US20190301813A1 - Sleeve-type heat conducting structure - Google Patents

Sleeve-type heat conducting structure Download PDF

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Publication number
US20190301813A1
US20190301813A1 US16/354,788 US201916354788A US2019301813A1 US 20190301813 A1 US20190301813 A1 US 20190301813A1 US 201916354788 A US201916354788 A US 201916354788A US 2019301813 A1 US2019301813 A1 US 2019301813A1
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US
United States
Prior art keywords
sleeve
heat conducting
heat pipe
heat
conducting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/354,788
Inventor
Pang-Hung Liao
Kuo-Feng Tseng
Wen-Hsiung JIANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chaun Choung Technology Corp
Original Assignee
Chaun Choung Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Assigned to CHAUN-CHOUNG TECHNOLOGY CORP. reassignment CHAUN-CHOUNG TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JIANG, WEN-HSIUNG, LIAO, PANG-HUNG, TSENG, KUO-FENG
Publication of US20190301813A1 publication Critical patent/US20190301813A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent

Definitions

  • the present invention relates to a heat conducting device, in particular, to a sleeve-type heat conducting structure.
  • the heat pipe having the characteristics of high heat conducting capability, light weight, and simple structure can conduct enormous heat without electric power and thus is commonly used in various 3C products as a necessary heat-dissipating device.
  • the combination of the above-mentioned heat pipe and the vapor chamber (or the plate heat pipe) is a currently popular technique for heat dissipation.
  • the heat pipe, the vapor chamber, or the plate heat pipe usually has to be properly bent or extended in length to fit various 3C products.
  • the manufacturing process requires customization, which leads to a situation that the parts are not interchangeable and then an excessive inventory.
  • the main objective of the present invention is to provide a sleeve-type heat conducting structure which uses the design of movable disposition to make the coupling between various heat conducting devices and the heat pipe more flexible, further applicable to different demands to reduce the inventory of parts.
  • the present invention provides a sleeve-type heat conducting structure which comprises a heat conducting device, a sleeve, and a heat pipe.
  • the heat conducting device has a working portion and a sleeve-connecting portion; a fitting hole is disposed in the sleeve-connecting portion such that the sleeve is fastened in the fitting hole.
  • the heat pipe has an end disposed movably in the sleeve and the other end exposed out of the sleeve in which the end of the heat pipe sleeved into the sleeve can slide axially in the sleeve and the heat pipe can rotate with respect to the heat conducting device through the sleeve.
  • FIG. 1 is a perspective exploded view of the sleeve-type heat conducting structure of the present invention
  • FIG. 2 is a perspective assembled view of the sleeve-type heat conducting structure of the present invention
  • FIG. 3 is a local cross-sectional view of the sleeve-type heat conducting structure of the present invention.
  • FIG. 4 is a perspective exploded view of the sleeve-type heat conducting structure according to another embodiment of the present invention.
  • FIGS. 1 and 2 are the perspective exploded view and the perspective assembled view of the sleeve-type heat conducting structure of the present invention, respectively.
  • the present invention provides a sleeve-type heat conducting structure which comprises a heat conducting device 1 , a sleeve 2 , and a heat pipe 3 .
  • the heat conducting device 1 may be a heat pipe, a vapor chamber, or a plate heat pipe in which two-phase phenomenon can occur.
  • the heat conducting device 1 is mainly made of copper or stainless steel and has a working portion 10 and a sleeve-connecting portion 11 .
  • the heat conducting device 1 is a heat pipe and has a long tube shape.
  • One end of the heat conducting device 1 with a tube shape is the above-mentioned working portion 10 ; the other end is the above-mentioned sleeve-connecting portion 11 .
  • the working portion 10 may has a plate shape to be easily attached to the heat source such as the electronic heat-generating device (not shown).
  • the working portion 10 also may have a curved shape or a combination of the plate shape and the curved shape according to the practical requirements.
  • a vacuum is created inside the working portion 10 in which a working fluid (not shown) is sealed.
  • the wick structure (not shown) is disposed on the internal wall of the working portion 10 to have the heat conducting effect through phase change inside the working portion 1 .
  • the above-mentioned heat conducting device 1 in the present invention is provided with a sleeve-connecting portion 11 .
  • the sleeve-connecting portion 11 is formed integrally, extending axially along the working portion 10 .
  • the end surface of the sleeve-connecting portion 11 is recessed inward to form the fitting hole 110 which extends axially along the sleeve-connecting portion 11 .
  • the fitting hole 110 is used for the sleeve 2 to be fastened therein and for either end of the heat pipe 3 to be disposed movably in the sleeve 2 .
  • the so-called “disposed movably” means the heat pipe 3 can slide axially inside the sleeve 2 to adjust the length of the heat pipe 3 protruding out of the sleeve 2 after either end of the heat pipe 3 is sleeved into the sleeve 2 . Meanwhile, the heat pipe 3 can rotate with respect to the heat conducting device 1 through the sleeve 2 .
  • the sleeve 2 may be made of copper, aluminum alloy, or stainless steel; the sleeve 2 may be part of a chamber structure of the heat pipe, the vapor chamber, or the plate heat pipe. Thermal grease (not shown) may be applied between the sleeve 2 and the heat pipe 3 for lubrication and enhanced heat dissipation.
  • FIG. 4 illustrates a perspective exploded view of the sleeve-type heat conducting structure according to another embodiment of the present invention.
  • the heat conducting device 1 is a vapor chamber or a plate heat pipe, which is movably coupled with the heat pipe 3 through the sleeve 2 such that the heat pipe 3 can flexibly be attached to the vapor chamber of the plate heat pipe.
  • the present invention is proper for various circumstances and for flexible comprehensive applications.
  • the heat conducting device 1 may have a plurality of sleeves 2 and a plurality of heat pipes 3 in which the sleeves 2 individually match the heat pipes 3 correspondingly.
  • the sleeve-type heat conducting structure of the present invention can be obtained through the combination of the above-mentioned structures.
  • the wall thickness of the heat pipe 3 and the heat conducting device 1 can remain thin without an additional combined structure having a thicker wall.
  • the heat pipe 3 of required specifications can be replaced through the sleeve 2 , which improves the flexibility in the application of the heat conducting device to reduce the inventory of parts.
  • the present invention can achieve the expected objective and overcome the disadvantages of the prior art. Also, it is indeed novel, useful, and non-obvious to be patentable. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Joints Allowing Movement (AREA)

Abstract

A sleeve-type heat conducting structure includes a heat conducting device (1), a sleeve (2), and a heat pipe (3). The heat conducting device (1) has a working portion (10) and a sleeve-connecting portion (11); a fitting hole (110) is disposed in the sleeve-connecting portion (11) such that the sleeve (2) is fastened in the fitting hole (110). The heat pipe (3) has an end disposed movably in the sleeve (2) and the other end exposed out of the sleeve (2) in which the end of the heat pipe (3) sleeved into the sleeve (2) can slide axially in the sleeve (2) and the heat pipe (3) can rotate with respect to the heat conducting device (1) through the sleeve (2).

Description

    BACKGROUND OF THE INVENTION Field of the Invention
  • The present invention relates to a heat conducting device, in particular, to a sleeve-type heat conducting structure.
    • Description of Related Art
  • The heat pipe having the characteristics of high heat conducting capability, light weight, and simple structure can conduct enormous heat without electric power and thus is commonly used in various 3C products as a necessary heat-dissipating device. In addition, the combination of the above-mentioned heat pipe and the vapor chamber (or the plate heat pipe) is a currently popular technique for heat dissipation.
  • In practical application using the current techniques, however, the heat pipe, the vapor chamber, or the plate heat pipe usually has to be properly bent or extended in length to fit various 3C products. Thus, the manufacturing process requires customization, which leads to a situation that the parts are not interchangeable and then an excessive inventory.
  • In view of this, the inventor pays special attention to research with the application of related theory and tries to overcome the above disadvantages regarding the above related art. Finally, the inventor proposes the invention which is a reasonable design and overcomes the above disadvantages.
    • SUMMARY OF THE INVENTION
  • The main objective of the present invention is to provide a sleeve-type heat conducting structure which uses the design of movable disposition to make the coupling between various heat conducting devices and the heat pipe more flexible, further applicable to different demands to reduce the inventory of parts.
  • To achieve the above objective, the present invention provides a sleeve-type heat conducting structure which comprises a heat conducting device, a sleeve, and a heat pipe. The heat conducting device has a working portion and a sleeve-connecting portion; a fitting hole is disposed in the sleeve-connecting portion such that the sleeve is fastened in the fitting hole. The heat pipe has an end disposed movably in the sleeve and the other end exposed out of the sleeve in which the end of the heat pipe sleeved into the sleeve can slide axially in the sleeve and the heat pipe can rotate with respect to the heat conducting device through the sleeve.
    • BRIEF DESCRIPTION OF DRAWING
  • FIG. 1 is a perspective exploded view of the sleeve-type heat conducting structure of the present invention;
  • FIG. 2 is a perspective assembled view of the sleeve-type heat conducting structure of the present invention;
  • FIG. 3 is a local cross-sectional view of the sleeve-type heat conducting structure of the present invention; and
  • FIG. 4 is a perspective exploded view of the sleeve-type heat conducting structure according to another embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • As for the characteristics and technical details of the present invention, please refer to the following detailed description and accompanying figures. However, the accompanying figures are only for reference and explanation, but not to limit the scope of the present invention. Please refer to FIGS. 1 and 2, which are the perspective exploded view and the perspective assembled view of the sleeve-type heat conducting structure of the present invention, respectively. The present invention provides a sleeve-type heat conducting structure which comprises a heat conducting device 1, a sleeve 2, and a heat pipe 3.
  • The heat conducting device 1 may be a heat pipe, a vapor chamber, or a plate heat pipe in which two-phase phenomenon can occur. The heat conducting device 1 is mainly made of copper or stainless steel and has a working portion 10 and a sleeve-connecting portion 11. In the current embodiment, the heat conducting device 1 is a heat pipe and has a long tube shape. One end of the heat conducting device 1 with a tube shape is the above-mentioned working portion 10; the other end is the above-mentioned sleeve-connecting portion 11. The working portion 10 may has a plate shape to be easily attached to the heat source such as the electronic heat-generating device (not shown). The working portion 10 also may have a curved shape or a combination of the plate shape and the curved shape according to the practical requirements. In addition, a vacuum is created inside the working portion 10 in which a working fluid (not shown) is sealed. The wick structure (not shown) is disposed on the internal wall of the working portion 10 to have the heat conducting effect through phase change inside the working portion 1.
  • Please refer to FIGS. 1-3. The above-mentioned heat conducting device 1 in the present invention is provided with a sleeve-connecting portion 11. The sleeve-connecting portion 11 is formed integrally, extending axially along the working portion 10. The end surface of the sleeve-connecting portion 11 is recessed inward to form the fitting hole 110 which extends axially along the sleeve-connecting portion 11. The fitting hole 110 is used for the sleeve 2 to be fastened therein and for either end of the heat pipe 3 to be disposed movably in the sleeve 2. The so-called “disposed movably” means the heat pipe 3 can slide axially inside the sleeve 2 to adjust the length of the heat pipe 3 protruding out of the sleeve 2 after either end of the heat pipe 3 is sleeved into the sleeve 2. Meanwhile, the heat pipe 3 can rotate with respect to the heat conducting device 1 through the sleeve 2. Moreover, the sleeve 2 may be made of copper, aluminum alloy, or stainless steel; the sleeve 2 may be part of a chamber structure of the heat pipe, the vapor chamber, or the plate heat pipe. Thermal grease (not shown) may be applied between the sleeve 2 and the heat pipe 3 for lubrication and enhanced heat dissipation.
  • Furthermore, FIG. 4 illustrates a perspective exploded view of the sleeve-type heat conducting structure according to another embodiment of the present invention. In the current embodiment, the heat conducting device 1 is a vapor chamber or a plate heat pipe, which is movably coupled with the heat pipe 3 through the sleeve 2 such that the heat pipe 3 can flexibly be attached to the vapor chamber of the plate heat pipe. Thus, the present invention is proper for various circumstances and for flexible comprehensive applications. Besides, the heat conducting device 1 may have a plurality of sleeves 2 and a plurality of heat pipes 3 in which the sleeves 2 individually match the heat pipes 3 correspondingly.
  • As a result, the sleeve-type heat conducting structure of the present invention can be obtained through the combination of the above-mentioned structures.
  • Therefore, by means of the sleeve-type heat conducting structure of the present invention in which the heat pipe 3 is combined to the heat conducting device 1 with the design of movable disposition through the sleeve 2, the wall thickness of the heat pipe 3 and the heat conducting device 1 can remain thin without an additional combined structure having a thicker wall. Also, the heat pipe 3 of required specifications can be replaced through the sleeve 2, which improves the flexibility in the application of the heat conducting device to reduce the inventory of parts.
  • In summary, the present invention can achieve the expected objective and overcome the disadvantages of the prior art. Also, it is indeed novel, useful, and non-obvious to be patentable. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
  • However, the embodiments described above are only preferred ones of the present invention and not to limit the claimed scope of the present invention. All the equivalent modifications and variations applying the specification and figures of the present invention should be embraced by the claimed scope of the present invention.

Claims (9)

What is claimed is:
1. A sleeve-type heat conducting structure comprising:
a heat conducting device (1) having a working portion (10) and a sleeve-connecting portion (11), wherein a fitting hole (110) is disposed in the sleeve-connecting portion (11);
a sleeve (2) fastened in the fitting hole (110); and
a heat pipe (3) having an end disposed movably in the sleeve (2) and the other end exposed out of the sleeve (2), wherein the end of the heat pipe (3) sleeved into the sleeve (2) can slide axially in the sleeve (2) and the heat pipe (3) can rotate with respect to the heat conducting device (1) through the sleeve (2).
2. The sleeve-type heat conducting structure according to claim 1, wherein the heat conducting device (1) is a heat pipe, a vapor chamber, or a plate heat pipe.
3. The sleeve-type heat conducting structure according to claim 1, wherein the heat conducting device (1) is a heat pipe, wherein an end of the heat conducting device (1) is the working portion (10) and the other end of the heat conducting device (1) is the sleeve-connecting portion (11).
4. The sleeve-type heat conducting structure according to claim 3, wherein the working portion (10) has a plate shape, a curved shape, or a combination of the plate shape and the curved shape.
5. The sleeve-type heat conducting structure according to claim 3, wherein an end surface of the sleeve-connecting portion (11) is recessed inward to form the fitting hole (110).
6. The sleeve-type heat conducting structure according to claim 1, wherein the sleeve (2) is made of copper, aluminum alloy, or stainless steel.
7. The sleeve-type heat conducting structure according to claim 1, wherein the sleeve (2) is part of a chamber structure of the heat pipe, the vapor chamber, or the plate heat pipe.
8. The sleeve-type heat conducting structure according to claim 1, wherein thermal grease is applied between the sleeve (2) and the heat pipe (3).
9. The sleeve-type heat conducting structure according to claim 1, wherein the heat conducting device (1) has a plurality of sleeves (2) and a plurality of heat pipes (3), wherein the sleeves (2) individually match the heat pipes (3) correspondingly.
US16/354,788 2018-04-03 2019-03-15 Sleeve-type heat conducting structure Abandoned US20190301813A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW107111890A TWI737906B (en) 2018-04-03 2018-04-03 Heat conductive sleeve structure
TW107111890 2018-04-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131510B1 (en) * 2020-03-04 2021-09-28 Inventec (Pudong) Technology Corporation Heat pipe structure

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US20080142067A1 (en) * 2006-12-14 2008-06-19 Robert Dell Thermoelectric power generation device
US20090310307A1 (en) * 2008-06-16 2009-12-17 Kuo-Len Lin Integrated heat-dissipating device for portable electronic product
US20100091450A1 (en) * 2008-10-14 2010-04-15 Foxconn Technology Co., Ltd. Heat dissipating hinge for portable electronic device
US20100096993A1 (en) * 2004-11-29 2010-04-22 Ian Ashdown Integrated Modular Lighting Unit
US20120227935A1 (en) * 2011-03-11 2012-09-13 Kunshan Jue-Chung Electronics Co., Interconnected heat pipe assembly and method for manufacturing the same
US20130043004A1 (en) * 2011-08-17 2013-02-21 Chaun-Choung Technology Corp. Lightweight heat pipe and method of making the same
US20140321059A1 (en) * 2013-04-26 2014-10-30 Giga-Byte Technology Co., Ltd. Heat dissipation module with heat pipe
US20170374762A1 (en) * 2016-06-27 2017-12-28 Foxconn Technology Co., Ltd. Heat pipe assembly and electronic device

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Publication number Priority date Publication date Assignee Title
US6376211B1 (en) * 1999-07-12 2002-04-23 Xoma Technology Ltd. Agents and methods for inhibiting F1/F0 ATPase
US20100096993A1 (en) * 2004-11-29 2010-04-22 Ian Ashdown Integrated Modular Lighting Unit
US20080142067A1 (en) * 2006-12-14 2008-06-19 Robert Dell Thermoelectric power generation device
US20090310307A1 (en) * 2008-06-16 2009-12-17 Kuo-Len Lin Integrated heat-dissipating device for portable electronic product
US20100091450A1 (en) * 2008-10-14 2010-04-15 Foxconn Technology Co., Ltd. Heat dissipating hinge for portable electronic device
US20120227935A1 (en) * 2011-03-11 2012-09-13 Kunshan Jue-Chung Electronics Co., Interconnected heat pipe assembly and method for manufacturing the same
US20130043004A1 (en) * 2011-08-17 2013-02-21 Chaun-Choung Technology Corp. Lightweight heat pipe and method of making the same
US20140321059A1 (en) * 2013-04-26 2014-10-30 Giga-Byte Technology Co., Ltd. Heat dissipation module with heat pipe
US20170374762A1 (en) * 2016-06-27 2017-12-28 Foxconn Technology Co., Ltd. Heat pipe assembly and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131510B1 (en) * 2020-03-04 2021-09-28 Inventec (Pudong) Technology Corporation Heat pipe structure

Also Published As

Publication number Publication date
TW201942533A (en) 2019-11-01
CN110351976A (en) 2019-10-18
TWI737906B (en) 2021-09-01
CN110351976B (en) 2020-10-23

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