CN110373117A - 一种嵌入式计算机电路板封装材料 - Google Patents

一种嵌入式计算机电路板封装材料 Download PDF

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CN110373117A
CN110373117A CN201910586575.9A CN201910586575A CN110373117A CN 110373117 A CN110373117 A CN 110373117A CN 201910586575 A CN201910586575 A CN 201910586575A CN 110373117 A CN110373117 A CN 110373117A
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circuit board
embedded computer
computer circuit
mold
package material
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张呈宇
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Chongqing College of Finance and Economics
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Chongqing College of Finance and Economics
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

本发明公开了一种嵌入式计算机电路板封装材料，由固体聚硫橡胶、聚氨酯压敏胶、硅砂、碳酸二甲酯、玻璃粉、环氧树脂、乙酸乙烯酯、聚氧乙烯胺、聚苯乙烯、二甲基乙醇胺、聚乙酸乙烯酯、聚乙烯蜡制成。按比例将各组分进行混合，装入容器中加热至130‑140度融化，将待封装的电路板放置于模具中，将融化后的物料填充模具，将电路板包覆于内，待冷却定型后即完成封装。与现有技术相比，本发明组分的材料将计算机电路板封装，使电路板不再受灰尘的影响，此外，封装材料具有屏蔽性能，防止电磁波干扰，且具有绝缘导热性能，利于电路板散热，保证计算机能够长时间运行，具有推广应用的价值。

Description

一种嵌入式计算机电路板封装材料
技术领域
本发明涉及一种计算机硬件领域，尤其涉及一种嵌入式计算机电路板封装材料。
背景技术
计算机由多个电路板组成，电路板有陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，PCB板，铝基板，高频板，厚铜板，阻抗板，PCB，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等。而计算机的电路板一般裸露在外，电路板上落入灰尘、受到电磁波干扰等情况，会影响电路板的正常工作，影响计算机的运行效率，因此，存在改进空间。
发明内容
本发明的目的就在于为了解决上述问题而提供一种嵌入式计算机电路板封装材料。
本发明通过以下技术方案来实现上述目的：
本发明由固体聚硫橡胶、聚氨酯压敏胶、硅砂、碳酸二甲酯、玻璃粉、环氧树脂、乙酸乙烯酯、聚氧乙烯胺、聚苯乙烯、二甲基乙醇胺、聚乙酸乙烯酯、聚乙烯蜡制成。
优选的，按重量比，每份含所述固体聚硫橡胶25％、所述聚氨酯压敏胶8％、所述硅砂12％、所述碳酸二甲酯12％、所述玻璃粉18％、所述环氧树脂7％、所述乙酸乙烯酯6％、所述聚氧乙烯胺3％、所述聚苯乙烯1％、所述二甲基乙醇胺1％、所述聚乙酸乙烯酯2％、所述聚乙烯蜡5％。
具体的，封装方法为：按比例将各组分进行混合，装入容器中加热至130-140度融化，将待封装的电路板放置于模具中，将融化后的物料填充模具，将电路板包覆于内，待冷却定型后即完成封装。
本发明的有益效果在于：
本发明是一种嵌入式计算机电路板封装材料，与现有技术相比，本发明组分的材料将计算机电路板封装，使电路板不再受灰尘的影响，此外，封装材料具有屏蔽性能，防止电磁波干扰，且具有绝缘导热性能，利于电路板散热，保证计算机能够长时间运行，具有推广应用的价值。
具体实施方式
下面对本发明作进一步说明：
本发明由固体聚硫橡胶、聚氨酯压敏胶、硅砂、碳酸二甲酯、玻璃粉、环氧树脂、乙酸乙烯酯、聚氧乙烯胺、聚苯乙烯、二甲基乙醇胺、聚乙酸乙烯酯、聚乙烯蜡制成。
优选的，按重量比，每份含所述固体聚硫橡胶25％、所述聚氨酯压敏胶8％、所述硅砂12％、所述碳酸二甲酯12％、所述玻璃粉18％、所述环氧树脂7％、所述乙酸乙烯酯6％、所述聚氧乙烯胺3％、所述聚苯乙烯1％、所述二甲基乙醇胺1％、所述聚乙酸乙烯酯2％、所述聚乙烯蜡5％。
具体的，封装方法为：按比例将各组分进行混合，装入容器中加热至130-140度融化，将待封装的电路板放置于模具中，将融化后的物料填充模具，将电路板包覆于内，待冷却定型后即完成封装。
以上显示和描述了本发明的基本原理和主要特征及本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (3)

1.一种嵌入式计算机电路板封装材料，其特征在于：由固体聚硫橡胶、聚氨酯压敏胶、硅砂、碳酸二甲酯、玻璃粉、环氧树脂、乙酸乙烯酯、聚氧乙烯胺、聚苯乙烯、二甲基乙醇胺、聚乙酸乙烯酯、聚乙烯蜡制成。
2.根据权利要求1所述的嵌入式计算机电路板封装材料，其特征在于：按重量比，每份含所述固体聚硫橡胶25％、所述聚氨酯压敏胶8％、所述硅砂12％、所述碳酸二甲酯12％、所述玻璃粉18％、所述环氧树脂7％、所述乙酸乙烯酯6％、所述聚氧乙烯胺3％、所述聚苯乙烯1％、所述二甲基乙醇胺1％、所述聚乙酸乙烯酯2％、所述聚乙烯蜡5％。
3.根据权利要求2所述的嵌入式计算机电路板封装材料，其特征在于：封装方法为：按比例将各组分进行混合，装入容器中加热至130-140度融化，将待封装的电路板放置于模具中，将融化后的物料填充模具，将电路板包覆于内，待冷却定型后即完成封装。
CN201910586575.9A 2019-07-01 2019-07-01 一种嵌入式计算机电路板封装材料 Pending CN110373117A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110776807A (zh) * 2019-10-31 2020-02-11 陕西理工大学 一种计算机电路板保护剂

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GB1298982A (en) * 1970-03-03 1972-12-06 Rte Corp Encapsulated electrical apparatus
CN104152741A (zh) * 2014-08-12 2014-11-19 铜陵国鑫光源技术开发有限公司 一种含有玻璃粉的led封装材料及其制备方法
US9545043B1 (en) * 2010-09-28 2017-01-10 Rockwell Collins, Inc. Shielding encapsulation for electrical circuitry
CN107358991A (zh) * 2017-07-05 2017-11-17 东莞珂洛赫慕电子材料科技有限公司 一种用于铝合金基板厚膜电路的介质浆料及其制备工艺
CN108219555A (zh) * 2018-01-16 2018-06-29 商洛学院 一种计算机电路板防尘膜制备方法
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GB1298982A (en) * 1970-03-03 1972-12-06 Rte Corp Encapsulated electrical apparatus
US9545043B1 (en) * 2010-09-28 2017-01-10 Rockwell Collins, Inc. Shielding encapsulation for electrical circuitry
CN104152741A (zh) * 2014-08-12 2014-11-19 铜陵国鑫光源技术开发有限公司 一种含有玻璃粉的led封装材料及其制备方法
CN107358991A (zh) * 2017-07-05 2017-11-17 东莞珂洛赫慕电子材料科技有限公司 一种用于铝合金基板厚膜电路的介质浆料及其制备工艺
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