CN206098448U - Led lamp - Google Patents
Led lamp Download PDFInfo
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- CN206098448U CN206098448U CN201620897941.4U CN201620897941U CN206098448U CN 206098448 U CN206098448 U CN 206098448U CN 201620897941 U CN201620897941 U CN 201620897941U CN 206098448 U CN206098448 U CN 206098448U
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- layer
- gel resin
- resin layer
- phosphor powder
- led
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Abstract
The utility model discloses a LED lamp, LED lamp's LED chip coats and is stamped first gel resin layer A, a fluorescent powder layer B is stamped in coating of first gel resin layer A. Compared with the prior art, the utility model discloses a LED lamp has luminous efficiency height, even, the high characteristics of light -emitting same colour nature of light -emitting.
Description
Technical field
The utility model is related to a kind of LED, and in particular to the encapsulation of LED.
Background technology
In order to reduce encapsulation volume, improve heat dissipation problem, improve the uniformity and lift chip reliability, and industry will
It is identical with LED wafer that CSP technology traditions are defined as encapsulation volume, or volume is not more than LED wafer 20%, and fully functional
Potted element, the potted element of the minimum CSP products exactly flip-chip (Flip-Chip) of current volume.
From the point of view of current encapsulation procedure, high power package is based on film (thin film) chip, then chip is fitted
To on ceramic substrate, then fluorescent powder coating is carried out, and then form white light, and the encapsulation of middle low-power is then more with horizontal wafer as base
Plinth, using lead frame and needs routing processing procedure, or adopts quad flat non-pin (QFN) encapsulation kenel, then sprayed with fluorescent powder
Mode carry out.As shown in figure 1, generally there is following three kinds of processing modes：(1) ＇ of prefabricated fluorescent film 2, the ＇ of fluorescent film 2 is pasted
On the ＇ of chip 1, the ＇ (as shown in Figure 1A) of transparent silicon glue-line 3 is then covered on the ＇ of fluorescent film 2；(2) the directly spraying on the ＇ of chip 1
The ＂ of fluorescent powder silica gel 2 (as shown in Figure 1B)；(3) ＇ of protection materials 5 is encapsulated in the periphery of the ＇ of chip 1, and then the ＇ of fluorescent film 2 is covered in core
The upper surface (as shown in Figure 1 C) of the ＇ of piece 1.
By contrast, it is because the ＇ of CSP white chips 1 that mode (1) and mode (2) are prepared goes out light in five faces therefore luminous
Efficiency is higher, and around the ＇ of mode (3) chips 1 ＇ of protection materials 5 is enclosed with, and only simultaneously goes out light, therefore luminous efficiency side
Formula (1) and mode (2) are low, but the luminous film thickness in mode (3) compared with mode (1) and mode (2) in uniform, and then mode
(1) go out light and aberration easily occur with mode (2), it is difficult to meet the demand in market.
Utility model content
In order to overcome that existing LED light extraction efficiency is not high, the problems such as to go out light uneven, on the one hand the utility model provides one
LED is planted, the first gel resin layer A is coated with the LED chip of the LED；The first fluorescence is coated with the first gel resin layer A
Bisque B.
According to an embodiment of the present utility model, the second gel resin layer is could be covered with the first phosphor powder layer B
C.The second phosphor powder layer D is could be covered with the second gel resin layer C.
According to another embodiment of the present utility model, for uniform in light emission, described in the first gel resin layer A all standings
LED chip described in LED chip or local complexity.
According to another embodiment of the present utility model, the first phosphor powder layer B can be multilayer.Second fluorescence
Bisque D can also be multilayer.
According to another embodiment of the present utility model, the neighbouring described first phosphor powder layer B's of the first gel resin layer A
Surface can be smooth, it is also possible to be serrated or wavy.Neighbouring described second phosphor powder layer of the second gel resin layer C
The surface of D can also be serrated or wavy.The first phosphor powder layer B is light away from the surface of the first gel resin layer A
It is sliding.The surface of the first gel resin layer A and the second gel resin layer C be serrated or it is wavy be to be more beneficial for out light efficiency
Rate and uniform in light emission.
According to another embodiment of the present utility model, the refractive index of the first gel resin layer A is more than first fluorescence
The refractive index of bisque B.The first gel resin layer A, the first phosphor powder layer B, the second gel resin layer C and second fluorescence
The refractive index of bisque D is gradually reduced.The first gel resin layer A, the first phosphor powder layer B, the second gel resin layer C and described
Be conducive to improving light extraction efficiency containing light diffusion and diffusion particle in second phosphor powder layer D.
Another aspect of the present utility model provides a kind of method for packing of LED, comprises the steps：First in the LED
One layer of first gel resin layer A is covered in the LED chip of lamp；And in outer layer first phosphor powder layer of covering of the first gel resin layer A
B。
According to an embodiment of the present utility model, in the outer layer of the first gel resin layer A the first phosphor powder layer B steps are covered
After rapid, the second gel resin layer C is covered on the first phosphor powder layer B.
According to another embodiment of the present utility model, the second gel resin layer step C is covered on the first phosphor powder layer B
Afterwards, the second phosphor powder layer D is covered on the second gel resin layer C.
According to another embodiment of the present utility model, the first gel resin layer A, the first phosphor powder layer B, described
Two gel resin layer C and the second phosphor powder layer D can be formed by dispensing, press mold or spraying.As the first gel resin layer A and B and
Can be with using three of the above mode, when gel resin layer and phosphor powder layer outer surface have necessarily during one phosphor powder layer B and B smooth outer surface
During shape, it is impossible to using dispensing mode, can be using press mold or spraying method.
LED of the present utility model covers silica gel on chip, then uniform fold phosphor powder layer again, it is possible thereby to real
Existing light efficiency is high, the white light of uniform in light emission.Compared with prior art, LED of the present utility model has that light extraction efficiency is high, it is equal to go out light
It is even, go out light color uniformity it is high the characteristics of.
Description of the drawings
Its example embodiment is described in detail by referring to accompanying drawing, above and other feature of the present utility model and advantage will
Become readily apparent from.
Figure 1A-Fig. 1 C are existing LED encapsulating structure schematic diagrames；
Fig. 2 is the LED encapsulating structure schematic diagram of embodiment 1-3；
Fig. 3 is the LED encapsulating structure schematic diagram of embodiment 4-5；And
Fig. 4 is the LED encapsulating structure schematic diagram of embodiment 6.
Wherein, description of reference numerals is as follows：
1 ＇ chips；2 ＇ fluorescent films；2 ＂ fluorescent powder silica gels；3 ＇ transparent silicon glue-lines；5 ＇ protection materials；1 chip；2 first gel resin
Layer A；3 first phosphor powder layer B；4 second gel resin layer C.
Specific embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with various shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；Conversely, thesing embodiments are provided so that this practicality is new
The design of example embodiment fully and completely, and will comprehensively be conveyed to those skilled in the art by type.In figure, in order to
Clearly, the thickness of region and layer is exaggerated.Identical reference represents same or similar structure in figure, thus will omit
Their detailed description.
Embodiment 1
As shown in Fig. 2 using 1033 sections of flip-chips 1, one layer of silica gel is covered on chip 1 using point gum machine, formed
First gel resin layer A 2, the chip 1 that will be covered with layer of silica gel is placed in baking oven the taking-up after 3 hours of baking at 150 DEG C, treats
Chip 1 containing the first gel resin layer A 2 is down to after room temperature and reuses point gum machine one layer of first phosphor powder layer B 3 of covering, then will be produced
Product are placed in baking oven and toast 3 hours, obtain finished product, and sample number is respectively DJ-1, DJ-2, DJ-3, DJ-4, DJ-5.
Comparative example 1
Using raw material same as Example 1, identical manufacture craft, the sample without gel resin layer is made, as right
Than sample BY-1.
The test result of the sample of embodiment 1 and comparative example 1 such as table 1 below：
Table 1：The test result of the sample of embodiment 1 and documents 1
From test result, the low about 5lm/W of light efficiency of the sample BY-1 of comparative example 1.
Embodiment 2
As shown in Fig. 2 using 1033 sections of flip-chips 1, one layer of silica gel is covered on chip 1 using film laminator, formed
First gel resin layer A 2, then one layer of first phosphor powder layer B 3 is covered using film laminator, then product is placed in baking oven and toasts 3
Hour, finished product is obtained, sample number is respectively YM-1, YM-2, YM-3, YM-4, YM-5.
Comparative example 2
Using raw material same as Example 2, identical manufacture craft, the sample without gel resin layer is made, as right
Than sample, sample number is BY-2.
The test result of the sample of embodiment 2 and comparative example 2 such as table 2 below：
Table 2：The test result of the sample of embodiment 2 and comparative example 2
From test result, the low about 6lm/W of light efficiency of the sample BY-2 of comparative example 2.
Embodiment 3
As shown in Fig. 2 using 1033 sections of flip-chips 1, one layer of silica gel is covered on chip 1 using point gum machine, formed
First gel resin layer A 2, the chip 1 that will be covered with layer of silica gel is placed in baking oven the taking-up after 3 hours of baking at 150 DEG C, treats
Chip 1 containing the first gel resin layer A 3 is down to after room temperature and reuses duster covering layer of fluorescent powder layer, is then placed into product
Toast 1 hour in baking oven, obtain finished product, sample number is respectively PF-1, PF-2, PF-3, PF-4, PF-5.
Comparative example 3
Using raw material same as Example 3, identical manufacture craft, the sample without gel resin layer is made, as right
Than sample, sample number is BY-3.
The test result of the sample of embodiment 3 and comparative example 3 such as table 3 below：
Table 3：The test result of the sample of embodiment 3 and comparative example 3
From test result, the low about 8lm/W of light efficiency of the sample BY-3 of comparative example 3.
Embodiment 4
As shown in figure 3, using 1033 sections of flip-chips 1, one layer of silica gel is covered on chip 1 using point gum machine, formed
First gel resin layer A 2, the chip 1 that will be covered with layer of silica gel is placed in baking oven the taking-up after 3 hours of baking at 150 DEG C, treats
Chip 1 containing the first gel resin layer A 2 is down to after room temperature and reuses point gum machine one layer of first phosphor powder layer B 3 of covering, then will be produced
Product are placed in baking oven and toast 3 hours, one layer second of point gum machine covering are reused after chip containing phosphor powder layer 1 is down to room temperature clear
Glue-line C 4, obtains finished product, and sample number is respectively DJ-6, DJ-7, DJ-8, DJ-9, DJ-10.
Comparative example 4
Using raw material same as Example 4, identical manufacture craft, the sample without gel resin layer is made, as right
Than sample BY-4.
The test result of the sample of embodiment 4 and comparative example 4 such as table 4 below：
Table 4：The test result of the sample of embodiment 4 and comparative example 4
From test result, the low about 6lm/W of light efficiency of the sample BY-4 of comparative example 4.
Embodiment 5
As shown in figure 3, using 1033 sections of flip-chips 1, one layer of silica gel is covered on chip 1 using film laminator, formed
First gel resin layer A 2, then one layer of first phosphor powder layer B 3 is covered using film laminator, then product is placed in baking oven and toasts 3
Hour, after the first phosphor powder layer B 3 solidifies, then cover one layer of second gel resin layer C 4, obtain finished product, sample number be respectively YM-6,
YM-7、YM-8、YM-9、YM-10。
Comparative example 5
Using raw material same as Example 5, identical manufacture craft, the sample without gel resin layer is made, as right
Than sample, sample number is BY-5.
The test result of the sample of embodiment 5 and comparative example 5 such as table 5 below：
Table 5：The test result of the sample of embodiment 5 and comparative example 5
From test result, the low about 9lm/W of light efficiency of the sample BY-5 of comparative example 5.
Embodiment 6
As shown in figure 3, using 1033 sections of flip-chips 1, one layer of silica gel is covered on chip 1 using point gum machine, formed
First gel resin layer A 2, the chip 1 that will be covered with layer of silica gel is placed in baking oven the taking-up after 3 hours of baking at 150 DEG C, treats
Chip 1 containing the first gel resin layer A 2 is down to after room temperature and reuses duster one layer of first phosphor powder layer B 3 of covering, then will be produced
Product are placed in baking oven and toast 1 hour, then cover one layer of second gel resin layer C 4, obtain finished product, sample number be respectively PF-6, PF-7,
PF-8、PF-9、PF-10。
Using identical raw material, identical manufacture craft, outermost layer the second gel resin layer C 4 of making goes out light for zigzag
Face (as shown in Figure 4), sample number is JC-1, JC-2, JC-3, JC-4, JC-5.
Comparative example 6
Using raw material same as Example 6, identical manufacture craft, the sample without gel resin layer is made, as right
Than sample, sample number is BY-6.
The test result of the sample of embodiment 6 and comparative example 6 such as table 6 below：
Table 6：The test result of the sample of embodiment 6 and comparative example 6
From test result, exiting surface is jagged sample light efficiency and uniformity highest, the sample BY-6 of comparative example 6
Light efficiency it is minimum.This is probably the scattering that exiting surface increased light for zigzag, so as to than the light-out effect of light face exiting surface and
The uniformity is more preferable.
Although it is multilayer that above example does not disclose the first phosphor powder layer B 3 and B, those skilled in the art can be with
Understand, the first phosphor powder layer B 3 and B is that multilayer is more beneficial for uniform in light emission.Above example does not disclose the second gel resin layer C
4 outer layers are also covered with the second phosphor powder layer D, it will be appreciated by a person skilled in the art that multilayer arranges gel resin layer and phosphor powder layer
It is more beneficial for uniform in light emission.Above example does not disclose the first gel resin layer A 2, the first phosphor powder layer B 3, the second gel resin layer C
4 and second the refractive index of phosphor powder layer D taper into, it will be appreciated by a person skilled in the art that the first gel resin layer A 2, first
Phosphor powder layer B 3, the refractive index of the second gel resin layer C 4 and the second phosphor powder layer D are tapered into and are more beneficial for uniform in light emission.More than
Embodiment is not disclosed and contained in the first gel resin layer A 2, the first phosphor powder layer B 3, the second gel resin layer C 4 and the second phosphor powder layer D
Have light to spread and diffusion particle, it will be appreciated by a person skilled in the art that the first gel resin layer A 2, the first phosphor powder layer B 3, the
Be conducive to improving light extraction efficiency containing light diffusion and diffusion particle in two gel resin layer C 4 and the second phosphor powder layer D.
Light of the present utility model diffusion and diffusion particle can be from it is any suitable for gel resin layer and fluorescence coating and not with clearly
Light diffusion and diffusion particle that glue-line and fluorescence coating react.
First gel resin layer A 2 of the present utility model and the second gel resin layer C 4 can select any LED chip that is suitably packaged
Glue.First gel resin layer A 2 can be formed with the second gel resin layer C 4 by the glue of identical material, it is also possible to by the glue shape of different materials
Into.
First phosphor powder layer B 3 of the present utility model and the second phosphor powder layer D can select any fluorescence for being suitable to LED
Powder.First phosphor powder layer B 3 can be formed with the second phosphor powder layer D with identical material, it is also possible to be formed by different materials.This practicality
New technical scheme is disclosed as above by preferred embodiment.Artisan will appreciate that new without departing from this practicality
The change made in the case of scope and spirit of the present utility model disclosed in claim appended by type and retouching, category are originally
Within the scope of the claims of utility model.
Claims (15)
1. a kind of LED, it is characterised in that the first gel resin layer A is coated with the LED chip of the LED；First gel resin
The first phosphor powder layer B is coated with layer A.
2. LED according to claim 1, it is characterised in that the second gel resin layer is coated with the first phosphor powder layer B
C。
3. LED according to claim 2, it is characterised in that be coated with the second phosphor powder layer on the second gel resin layer C
D。
4. LED according to claim 1 and 2, it is characterised in that LED chip described in the first gel resin layer A all standings
Or LED chip described in local complexity.
5. LED according to claim 1 and 2, it is characterised in that neighbouring described the first of the first gel resin layer A is glimmering
The surface of light bisque B is smooth or is serrated or wavy.
6. LED according to claim 1 and 2, it is characterised in that the first phosphor powder layer B is multilayer.
7. LED according to claim 1 and 2, it is characterised in that the first phosphor powder layer B is clear away from described first
The surface of glue-line A is smooth or is serrated or wavy.
8. LED according to claim 3, it is characterised in that neighbouring described second fluorescent material of the second gel resin layer C
The surface of layer D is smooth or is serrated or wavy.
9. LED according to claim 3, it is characterised in that the second phosphor powder layer D is multilayer.
10. LED according to claim 3, it is characterised in that the second phosphor powder layer D is away from second gel resin
The surface of layer C is smooth or is serrated or wavy.
11. LEDs according to claim 1, it is characterised in that the refractive index of the first gel resin layer A is more than described the
The refractive index of one phosphor powder layer B.
12. LEDs according to claim 2, it is characterised in that the first gel resin layer A, the phosphor powder layer and described
The refractive index of the second gel resin layer C is gradually reduced.
13. LEDs according to claim 3, it is characterised in that the first gel resin layer A, the first phosphor powder layer B,
The refractive index of the second gel resin layer C and the second phosphor powder layer D is gradually reduced.
14. LEDs according to claim 1, it is characterised in that the first gel resin layer A and/or first fluorescence
Containing light diffusion and diffusion particle in bisque B.
15. LEDs according to claim 3, it is characterised in that the second gel resin layer C and/or second fluorescent material
Containing light diffusion and diffusion particle in layer D.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620897941.4U CN206098448U (en) | 2016-08-18 | 2016-08-18 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620897941.4U CN206098448U (en) | 2016-08-18 | 2016-08-18 | Led lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206098448U true CN206098448U (en) | 2017-04-12 |
Family
ID=58469428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620897941.4U Expired - Fee Related CN206098448U (en) | 2016-08-18 | 2016-08-18 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206098448U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768508A (en) * | 2016-08-18 | 2018-03-06 | 四川新力光源股份有限公司 | LED and its method for packing |
-
2016
- 2016-08-18 CN CN201620897941.4U patent/CN206098448U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768508A (en) * | 2016-08-18 | 2018-03-06 | 四川新力光源股份有限公司 | LED and its method for packing |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 Termination date: 20170818 |
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| CF01 | Termination of patent right due to non-payment of annual fee |