CN110461542A - 基板的研磨装置及研磨方法 - Google Patents

基板的研磨装置及研磨方法 Download PDF

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Publication number
CN110461542A
CN110461542A CN201880018928.9A CN201880018928A CN110461542A CN 110461542 A CN110461542 A CN 110461542A CN 201880018928 A CN201880018928 A CN 201880018928A CN 110461542 A CN110461542 A CN 110461542A
Authority
CN
China
Prior art keywords
grinding
substrate
structural unit
pad
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880018928.9A
Other languages
English (en)
Chinese (zh)
Inventor
安田穗积
小畠严贵
高桥信行
作川卓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN110461542A publication Critical patent/CN110461542A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN201880018928.9A 2017-03-22 2018-01-10 基板的研磨装置及研磨方法 Pending CN110461542A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-055976 2017-03-22
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
CN110461542A true CN110461542A (zh) 2019-11-15

Family

ID=63584243

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880018928.9A Pending CN110461542A (zh) 2017-03-22 2018-01-10 基板的研磨装置及研磨方法

Country Status (7)

Country Link
US (1) US20200269383A1 (ja)
JP (1) JP6884015B2 (ja)
KR (1) KR102482181B1 (ja)
CN (1) CN110461542A (ja)
SG (1) SG11201908381RA (ja)
TW (1) TWI763765B (ja)
WO (1) WO2018173421A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113134785A (zh) * 2020-01-17 2021-07-20 株式会社荏原制作所 研磨头系统及研磨装置
CN113211299A (zh) * 2020-02-05 2021-08-06 株式会社荏原制作所 基板处理装置及基板处理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210102336A (ko) * 2018-12-19 2021-08-19 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법

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JPH11179648A (ja) * 1997-12-19 1999-07-06 Nec Corp 半導体基板研磨装置
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
JP2002321146A (ja) * 2001-04-24 2002-11-05 Canon Inc 回折光学素子用金型加工方法
WO2010021297A1 (en) * 2008-08-21 2010-02-25 Ebara Corporation Method and apparatus for polishing a substrate
JP2010076080A (ja) * 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP2011167813A (ja) * 2010-02-19 2011-09-01 Jtekt Corp カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
WO2015050185A1 (ja) * 2013-10-04 2015-04-09 株式会社 フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具
CN105047582A (zh) * 2014-04-18 2015-11-11 株式会社荏原制作所 基板处理装置
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
CN106256016A (zh) * 2014-04-18 2016-12-21 株式会社荏原制作所 基板处理装置、基板处理系统及基板处理方法

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US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
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US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
US8915768B2 (en) * 2008-07-31 2014-12-23 Mitsubishi Heavy Industries, Ltd. Method of phasing threaded grinding stone, as well as device therefor
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US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
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JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179648A (ja) * 1997-12-19 1999-07-06 Nec Corp 半導体基板研磨装置
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
JP2002321146A (ja) * 2001-04-24 2002-11-05 Canon Inc 回折光学素子用金型加工方法
WO2010021297A1 (en) * 2008-08-21 2010-02-25 Ebara Corporation Method and apparatus for polishing a substrate
JP2010076080A (ja) * 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP2011167813A (ja) * 2010-02-19 2011-09-01 Jtekt Corp カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
WO2015050185A1 (ja) * 2013-10-04 2015-04-09 株式会社 フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具
CN105047582A (zh) * 2014-04-18 2015-11-11 株式会社荏原制作所 基板处理装置
CN106256016A (zh) * 2014-04-18 2016-12-21 株式会社荏原制作所 基板处理装置、基板处理系统及基板处理方法
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113134785A (zh) * 2020-01-17 2021-07-20 株式会社荏原制作所 研磨头系统及研磨装置
CN113134785B (zh) * 2020-01-17 2024-05-14 株式会社荏原制作所 研磨头系统及研磨装置
CN113211299A (zh) * 2020-02-05 2021-08-06 株式会社荏原制作所 基板处理装置及基板处理方法
CN113211299B (zh) * 2020-02-05 2024-04-16 株式会社荏原制作所 基板处理装置及基板处理方法

Also Published As

Publication number Publication date
JP6884015B2 (ja) 2021-06-09
WO2018173421A1 (ja) 2018-09-27
JP2018158399A (ja) 2018-10-11
KR102482181B1 (ko) 2022-12-29
US20200269383A1 (en) 2020-08-27
TW201834786A (zh) 2018-10-01
TWI763765B (zh) 2022-05-11
SG11201908381RA (en) 2019-10-30
KR20190131501A (ko) 2019-11-26

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Application publication date: 20191115

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