CN102413662B - The heat abstractor of portable consumer electronic device - Google Patents
The heat abstractor of portable consumer electronic device Download PDFInfo
- Publication number
- CN102413662B CN102413662B CN201010289823.2A CN201010289823A CN102413662B CN 102413662 B CN102413662 B CN 102413662B CN 201010289823 A CN201010289823 A CN 201010289823A CN 102413662 B CN102413662 B CN 102413662B
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- China
- Prior art keywords
- dissipating layer
- heat
- shell
- condensation segment
- heat dissipating
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of heat abstractor of portable consumer electronic device, comprise heat pipe and radiator, described heat pipe comprises evaporation section and condensation segment, described evaporation section is used for and a thermal source hot link, described radiator comprises shell and the porous heat dissipating layer be located in described shell and working fluid, form some holes in described porous heat dissipating layer, described working fluid is located between described hole, in the porous heat dissipating layer that the condensation segment of described heat pipe inserts described radiator and with the thermo-contact of described porous heat dissipating layer.Porous heat dissipating layer and working fluid is provided with in above-mentioned radiator, described working fluid is fled after absorbing heat between the hole of described porous heat dissipating layer, thus jointly heat is fully reached on described shell with described porous heat dissipating layer and distribute, be conducive to the radiating efficiency improving heat abstractor.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor for the electronic element radiating to portable consumer electronic device.
Background technology
Along with the fast development of electronic industry, all kinds of portable consumer electronic device is given birth to as application such as panel computer, iPad, mobile communication or hand-held devices, the high speed of the electronic component in it, high frequency and integrated its caloric value that makes increase severely, therefore, in limited space, how can take away the heat that electronic component produces in time efficiently, be the problem of industry institute general concern.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor being applicable to portable consumer electronic device.
A kind of heat abstractor of portable consumer electronic device, comprise heat pipe and radiator, described heat pipe comprises evaporation section and condensation segment, described evaporation section is used for and a thermal source hot link, described radiator comprises shell and the porous heat dissipating layer be located in described shell and working fluid, some holes are formed in described porous heat dissipating layer, described working fluid is located between described hole, in the porous heat dissipating layer that the condensation segment of described heat pipe inserts described radiator and with the thermo-contact of described porous heat dissipating layer, described porous heat dissipating layer and working fluid are surrounded on the periphery of described condensation segment, described shell is hollow cylindrical, receiving space is formed in described shell, described porous heat dissipating layer and working fluid are contained in described receiving space, described shell is provided with the opening for being in communication with the outside by described receiving space, the external diameter of the aperture of described opening and the condensation segment of described heat pipe is suitable, described condensation segment is inserted in described receiving space by described opening, and described opening is sealed.
In above-mentioned heat abstractor, porous heat dissipating layer and working fluid is provided with in described radiator, described working fluid is fled after absorbing heat between the hole of described porous heat dissipating layer, thus jointly heat is fully reached on described shell with described porous heat dissipating layer and distribute, be conducive to the radiating efficiency improving heat abstractor.In addition, owing to being provided with hole in described porous heat dissipating layer, make porous heat dissipating layer be easy to adjustment size and shape, there is stronger space adaptability.Moreover, when size or the change of shape of described porous heat dissipating layer, described working fluid can fill in time this porous heat dissipating layer because of sized by or the change of shape and the hole changed, thus guarantee timely and effectively heat to be distributed, can further improve the radiating efficiency of heat abstractor.
Accompanying drawing explanation
Fig. 1 is the three-dimensional assembly diagram of the heat abstractor of the portable consumer electronic device of first embodiment of the invention.
Fig. 2 is the three-dimensional exploded view of heat abstractor shown in Fig. 1.
Fig. 3 is for heat abstractor shown in Fig. 1 is along the generalized section of III-III line.
Fig. 4 is the three-dimensional assembly diagram of the heat abstractor of the portable consumer electronic device of second embodiment of the invention.
Fig. 5 is the three-dimensional exploded view of heat abstractor shown in Fig. 4.
Fig. 6 is for heat abstractor shown in Fig. 4 is along the generalized section of VI-VI line.
Main element symbol description
Thermal source 10
Radiator 20,20a
Shell 21,21a
Receiving space 211
Opening 212
Porous heat dissipating layer 22
Hole 221
Heat pipe 30,30a
Capillary structure 301
Evaporation section 31,31a
Contact-making surface 311
Condensation segment 32,32a
Linkage section 33
Soaking plate 40a
Accepting hole 41a
Embodiment
Fig. 1 is to the heat abstractor of the portable consumer electronic device that Figure 3 shows that in first embodiment of the invention, this heat abstractor is used for dispelling the heat to thermal source 10 such as the processor etc. in this portable consumer electronic device, and this heat abstractor comprises a radiator 20 and for by this thermal source 10 and the hot linked heat pipe 30 of radiator 20.
This heat pipe 30 is passed to radiator 20 for the heat produced by this thermal source 10 and distributes, this heat pipe 30 is roughly in bending rectangular hollow tubular, be provided with the capillary structure 301 and appropriate working media (not shown) that extend longitudinally in it, this working media is the more lower boiling materials of tool such as water, wax, alcohol, methyl alcohol.The linkage section 33 that this heat pipe 30 comprises evaporation section 31, condensation segment 32 and is connected with condensation segment 32 by this evaporation section 31, this evaporation section 31 and condensation segment 32 lay respectively at the two ends of this heat pipe 30, and this linkage section 33 is between this evaporation section 31 and condensation segment 32.
This evaporation section 31 is roughly in hollow squares shape, and its bottom is provided with a square contact-making surface 311, and this contact-making surface 311 fits tightly on this thermal source 10.This linkage section 33 is in the circular tube shaped be bent upwards, and its one end is communicated with the side on this evaporation section 31 top, and the other end is communicated with this condensation segment 32.This condensation segment 32 is in straight circular tube shaped, and its one end away from this condensation segment 32 is closed, this condensation segment 32 and this radiator 20 thermo-contact.
This radiator 20 comprises a shell 21 and is located at porous heat dissipating layer in this shell 21 22 and working fluid (not shown), and this working fluid is the good material of conductivity of heat, as water, mercury etc.
This shell 21 is made up of the material that thermal conductivity is good, and as copper etc., the heat of inside can be passed to outside and distribute by it.In the present embodiment, this shell 21 is roughly in hollow round tubular, and form a receiving space 211 in it, one end of this shell 21 is provided with the opening 212 for being in communication with the outside by this receiving space 211, this opening 212 is rounded, and the external diameter of the condensation segment 32 of its aperture and this heat pipe 30 is suitable.This condensation segment 32 is inserted in this receiving space 211 by this opening 212, and is sealed by this opening 212, and certainly, this condensation segment 32 also can be welded in this opening 212 place further.
This porous heat dissipating layer 22 can be made of porous materials, and also can be formed by particle such as the accumulations such as copper powder that thermal conductivity is good.Form the hole 221 of some random arrangements in this porous heat dissipating layer 22, these holes 221 are interconnected, and this working fluid is located between these holes 221, and the size of the heat that the large I of these holes 221 is distributed as required decides.This porous heat dissipating layer 22 is all sealed in the receiving space 211 of this shell 21 with working fluid, and is surrounded on the periphery of the condensation segment 32 of this heat pipe 30, with thermo-contact abundant with this condensation segment 32.
During work, the heat that this thermal source 10 produces reaches condensation segment 32 by the evaporation section 31 of this heat pipe 30, and pass to and the porous heat dissipating layer 22 of this condensation segment 32 thermo-contact and working fluid, this working fluid absorbs after heat flees between the hole 221 of this porous heat dissipating layer 22, thus distributes with common fully to be reached on this shell 21 by the heat at this condensation segment 32 place of this porous heat dissipating layer 22.
In above-mentioned heat abstractor, be provided with porous heat dissipating layer 22 and working fluid in this radiator 20, this porous heat dissipating layer 22 by being provided with hole 221 in the inner, and is easy to adjust its size and shape, has stronger space adaptability.Moreover, when size or the change of shape of this porous heat dissipating layer 22, this working fluid can fill in time this porous heat dissipating layer 22 because of sized by or the change of shape and the hole 221 changed, thus guarantee timely and effectively the heat that this thermal source 10 produces to be distributed, be conducive to the radiating efficiency improving heat abstractor.This heat abstractor can be applicable in the portable consumer electronic device of fan-free, as panel computer, iPad, mobile communication or hand-held device etc., and the noise pollution of fan-free and the additional power without the need to supplying fan.In addition, the shell 21 of this radiator 20 is the cylindric of hollow, and it has stronger flexing and elasticity, thus makes this radiator 20 be easy to be flattened or bend, to meet the needs of system space.
Fig. 4 is to the heat abstractor that Figure 6 shows that in second embodiment of the invention, heat abstractor in this heat abstractor and the first embodiment is similar, its difference is: the shell 21a of the radiator 20a of the heat abstractor in the present embodiment is the rectangular-shaped of hollow, its one end is closed, and the other end is opening completely, this heat pipe 30a is linear rectangular hollow round tubular, it condensation segment 32a comprising an evaporation section 31a and be communicated with this evaporation section 31a, and this condensation segment 32a stretches in this radiator 20a by the open one end of this shell 21a, heat abstractor in the present embodiment also comprises a soaking plate 40a, this soaking plate 40a is also the rectangular-shaped of hollow, an accepting hole 41a (Fig. 6) is provided with in it, the external diameter of the internal diameter of this accepting hole 41a and the evaporation section 31a of this heat pipe 30a is suitable, this evaporation section 31a is contained in this accepting hole 41a, and thermo-contact abundant with this soaking plate 40a, the thickness of this soaking plate 40a is identical with the thickness of this shell 21a, this soaking plate 40a keeps out the open one end in this shell 21a, and shell 21a is closed, this soaking plate 40a fits on this thermal source 10, this heat pipe 30a is passed to for the even heat produced by this thermal source 10.
Certainly, radiator 20 in the heat abstractor of first, second embodiment above-mentioned, 20a, heat pipe 30,30a and soaking plate 40a also can be designed to other shapes as required, as platypelloid type, square shape etc., or be designed to difform combination, if radiator 20,20a are cylindric, and heat pipe 30,30a are platypelloid type.
Claims (6)
1. the heat abstractor of a portable consumer electronic device, comprise heat pipe, described heat pipe comprises evaporation section and condensation segment, described evaporation section is used for and a thermal source hot link, it is characterized in that: described heat abstractor also comprises radiator, described radiator comprises shell and the porous heat dissipating layer be located in described shell and working fluid, some holes are formed in described porous heat dissipating layer, described working fluid is located between described hole, in the porous heat dissipating layer that the condensation segment of described heat pipe inserts described radiator and with the thermo-contact of described porous heat dissipating layer, described porous heat dissipating layer and working fluid are surrounded on the periphery of described condensation segment, described shell is hollow cylindrical, receiving space is formed in described shell, described porous heat dissipating layer and working fluid are contained in described receiving space, described shell is provided with the opening for being in communication with the outside by described receiving space, the external diameter of the aperture of described opening and the condensation segment of described heat pipe is suitable, described condensation segment is inserted in described receiving space by described opening, and described opening is sealed.
2. the heat abstractor of portable consumer electronic device as claimed in claim 1, is characterized in that: described porous heat dissipating layer is made of porous materials or is formed by the particle packing of thermal conductivity.
3. the heat abstractor of portable consumer electronic device as claimed in claim 1, it is characterized in that: described heat abstractor also comprises soaking plate, the evaporation section of described heat pipe is by described soaking plate and thermal source hot link.
4. the heat abstractor of portable consumer electronic device as claimed in claim 3, it is characterized in that: described shell is replaced with one end and close and the wide-open hollow of the other end rectangular-shaped, the condensation segment of described heat pipe stretches in described radiator by the open one end of described shell, described soaking plate keeps out the open one end in described shell, and by described shell seal.
5. the heat abstractor of portable consumer electronic device as claimed in claim 3, it is characterized in that: in described soaking plate, be provided with accepting hole, the external diameter of the internal diameter of described accepting hole and the evaporation section of described heat pipe is suitable, and described evaporation section is contained in described accepting hole.
6. the heat abstractor of portable consumer electronic device as claimed in claim 1, it is characterized in that: described heat pipe also comprises the linkage section connecting described evaporation section and condensation segment, described evaporation section is that hollow is block, it is provided with the contact-making surface with thermal source thermo-contact, described linkage section is from the bending extension of described evaporation section, and described condensation segment is straight tube-like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010289823.2A CN102413662B (en) | 2010-09-24 | 2010-09-24 | The heat abstractor of portable consumer electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010289823.2A CN102413662B (en) | 2010-09-24 | 2010-09-24 | The heat abstractor of portable consumer electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102413662A CN102413662A (en) | 2012-04-11 |
| CN102413662B true CN102413662B (en) | 2015-12-16 |
Family
ID=45915405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010289823.2A Expired - Fee Related CN102413662B (en) | 2010-09-24 | 2010-09-24 | The heat abstractor of portable consumer electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102413662B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981133B (en) * | 2015-07-14 | 2018-01-19 | 广东欧珀移动通信有限公司 | A kind of heat abstractor and mobile phone |
| CN105182768A (en) * | 2015-08-17 | 2015-12-23 | 惠州莫思特科技有限公司 | Intelligent control system |
| CN105045126B (en) * | 2015-08-17 | 2019-01-11 | 珠海美光原科技股份有限公司 | Intelligent temperature control system |
| KR101998343B1 (en) | 2016-02-26 | 2019-07-09 | 삼성전자주식회사 | Electronic Device having Cooling Structure |
| CN105578847B (en) * | 2016-03-07 | 2018-09-28 | 苏州硅果电子有限公司 | A kind of tubing type liquid radiator |
| CN105698141A (en) * | 2016-03-16 | 2016-06-22 | 南京航空航天大学 | Cooling device |
| CN107771003A (en) * | 2016-08-17 | 2018-03-06 | 奇鋐科技股份有限公司 | Radiating subassembly |
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
| CN112822906A (en) * | 2019-11-18 | 2021-05-18 | 英业达科技有限公司 | Computer system and composite heat dissipation system |
Citations (6)
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| CN2519411Y (en) * | 2001-12-27 | 2002-10-30 | 富准精密工业(深圳)有限公司 | Cooling device |
| CN2572461Y (en) * | 2002-10-08 | 2003-09-10 | 陈勇 | Pin fin type heat-pipe heat-sink |
| CN101222838A (en) * | 2007-01-12 | 2008-07-16 | 李建民 | Sunflower embedded heat pipe radiator |
| CN101230472A (en) * | 2007-01-26 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Method for manufacturing airtight cavity structure |
| CN101634532A (en) * | 2008-12-22 | 2010-01-27 | 富瑞精密组件（昆山）有限公司 | Heat pipe and manufacturing method thereof |
| CN201569965U (en) * | 2009-12-31 | 2010-09-01 | 宏碁股份有限公司 | Eccentric heat radiator |
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2010
- 2010-09-24 CN CN201010289823.2A patent/CN102413662B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2519411Y (en) * | 2001-12-27 | 2002-10-30 | 富准精密工业(深圳)有限公司 | Cooling device |
| CN2572461Y (en) * | 2002-10-08 | 2003-09-10 | 陈勇 | Pin fin type heat-pipe heat-sink |
| CN101222838A (en) * | 2007-01-12 | 2008-07-16 | 李建民 | Sunflower embedded heat pipe radiator |
| CN101230472A (en) * | 2007-01-26 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Method for manufacturing airtight cavity structure |
| CN101634532A (en) * | 2008-12-22 | 2010-01-27 | 富瑞精密组件（昆山）有限公司 | Heat pipe and manufacturing method thereof |
| CN201569965U (en) * | 2009-12-31 | 2010-09-01 | 宏碁股份有限公司 | Eccentric heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102413662A (en) | 2012-04-11 |
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