature compensation unit is connected to the corresponding temperature control compensation area. The distance between them is greater than or equal to 0. The temperature compensation system according to claim 5, wherein the auxiliary temperature control module further includes a fixing component used to fix the temperature compensation unit to the corresponding temperature control compensation area. The temperature compensation system of claim 5, wherein, The auxiliary temperature control module also includes a support member disposed on the partition, an elastic member disposed inside the support member, and a mounting portion disposed on the top of the elastic member. The temperature compensation unit is disposed on the mounting portion. The side facing the heating plate; and The elastic member exerts a force on the temperature compensation unit in a direction corresponding to the temperature control compensation area under the action of the support member to adjust the distance between the temperature compensation unit and the corresponding temperature control compensation area. The temperature compensation system as claimed in claim 7, wherein a lead hole is provided in the support member to allow lead wires to pass through. The temperature compensation system as claimed in claim 7, wherein the temperature compensation unit includes a temperature increasing unit and a temperature decreasing unit, and the temperature increasing unit and the temperature decreasing unit are arranged at intervals. The temperature compensation system of claim 9, wherein, When the second temperature value is less than the preset second target temperature, the distributed temperature control module controls the temperature rising unit to perform the temperature compensation adjustment in the temperature control compensation zone corresponding to the second temperature value. The temperature compensation system of claim 9, wherein, When the second temperature value is greater than the preset second target temperature, the distributed temperature control module controls the cooling unit to perform the temperature compensation adjustment in the temperature control compensation zone corresponding to the second temperature value. The temperature compensation system as described in claim 1 or 9, further includes a temperature control sealing plate disposed in the installation cavity, the temperature control sealing plate is located at the bottom of the heating plate, the temperature control sealing plate and the heating plate A thermal insulation space is formed between the installation cavity and the inner wall of the installation cavity. The distributed temperature control module and the auxiliary temperature regulation module are both arranged in the thermal insulation space. A semiconductor device including the temperature compensation system according to claim 1. A temperature compensation method includes the following steps: S0: Provide a heating plate, a main heating module and at least one auxiliary temperature control module. The bottom surface of the heating plate is provided with at least one temperature control compensation area, and the auxiliary temperature control module is set corresponding to the temperature control compensation area; S1: Perform a temperature detection on the heating plate to obtain a first temperature value and a second temperature value; S2: Control the main heating module to perform a temperature adjustment on the heating plate according to the first temperature value; and S3: Control the auxiliary temperature adjustment module to perform a temperature compensation adjustment on the temperature control compensation area according to the second temperature value.