CN110416366B - 一种mwt铜铝芯板拼接加工方法 - Google Patents
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Abstract
本发明公开了一种MWT铜铝芯板拼接加工方法,包括如下步骤:步骤1,将两张500mm的原始铜铝箔长边相接并平铺在EVA上,与衬底EVA进行粘接,粘接成一整体后对原始铜铝箔进行刻线,刻线后将刻出的线径撕掉;撕线后将尾部镂空断路区域的铜铝导电芯板幅面揭掉;步骤2,将准备好替换原始铜铝导电芯板的尾部镂空断路区域的替代幅面,沿原始铜铝导电芯板幅面边缘贴在EVA上方,然后通过加热模块将替代幅面与EVA粘接。本发明解决了铜铝芯板拼接位置镂空断路的问题。
Description
技术领域
本发明涉及一种MWT铜铝芯板拼接加工方法,属于MWT太阳能电池组件加工技术领域。
背景技术
随着光伏组件的应用越来越广,高效率、低成本的光伏组件一直是行业技术发展的目标。MWT电池组件由于其自身的特点,使用导电芯板进行电池片之间的串联。对于目前使用的最多的导电芯板是电解铜箔,但由于成本方面考虑,使用铜铝箔进行替代,可以明显降低组件的生产成本。
目前市面上铜+铝制作方法较多,有铜铝复合压扎,化学电镀,溅射电镀等方法,其中采用压扎复合方法生产的铜铝箔,宽幅厚度比较均匀性,但由于受扎压工艺成熟度的限制,1m宽幅的铜铝箔在市场上很少见,无法满足工厂的生产要求。从生产经营方面考虑,通常使用窄幅铜铝箔拼接替代宽幅铜铝箔。MWT铜铝导电芯板领域,铜铝导电芯板宽幅为954mm,采用980mm宽幅整体铜铝箔原料进行激光雕刻成一整体,但面对500mm*2合二为一拼接铜铝方案,现有工艺无法实现,如按正常工艺两张500mm铜铝箔中间区域会产生镂空断路,组件端使用时电流无法传递,产品无法使用。
发明内容
发明目的:针对现有技术中存在的问题与不足,本发明提供一种MWT铜铝芯板拼接加工方法,用于解决铜铝芯板拼接位置镂空断路的问题。
技术方案:一种MWT铜铝芯板拼接加工方法,包括如下步骤:
步骤1,将两张500mm的原始铜铝箔长边相接并平铺在EVA上,与衬底EVA进行粘接,粘接成一整体后对原始铜铝箔进行刻线,刻线后将刻出的线径撕掉;撕线后将尾部镂空断路区域的铜铝导电芯板幅面揭掉;
步骤2,将准备好替换原始铜铝导电芯板的尾部镂空断路区域的替代幅面,沿原始铜铝导电芯板幅面边缘贴在EVA上方,然后通过加热模块将替代幅面与EVA粘接。
所述替代幅面粘接在EVA后,与原铜铝箔边缘的间隙为1-2mm。
所述加热模块的加热接触面积为100mm*100mm,加热块厚度为15mm,加热温度为150~240℃;加热时间为3-10s。
所述替代幅面的制备方法为:取覆EVA后的铜铝箔,然后对铜铝箔进行刻线,刻线时仅加工需替换的原始铜铝导电芯板幅面的图形即可,加工后将替代幅面沿雕刻路径边缘拨下备用。
所述用于制备替代幅面的铜铝箔的尺寸大于350 mm *350mm。
采用激光刻线机对铜铝箔进行刻线。
有益效果:与现有技术相比,本发明所提供的MWT铜铝芯板拼接加工方法,具有如下优点:
(1)采用本发明可实现拼接铜铝导电芯板的正常电路导通;
(2)采用本发明可提高拼接铜铝导电芯板的生产效率,可降低生产成本,不增加任何机器及物料投入;
(3)本发明可试用各种MWT芯板,兼容性较强,如60版型、半片、双玻芯板等。
附图说明
图1为未拼接前导电芯板部分示意图,其中:箭头表示电流方向,点部填充区域表示要从EVA上撕掉的镂空断路区域的铜铝导电芯板幅面;
图2为撕掉尾部镂空断路区域的铜铝导电芯板部分示意图;
图3为拼接后的铜铝导电芯板部分示意图;
图4为替代幅面示意图。
1、镂空断路区域的铜铝导电芯板幅面,2、替代幅面。
具体实施方式
下面结合附图和具体实施例,进一步阐明本发明。
如图1-4所示,MWT铜铝芯板拼接加工方法,包括如下步骤:
步骤1,将两张500mm的原始铜铝箔长边相接并平铺在EVA上,与衬底EVA进行粘接,粘接成一整体后,采用激光刻线机对原始铜铝箔进行刻线,刻线后将刻出的线径撕掉;撕线后将尾部镂空断路区域的铜铝导电芯板幅面1揭掉;
步骤2,将准备好替换原始铜铝导电芯板的尾部镂空断路区域的替代幅面2,沿原始铜铝导电芯板幅面边缘贴在EVA上方,然后通过加热模块将替代幅面2与EVA粘接,替代幅面2粘接在EVA后,与原铜铝箔边缘的间隙为1-2mm;
加热模块的加热接触面积为100mm*100mm,加热块厚度为15mm;加热温度为150~240℃;加热时间为3-10s。
替代幅面2的制备方法为:取覆EVA后的铜铝箔,然后对铜铝箔进行刻线,刻线时仅加工需替换的原始铜铝导电芯板幅面的图形即可,加工后将替代幅面2沿雕刻路径边缘拨下备用。
用于制备替代幅面2的铜铝箔的尺寸大于350 mm *350mm。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以作出若干改进,这些改进也应视为本发明的保护范围。
Claims (4)
1.一种MWT铜铝芯板拼接加工方法,其特征在于,包括如下步骤:
步骤1,将两张500mm的原始铜铝箔长边相接并平铺在EVA上,与衬底EVA进行粘接,粘接成一整体后对原始铜铝箔进行刻线,刻线后将刻出的线径撕掉;撕线后将尾部镂空断路区域的铜铝导电芯板幅面揭掉;
步骤2,将准备好替换原始铜铝导电芯板的尾部镂空断路区域的替代幅面,沿原始铜铝导电芯板幅面边缘贴在EVA上方,然后通过加热模块将替代幅面与EVA粘接;
所述替代幅面粘接在EVA后,与原铜铝箔边缘的间隙为1-2mm。
2.如权利要求1所述的MWT铜铝芯板拼接加工方法,其特征在于,所述加热模块的加热接触面积为100mm*100mm,加热块厚度为15mm,加热温度为150~240℃;加热时间为3-10s。
3.如权利要求1所述的MWT铜铝芯板拼接加工方法,其特征在于,所述替代幅面的制备方法为:取覆EVA后的铜铝箔,然后对铜铝箔进行刻线,刻线时仅加工需替换的原始铜铝导电芯板幅面的图形即可,加工后将替代幅面沿雕刻路径边缘拨下备用。
4. 如权利要求3所述的MWT铜铝芯板拼接加工方法,其特征在于,用于制备所述替代幅面的铜铝箔的尺寸大于350 mm *350mm。
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