CN110459664A - A kind of packaging method of laminated devices quantum dot LED lamp bead - Google Patents
A kind of packaging method of laminated devices quantum dot LED lamp bead Download PDFInfo
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- CN110459664A CN110459664A CN201910704933.1A CN201910704933A CN110459664A CN 110459664 A CN110459664 A CN 110459664A CN 201910704933 A CN201910704933 A CN 201910704933A CN 110459664 A CN110459664 A CN 110459664A
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- Prior art keywords
- rouge
- powder
- centrifugation
- led lamp
- lamp bead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses a kind of packaging methods of laminated devices quantum dot LED lamp bead, the method includes rouge and powder colloid is put in the package support of LED lamp bead, successively pass through slow-speed of revolution centrifugation technique, high revolving speed centrifugation process, rouge and powder colloid obtains the rouge and powder glue-line of complete levelling after precipitating centrifugation；Green arogel body is put on the rouge and powder glue-line after preceding solidification, successively pass through slow-speed of revolution centrifugation technique, high revolving speed centrifugation process, green arogel body obtains the green arogel layer of complete levelling after precipitating centrifugation, handles by curing process, forms laminated devices quantum dot LED lamp bead finished product；The method of the present invention improves that the centrality of product chromaticity coordinates, heat dissipation performance be more preferable, dosage of fluorescent powder (green powder, rouge and powder) significantly reduces, and substantially reduces cost；The features such as luminescent material is evenly distributed in phosphor powder layer, and color area, which practices shooting, to be concentrated, and process yields greatly improve.
Description
Technical field
The present invention relates to LED encapsulation field, in particular to a kind of packaging method of laminated devices quantum dot LED lamp bead.
Background technique
LED lamp bead packaging technology uses hierarchy technique, and what the advantages of hierarchical process was to be promoted light efficiency and product can
By property, however existing LED lamp bead uses demixing technology, and presently, there are manufacturing process hardly possiblies, and there are the following problems:
(1) rouge and powder glue-line and green arogel layer binding force are bad, and green arogel is be easy to cause to fall off；
(2) luminescent material is unevenly distributed in phosphor powder layer, causes colour cast phenomenon；
(3) color area practices shooting and does not concentrate；
(4) process yields are lower, are unfavorable for being mass produced.
Summary of the invention
For this purpose, the purpose of the present invention overcomes prior art problem, a kind of encapsulation side of laminated devices quantum dot LED lamp bead is proposed
Method, the present invention adopts the following technical scheme:
A kind of packaging method of laminated devices quantum dot LED lamp bead, includes the following steps:
(1) rouge and powder glue packaging technology:
Rouge and powder colloid is put in the package support of LED lamp bead, is successively centrifuged by slow-speed of revolution centrifugation technique, high revolving speed
Depositing technology processing, rouge and powder colloid obtain the rouge and powder glue-line of complete levelling after precipitating centrifugation；
The laminated devices quantum dot LED lamp bead semi-finished product of the rouge and powder glue-line of complete levelling by precipitating centrifugation pass through low-temperature space
Preceding curing process；The low-temperature space curing process is that 20min~40min is handled under the conditions of temperature is 80 DEG C~120 DEG C；
(2) green arogel packaging technology:
Green arogel body is put on the rouge and powder glue-line after preceding solidification, successively by slow-speed of revolution centrifugation technique, high turn
Fast centrifugation process, green arogel body obtain the green arogel layer of complete levelling after precipitating centrifugation；
(3) the laminated devices quantum dot LED lamp bead semi-finished product of the green arogel layer of the complete levelling by precipitating centrifugation are by solid
Change process, forms laminated devices quantum dot LED lamp bead finished product；
The slow-speed of revolution centrifugation technique makes the uniform levelling of rouge and powder colloid, the high revolving speed centrifugation technique stream
Rouge and powder is uniformly deposited in chip surface and surrounding by flat rouge and powder colloid；The slow-speed of revolution centrifugation technique is in centrifuge
Revolving speed is that 700r/min~1000r/min carries out centrifugation 10s~30s；The high revolving speed centrifugation technique is to be centrifuged
Machine revolving speed is that 1700r/min~2300r/min carries out centrifugation 50s~100s.
Further, in embodiments of the present invention, the rouge and powder colloid include the first luminescent material, the second luminescent material,
White glue, first luminescent material are the nitride that emission peak is 630nm, and it is 650nm that second luminescent material, which is emission peak,
Nitride, the white glue be silica gel or epoxy natural gum.
Further, it is preferable that the first luminescent material, the second luminescent material, white glue weight ratio be 5:7.4:100.
Further, in embodiments of the present invention, the green arogel includes third luminescent material, white glue, the third hair
Luminescent material is the silicate that emission peak is 530nm, and the white glue is silica gel or epoxy natural gum.
Further, it is preferable that third luminescent material, white glue weight ratio be 121:100.
Further, in embodiments of the present invention, the laminated devices amount of the green arogel layer of the complete levelling by precipitating centrifugation
Son point LED lamp bead semi-finished product specifically comprise the following steps: low-temperature space baking and high-temperature region baking procedure by curing process processing,
Less than 130 DEG C, the high-temperature region baking temperature is greater than 150 DEG C and less than 200 DEG C the low-temperature space baking temperature.
The packaging method of laminated devices quantum dot LED lamp bead of the present invention can achieve below beneficial to effect with the prior art
Fruit:
(1) rouge and powder colloid when the slow-speed of revolution can uniform levelling, and high revolving speed carries out centrifugation can make this
Rouge and powder is uniformly deposited in chip surface and surrounding by the rouge and powder colloid of body levelling, on the one hand, improves the concentration of product chromaticity coordinates
Property, another aspect rouge and powder, which is deposited on stent substrate, makes heat dissipation performance more preferable；
(2) it is significantly reduced using the dosage of the method for the present invention fluorescent powder (green powder, rouge and powder), substantially reduces cost；
(3) rouge and powder glue-line and green arogel layer binding force are good, and green arogel layer is not easily to fall off；
(4) luminescent material is evenly distributed in phosphor powder layer, and color area, which practices shooting, to be concentrated, and process yields greatly improve；
(5) forward LED packaging technology is used, welding wire is needed, can rouge and powder is deposited in using the method for the present invention
Bank is not allowed on the electrode of welding and on stent substrate easily broken, improve stability.
Detailed description of the invention
Attached drawing described herein is used to provide to further understand invention, constitutes a part of the invention, the present invention
Illustrative embodiments and their description be used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
The step of Fig. 1 is a kind of packaging method of laminated devices quantum dot LED lamp bead is schemed.
Specific embodiment
In order to be clearer and more clear technical problems, technical solutions and advantages to be solved, tie below
Drawings and examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
Embodiment 1
A kind of packaging method of laminated devices quantum dot LED lamp bead includes the following steps: as shown in Fig. 1
(1) rouge and powder glue packaging technology:
Rouge and powder colloid is put in the package support of LED lamp bead, is successively centrifuged by slow-speed of revolution centrifugation technique, high revolving speed
Depositing technology processing, rouge and powder colloid obtain the rouge and powder glue-line of complete levelling after precipitating centrifugation；
It is that 700r/min~1000r/min carries out centrifugation that the slow-speed of revolution centrifugation technique, which is in centrifuge speed,
10s~30s；The high revolving speed centrifugation technique is that be that 1700r/min~2300r/min carries out centrifugation in centrifuge speed heavy
Shallow lake 50s~100s；In embodiments of the present invention, it is preferred that rouge and powder colloid elder generation's centrifuge speed carries out centrifugation for 900r/min and sinks
It is that 2000r/min carries out centrifugation 77s using centrifuge speed after the 15s of shallow lake；It should be noted that the present invention is limited
Centrifuge speed be wherein one group of preferable range of speeds；It is that 900r/min progress centrifugation 15s is in centrifuge speed
It in order to enable the rouge and powder colloid of this incoming flow injustice uniform levelling when the slow-speed of revolution, and is 2000r/ in centrifuge speed
Min, which carries out centrifugation 77s, makes the rouge and powder colloid of levelling itself that rouge and powder is uniformly deposited in chip surface and surrounding.
Wherein, table 1 lists rouge and powder glue depositing technology, slow-speed of revolution centrifugation technique used by multiple groups are tested, high turn
The revolving speed of fast centrifugation technique and time setting, it should be noted that slow-speed of revolution centrifugation technique, high revolving speed centrifugation
The relevant parameter of technique is not limited to cited by the embodiment of the present invention.
1 rouge and powder glue depositing technology of table
The laminated devices quantum dot LED lamp bead semi-finished product of the rouge and powder glue-line of complete levelling by precipitating centrifugation pass through low-temperature space
Preceding curing process, in embodiments of the present invention, it is preferred that put 100 degree of oven cooking cycle half an hour into；It should be noted that rouge and powder
Colloid has to preceding solidification, but cannot be fully cured, if increasing baking time or improving solidification temperature, rouge and powder
Glue-line and subsequent green arogel layer will have a binding force, rouge and powder glue-line and green arogel layer binding force is bad just will appear
Serious green arogel obscission.
(2) green arogel packaging technology:
Green arogel body is put on the rouge and powder glue-line after preceding solidification, successively by slow-speed of revolution centrifugation technique, high turn
Fast centrifugation process, green arogel body obtain the green arogel layer of complete levelling after precipitating centrifugation；
It is that 700r/min~1000r/min carries out centrifugation that the slow-speed of revolution centrifugation technique, which is in centrifuge speed,
10s~30s；The high revolving speed centrifugation technique is that be that 1700r/min~2300r/min carries out centrifugation in centrifuge speed heavy
Shallow lake 50s~100s；In embodiments of the present invention, it is preferred that rouge and powder colloid elder generation's centrifuge speed carries out centrifugation for 900r/min and sinks
It is that 2000r/min carries out centrifugation 77s using centrifuge speed after the 15s of shallow lake；It should be noted that the present invention is limited
Centrifuge speed be the preferable range of speeds.Wherein, table 2 lists green arogel depositing technology, low used by multiple groups experiment
Revolving speed centrifugation technique, the revolving speed of high revolving speed centrifugation technique and time setting, it should be noted that slow-speed of revolution centrifugation is heavy
Shallow lake technique, high revolving speed centrifugation technique relevant parameter be not limited to cited by the embodiment of the present invention.
The green arogel depositing technology parameter of table 2
(3) the laminated devices quantum dot LED lamp bead semi-finished product of the green arogel layer of the complete levelling by precipitating centrifugation are by solid
Change process, in embodiments of the present invention, it is preferred that the curing process includes before low-temperature space at solidification and high-temperature region solidification
Reason；
It is 90-120 DEG C that temperature is cured as before low-temperature space, toasts 50-100min；
In embodiments of the present invention, specifically, being cured as before the low-temperature space by laminated devices quantum dot LED lamp bead semi-finished product
It is put into oven, 100 DEG C of set temperature are toasted 1 hour；The high-temperature region is cured as 150 DEG C of oven temperature, toasts 4 hours,
It obtains completing cured laminated devices quantum dot LED lamp bead finished product.
In embodiments of the present invention, the rouge and powder colloid includes the first luminescent material, the second luminescent material, white glue, described
First luminescent material is the nitride that emission peak is 630nm, and second luminescent material is the nitride that emission peak is 650nm,
The white glue is silica gel or epoxy natural gum；
First luminescent material, the second luminescent material, white glue weight ratio be 5:7.4:100；It is to be understood that if white glue is
100g, emission peak are the nitride 5g of 630nm, and emission peak is the nitride 7.4g of 650nm, and rouge and powder glue total weight is 100g+5g+
7.4g=112.4g.
In embodiments of the present invention, the green arogel includes third luminescent material, white glue, and the third luminescent material is hair
The silicate that peak is 530nm is penetrated, the white glue is silica gel or epoxy natural gum；
Third luminescent material, white glue weight ratio be 121:100；It is to be understood that emission peak is if white glue is 100g
The silicate 121g of 530nm, green arogel total weight are 100g+121g=221g.
Description above describe the preferred embodiment of the present invention, but those skilled in the art should be understood that the present invention simultaneously
It is not limited to above-described embodiment, and excluding other embodiments should not be regarded as.It is limited not departing from the appended claims
The spirit and scope of the present invention in, enlightenment through the invention, those skilled in the art combine known or the prior art, knowledge
The change carried out also should be regarded as within the scope of the present invention.
Claims (6)
1. a kind of packaging method of laminated devices quantum dot LED lamp bead, which comprises the steps of:
(1) rouge and powder glue packaging technology:
Rouge and powder colloid is put in the package support of LED lamp bead, successively passes through slow-speed of revolution centrifugation technique, high revolving speed centrifugation
Process, rouge and powder colloid obtain the rouge and powder glue-line of complete levelling after precipitating centrifugation；
The laminated devices quantum dot LED lamp bead semi-finished product of the rouge and powder glue-line of complete levelling by precipitating centrifugation are by solid before low-temperature space
Chemical industry skill；The low-temperature space curing process is that 20min~40min is handled under the conditions of temperature is 80 DEG C~120 DEG C；
(2) green arogel packaging technology:
Green arogel body is put on the rouge and powder glue-line after preceding solidification, successively by slow-speed of revolution centrifugation technique, high revolving speed from
The processing of heart depositing technology, green arogel body obtain the green arogel layer of complete levelling after precipitating centrifugation；
(3) the laminated devices quantum dot LED lamp bead semi-finished product of the green arogel layer of the complete levelling by precipitating centrifugation are by solidification work
Skill processing, forms laminated devices quantum dot LED lamp bead finished product；
The slow-speed of revolution centrifugation technique makes the uniform levelling of rouge and powder colloid, the high revolving speed centrifugation technique levelling
Rouge and powder is uniformly deposited in chip surface and surrounding by rouge and powder colloid；The slow-speed of revolution centrifugation technique is in centrifuge speed
Centrifugation 10s~30s is carried out for 700r/min~1000r/min；The high revolving speed centrifugation technique is in centrifugal basket
Speed is that 1700r/min~2300r/min carries out centrifugation 50s~100s.
2. the packaging method of laminated devices quantum dot LED lamp bead according to claim 1, which is characterized in that
In embodiments of the present invention, the rouge and powder colloid include the first luminescent material, the second luminescent material, white glue, described first
Luminescent material is the nitride that emission peak is 630nm, and second luminescent material is the nitride that emission peak is 650nm, described
White glue is silica gel or epoxy natural gum.
3. the packaging method of laminated devices quantum dot LED lamp bead according to claim 2, which is characterized in that
First luminescent material, the second luminescent material, white glue weight ratio be 5:7.4:100.
4. the packaging method of laminated devices quantum dot LED lamp bead according to claim 1, which is characterized in that
The green arogel includes third luminescent material, white glue, and the third luminescent material is the silicate that emission peak is 530nm,
The white glue is silica gel or epoxy natural gum.
5. the packaging method of laminated devices quantum dot LED lamp bead according to claim 4, which is characterized in that
Third luminescent material, white glue weight ratio be 121:100.
6. the packaging method of laminated devices quantum dot LED lamp bead according to claim 1, which is characterized in that
The laminated devices quantum dot LED lamp bead semi-finished product of the green arogel layer of complete levelling by precipitating centrifugation are by curing process
Reason specifically comprises the following steps:
Low-temperature space baking and high-temperature region baking procedure, the low-temperature space baking temperature is less than 130 DEG C, the high-temperature region baking temperature
Greater than 150 DEG C and less than 200 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910704933.1A CN110459664B (en) | 2019-07-31 | 2019-07-31 | Packaging method of layered quantum dot LED lamp bead |
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| CN201910704933.1A CN110459664B (en) | 2019-07-31 | 2019-07-31 | Packaging method of layered quantum dot LED lamp bead |
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| CN110459664A true CN110459664A (en) | 2019-11-15 |
| CN110459664B CN110459664B (en) | 2021-02-19 |
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| CN103855258A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED wafer manufacturing method and LED |
| CN104037307A (en) * | 2013-03-04 | 2014-09-10 | 奥斯兰姆施尔凡尼亚公司 | Led Lamp With Quantum Dots Layer |
| CN106558644A (en) * | 2016-11-30 | 2017-04-05 | 深圳市聚飞光电股份有限公司 | A kind of method for packing of laminated devices quantum dot LED lamp bead |
| US20170122527A1 (en) * | 2014-04-08 | 2017-05-04 | Ns Materials Inc. | Wavelength conversion member, compact, wavelength conversion apparatus, sheet member, light emitting apparatus, light guide apparatus and display apparatus |
| CN209087903U (en) * | 2018-12-28 | 2019-07-09 | 深圳Tcl新技术有限公司 | A kind of LED light source and its backlight module |
-
2019
- 2019-07-31 CN CN201910704933.1A patent/CN110459664B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037307A (en) * | 2013-03-04 | 2014-09-10 | 奥斯兰姆施尔凡尼亚公司 | Led Lamp With Quantum Dots Layer |
| CN103311406A (en) * | 2013-05-11 | 2013-09-18 | 东莞市中之光电科技有限公司 | Packaging process for white light-emitting diodes (LEDs) |
| CN103855258A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED wafer manufacturing method and LED |
| US20170122527A1 (en) * | 2014-04-08 | 2017-05-04 | Ns Materials Inc. | Wavelength conversion member, compact, wavelength conversion apparatus, sheet member, light emitting apparatus, light guide apparatus and display apparatus |
| CN106558644A (en) * | 2016-11-30 | 2017-04-05 | 深圳市聚飞光电股份有限公司 | A kind of method for packing of laminated devices quantum dot LED lamp bead |
| CN209087903U (en) * | 2018-12-28 | 2019-07-09 | 深圳Tcl新技术有限公司 | A kind of LED light source and its backlight module |
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