CN110351976A - 套筒式热传导结构 - Google Patents

套筒式热传导结构 Download PDF

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CN110351976A
CN110351976A CN201910074847.7A CN201910074847A CN110351976A CN 110351976 A CN110351976 A CN 110351976A CN 201910074847 A CN201910074847 A CN 201910074847A CN 110351976 A CN110351976 A CN 110351976A
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sleeve
heat pipe
transmission element
conduction structure
thermal transmission
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CN110351976B (zh
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廖邦宏
江文雄
曾国峰
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Nidec Chaun Choung Technology Corp
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Chaun Choung Technology Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Joints Allowing Movement (AREA)

Abstract

本发明公开一种套筒式热传导结构，包括一热传元件、一套筒以及一热管；热传元件具有一工作部与一套接部，且套接部内设有一配合孔，以供套筒固设于配合孔内，而热管的一端活动设置于套筒内，并使热管的另一端突出于套筒外；其中，热管套入套筒内的一端能沿着套筒轴向于套筒内滑动，且热管能依套筒而与热传元件作相对转动。本发明使各式热传元件在与热管的配合上能更加灵活。

Description

套筒式热传导结构
技术领域
本发明涉及一种热传元件，尤指一种套筒式热传导结构。
背景技术
按，由于热管(Heat Pipe)具有高热传能力、重量轻及结构简单等特性，并可传递大量的热量又不消耗电力，故现今已被广泛地应用于各式3C产品上作为散热的必备元件之一。另外，通过上述热管与均温板(Vapor Chamber)或平板热管(Plate Heat Pipe)的结合，也是目前现有技术中用于散热上的常见技术手段。
然而，现有技术中，为了配合不同的3C产品，热管或均温板、平板热管在实际应用上，往往也需视情况经过弯制、或延伸其长度等，因此在生产化必须客制化，也因此容易造成料件间不通用而有库存等问题。
有鉴于此，本发明为改善并解决上述的缺失，乃特潜心研究并配合学理的运用，终于提出一种设计合理且有效改善上述缺失的本发明。
发明内容
本发明的主要目的，在于可提供一种套筒式热传导结构，其采活动设置方式，使各式热传元件在与热管的配合上能更加灵活，进而能应用于更多不同需求的场合上，以降低料件库存等问题。
为了达成上述的目的，本发明提供一种套筒式热传导结构，包括一热传元件、一套筒以及一热管；热传元件具有一工作部与一套接部，且套接部内设有一配合孔，以供套筒固设于配合孔内，而热管的一端活动设置于套筒内，并使热管的另一端突出于套筒外；其中，热管套入套筒内的一端能沿着套筒轴向于套筒内滑动，且热管能依套筒而与热传元件作相对转动。
其中，该热传元件为热管、均温板或平板热管。
其中，该热传元件为一热管，且该热传元件一端为所述工作部、另一端为所述套接部。
其中，该工作部呈一扁平状、一弯曲状或所述扁平状与所述弯曲状的组合。
其中，该配合孔由该套接部端面向内凹入而形成。
其中，该套筒为铜、铝合金或不锈钢的金属材质制成。
其中，该套筒为热管、均温板或平板热管腔体结构内的一部分。
其中，该套筒与该热管间涂布有导热膏。
其中，该热传元件具有多个所述套筒以及多个分别相互配合于该套筒内的所述热管。
以下结合附图和具体实施例对本发明进行详细描述，但不作为对本发明的限定。
附图说明
图1为本发明的立体分解示意图。
图2为本发明的立体组合示意图。
图3为本发明的局部剖面示意图。
图4为本发明另一实施例的立体分解示意图。
其中，附图标记：
1 热传元件
10 工作部
11 套接部
110 配合孔
2 套筒
3 热管
具体实施方式
为了使本领域技术人员能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所附图式仅提供参考与说明用，并非用来对本发明加以限制。
请参阅图1及图2，分别为本发明的立体分解示意图及立体组合示意图。本发明提供一种套筒式热传导结构，包括一热传元件1、一套筒2、以及一热管3；其中：
该热传元件1可为一内部能产生相变化的热管(Heat Pipe)、均温板(VaporChamber)、或平板热管(Plate Heat Pipe)。其主要由铜或不锈钢等金属材质制成，并具有一工作部10与一套接部11；而在本实施例中，所述热传元件1为一热管，并为一长条管状体，且该热传元件1呈管状的一端为前述工作部10、另一端为前述套接部11，所述工作部10可呈一扁平状而便于贴接在如电子发热元件等热源(图略)上，当然亦可视实际需求而呈弯曲状、或前述扁平状与弯曲状二者的组合等，且所述工作部10内呈真空而封存有工作流体(图略)，并于内壁上贴附有毛细组织(图略)，以使所述工作部10内部能产生相变化而提供热传效果。
请一并参阅图3所示，本发明主要于上述热传元件1上设有一所述套接部11，该套接部11可沿着工作部10轴向延伸而一体成型，并于该套接部11端面向内凹设有一沿其轴向延伸的配合孔110，所述配合孔110即用以供上述套筒2固设于内后，再供上述热管3的任一端活动设置于该套筒2内，所谓活动设置指热管3的任一端套入该套筒2内后，能沿着轴向于该套筒2内滑动而调整热管3突出于套筒2外的部位长度，同时，热管3也能依该套筒2而与该热传元件1作相对的转动。此外，该套筒2可为铜、铝合金或不锈钢等金属材质制成，其可为热管、均温板或平板热管腔体结构内的一部分，而该套筒2与热管3间亦可涂布有导热膏(图略)作为润滑与增加彼此间导热性。
再者，如图4所示，为本发明另一实施例的立体分解示意图。其中，所述热传元件1为一均温板或平板热管，并通过上述套筒2而与热管3活动设置，使得热管2也能灵活地与均温板或平板热管相结合，进而达到可适应不同场合而灵活可变的广泛应用。此外，该热传元件1上亦可设有一以上的所述套筒2、以及多个分别相互配合于所述套筒2内的热管3。
是以，借由上述的构造组成，即可得到本发明套筒式热传导结构。
因此，借由本发明套筒式热传导结构，由于是通过所述套筒2将热管3与热传元件1以活动设置方式相结合，如此不仅可维持热管2、热传元件1为了薄化而使其壁厚较薄、不需为了增设结合结构而加厚等外，同时通过套筒2也能替换所需规格的热管2，大大增加了热传元件在应用场合上的灵活性，借以降低料件库存等问题。
惟以上所述仅为本发明的较佳可行实施例，非因此即拘限本发明的专利范围。当然，本发明还可有其它多种实施例，在不背离本发明精神及其实质的情况下，熟悉本领域的技术人员可根据本发明作出各种相应的改变和变形，但这些相应的改变和变形都应属于本发明权利要求的保护范围。

Claims (9)

1.一种套筒式热传导结构，其特征在于，包括：
一热传元件，具有一工作部与一套接部，且该套接部内设有一配合孔；
一套筒，固设于该配合孔内；以及
一热管，该热管的一端活动设置于该套筒内，并使该热管的另一端突出于该套筒外；
其中，该热管套入该套筒内的该端能沿着该套筒轴向于该套筒内滑动，且该热管能依该套筒而与该热传元件作相对转动。
2.根据权利要求1所述的套筒式热传导结构，其特征在于，该热传元件为热管、均温板或平板热管。
3.根据权利要求1所述的套筒式热传导结构，其特征在于，该热传元件为一热管，且该热传元件一端为所述工作部、另一端为所述套接部。
4.根据权利要求3所述的套筒式热传导结构，其特征在于，该工作部呈一扁平状、一弯曲状或所述扁平状与所述弯曲状的组合。
5.根据权利要求3所述的套筒式热传导结构，其特征在于，该配合孔由该套接部端面向内凹入而形成。
6.根据权利要求1所述的套筒式热传导结构，其特征在于，该套筒为铜、铝合金或不锈钢的金属材质制成。
7.根据权利要求1所述的套筒式热传导结构，其特征在于，该套筒为热管、均温板或平板热管腔体结构内的一部分。
8.根据权利要求1所述的套筒式热传导结构，其特征在于，该套筒与该热管间涂布有导热膏。
9.根据权利要求1所述的套筒式热传导结构，其特征在于，该热传元件具有多个所述套筒以及多个分别相互配合于该套筒内的所述热管。
CN201910074847.7A 2018-04-03 2019-01-25 套筒式热传导结构 Active CN110351976B (zh)

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CN113357944B (zh) * 2020-03-04 2023-04-18 英业达科技有限公司 热管结构

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CN110351976B (zh) 2020-10-23
US20190301813A1 (en) 2019-10-03
TW201942533A (zh) 2019-11-01

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