CN110459645A - 电池板与汇流条的焊接方法 - Google Patents
电池板与汇流条的焊接方法 Download PDFInfo
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- CN110459645A CN110459645A CN201910700622.8A CN201910700622A CN110459645A CN 110459645 A CN110459645 A CN 110459645A CN 201910700622 A CN201910700622 A CN 201910700622A CN 110459645 A CN110459645 A CN 110459645A
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- 238000003466 welding Methods 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 91
- 238000005452 bending Methods 0.000 claims abstract description 86
- 238000007600 charging Methods 0.000 claims abstract description 75
- 238000005520 cutting process Methods 0.000 claims abstract description 55
- 238000001514 detection method Methods 0.000 claims description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000000994 depressogenic effect Effects 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000013011 mating Effects 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000001737 promoting effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000012372 quality testing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
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- 238000007599 discharging Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
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Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910700622.8A CN110459645B (zh) | 2019-07-31 | 2019-07-31 | 电池板与汇流条的焊接方法 |
Applications Claiming Priority (1)
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CN201910700622.8A CN110459645B (zh) | 2019-07-31 | 2019-07-31 | 电池板与汇流条的焊接方法 |
Publications (2)
Publication Number | Publication Date |
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CN110459645A true CN110459645A (zh) | 2019-11-15 |
CN110459645B CN110459645B (zh) | 2021-04-02 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114783929A (zh) * | 2022-06-23 | 2022-07-22 | 丽瀑光能(常熟)有限公司 | 一种光伏组件的汇流带输送装置 |
CN118174111A (zh) * | 2024-05-15 | 2024-06-11 | 翊腾电子科技(昆山)有限公司 | 一种电池接头的组装设备 |
CN118174111B (zh) * | 2024-05-15 | 2024-07-05 | 翊腾电子科技(昆山)有限公司 | 一种电池接头的组装设备 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2269757A1 (de) * | 2009-06-30 | 2011-01-05 | Feintool Intellectual Property AG | Vorrichtung zum Verbinden, insbesondere Löten, eines Verbinders mit einer Solarzelle mit einer Reinigungseinrichtung |
CN104966764A (zh) * | 2015-07-21 | 2015-10-07 | 宁波华顺太阳能科技有限公司 | 光伏组件汇流带自动折弯装置及其方法 |
CN105414267A (zh) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | 汇流条折弯机 |
CN206010196U (zh) * | 2016-08-31 | 2017-03-15 | 无锡奥特维科技股份有限公司 | 一种汇流条焊接装置 |
CN106825839A (zh) * | 2017-03-22 | 2017-06-13 | 无锡先导智能装备股份有限公司 | 汇流条的供料机构以及供料方法 |
CN106925921A (zh) * | 2015-12-31 | 2017-07-07 | 苏州博阳能源设备有限公司 | 太阳能电池汇流条焊接装置 |
CN107414401A (zh) * | 2017-09-12 | 2017-12-01 | 无锡奥特维科技股份有限公司 | 汇流条焊接装置 |
CN207127362U (zh) * | 2017-06-05 | 2018-03-23 | 博硕皓泽自动化设备无锡有限公司 | 自动汇流条焊接设备 |
CN207344002U (zh) * | 2017-09-25 | 2018-05-11 | 苏州赛历新材料科技股份有限公司 | 一种光伏汇流带焊接用新型自动上料机构 |
CN108067759A (zh) * | 2016-11-16 | 2018-05-25 | 上海涛创自动化科技有限公司 | 一种汇流条自动上料焊接一体设备 |
CN207642649U (zh) * | 2017-10-30 | 2018-07-24 | 昆山盟特展精密机电有限公司 | 一种汇流条自动裁切焊接机 |
CN208358243U (zh) * | 2018-06-19 | 2019-01-11 | 齐河双百数码影像设备有限公司 | 一种汇流条备料机构 |
CN208840862U (zh) * | 2018-08-08 | 2019-05-10 | 苏州德睿联自动化科技有限公司 | 汇流条焊接系统 |
-
2019
- 2019-07-31 CN CN201910700622.8A patent/CN110459645B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2269757A1 (de) * | 2009-06-30 | 2011-01-05 | Feintool Intellectual Property AG | Vorrichtung zum Verbinden, insbesondere Löten, eines Verbinders mit einer Solarzelle mit einer Reinigungseinrichtung |
CN104966764A (zh) * | 2015-07-21 | 2015-10-07 | 宁波华顺太阳能科技有限公司 | 光伏组件汇流带自动折弯装置及其方法 |
CN106925921A (zh) * | 2015-12-31 | 2017-07-07 | 苏州博阳能源设备有限公司 | 太阳能电池汇流条焊接装置 |
CN105414267A (zh) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | 汇流条折弯机 |
CN206010196U (zh) * | 2016-08-31 | 2017-03-15 | 无锡奥特维科技股份有限公司 | 一种汇流条焊接装置 |
CN108067759A (zh) * | 2016-11-16 | 2018-05-25 | 上海涛创自动化科技有限公司 | 一种汇流条自动上料焊接一体设备 |
CN106825839A (zh) * | 2017-03-22 | 2017-06-13 | 无锡先导智能装备股份有限公司 | 汇流条的供料机构以及供料方法 |
CN207127362U (zh) * | 2017-06-05 | 2018-03-23 | 博硕皓泽自动化设备无锡有限公司 | 自动汇流条焊接设备 |
CN107414401A (zh) * | 2017-09-12 | 2017-12-01 | 无锡奥特维科技股份有限公司 | 汇流条焊接装置 |
CN207344002U (zh) * | 2017-09-25 | 2018-05-11 | 苏州赛历新材料科技股份有限公司 | 一种光伏汇流带焊接用新型自动上料机构 |
CN207642649U (zh) * | 2017-10-30 | 2018-07-24 | 昆山盟特展精密机电有限公司 | 一种汇流条自动裁切焊接机 |
CN208358243U (zh) * | 2018-06-19 | 2019-01-11 | 齐河双百数码影像设备有限公司 | 一种汇流条备料机构 |
CN208840862U (zh) * | 2018-08-08 | 2019-05-10 | 苏州德睿联自动化科技有限公司 | 汇流条焊接系统 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114783929A (zh) * | 2022-06-23 | 2022-07-22 | 丽瀑光能(常熟)有限公司 | 一种光伏组件的汇流带输送装置 |
CN118174111A (zh) * | 2024-05-15 | 2024-06-11 | 翊腾电子科技(昆山)有限公司 | 一种电池接头的组装设备 |
CN118174111B (zh) * | 2024-05-15 | 2024-07-05 | 翊腾电子科技(昆山)有限公司 | 一种电池接头的组装设备 |
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Effective date of registration: 20210316 Address after: 215000 No. 1, Xian Shi Road, Changshu hi tech Industrial Development Zone, Suzhou, Jiangsu Applicant after: Skylight think tank culture communication (Suzhou) Co.,Ltd. Address before: 311199 ideal city 2701, 380 Yingbin Road, Hangzhou City, Zhejiang Province Applicant before: Xu Jiahui |
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Effective date of registration: 20240411 Address after: No. 1599 Yangzijiang Road, Binjiang Street, Haimen District, Nantong City, Jiangsu Province, 226100 Patentee after: Shanghai Electric Group Hengxi Photovoltaic Technology (Nantong) Co.,Ltd. Country or region after: China Address before: 215000 No. 1, Xian Shi Road, Changshu hi tech Industrial Development Zone, Suzhou, Jiangsu Patentee before: Skylight think tank culture communication (Suzhou) Co.,Ltd. Country or region before: China |