CN110389243B - Probe card device - Google Patents
Probe card device Download PDFInfo
- Publication number
- CN110389243B CN110389243B CN201810347589.0A CN201810347589A CN110389243B CN 110389243 B CN110389243 B CN 110389243B CN 201810347589 A CN201810347589 A CN 201810347589A CN 110389243 B CN110389243 B CN 110389243B
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- guide plate
- positioning
- section
- positioning portion
- rectangular
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe card device, wherein a rectangular probe comprises an upper positioning section, an upper contact section, a deformation section, a lower positioning section and a lower contact section. The upper positioning section comprises a dislocation part, a first positioning part extending from the dislocation part along a first direction, and a second positioning part extending from the dislocation part along a second direction parallel to but opposite to the first direction. In the width direction perpendicular to the first direction, the width of the first positioning portion is 95% to 25% of the width of the offset portion, and the width of the second positioning portion is 95% to 25% of the width of the offset portion. The upper contact section is formed by extending the first positioning part along the first direction. The deformation section, the lower positioning section and the lower contact section sequentially extend from the second positioning part along the second direction. Thus, a rectangular probe having a structure different from that of the conventional probe is provided.
Description
Technical Field
The present invention relates to a probe, and more particularly, to a probe card apparatus and a rectangular probe thereof.
Background
When the semiconductor chip is tested, the test equipment is electrically connected with the object to be tested through a probe card device, and the test result of the object to be tested is obtained through signal transmission and signal analysis. The conventional probe card device is provided with a plurality of probes arranged corresponding to the electrical contacts of the object to be tested, so that the probes can simultaneously contact the corresponding electrical contacts of the object to be tested.
More specifically, the probe of the conventional probe card apparatus includes a rectangular probe manufactured by Micro Electro Mechanical Systems (MEMS) technology, and the shape of the rectangular probe can be shaped according to the requirement of the designer. However, the development direction of the conventional rectangular probe is limited by the existing structural design, and thus it is difficult to provide technical effects different from the conventional ones.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
Embodiments of the present invention provide a probe card apparatus and a rectangular probe thereof, which can effectively overcome the defects of the conventional rectangular probe.
The embodiment of the invention discloses a probe card device which comprises an upper guide plate unit, a lower guide plate and a plurality of rectangular probes. The upper guide plate unit comprises a first guide plate and a second guide plate which are arranged at intervals; the lower guide plate is arranged on one side, far away from the first guide plate, of the second guide plate at intervals, and the distance between the lower guide plate and the second guide plate is larger than the distance between the first guide plate and the second guide plate; the plurality of rectangular probes respectively comprise an upper positioning section, an upper contact section, a deformation section, a lower positioning section and a lower contact section. The upper positioning section comprises an offset part, a first positioning part extending from the offset part along a first direction and a second positioning part extending from the offset part along a second direction parallel to the first direction but opposite to the first direction, and a central axis of the first positioning part parallel to the first direction is not overlapped with a central axis of the second positioning part parallel to the second direction; wherein, in a width direction perpendicular to the first direction, the width of the first positioning portion is 95% to 25% of the width of the offset portion, and the width of the second positioning portion is 95% to 25% of the width of the offset portion; the upper contact section is formed by extending from the first positioning part along the first direction; the deformation section, the lower positioning section and the lower contact section are formed by sequentially extending from the second positioning part along the second direction; the upper positioning sections of the rectangular probes are respectively positioned in the upper guide plate unit, the lower positioning sections of the rectangular probes are respectively positioned in the lower guide plate, and the deformation sections of the rectangular probes are positioned between the second guide plate and the lower guide plate; when the first guide plate is displaced in the width direction relative to the second guide plate, the first guide plate and the second guide plate respectively abut against the first positioning portion and the second positioning portion of each rectangular probe in opposite directions, and the offset portion of each rectangular probe is located between the first guide plate and the second guide plate.
Preferably, in each of the rectangular probes, the central axis of the first positioning portion and the central axis of the second positioning portion are separated by a misalignment distance, and the misalignment distance is between 3 micrometers and 280 micrometers.
Preferably, in each of the rectangular probes, the offset portion and the first positioning portion form a first corner together, and the offset portion and the second positioning portion form a second corner together; when the first guide plate is displaced along the width direction relative to the second guide plate, the first guide plate abuts against the first corner, and the second guide plate abuts against the second corner.
Preferably, in each of the rectangular probes, the upper contact section is a straight strip, and an area of any cross section of the upper contact section perpendicular to the first direction is not greater than an area of any cross section of the first positioning portion perpendicular to the first direction.
Preferably, when the upper guide plate unit is offset relative to the lower guide plate along an oblique direction perpendicular to the second direction, the upper guide plate unit and the lower guide plate press the upper positioning section and the lower positioning section of each rectangular probe, so that the deformation section of each rectangular probe is stressed to be bent and deformed.
Preferably, the probe card apparatus includes an adapter plate, the adapter plate is abutted and fixed to the upper contact sections of the rectangular probes, and the lower contact sections of the rectangular probes are used for elastically and separably abutting against an object to be tested.
Preferably, the upper guide plate unit includes a support plate clamped between the first guide plate and the second guide plate, and an accommodating space is formed in an inner edge of the support plate, and the plurality of offset portions are spaced from each other and located in the accommodating space; the probe card device comprises a partition plate clamped between the second guide plate and the lower guide plate, a containing hole is formed in the inner edge of the partition plate, and a plurality of deformation sections are positioned in the containing hole of the partition plate at intervals.
The embodiment of the invention also discloses a rectangular probe of the probe card device, which comprises an upper positioning section, an upper contact section, a deformation section, a lower positioning section and a lower contact section. The upper positioning section comprises an offset portion, a first positioning portion extending from the offset portion along a first direction, and a second positioning portion extending from the offset portion along a second direction parallel to but opposite to the first direction, and a central axis of the first positioning portion parallel to the first direction is not overlapped with a central axis of the second positioning portion parallel to the second direction; wherein, in a width direction perpendicular to the first direction, the width of the first positioning portion is 95% to 25% of the width of the offset portion, and the width of the second positioning portion is 95% to 25% of the width of the offset portion; the upper contact section is formed by extending from the first positioning part along the first direction; and the deformation section, the lower positioning section and the lower contact section are formed by sequentially extending from the second positioning part along the second direction.
Preferably, the central axis of the first positioning portion and the central axis of the second positioning portion are separated by a misalignment distance, and the misalignment distance is between 3 micrometers and 280 micrometers.
Preferably, the first positioning portion forms a projection area by orthographic projection along the second direction, and the projection area covers a part of the second positioning portion.
In summary, in the probe card apparatus and the rectangular probe thereof according to the embodiments of the invention, the first positioning portion and the second positioning portion connected to the offset portion and offset from each other are formed in the upper positioning section, so that the rectangular probe is different from the conventional structure, and the upper positioning section of the rectangular probe has an independent positioning effect. In addition, the probe card apparatus according to the embodiment of the invention employs the first guide plate and the second guide plate to be matched with the upper positioning section of each rectangular probe, so that the rectangular probe can be effectively positioned on the upper guide plate unit.
For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a schematic view of a rectangular probe according to a first embodiment of the invention.
Fig. 2 is a schematic view of another embodiment of a rectangular probe according to the first embodiment of the present invention.
Fig. 3 is a schematic diagram (a) of a probe base of a probe card device according to a second embodiment of the invention.
Fig. 4 is a schematic diagram (ii) of a probe base of the probe card device according to the second embodiment of the invention.
Fig. 5 is a partially enlarged view of the V region in fig. 4.
Fig. 6 is a schematic diagram (iii) of a probe base of the probe card device according to the second embodiment of the invention.
Fig. 7 is a schematic diagram of a probe card device according to a second embodiment of the present invention.
Detailed Description
[ example one ]
Please refer to fig. 1 and fig. 2, which are a first embodiment of the present invention, and it should be noted that, in the present embodiment, relative numbers and shapes mentioned in relation to the drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate understanding of the contents of the present invention, and not for limiting the scope of the present invention.
The present embodiment discloses a rectangular probe 1, and more particularly, to a rectangular probe 1 of a probe card apparatus. In the present embodiment, the rectangular probe 1 is a flexible strip structure that is electrically conductive. The rectangular probe 1 of the present embodiment is preferably limited to be manufactured using micro-electro-mechanical systems (MEMS) technology, so the present embodiment excludes circular probes having distinct manufacturing processes. In other words, the rectangular probe 1 of the present embodiment has no motivation to refer to each other because the manufacturing processes are very different compared to the circular probe.
In this embodiment, the rectangular probe 1 includes an upper positioning section 11, an upper contact section 12 extending from one end of the upper positioning section 11 (e.g., the top end of the upper positioning section 11 in fig. 1), and a deformation section 13, a lower positioning section 14 and a lower contact section 15 sequentially extending from the other end of the upper positioning section 11 (e.g., the bottom end of the upper positioning section 11 in fig. 1).
In the present embodiment, the upper positioning section 11 includes an offset portion 111, a first positioning portion 112 extending from (a top edge of) the offset portion 111 along a first direction D1 (e.g., upward direction in fig. 1), and a second positioning portion 113 extending from (a bottom edge of) the offset portion 111 along a second direction D2 (e.g., downward direction in fig. 1) parallel to but opposite to the first direction D1.
In a width direction W perpendicular to the first direction D1, the width W112 of the first positioning portion 112 is 95% to 25% of the width W111 of the displacement portion 111, and the width W113 of the second positioning portion 113 is 95% to 25% of the width W111 of the displacement portion 111. It should be noted that the width W112 of the first positioning portion 112 in the present embodiment is preferably equal to the width W113 of the second positioning portion 113, but the invention is not limited thereto.
Furthermore, a central axis C112 of the first positioning portion 112 parallel to the first direction D1 does not overlap with a central axis C113 of the second positioning portion 113 parallel to the second direction D2. That is, the positions of the first positioning portion 112 and the second positioning portion 113 are shifted from each other compared to the shift portion 111. The distance between the central axis C112 of the first positioning portion 112 and the central axis C113 of the second positioning portion 113 is a misalignment distance Ds, and the misalignment distance Ds is between 3 micrometers and 250 micrometers, but the invention is not limited thereto.
Further, the rectangular probe 1 of the present embodiment includes two embodiments, as shown in fig. 1, a projection area formed by orthographically projecting the first positioning portion 112 along the second direction D2 is located outside the second positioning portion 113 (e.g., the sum of the 50% width W112 of the first positioning portion 112 and the 50% width W113 of the second positioning portion 113 is smaller than the displacement distance Ds); alternatively, as shown in fig. 2, the first positioning portion 112 forms a projection area by orthographically projecting along the second direction D2, which covers a part of the second positioning portion 113 (e.g., the sum of the 50% width W112 of the first positioning portion 112 and the 50% width W113 of the second positioning portion 113 is greater than the above-mentioned offset distance Ds).
In addition, the offset portion 111 and the first positioning portion 112 form a first corner 114 together, and the offset portion 111 and the second positioning portion 113 form a second corner 115 together. The first corner 114 and the second corner 115 are preferably at 90 degrees, that is, the first positioning portion 112 is connected to the positioning portion 111 substantially perpendicularly, and the second positioning portion 113 is also connected to the positioning portion 111 substantially perpendicularly, but the invention is not limited thereto.
The upper contact segment 12 extends from the first positioning portion 112 along the first direction D1, and the area of any cross section of the upper contact segment 12 perpendicular to the first direction D1 is not greater than the area of any cross section of the first positioning portion 112 perpendicular to the first direction D1. The upper contact section 12 of the present embodiment is preferably in a straight strip shape, that is, the upper contact section 12 of the present embodiment is preferably not formed with any protruding structure, but the present invention is not limited thereto.
The deformation section 13, the lower positioning section 14 and the lower contact section 15 are sequentially formed by extending from the second positioning portion 113 along the second direction D2. That is, the second positioning portion 113, the deformation section 13, the lower positioning section 14 and the lower contact section 15 of the upper positioning section 11 are linear in shape in the present embodiment and preferably have substantially the same width, but the present invention is not limited thereto.
Accordingly, the rectangular probe 1 is different from the conventional structure in that the first positioning portion 112 and the second positioning portion 113 which are connected to the displacement portion 111 and are displaced from each other are formed in the upper positioning section 11.
[ example two ]
Referring to fig. 3 to 7, a second embodiment of the invention discloses a probe card apparatus 1000, which includes a probe holder 100 and an interposer 200 abutting against one side (e.g., the top side of the probe holder 100 in fig. 7) of the probe holder 100, and the other side (e.g., the bottom side of the probe holder 100 in fig. 7) of the probe holder 100 can be used for testing an object (not shown), such as a semiconductor wafer. Although the probe socket 100 of the present embodiment is described by being combined with the interposer 200, the practical application of the probe socket 100 is not limited thereto.
It should be noted that, for the convenience of understanding the present embodiment, the drawings only show a partial structure of the probe card apparatus 1000, so as to clearly show the structure and connection relationship of the various components of the probe card apparatus 1000. The construction of each component of the probe socket 100 and the connection relationship thereof will be described below.
As shown in fig. 3 to 5, the probe holder 100 includes an upper guide plate unit 2, a lower guide plate 3 substantially parallel to the upper guide plate unit 2, a partition plate 4 clamped between the upper guide plate unit 2 and the lower guide plate 3, and a plurality of rectangular probes 1 passing through the upper guide plate unit 2 and the lower guide plate 3. In this embodiment, each rectangular probe 1 is the same as the rectangular probe 1 described in the above embodiment (as shown in fig. 1 and 2), and therefore, the detailed structure of the rectangular probe 1 will not be described herein.
Moreover, since the plurality of rectangular probes 1 of the probe socket 100 of the present embodiment have substantially the same structure, for the convenience of understanding the present embodiment, the drawings only show a partial structure of the probe card apparatus 1000 (three rectangular probes 1 and their corresponding structures), so as to clearly show the structure and connection relationship of each component of the probe card apparatus 1000. However, in other embodiments not shown in the present invention, the plurality of rectangular probes 1 of the probe socket 100 may have different configurations from each other.
As shown in fig. 3 to 5, the upper guide plate unit 2 in this embodiment includes a first guide plate 21, a second guide plate 22 spaced apart from the first guide plate 21, and a support plate 23 clamped between the first guide plate 21 and the second guide plate 22. Wherein the first guide plate 21 is formed with a plurality of first through holes 211 and the second guide plate 22 is formed with a plurality of second through holes 221. The positions of the first through holes 211 respectively correspond to the positions of the second through holes 221 one-to-one, and the size of any one of the first through holes 211 is preferably not smaller than the size of any one of the second through holes 221.
Furthermore, the size of the first through hole 211 is not smaller than the size of the offset portion 111 of the rectangular probe 1, so that the upper positioning section 11 of the rectangular probe 1 passes through the first through hole 211. The size of the second through hole 221 is smaller than the size of the offset portion 111 of the rectangular probe 1, so that the offset portion 111 of the rectangular probe 1 cannot pass through the second through hole 221. In other words, the width W111 of the offset 111 (i.e., the width of any offset 111 perpendicular to the first direction D1) of the rectangular probe 1 of the present embodiment is not greater than the width W211 corresponding to the first through hole 211 and is greater than the width W221 corresponding to the second through hole 221.
The thickness of the supporting plate 23 is substantially equal to the thickness of the offset portion 111 of the rectangular probe 1, and an accommodating space 231 is formed at the inner edge of the supporting plate 23. The supporting plate 23 abuts against the first guide plate 21 and the second guide plate 22, so that the first guide plate 21 and the second guide plate 22 can be maintained to be spaced apart from each other, and the plurality of first through holes 211 of the first guide plate 21 and the plurality of second through holes 221 of the second guide plate 22 are all communicated with the accommodating space 231 of the supporting plate 23.
In the present embodiment, the supporting plate 23 is sandwiched between the first guide plate 21 and the second guide plate 22, but the present invention is not limited thereto. For example, in other embodiments of the present invention, not shown, the first guide plate 21 can be locally thickened to abut against the second guide plate 22, so as to omit the supporting plate 23; alternatively, the upper guide plate unit 2 may have a third guide plate instead of the support plate 23.
As shown in fig. 3 to 5, the lower guide plate 3 is formed with a plurality of lower through holes 31, and the size of each lower through hole 31 is preferably not greater than that of any one of the second through holes 221. Wherein the lower guide plate 3 is spaced apart from the first guide plate 21 on the side of the second guide plate 22 (e.g. the lower side of the second guide plate 22 in fig. 3), and the distance between the lower guide plate 3 and the second guide plate 22 is greater than the distance between the first guide plate 21 and the second guide plate 22.
Furthermore, the thickness of the partition plate 4 is substantially equal to the length of the deformation section 13 of the rectangular probe 1, and a receiving hole 41 is formed at the inner edge of the partition plate 4. The partition plate 4 is clamped between the second guide plate 22 and the lower guide plate 3, so that the second guide plate 22 and the lower guide plate 3 can be spaced apart from each other, and the second through holes 221 of the second guide plate 22 and the lower through holes 31 of the lower guide plate 3 are all communicated with the accommodating hole 41 of the partition plate 4.
In the present embodiment, the partition plate 4 is sandwiched between the second guide plate 22 and the lower guide plate 3, but the present invention is not limited thereto. In other embodiments of the invention, not shown, the second guide plate 22 and the lower guide plate 3 may be kept spaced apart from each other by other means.
As shown in fig. 3, each of the rectangular probes 1 passes through the upper guide plate unit 2, the partition plate 4, and the lower guide plate 3 in this order. Wherein, the upper positioning sections 11 of the plurality of rectangular probes 1 are respectively located in the upper guide plate unit 2, the deformation sections 13 of the plurality of rectangular probes 1 are located between the second guide plate 22 and the lower guide plate 3 (i.e., the deformation sections 13 are located in the accommodating holes 41 of the partition plate 4 at intervals), the lower positioning sections 14 of the plurality of rectangular probes 1 are respectively located in (the lower through holes 31 of) the lower guide plate 3, and the upper contact sections 12 and the lower contact sections 15 of the plurality of rectangular probes 1 are respectively located on the outer sides of the upper guide plate unit 2 and the lower guide plate 3 away from each other (e.g., the upper side of the upper guide plate unit 2 and the lower side of the lower guide plate 3 in fig. 3).
Further, the first positioning portions 112 of the upper positioning segments 11 are respectively located in the first through holes 211 of the first guide plate 21, the second positioning portions 113 of the upper positioning segments 11 are respectively located in the second through holes 221 of the second guide plate 22, and the plurality of the positioning portions 111 of the upper positioning segments 11 are located in the accommodating space 231 of the support plate 23 at intervals.
As shown in fig. 4 and 5, when the first guide plate 21 is displaced in the width direction W with respect to the second guide plate 22, the first guide plate 21 and the second guide plate 22 of the present embodiment respectively abut against the first positioning portion 112 and the second positioning portion 113 of each rectangular probe 1 in opposite directions, and the offset portion 111 of each rectangular probe 1 is located between the first guide plate 21 and the second guide plate 22.
Further, when the first guide plate 21 is displaced along the width direction W relative to the second guide plate 22, the first guide plate 21 of the present embodiment abuts against the first corner 114 of each rectangular probe 1, and the second guide plate 22 abuts against the second corner 115 of each rectangular probe 1; that is, the offset portion 111 of each rectangular probe 1 is sandwiched between the first guide plate 21 and the second guide plate 22. However, in other embodiments not shown in the present invention, the offset portion 111 of each rectangular probe 1 may be disposed on the second guide plate 22, but is not clamped between the first guide plate 21 and the second guide plate 22.
Accordingly, the probe card apparatus 1000 enables each rectangular probe 1 to be effectively positioned on the upper guide plate unit 2 by employing the first guide plate 21 and the second guide plate 22 in cooperation with the upper positioning section 11 of each rectangular probe 1.
Furthermore, as shown in FIG. 6, when the upper guide plate unit 2 is shifted relative to the lower guide plate 3 along an oblique direction perpendicular to the second direction D2 (e.g., the entire upper guide plate unit 2 is moved or the lower guide plate 3 is moved), the upper guide plate unit 2 and the lower guide plate 3 press the upper positioning section 11 and the lower positioning section 14 of each rectangular probe 1, so that the deformation section 13 of each rectangular probe 1 is forced to bend and deform. That is, if the deformation section of the rectangular probe is not stressed and is bent (e.g. directly formed into a bent shape), the rectangular probe is not the rectangular probe 1 of the present embodiment. In this embodiment, the inclined direction is preferably located on the same plane as the width direction W and forms an acute angle with the width direction W, but the invention is not limited thereto.
As shown in fig. 7, the interposer 200 is abutted and fixed on the upper contact sections 12 of the rectangular probes 1, and the lower contact sections 15 of the rectangular probes 1 are used for elastically and detachably abutting against an object to be tested (not shown, such as a semiconductor wafer). That is to say, the upper guide plate unit 2 and the upper positioning section 11 of each rectangular probe 1 in the present embodiment are disposed adjacent to the adapter plate 200, so the present embodiment preferably excludes the upper guide plate unit 2 or the upper positioning section 11 of each rectangular probe 1 from being adjacent to the object to be tested.
[ technical effects of embodiments of the present invention ]
As described above, in the probe card apparatus 1000 and the rectangular probe 1 thereof according to the embodiment of the present invention, the first positioning portion 112 and the second positioning portion 113 connected to the positioning portion 111 and provided in a staggered manner are formed in the upper positioning section 11, so that the rectangular probe 1 is different from the conventional structure, and the upper positioning section 11 of the rectangular probe 1 has an effect of performing positioning independently. Further, the probe card apparatus 1000 according to the embodiment of the present invention employs the first guide plate 21 and the second guide plate 22 to cooperate with the upper positioning section 11 of each rectangular probe 1, so that the rectangular probe 1 can be effectively positioned on the upper guide plate unit 2.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention, which is defined by the appended claims.
Claims (7)
1. A probe card apparatus, characterized in that the probe card apparatus comprises:
an upper guide plate unit including a first guide plate and a second guide plate spaced apart from each other;
a lower guide plate which is arranged at a position apart from one side of the second guide plate far away from the first guide plate, and the distance between the lower guide plate and the second guide plate is larger than the distance between the first guide plate and the second guide plate; and
a plurality of rectangular probes, each comprising:
an upper positioning section including an offset portion, a first positioning portion extending from the offset portion in a first direction, and a second positioning portion extending from the offset portion in a second direction parallel to but opposite to the first direction, a central axis of the first positioning portion parallel to the first direction not overlapping a central axis of the second positioning portion parallel to the second direction; wherein the first positioning portion is vertically connected to the dislocation portion, and the second positioning portion is vertically connected to the dislocation portion; in a width direction perpendicular to the first direction, a width of the first positioning portion is 95% to 25% of a width of the offset portion, and a width of the second positioning portion is 95% to 25% of the width of the offset portion;
an upper contact section extending from the first positioning portion along the first direction; and
the deformation section, the lower positioning section and the lower contact section are formed by sequentially extending from the second positioning part along the second direction;
the upper positioning sections of the rectangular probes are respectively positioned in the upper guide plate unit, the lower positioning sections of the rectangular probes are respectively positioned in the lower guide plate, and the deformation sections of the rectangular probes are positioned between the second guide plate and the lower guide plate;
when the first guide plate is displaced in the width direction relative to the second guide plate, the first guide plate and the second guide plate respectively abut against the first positioning portion and the second positioning portion of each rectangular probe in opposite directions, and the offset portion of each rectangular probe is located between the first guide plate and the second guide plate.
2. The probe card apparatus of claim 1, wherein in each of the rectangular probes, the central axis of the first positioning portion and the central axis of the second positioning portion are separated by a misalignment distance, and the misalignment distance is between 3 micrometers and 280 micrometers.
3. The probe card apparatus of claim 1, wherein in each of the rectangular probes, the offset portion and the first positioning portion form a first corner together, and the offset portion and the second positioning portion form a second corner together; when the first guide plate is displaced along the width direction relative to the second guide plate, the first guide plate abuts against the first corner, and the second guide plate abuts against the second corner.
4. The probe card apparatus of claim 1, wherein in each of the rectangular probes, the upper contact section has a straight bar shape, and an area of any cross section of the upper contact section perpendicular to the first direction is not greater than an area of any cross section of the first positioning portion perpendicular to the first direction.
5. The probe card apparatus according to claim 1, wherein when the upper guide plate unit is shifted relative to the lower guide plate in an oblique direction perpendicular to the second direction, the upper guide plate unit and the lower guide plate press the upper positioning section and the lower positioning section of each of the rectangular probes so that the deformation section of each of the rectangular probes is forced to be bent and deformed.
6. The probe card apparatus of claim 1, wherein the probe card apparatus comprises an adapter plate, the adapter plate is abutted and fixed to the upper contact sections of the rectangular probes, and the lower contact sections of the rectangular probes are elastically and detachably abutted against an object to be tested.
7. The probe card apparatus according to claim 1, wherein the upper guide plate unit comprises a support plate clamped between the first guide plate and the second guide plate, and an accommodating space is formed at an inner edge of the support plate, and a plurality of the offset portions are spaced apart from each other and located in the accommodating space; the probe card device comprises a partition plate clamped between the second guide plate and the lower guide plate, a containing hole is formed in the inner edge of the partition plate, and the deformation sections are positioned in the containing hole of the partition plate at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810347589.0A CN110389243B (en) | 2018-04-18 | 2018-04-18 | Probe card device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810347589.0A CN110389243B (en) | 2018-04-18 | 2018-04-18 | Probe card device |
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| Publication Number | Publication Date |
|---|---|
| CN110389243A CN110389243A (en) | 2019-10-29 |
| CN110389243B true CN110389243B (en) | 2022-05-06 |
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| CN201810347589.0A Active CN110389243B (en) | 2018-04-18 | 2018-04-18 | Probe card device |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376413B (en) * | 2020-03-10 | 2023-12-19 | 台湾中华精测科技股份有限公司 | Vertical probe head and double-arm probe thereof |
| CN113625019B (en) * | 2020-05-08 | 2023-12-05 | 台湾中华精测科技股份有限公司 | Vertical testing device and sheet-shaped probe thereof |
| CN114414862B (en) * | 2020-11-28 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | Viscous adsorption method for test probe cleaning method |
| CN114252665B (en) * | 2021-11-19 | 2022-12-13 | 深圳市顺天祥电子有限公司 | Test probe module for miniature connector of circuit board |
| CN117890770B (en) * | 2024-03-15 | 2024-05-10 | 苏州微飞半导体有限公司 | Multi-arm dislocation type probe and testing device |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1121644A (en) * | 1994-07-12 | 1996-05-01 | 现代电子产业株式会社 | Probe card |
| CN1159001A (en) * | 1996-02-13 | 1997-09-10 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
| US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
| US6529021B1 (en) * | 2000-04-25 | 2003-03-04 | International Business Machines Corporation | Self-scrub buckling beam probe |
| JP2004235591A (en) * | 2003-02-03 | 2004-08-19 | Micronics Japan Co Ltd | Electric connection device |
| EP1720020A2 (en) * | 2001-01-29 | 2006-11-08 | Sumitomo Electric Industries, Ltd. | Contact probe and test apparatus and test method |
| CN203894282U (en) * | 2014-01-13 | 2014-10-22 | 诺亚电子股份有限公司 | Signal switching structure of probe type detection device |
| CN104204818A (en) * | 2012-03-23 | 2014-12-10 | 爱德万测试公司 | Laterally driven probes for semiconductor testing |
| CN104297535A (en) * | 2013-07-16 | 2015-01-21 | 日置电机株式会社 | Probe unit and substrate inspection device |
| CN205263143U (en) * | 2015-12-29 | 2016-05-25 | 苏州韬盛电子科技有限公司 | A grip block for probe |
| CN107783024A (en) * | 2016-08-24 | 2018-03-09 | 中华精测科技股份有限公司 | Probe apparatus of vertical probe card |
| TWM557828U (en) * | 2017-11-01 | 2018-04-01 | Chunghwa Precision Test Tech Co Ltd | Probe card device, signal transmission module and rectangular probe |
| TWI620938B (en) * | 2017-07-21 | 2018-04-11 | 中華精測科技股份有限公司 | Probe device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1853930A1 (en) * | 2005-02-24 | 2007-11-14 | SV Probe Pte Ltd. | Probes for a wafer test apparatus |
| KR200411355Y1 (en) * | 2005-12-26 | 2006-03-15 | 송광석 | Probe card for semiconductor test |
| KR100850274B1 (en) * | 2007-01-04 | 2008-08-04 | 삼성전자주식회사 | probe card for semiconductor chip test and semiconductor chip test method thereof |
-
2018
- 2018-04-18 CN CN201810347589.0A patent/CN110389243B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1121644A (en) * | 1994-07-12 | 1996-05-01 | 现代电子产业株式会社 | Probe card |
| CN1159001A (en) * | 1996-02-13 | 1997-09-10 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
| US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
| US6529021B1 (en) * | 2000-04-25 | 2003-03-04 | International Business Machines Corporation | Self-scrub buckling beam probe |
| EP1720020A2 (en) * | 2001-01-29 | 2006-11-08 | Sumitomo Electric Industries, Ltd. | Contact probe and test apparatus and test method |
| JP2004235591A (en) * | 2003-02-03 | 2004-08-19 | Micronics Japan Co Ltd | Electric connection device |
| CN104204818A (en) * | 2012-03-23 | 2014-12-10 | 爱德万测试公司 | Laterally driven probes for semiconductor testing |
| CN104297535A (en) * | 2013-07-16 | 2015-01-21 | 日置电机株式会社 | Probe unit and substrate inspection device |
| CN203894282U (en) * | 2014-01-13 | 2014-10-22 | 诺亚电子股份有限公司 | Signal switching structure of probe type detection device |
| CN205263143U (en) * | 2015-12-29 | 2016-05-25 | 苏州韬盛电子科技有限公司 | A grip block for probe |
| CN107783024A (en) * | 2016-08-24 | 2018-03-09 | 中华精测科技股份有限公司 | Probe apparatus of vertical probe card |
| TWI620938B (en) * | 2017-07-21 | 2018-04-11 | 中華精測科技股份有限公司 | Probe device |
| TWM557828U (en) * | 2017-11-01 | 2018-04-01 | Chunghwa Precision Test Tech Co Ltd | Probe card device, signal transmission module and rectangular probe |
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| CN110389243A (en) | 2019-10-29 |
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